JP2517203Y2 - 半導体素子収納用パッケージ - Google Patents

Info

Publication number

JP2517203Y2

JP2517203Y2 JP7838090U JP7838090U JP2517203Y2 JP 2517203 Y2 JP2517203 Y2 JP 2517203Y2 JP 7838090 U JP7838090 U JP 7838090U JP 7838090 U JP7838090 U JP 7838090U JP 2517203 Y2 JP2517203 Y2 JP 2517203Y2

Authority

JP

Japan

Prior art keywords

external lead

insulating

package

lead terminals

glass member

Prior art date

1990-07-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000004065 semiconductor Substances 0.000 title claims description 46
• 239000011521 glass Substances 0.000 claims description 33
• QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 14
• VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
• 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
• DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
• 239000011734 sodium Substances 0.000 claims description 6
• ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
• 229910052700 potassium Inorganic materials 0.000 claims description 3
• 239000011591 potassium Substances 0.000 claims description 3
• 229910052708 sodium Inorganic materials 0.000 claims description 3
• 229910052751 metal Inorganic materials 0.000 description 20
• 239000002184 metal Substances 0.000 description 20
• 238000005219 brazing Methods 0.000 description 17
• 239000000758 substrate Substances 0.000 description 16
• 239000000463 material Substances 0.000 description 13
• 239000000919 ceramic Substances 0.000 description 8
• 238000007747 plating Methods 0.000 description 7
• 239000000155 melt Substances 0.000 description 6
• 239000000126 substance Substances 0.000 description 5
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
• 239000012777 electrically insulating material Substances 0.000 description 4
• 238000000034 method Methods 0.000 description 4
• 230000002093 peripheral effect Effects 0.000 description 4
• 239000000843 powder Substances 0.000 description 4
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
• 239000005388 borosilicate glass Substances 0.000 description 3
• 238000010438 heat treatment Methods 0.000 description 3
• CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 3
• 229910001950 potassium oxide Inorganic materials 0.000 description 3
• 239000003870 refractory metal Substances 0.000 description 3
• 229910001948 sodium oxide Inorganic materials 0.000 description 3
• ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 238000005260 corrosion Methods 0.000 description 2
• 230000007797 corrosion Effects 0.000 description 2
• 230000005496 eutectics Effects 0.000 description 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
• 229910052737 gold Inorganic materials 0.000 description 2
• 239000010931 gold Substances 0.000 description 2
• 238000002844 melting Methods 0.000 description 2
• 230000008018 melting Effects 0.000 description 2
• 229910052750 molybdenum Inorganic materials 0.000 description 2
• 239000011733 molybdenum Substances 0.000 description 2
• 229910052759 nickel Inorganic materials 0.000 description 2
• 239000003960 organic solvent Substances 0.000 description 2
• TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 238000007789 sealing Methods 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 239000002904 solvent Substances 0.000 description 2
• WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
• 229910052721 tungsten Inorganic materials 0.000 description 2
• 239000010937 tungsten Substances 0.000 description 2
• PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 229910052810 boron oxide Inorganic materials 0.000 description 1
• JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
• 238000007606 doctor blade method Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• -1 for example Substances 0.000 description 1
• 239000003292 glue Substances 0.000 description 1
• 230000010354 integration Effects 0.000 description 1
• 229910000833 kovar Inorganic materials 0.000 description 1
• 238000010030 laminating Methods 0.000 description 1
• 229910000464 lead oxide Inorganic materials 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 229910052748 manganese Inorganic materials 0.000 description 1
• 239000011572 manganese Substances 0.000 description 1
• WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
• YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
• 238000003672 processing method Methods 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1
• 239000003566 sealing material Substances 0.000 description 1
• 239000010802 sludge Substances 0.000 description 1