JP2516820Y2 - 磁気センサー - Google Patents
磁気センサーInfo
- Publication number
- JP2516820Y2 JP2516820Y2 JP1988050606U JP5060688U JP2516820Y2 JP 2516820 Y2 JP2516820 Y2 JP 2516820Y2 JP 1988050606 U JP1988050606 U JP 1988050606U JP 5060688 U JP5060688 U JP 5060688U JP 2516820 Y2 JP2516820 Y2 JP 2516820Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conversion element
- element chip
- package
- magnetic sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 36
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010931 gold Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Transmission And Conversion Of Sensor Element Output (AREA)
- Measuring Magnetic Variables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050606U JP2516820Y2 (ja) | 1988-04-15 | 1988-04-15 | 磁気センサー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050606U JP2516820Y2 (ja) | 1988-04-15 | 1988-04-15 | 磁気センサー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01154411U JPH01154411U (enrdf_load_stackoverflow) | 1989-10-24 |
| JP2516820Y2 true JP2516820Y2 (ja) | 1996-11-13 |
Family
ID=31276644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988050606U Expired - Lifetime JP2516820Y2 (ja) | 1988-04-15 | 1988-04-15 | 磁気センサー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2516820Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7138261B1 (ja) * | 2022-06-30 | 2022-09-15 | 旭化成エレクトロニクス株式会社 | 半導体パッケージ、及び駆動装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51103354U (enrdf_load_stackoverflow) * | 1975-02-14 | 1976-08-19 | ||
| JPS62112155U (enrdf_load_stackoverflow) * | 1985-12-27 | 1987-07-17 | ||
| JPS63280U (enrdf_load_stackoverflow) * | 1986-06-20 | 1988-01-05 | ||
| JPS6355776U (enrdf_load_stackoverflow) * | 1986-09-30 | 1988-04-14 |
-
1988
- 1988-04-15 JP JP1988050606U patent/JP2516820Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01154411U (enrdf_load_stackoverflow) | 1989-10-24 |
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