JP2516196Y2 - Circuit device cover contact structure - Google Patents

Circuit device cover contact structure

Info

Publication number
JP2516196Y2
JP2516196Y2 JP7918990U JP7918990U JP2516196Y2 JP 2516196 Y2 JP2516196 Y2 JP 2516196Y2 JP 7918990 U JP7918990 U JP 7918990U JP 7918990 U JP7918990 U JP 7918990U JP 2516196 Y2 JP2516196 Y2 JP 2516196Y2
Authority
JP
Japan
Prior art keywords
cover
circuit device
shield plate
cut
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7918990U
Other languages
Japanese (ja)
Other versions
JPH0438085U (en
Inventor
崇嗣 松留
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP7918990U priority Critical patent/JP2516196Y2/en
Publication of JPH0438085U publication Critical patent/JPH0438085U/ja
Application granted granted Critical
Publication of JP2516196Y2 publication Critical patent/JP2516196Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は、回路装置のカバー接触構造、特に、回路装
置のケース体内で回路の各段毎にケース体を仕切るよう
に設けられたシールド板と回路装置を覆うカバーとの接
触構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a cover contact structure for a circuit device, and more particularly, a shield plate provided so as to partition the case body at each stage of the circuit in the case body of the circuit device. And a cover for covering the circuit device.

[従来の技術] 一般に、映像信号のブースター等の回路装置では、高
周波回路で構成されるため、回路基板上の部品側にシー
ルド板を設ける必要がある。シールド板は、回路の各段
毎に仕切るため、回路基板に垂直に設けられる。シール
ド板はケース体を覆うカバーに接触するようにされて接
地される。これは、通常、第6図に示すように、カバー
4にU字状の切り込みによって切片4aを設けて下方に折
り曲げ、この切片4aの先端をケース体2に設置したシー
ルド板3の上端に設けた突起3aに接触させるようにして
実現されていた。
[Prior Art] Generally, in a circuit device such as a booster for a video signal, the circuit device includes a high-frequency circuit, and therefore, it is necessary to provide a shield plate on the component side of the circuit board. The shield plate is provided perpendicularly to the circuit board because it is divided into stages of the circuit. The shield plate is brought into contact with the cover that covers the case body and is grounded. Usually, as shown in FIG. 6, a cover 4 is provided with a section 4a by a U-shaped cut and bent downward, and the tip of this section 4a is provided on the upper end of the shield plate 3 installed in the case body 2. It was realized by contacting the protrusion 3a.

しかしながらこの接触構造では、切片の先端の電位
と、切片が形成された穴の縁部のうち切片の先端に対応
する縁部における電位との間に差が生じるという問題が
あった。
However, this contact structure has a problem that a difference occurs between the potential at the tip of the section and the potential at the edge of the hole in which the section is formed, which corresponds to the tip of the section.

そこで、本考案の出願人は、電位差が生ずること無く
カバーにシールド板を接触させる構造として、実公平1-
29826号公報に示されるものを考案した。
Therefore, the applicant of the present invention has proposed a fair structure as a structure in which the shield plate is brought into contact with the cover without causing a potential difference.
The one shown in Japanese Patent No. 29826 was devised.

第4図及び第5図に示されているように、カバー4の
一部に切り込みを入れると共に下方に突出させて突出部
4aを形成し、この突出部4aにシールド板3の上端に設け
た突起3aを接触させる構造が開示されている。
As shown in FIGS. 4 and 5, a part of the cover 4 is notched and protruded downward so as to protrude.
There is disclosed a structure in which 4a is formed and a protrusion 3a provided on the upper end of the shield plate 3 is brought into contact with the protrusion 4a.

[考案が解決しようとする課題] しかしながら、上述した突出部4aはバネ性が小さいた
め、修理や保守作業時にカバーを取り外して再びカバー
を取り付けたりすると、カバーの突出部とシールド板の
突起との間で接触不良を起すことがあった。
[Problems to be solved by the invention] However, since the above-mentioned protrusion 4a has a small spring property, if the cover is removed and the cover is attached again during repair or maintenance work, the protrusion of the cover and the protrusion of the shield plate In some cases, poor contact occurred.

また、再度の間に取り付け時に、カバー及びシールド
板が変形することもあった。
In addition, the cover and the shield plate may be deformed during re-installation.

そこで、本考案の技術的課題は、カバーとシールド板
との間で接触不良を起さず、しかもカバーの電位を均一
にすることのできる回路装置のカバー接触構造を提供す
ることにある。
SUMMARY OF THE INVENTION Therefore, a technical object of the present invention is to provide a cover contact structure for a circuit device in which a contact failure does not occur between the cover and the shield plate and the potential of the cover can be made uniform.

[課題を解決するための手段] 本考案によれば、少なくとも一面を開口したケース体
と、該ケース体を仕切るシールド板と、前記ケース体の
開口を覆うカバーとを有する回路装置において、前記カ
バーにH字状の切り込みを入れて形成した1対の切片を
前記ケース体内方に切り起し、該1対の切り起こし部の
先端と当接するように前記シールド板の上端には互いに
隣接した位置に1対の突起を形成したことを特徴とする
回路装置のカバー接触構造が得られる。
[Means for Solving the Problems] According to the present invention, in a circuit device having a case body having an opening on at least one surface, a shield plate for partitioning the case body, and a cover for covering the opening of the case body, the cover is provided. A pair of sections formed by cutting an H-shaped cut into the inside of the case are cut and raised inside the case, and the upper and lower ends of the shield plate are adjacent to each other so as to contact with the tips of the pair of cut and raised portions. A cover contact structure for a circuit device is obtained, characterized in that a pair of protrusions is formed on the cover contact structure.

[作用] H字状の切り込みにより形成される1対の切片は切り
起こしにより片持ち式のバネとして作用する。
[Operation] The pair of segments formed by the H-shaped notch act as a cantilever spring by cutting and raising.

これにより、カバーの取り付け取り外しを繰返し行っ
ても、切り起こし部はそのバネ性により、シールド板の
突起に常に当接するように作用する。
As a result, even if the cover is repeatedly attached and detached, the cut-and-raised portion always acts on the projection of the shield plate due to its spring property.

この結果、カバー及びシールド板に余分な応力が加わ
ることはなく、カバーの1対の切り起こし部がそれぞれ
シールド板の隣接した突起に確実に接続される。これ
は、また1対の切り起こし部が形成された穴に電位差が
生じにくいことを意味する。
As a result, no extra stress is applied to the cover and the shield plate, and the pair of cut and raised portions of the cover are reliably connected to the adjacent protrusions of the shield plate. This means that a potential difference is unlikely to occur in the hole in which the pair of cut and raised portions are formed.

[実施例] 以下、本考案の実施例に係る回路装置のカバー接触構
造について図面を参照して説明する。
[Embodiment] Hereinafter, a cover contact structure of a circuit device according to an embodiment of the present invention will be described with reference to the drawings.

第1図及び第2図を参照すると、本考案に係る回路装
置のカバーの接触構造を有する回路装置は、回路基板
(図示せず)を収容するためのケース体20と、回路基板
に垂直に取り付けられ、互いに隣接した状態で1対の突
起30a、30bを上端に備えたシールド板30と、回路基板を
覆うためのものであって、H形状の切り込みを施して形
成された1対の切片を切り起こして形成された切り起こ
し部40a、40bを備えたカバー40とを有する。
Referring to FIGS. 1 and 2, a circuit device having a contact structure of a cover of the circuit device according to the present invention includes a case body 20 for accommodating a circuit board (not shown), and a case body 20 disposed vertically to the circuit board. A pair of pieces that are attached to each other and cover the circuit board and a shield plate 30 having a pair of protrusions 30a and 30b at the upper end in a state of being adjacent to each other and formed by making an H-shaped cut And a cover 40 having cut-and-raised portions 40a and 40b formed by cutting and raising.

ここでは、説明を簡単にするためシールド板は1枚で
1対の突起30a,30bは2組図示しているが、シールド板
は通常複数設けられ、これらのそれぞれに1対の突起が
設けられ、カバー40にはシールド板の突起に対応した位
置に1対の切り起こし部が設けられることは言うまでも
ない。切り起こし部40a、40bは、カバー40をH字状に切
り込み、1対の切片を同じ方向、即ち、ケース体20の内
方に向けて力を加えて形成されており、バネ性を有して
いる。
Here, in order to simplify the explanation, one shield plate is shown and two pairs of projections 30a and 30b are shown. However, a plurality of shield plates are usually provided, and a pair of projections is provided for each of them. Needless to say, the cover 40 is provided with a pair of cut-and-raised parts at positions corresponding to the protrusions of the shield plate. The cut-and-raised parts 40a and 40b are formed by cutting the cover 40 into an H-shape and applying a force to the pair of sections in the same direction, that is, toward the inside of the case body 20, and have spring properties. ing.

第3図に示されているように、カバー40がケース体20
に取り付けられると、切り起こし部40a、40bは夫々その
先端が突起30a,30bに当接することにより、切り起こし
部40a、40bと当接端部30a,30bとが確実に接続されて、
シールド板30はカバー40に接地接続される。
As shown in FIG. 3, the cover 40 covers the case body 20.
When attached to the cut-and-raised parts 40a, 40b, the tips of the cut-and-raised parts 40a, 40b abut the projections 30a, 30b, respectively, so that the cut-and-raised parts 40a, 40b and the abutting ends 30a, 30b are reliably connected,
The shield plate 30 is grounded to the cover 40.

[考案の効果] 以上説明したように、本考案によれば、H字状の切り
込みによる1対の切り起こし部がバネ性を有するように
なり、ケース体からカバーの取り付け及び取り外しを繰
り返し行っても、カバーの切り起こし部とシールド板の
突起との接触不良を防止できるだけでなく、カバー及び
シールド板が変形することをも防止できるという効果が
ある。
[Effects of the Invention] As described above, according to the present invention, the pair of cut-and-raised portions formed by the H-shaped cuts have the spring property, and the cover is repeatedly attached and detached from the case body. In addition, it is possible to prevent not only poor contact between the cut-and-raised part of the cover and the projection of the shield plate, but also the deformation of the cover and the shield plate.

また、カバーの1対の切り起こし部は、シールド板に
おける隣接し合った1対の突起と接続されるため、カバ
ーの1対の切り起こし部の根元部分の電位が同じにな
り、カバーに電位差を生ずることが無いという効果もあ
る。
Also, since the pair of cut-and-raised parts of the cover are connected to the pair of adjacent protrusions on the shield plate, the potentials of the root portions of the pair of cut-and-raised parts of the cover are the same, and the potential difference is generated in the cover. There is also the effect of not causing.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の実施例に係る回路装置の要部の上下逆
にして示した分解斜視図、 第2図は第1図の回路装置のカバーを部分的に示す図、 第3図は第2図の線B−B断面図を示す図、 第4図は従来のカバーの例を部分的に示す図、 第5図は第4図の線A−A断面図を示す図、 第6図は従来の回路装置の他の別の要部の断面図であ
る。 1……回路装置、2……ケース体、3……シールド板、
4……カバー、30……シールド板、30a……突起、40…
…カバー、40a……切り起こし部。
FIG. 1 is an exploded perspective view showing an essential part of a circuit device according to an embodiment of the present invention upside down, FIG. 2 is a view partially showing a cover of the circuit device of FIG. 1, and FIG. FIG. 4 is a view showing a sectional view taken along the line BB in FIG. 2, FIG. 4 is a view partially showing an example of a conventional cover, FIG. 5 is a view showing the sectional view taken along the line AA in FIG. 4, and FIG. The figure is a cross-sectional view of another main part of a conventional circuit device. 1 ... Circuit device, 2 ... Case body, 3 ... Shield plate,
4 ... Cover, 30 ... Shield plate, 30a ... Protrusion, 40 ...
… Cover, 40a… Cut and raised part.

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of utility model registration request] 【請求項1】少なくとも一面を開口したケース体と、該
ケース体を仕切るシールド板と、前記ケース体の開口を
覆うカバーとを有する回路装置において、前記カバーに
H字状の切り込みを入れて形成した1対の切片を前記ケ
ース体内方に切り起し、該1対の切り起こし部の先端と
当接するように前記シールド板の上端には互いに隣接し
た位置に1対の突起を形成したことを特徴とする回路装
置のカバー接触構造。
1. A circuit device having a case body having an opening on at least one surface, a shield plate for partitioning the case body, and a cover for covering the opening of the case body, wherein an H-shaped cut is formed in the cover. A pair of the cut pieces are cut and raised inside the case, and a pair of protrusions are formed at positions adjacent to each other on the upper end of the shield plate so as to come into contact with the tips of the pair of cut and raised portions. The cover contact structure of the characteristic circuit device.
JP7918990U 1990-07-27 1990-07-27 Circuit device cover contact structure Expired - Lifetime JP2516196Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7918990U JP2516196Y2 (en) 1990-07-27 1990-07-27 Circuit device cover contact structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7918990U JP2516196Y2 (en) 1990-07-27 1990-07-27 Circuit device cover contact structure

Publications (2)

Publication Number Publication Date
JPH0438085U JPH0438085U (en) 1992-03-31
JP2516196Y2 true JP2516196Y2 (en) 1996-11-06

Family

ID=31623127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7918990U Expired - Lifetime JP2516196Y2 (en) 1990-07-27 1990-07-27 Circuit device cover contact structure

Country Status (1)

Country Link
JP (1) JP2516196Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2581455Y2 (en) * 1992-12-15 1998-09-21 ミツミ電機株式会社 Shield case

Also Published As

Publication number Publication date
JPH0438085U (en) 1992-03-31

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