JP2522488Y2 - Conductive bag - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive bag for preventing static electricity in an IC, an LSI, etc., which is prevented from being damaged by static electricity.

[0002]

2. Description of the Related Art Electronic components such as ICs and LSIs are liable to be destroyed by the flow of a current larger than their respective allowable current values. For example, when a container used for transporting the container is charged by static electricity, a current larger than an allowable current value flows through an IC, an LSI, or the like in the container, and the IC, the LSI, or the like may be destroyed. Therefore, conventionally, IC and L
As a container for enclosing electronic components such as SI, a conductive bag for preventing static electricity using a conductive material such as an aluminum alloy has been used.

[0003]

However, a conventional conductive bag using a conductive material such as an aluminum alloy has a high airtightness, and therefore, a temperature difference between the inside and outside of the bag causes the inner surface of the bag or the inside of the bag to have a high temperature.
Condensation may occur on C and the like, and if such condensation occurs, there is an inconvenience that the metal used for the electrode rusts.

In this case, as a measure for preventing moisture in the bag that dislikes moisture, there has been a method of sealing a commonly used moisture absorbing agent, such as silica gel, in a conductive bag together with electronic parts such as IC and LSI. . However, according to such means, the hygroscopic agent tends to be localized and cannot be an effective measure for preventing dew condensation.Moreover, the hygroscopic agent moves between the encapsulated electronic components and collides with the electronic components and is crushed. In addition, there are adverse effects such as a pulverized moisture absorbent adhering to an enclosure such as an electronic component.

[0005] In order to prevent dew condensation in a conductive bag for preventing static electricity, there has been a technique in which an IC, an LSI, or the like is sealed in the bag and then the bag is evacuated. However, multiple ICs and LS
In the bag enclosing I or the like, the inner surface of the bag does not easily adhere to the IC or LSI when the IC or LSI overlaps each other, and it is not easy to apply a vacuum.

Accordingly, the present invention has been made with the aim of solving the above-mentioned adverse effects and providing a conductive bag which can effectively prevent dew condensation in the bag simply by applying simple means.

[0007]

The structure of the conductive bag according to the present invention has an outer sheet formed in a bag shape, having conductivity for preventing static electricity, and laminated inside the outer sheet. an inner sheet formed by sandwiching a hygroscopic substance between two films with breathable made, the inner sheet
The two filters without the interposition of the hygroscopic substance.
Are directly joined to each other at predetermined intervals.
It is characterized in that

[0008]

In the conductive bag according to the present invention, an inner sheet in which a hygroscopic substance is sandwiched between two air-permeable films is laminated inside the outer sheet, that is, inside the conductive bag. In addition, the inner sheet has a hygroscopic substance
Since the portions formed by directly joining the two films are provided at a predetermined interval without any need, the hygroscopic substance sandwiched between the two films is not locally biased, and is not in the conductive bag. Absorbs all the moisture.

In addition, since the inner sheet sandwiches the hygroscopic substance between the two films, even if the outer sheet and the inner sheet are separated and handled separately, the hygroscopic substance may be exposed. There are no inner sheets, and two sheets
To bend the film directly at the joint
Therefore, it is easily deformed and the two films are
If the part is directly joined, the hygroscopic substance does not leak out even if the part is cut. Furthermore, the inner sheet laminated on the inner side of the outer sheet functions as a cushioning material, and the two films sandwiching the hygroscopic substance in the inner sheet are made of electronic components sealed in the conductive bag. Protects hygroscopic substances.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to one embodiment described in detail below, but includes all embodiments conceivable to those skilled in the art based on obvious matters.

The conductive bag 10 according to one embodiment of the present invention has
This is a bag that is prevented from being charged by static electricity so as to prevent the contents such as IC and LSI from being destroyed by static electricity generated due to vibration and friction during transportation when C or LSI is enclosed. As shown in FIGS. 1 and 2, the conductive bag 10 is a polyethylene film provided with conductivity by depositing an aluminum alloy, and has an outer sheet 20 that functions to prevent electrostatic charging, and an inner surface of the outer sheet 20. And an inner sheet 30 that absorbs moisture in the conductive bag 10 and also has a buffer function.

The outer sheet 20 and the inner sheet 30
Are formed in a bag shape, and a fastener 45 is attached to the opening 40 of the outer sheet 20 so that the outer sheet 20 can be sealed. The inner sheet 30 includes two breathable films 32a, 3
2b, and the two films 32a, 3b
The silica gel powder 34 is sandwiched between 2b.

The manufacture of such an inner sheet 30 is illustrated in FIG.
As shown in (1), first, the delivery rollers 50, 50 deliver one sheet of film 32a having one surface coated with an adhesive. The fed film 32a passes between the positive electrode 60 and the negative electrode 62 to which a high voltage is applied. At this time,
The silica gel powder 34 charged by the negative electrode 62 is placed between the negative electrode 62 and the film 32a.
2a is applied in a planar manner. The applied silica gel powder 34 is fixed on the film 32a by the adhesive applied to one side of the film 32a. The application of the silica gel powder 34 to the film 32a is performed intermittently at predetermined intervals.

The film 32a thus coated with the silica gel powder 34 advances further, and
Pass between 0 and 72. Since the intermediate roller 72 supplies another film 32b, when the film 32a passes between the intermediate rollers 70 and 72, the film 32b is aligned with the surface of the film 32a coated with the silica gel powder 34, and the intermediate roller 70 , 72, two films 3
2a and 32b are pressed together.

In the next heating step 80,
Two films 32a sandwiching silica gel powder 34,
32b is heated and dried. The adhesive applied to the film 32a is solidified by the heating and drying, and the two films 32a and 32b are sandwiched while holding the silica gel powder 34 therebetween.
Are joined.

Since the adhesive is applied only to the film 32a, even if the air holes of the film 32a are closed by the adhesive, the air holes of the film 32b are not closed by the adhesive. The silica gel powder 34 sandwiched between the two films through the air holes of the film 32b can function to absorb moisture outside the film.

Further, as described above, the silica gel powder 34 is used.
Is intermittently applied to the film 32a at a predetermined interval, so that the film 32 on which the silica gel powder 34 is not applied is
Part a is directly bonded to the film 32b by the adhesive. Accordingly, the silica gel powder 34 is fixed to the film 32a side with an adhesive, and the silica gel powder 3
By providing a portion at which the film 32a and the film 32b are directly joined by an adhesive without using an adhesive at a predetermined interval, the silica gel powder 34 is made of two films 32a,
It is firmly fixed between 32b.

After the heating and drying steps, the inner sheet 30
Is completed, and the completed inner sheet 30 is taken up by the take-up rollers 90, 90. The inner sheet 30 manufactured in this manner was appropriately cut at a portion where the film 32a and the film 32b were directly joined without interposing the silica gel powder 34, processed into a bag shape, and formed into a larger bag shape. It is attached to the inner surface of the outer sheet 20 using an adhesive.

The inner sheet 30 includes two films 32.
Since the silica gel powder 34 is sandwiched between the sheets 32a and 32b in a planar manner, the silica gel powder 34 does not leak out of the films 32a and 32b in the conductive bag 10 according to the present embodiment. Moisture is efficiently and substantially uniformly distributed throughout the bag. Therefore, according to the present embodiment, the silica gel powder 34 does not adhere to the electronic components and the like sealed in the conductive bag 10, and dew condensation occurs in the conductive bag 10 even if there is a temperature difference inside and outside the conductive bag 10. Never.

Instead of using a large-scale means such as vacuuming the inside of the bag using a vacuum device, a simple structure means such as an inner sheet 30 composed of two films 32a and 32b sandwiching a silica gel powder 34 is used. Only by this, effective prevention of dew condensation in the conductive bag 10 is realized.

Further, since the inner sheet 30 is composed of the two films 32a and 32b, and sandwiches the silica gel powder 34 between them, the inner sheet 30 has a slight thickness and also functions as a cushioning material. In addition, adverse effects due to physical force on ICs, LSIs, and the like sealed in the conductive bag 10 (for example, damage to ICs and LSIs due to vibration during transportation) can be reduced.

The means for attaching the inner sheet 30 to the outer sheet 20 does not need to be an adhesive, and any means for attaching sheet materials, such as a double-sided tape, can be used .

Further, in this embodiment, the adhesive is applied to the entire surface of the film 32a. In that case,
In a strong electric field, apply the silica gel powder intermittently on one film, and in the electric field, combine the other film from above, and apply the adhesive applied in advance to the area where the silica gel powder is not applied. The two films are joined together by an agent. The bonding of the films with such an adhesive limits the movement of the silica gel powder between the two films. Alternatively, a method of welding two films together without using such an adhesive may be used. That is, as described above, the silica gel powder is intermittently applied on one of the films, and is placed in an electric field.
The other films are combined from above, and the two films are welded to each other in a portion where the silica gel powder is not applied. Such welding of the films limits the movement of the silica gel powder between the two films.

In addition, instead of processing the inner sheet into a bag as in this embodiment, one inner sheet itself may be attached to one inner surface of the outer sheet processed into a bag.

[0025]

[Effects of the Invention] According to the conductive bag of the present invention, it is possible to absorb moisture.
The substance is not localized locally in the conductive bag,
Absorbs all the moisture in the bag, so it is effectively in the conductive bag
Can be prevented from dew condensation.

The inner sheet is separate from the outer sheet.
, Easy to deform and absorb moisture
That can be cut without exposing any
Therefore, an appropriate size according to the shape and size of the outer sheet
Can be cut or deformed into a suitable shape
You. As a result, this inner sheet can be
Can be used in common for outer sheets of
For example, a conventional conductive bag consisting of an outer sheet alone
Attach the sheet to configure the conductive bag of the present invention, or
If the moisture absorption of the sheet deteriorates, only the inner sheet
Can be replaced and used, simple and reliable conductive
Dew condensation in the bag can be prevented.

In addition, according to the conductive bag of the present invention ,
Since the inner sheet functions as a buffer, it is possible to reduce the physical force (for example, vibration during transportation) received by the contents enclosed in the conductive bag , and the moisture-absorbing substance is used as a material.
Is protected by a film, so it is enclosed in a conductive bag.
Even if electronic components, etc. that collide with the inner sheet,
There is no crushing.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view of a conductive bag 10 according to the present embodiment.

FIG. 2 is an explanatory sectional view of a main part of the conductive bag 10 according to the embodiment.

FIG. 3 is an explanatory diagram of a manufacturing process of the inner sheet 30.

[Explanation of symbols]

10: conductive bag, 20: outer sheet, 3
0: inner sheet, 32a, 32b: film,
34 ... Silica gel powder,

Claims (1)

(57) [Scope of request for utility model registration] 1. An outer sheet having a conductive shape for preventing static electricity and formed in a bag shape, and a hygroscopic substance sandwiched between two air-permeable films laminated inside the outer sheet. and becomes an inner sheet from comprising, on the inner sheet, going through the hygroscopic substance
Do not join the two films directly to each other without
A conductive bag provided at predetermined intervals .