JP2520429C - - Google Patents
Info
- Publication number
- JP2520429C JP2520429C JP2520429C JP 2520429 C JP2520429 C JP 2520429C JP 2520429 C JP2520429 C JP 2520429C
- Authority
- JP
- Japan
- Prior art keywords
- opening
- wiring board
- adhesive resin
- mounting
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004840 adhesive resin Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 240000004375 Petrea volubilis Species 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical class O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
[技術分野]
本発明は、ICなど電子部品を実装するために用いられるプリント配線板に関
するものである。
[背景技術]
プリント配線板AにICなどの電子部品2を実装するにあたって、プリント配
線板Aに実装用凹部9を設けることがなされる。すなわち、第7図に示すように
配線基板1に開口部7を設けた他の配線基板8を積層し、開口部7によって実装
用凹部9が設けられたプリント配線板Aを形成するのである。そして配線基板1
には配線基板8との間の電気絶縁性を確保するために、絶縁樹脂等を塗布硬化さ
せるなどして電気絶縁層4が形成してあり、配線基板1,8の間に接着樹脂層6
を入れて加熱加圧する積層成形をおこなうことによって、接着樹脂層6で配線基
板1,8を積層接着させることができるのである。
ここで、電気絶縁層4及び接着樹脂層6にもそれぞれ実装用凹部9を形成する
ために開口部3,5が設けてある。そして第7図のように電気絶縁層4の開口部
3の大きさが接着樹脂層6の開口部5の大きさよりも大きいと、接着樹脂層6の
開口部5の周縁部が電気絶縁層4の開口部3内にはみ出し、第8図に示すように
接着樹脂層6のはみ出した部分において実装用凹部9内にくぼみ12ができるこ
とになる。しかしこのようにくぼみ12ができるとプリント配線板Aを洗浄する
にあたって、くぼみ12内に洗浄液が残留し、この残留した洗浄液が洗浄後に流
出してプリント配線板Aの回路13を汚染したりするおそれがあり、また電子部
品2を実装用凹部9内に封止するために封止樹脂を充填するにあたって、くぼみ
12内にボイドが発生し易く封止が不十分になるおそれがある。特に積層成形を
おこなう際に接着樹脂層6のはみ出し部分が第8図のように垂れて、この垂れ部
分21でくぼみ12は開口幅が狭まる状態になり、洗浄液の残留やボイドが発生
し易くなるものである。
[発明の目的]
本発明は、上記の点に鑑みて為されたものであり、実装用凹部内にくぼみが生
じるおそれのない電子部品実装用プリント配線板を提供することを目的とするも
のである。
[発明の開示]
しかして本発明は、配線基板1に電子部品2の実装箇所を開口部3とした電気
絶縁層4を介して、電子部品2の実装箇所に開口部5を設けた接着樹脂層6によ
って同様に電子部品2の実装箇所に開口部7を設けた配線基板8を積層接着して
形成され、各開口部3,5,7を上下に合致して形成される実装用凹所9が設け
られた電子部品実装用プリント配線板Aに関するものであり、配線基板に樹脂を
塗布硬化して形成される電気絶縁層4に設けた開口部3の大きさを接着樹脂層6
の開口部5よりも小さく設定して成ることを特徴とするものであって、接着樹脂
層6の開口部5の縁部が電気絶縁層4の開口部3内にはみ出さないように両開口
部3,5の大きさを設定して、実装用凹部9内にくぼみが形成されないようにし
たものである。
以下本発明を実施例により詳述する。第1図は本考案の一実施例を示すもので
あり、配線基板1は例えばガラス基材エポキシ樹脂積層板など樹脂積層板で形成
されるものであって、その下面には銅箔などの金属箔14が積層して張ってある
。この配線基板1の上面には電気絶縁層4が形成してある。この電気絶縁層4は
、例えばエポキシ樹脂など電気絶縁性に優れた樹脂を塗布して硬化させて形成す
ることができるものであり、電子部品2を実装する箇所においては配線基板1を
露出させるように開口部3が形成してある。また接着樹脂層6としては、例えば
ガラス基材等にエポキシ樹脂等を含浸して乾燥させて調整したボンディング用プ
リプレグなどを用いることができ、電子部品2を実装する箇所においては開口部
5が形成してある。さらに配線基板8としては上記した配線基板1と同じように
形成したもの、例えばガラス基材エポキシ樹脂積層板など樹脂積層板で形成され
るものであって、その上面には銅箔などの金属箔14が積層して張ってあり、ま
た電子部品2を実装する箇所においては開口部7が形成してある。ここで、各開
口部3,5,7はそれぞれ四角形など同じ平面形状で形成されているものであり
、電気絶縁層4の開口部3の大きさ(すなわちその内径)は接着樹脂層6の開口
部5の大きさ(すなわちその内径)より小さくなるように形成してある。また接
着樹脂層6の開口部5の大きさと配線基板8の開口部7の大きさとは等しくなる
ように形成してある。
しかして第1図(a)に示すように配線基板1の上に電気絶縁層4を介して接
着樹脂層6を、その上に配線基板8をそれぞれ重ねると共に各開口部3,5,7
を上下に合致させ、この状態で加熱加圧して積層成形をおこなうことによって、
第1図(b)のように接着樹脂層6で配線基板1,8を積層一体化することがで
き、また各開口部3,5,7によって実装用凹部9を形成することができる。こ
こで、電気絶縁層4の表面を粗面化しておくことによって、電気絶縁層4と接着
樹脂層6との接着性を高めることができる。粗面化加工は、液体ホーニング、サ
ンドブラスト、サンドペーパーなどを用いた機械的粗面化あるいは、重クロム酸
類による処理など化学的粗化を単独であるいは併用することによっておこなうこ
とができる。そしてさらに各配線基板1,8の金属箔14をエッチング加工など
して回路13を形成することによって、プリント配線板Aとして仕上げることが
でき、実装用凹部9内にICなどの電子部品2を搭載して回路13とワイヤー1
5などでボンディングすることによって、プリント配線板Aに電子部品2を実装
することができる。このものにあって、接着樹脂層6の開口部5は電気絶縁層4
の開口部3よりも大きく形成されているために、接着樹脂層6の開口部5の周縁
部が電気絶縁層4の開口部3の内方へはみ出すことはなく、従って接着樹脂層6
のはみ出しでくぼみが実装用凹部9内に形成されるようなことはないものである
。
第2図及び第3図の実施例では、配線基板1として少なくとも上面側に回路1
3を予め形成した回路板を用いるようにして、配線基板1,8間に内層の回路1
3が設けられるようにしてあり、実装用凹部9内に実装した電子部品2を配線基
板8の回路13の他に内層回路となる配線基板1の回路13にもワイヤー15で
ボンディングするようにしてある。第2図において16はスルーホールである。
第4図の実施例は、配線基板1として実装用凹部9の底部の位置において放熱用
の金属板17を設けたものを用いるようにしたものであり、この配線基板1は金
属板17をはめ込んだ下層基板1aに接着樹脂層18で上層基板1bを積層した
構造に形成してある。第5図の実施例は配線基板1に貫通孔19を形成するよう
にしたものを示す。第6図の実施例は配線基板1として金属板20をコアとして
積層したものを用いるようにしたものである。
[発明の効果]
上述のように本発明にあっては、配線基板に樹脂を塗布硬化して形成される電
気絶縁層に設けた開口部の大きさを接着樹脂層の開口部よりも小さく設定したの
で、接着樹脂層の開口部の周縁部が電気絶縁層の開口部の内方へはみ出すような
ことがなく、接着樹脂層のはみ出しでくぼみが実装用凹部内に形成されるような
ことはないものであって、くぼみに洗浄水が残留したり樹脂封止の際にボイドが
発生したりする問題をなくすことができるものである。Description: TECHNICAL FIELD The present invention relates to a printed wiring board used for mounting an electronic component such as an IC. BACKGROUND ART When mounting electronic components 2 such as ICs on a printed wiring board A, mounting recesses 9 are provided on the printed wiring board A. That is, as shown in FIG. 7, another wiring board 8 provided with the opening 7 is laminated on the wiring board 1 to form the printed wiring board A in which the mounting recess 9 is provided by the opening 7. And the wiring board 1
An electric insulating layer 4 is formed by applying and hardening an insulating resin or the like in order to secure electric insulation between the wiring substrate 8 and the wiring substrate 8.
The wiring substrates 1 and 8 can be laminated and adhered by the adhesive resin layer 6 by performing lamination molding in which heat is applied under heat. Here, openings 3 and 5 are also provided in the electrical insulating layer 4 and the adhesive resin layer 6 to form the mounting recess 9 respectively. When the size of the opening 3 of the electric insulating layer 4 is larger than the size of the opening 5 of the adhesive resin layer 6 as shown in FIG. 8, the recess 12 is formed in the mounting recess 9 at the portion where the adhesive resin layer 6 protrudes, as shown in FIG. However, when the recesses 12 are formed in this way, when cleaning the printed wiring board A, the cleaning liquid remains in the recesses 12, and the remaining cleaning liquid flows out after cleaning and may contaminate the circuit 13 of the printed wiring board A. When filling the electronic component 2 with the sealing resin in order to seal the inside of the mounting concave portion 9, voids are easily generated in the recess 12, and the sealing may be insufficient. In particular, when the lamination molding is performed, the protruding portion of the adhesive resin layer 6 hangs down as shown in FIG. Things. [Object of the Invention] The present invention has been made in view of the above points, and has as its object to provide a printed wiring board for mounting electronic components, which does not have a possibility of forming a recess in a mounting recess. is there. DISCLOSURE OF THE INVENTION Accordingly, the present invention provides an adhesive resin in which an opening 5 is provided at a mounting position of an electronic component 2 via an electrical insulating layer 4 having an opening 3 at the mounting position of the electronic component 2 on the wiring board 1. A mounting recess is also formed by laminating and adhering a wiring board 8 having openings 7 at the mounting positions of the electronic components 2 by the layer 6, and the openings 3, 5, 7 are vertically aligned. 9 relates to a printed wiring board A for mounting electronic components, in which the size of the opening 3 provided in the electrical insulating layer 4 formed by applying and curing a resin on the wiring board is determined by the size of the adhesive resin layer 6.
The opening 5 is characterized by being set smaller than the opening 5 of the electrical insulating layer 4 so that the edge of the opening 5 of the adhesive resin layer 6 does not protrude into the opening 3 of the electrical insulating layer 4. The size of the portions 3 and 5 is set so that no depression is formed in the mounting recess 9. Hereinafter, the present invention will be described in detail with reference to examples. FIG. 1 shows an embodiment of the present invention, in which a wiring board 1 is formed of a resin laminate such as a glass base epoxy resin laminate, and has a lower surface formed of a metal such as copper foil. Foil 14 is laminated and stretched. An electric insulating layer 4 is formed on the upper surface of the wiring board 1. The electric insulating layer 4 can be formed by applying and hardening a resin having excellent electric insulating properties such as an epoxy resin, for example, so that the wiring board 1 is exposed where electronic components 2 are mounted. An opening 3 is formed in the opening. Further, as the adhesive resin layer 6, for example, a bonding prepreg prepared by impregnating a glass substrate or the like with an epoxy resin or the like and drying the same can be used, and an opening 5 is formed at a place where the electronic component 2 is mounted. I have. Further, the wiring board 8 is formed in the same manner as the wiring board 1 described above, for example, formed of a resin laminate such as a glass base epoxy resin laminate, and has a metal foil such as a copper foil on the upper surface thereof. 14 are laminated and stretched, and an opening 7 is formed at a place where the electronic component 2 is mounted. Here, each of the openings 3, 5, and 7 is formed in the same plane shape such as a quadrangle, and the size (that is, the inner diameter) of the opening 3 of the electric insulating layer 4 is the It is formed so as to be smaller than the size of the portion 5 (that is, its inner diameter). Further, the size of the opening 5 of the adhesive resin layer 6 and the size of the opening 7 of the wiring board 8 are formed to be equal. Then, as shown in FIG. 1 (a), the adhesive resin layer 6 is placed on the wiring board 1 via the electric insulating layer 4 and the wiring board 8 is placed thereon, and the openings 3, 5, 7
By vertically pressing and heating and pressing in this state to perform lamination molding,
As shown in FIG. 1B, the wiring substrates 1 and 8 can be laminated and integrated by the adhesive resin layer 6, and the mounting recesses 9 can be formed by the openings 3, 5, and 7. Here, by roughening the surface of the electric insulating layer 4, the adhesiveness between the electric insulating layer 4 and the adhesive resin layer 6 can be improved. The surface roughening can be performed by mechanical surface roughening using liquid honing, sand blasting, sand paper, or the like, or by chemical roughening such as treatment with dichromic acids alone or in combination. Further, the printed circuit board A can be finished by forming the circuit 13 by etching the metal foil 14 of each of the wiring boards 1 and 8 and mounting the electronic component 2 such as an IC in the mounting recess 9. Circuit 13 and wire 1
The electronic component 2 can be mounted on the printed wiring board A by performing bonding at 5 or the like. In this case, the opening 5 of the adhesive resin layer 6 is
Is formed larger than the opening 3 of the adhesive resin layer 6, the periphery of the opening 5 of the adhesive resin layer 6 does not protrude inward of the opening 3 of the electric insulating layer 4, and therefore, the protrusion of the adhesive resin layer 6 The recess is not formed in the mounting recess 9. In the embodiment shown in FIGS. 2 and 3, the circuit board 1
3 is used between the wiring boards 1 and 8 by using a circuit board in which the circuit board 3 is formed in advance.
The electronic component 2 mounted in the mounting recess 9 is bonded to the circuit 13 of the wiring board 1 as an inner layer circuit with the wire 15 in addition to the circuit 13 of the wiring board 8. is there. In FIG. 2, reference numeral 16 denotes a through hole.
In the embodiment shown in FIG. 4, a wiring board 1 provided with a metal plate 17 for heat radiation at the bottom of the mounting recess 9 is used, and the wiring board 1 is fitted with the metal plate 17. The upper substrate 1b is formed by laminating the upper substrate 1b with the adhesive resin layer 18 on the lower substrate 1a. FIG. 5 shows an embodiment in which a through hole 19 is formed in the wiring board 1. In the embodiment shown in FIG. 6, a wiring board 1 having a metal plate 20 laminated as a core is used. [Effect of the Invention] As described above, in the present invention, the size of the opening provided in the electric insulating layer formed by applying and curing the resin on the wiring board is set smaller than the opening of the adhesive resin layer. Therefore, the peripheral portion of the opening of the adhesive resin layer does not protrude inward of the opening of the electrical insulating layer, and the recess of the adhesive resin layer does not form in the mounting recess. This eliminates the problem that cleaning water remains in the recess and voids occur during resin sealing.
【図面の簡単な説明】
第1図(a)(b)は本発明の一実施例の断面図、第2図は他の実施例の断面
図、第3図は同上の一部の拡大断面図、第4図、第5図、第6図はさらに他の実
施例の断面図、第7図は従来例の断面図、第8図は同上の一部の拡大断面図であ
る。
1は配線基板、2は電子部品、3は電気絶縁層の開口部、4は電気絶縁層、5
は接着樹脂層の開口部、6は接着樹脂層、7は配線基板の開口部、8は配線基板
、9は実装用凹部である。BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 (a) and (b) are cross-sectional views of one embodiment of the present invention, FIG. 2 is a cross-sectional view of another embodiment, and FIG. 4, 5, 5, and 6 are cross-sectional views of still another embodiment, FIG. 7 is a cross-sectional view of a conventional example, and FIG. 8 is an enlarged cross-sectional view of a part of the embodiment. 1 is a wiring board, 2 is an electronic component, 3 is an opening of an electric insulating layer, 4 is an electric insulating layer, 5
Is an opening of the adhesive resin layer, 6 is an adhesive resin layer, 7 is an opening of the wiring board, 8 is a wiring board, and 9 is a mounting recess.
Claims (1)
電子部品の実装箇所に開口部を設けた接着樹脂層によって同様に電子部品の実装
箇所に開口部を設けた配線基板を積層接着して形成され、各開口部を上下に合致
して形成される実装用凹所が設けられた電子部品実装用プリント配線板において
、配線基板に樹脂を塗布硬化して形成される上記電気絶縁層に設けた開口部の大
きさを上記接着樹脂層の開口部よりも小さく設定して成ることを特徴とする電子
部品実装用プリント配線板。Claims: (1) An electric insulating layer having an opening at a mounting position of an electronic component on a wiring board is provided,
Similarly, a wiring board provided with an opening at the mounting position of an electronic component is formed by laminating and bonding with an adhesive resin layer having an opening at the mounting position of an electronic component, and each opening is formed so as to match up and down. in the electronic component mounting printed circuit board for the recess is provided mounted, the size of the opening provided in the electrical insulating layer formed by application of a resin cured wiring board from the opening of the adhesive resin layer A printed wiring board for mounting electronic components, characterized in that it is also set to be small.
Family
ID=
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