JP2581455Y2 - Shield case - Google Patents
Shield caseInfo
- Publication number
- JP2581455Y2 JP2581455Y2 JP1992085994U JP8599492U JP2581455Y2 JP 2581455 Y2 JP2581455 Y2 JP 2581455Y2 JP 1992085994 U JP1992085994 U JP 1992085994U JP 8599492 U JP8599492 U JP 8599492U JP 2581455 Y2 JP2581455 Y2 JP 2581455Y2
- Authority
- JP
- Japan
- Prior art keywords
- ground terminal
- contact
- spring
- shield case
- contact portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【0001】[0001]
【産業上の利用分野】本考案はシールドケースに関する
ものであり、特に、アース端子との接触部位の形状に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield case, and more particularly to a shape of a contact portion with a ground terminal.
【0002】[0002]
【従来の技術】従来のシールドケースを図6に示す。シ
ールドケース1内には基板2が設けられ、同図に於いて
該基板2の背面側に各種電子部品(図示せず)が装着さ
れている。該基板2の背面側には所々にシールド板3,
3…が設けられており、夫々のシールド板3,3…のア
ース端子4,4…は、該基板2を貫通して基板の正面側
へ突出している。前記シールドケース1には金属カバー
5が装着されており、該基板2から突出したアース端子
4,4…に弾性接触して、アース電流をシールドケース
1の接栓6或いはアース接続部(図示せず)へ導通する
ように形成してある。2. Description of the Related Art FIG. 6 shows a conventional shield case. A board 2 is provided in the shield case 1, and various electronic components (not shown) are mounted on the back side of the board 2 in FIG. On the back side of the substrate 2, shield plates 3,
Are provided, and the ground terminals 4, 4,... Of the respective shield plates 3, 3,... Penetrate through the substrate 2 and protrude toward the front side of the substrate. A metal cover 5 is mounted on the shield case 1 and makes elastic contact with the ground terminals 4, 4... Protruding from the substrate 2 so that ground current flows through the plug 6 of the shield case 1 or a ground connection portion (not shown). )).
【0003】金属カバー5とアース端子4との接触部位
は、例えば、金属カバー5の三方に切り込みを設けて片
持ちのばね部7を形成し、図7に示すように、該ばね部
7を基板2側へ折り曲げておき、前記アース端子4へ弾
性接触させながら金属カバー5をシールドケース1へ装
着する。或いは、金属カバー5に平行なスリットを開穿
して両持ちのばね部8を形成し、図8に示すように、該
ばね部8を基板2側へ折り曲げておき、前記アース端子
4へ弾性接触させながら金属カバー5をシールドケース
1へ装着する。[0003] A contact portion between the metal cover 5 and the ground terminal 4 is formed, for example, by forming cuts on three sides of the metal cover 5 to form a cantilevered spring portion 7, as shown in FIG. 7. The metal cover 5 is mounted on the shield case 1 while being bent toward the substrate 2 and brought into elastic contact with the ground terminal 4. Alternatively, a slit parallel to the metal cover 5 is opened to form a double-ended spring portion 8, and the spring portion 8 is bent toward the substrate 2 as shown in FIG. The metal cover 5 is attached to the shield case 1 while making contact.
【0004】[0004]
【考案が解決しようとする課題】従来のシールドケース
1は、前述したように、片持ちのばね部7或いは両持ち
のばね部8を基板2側へ折り曲げておき、夫々のばね部
7或いは8にアース端子4を弾性接触させている。然
し、片持ちのばね部7の場合は、ばねの基部7aのみが
金属カバー5に接続されており、アース端子4との接触
部7bは金属ケース5に接触していない。従って、金属
カバー5のばねの基部7a側と接触部7b側とで電圧差
が生じ、アース効果が低下する。As described above, in the conventional shield case 1, the cantilevered spring portion 7 or the both-sided spring portion 8 is bent toward the substrate 2, and the respective spring portions 7 or 8 are bent. The ground terminal 4 is brought into elastic contact with the ground. However, in the case of the cantilevered spring portion 7, only the base 7 a of the spring is connected to the metal cover 5, and the contact portion 7 b with the ground terminal 4 does not contact the metal case 5. Therefore, a voltage difference occurs between the base 7a of the spring of the metal cover 5 and the contact 7b, and the grounding effect is reduced.
【0005】又、両持ちのばね部8の場合は、片持ちの
ばね部7と比較してばねの弾力性が小さいため、ばねの
たわみ量を微細に調整する必要がある。たわみ量が少な
いと接触圧が減少してアース効果が低下し、たわみ量が
大き過ぎると金属カバー5をシールドケース1へ装着し
た際に、金属カバー5が変形する可能性がある。そこ
で、アース端子との弾性接触圧を最適にして金属カバー
の変形をなくすとともに、良好なアース効果を得るため
に解決すべき技術的課題が生じてくるのであり、本考案
はこの課題を解決することを目的とする。Further, in the case of the double-ended spring portion 8, the elasticity of the spring is smaller than that of the cantilevered spring portion 7, so that it is necessary to finely adjust the amount of deflection of the spring. If the amount of flexure is small, the contact pressure is reduced and the ground effect is reduced. If the amount of flexure is too large, the metal cover 5 may be deformed when the metal cover 5 is mounted on the shield case 1. Then, while optimizing the elastic contact pressure with the ground terminal to eliminate the deformation of the metal cover and to obtain a technical problem to be solved to obtain a good grounding effect, the present invention solves this problem. The purpose is to:
【0006】[0006]
【課題を解決するための手段】本考案は上記目的を達成
するために提案せられたものであり、基板からアース端
子を突出し、該アース端子に弾性接触する金属カバーを
装着したシールドケースに於いて、前記アース端子との
接触部位に、平行なスリットを開穿してこのスリット間
に両持ちのばね部を形成し、更に、該ばね部の片側中央
部に片持ちの接触部を形成して前記アース端子を弾性接
触させたシールドケースを提供するものである。SUMMARY OF THE INVENTION The present invention has been proposed to achieve the above-mentioned object, and is intended for a shield case in which a ground terminal is protruded from a substrate and a metal cover elastically contacts the ground terminal. A parallel slit is formed in a contact portion with the ground terminal to form a double- ended spring portion between the slits, and further, a cantilevered contact portion is formed in a central portion on one side of the spring portion. To provide a shield case in which the ground terminal is brought into elastic contact.
【0007】[0007]
【作用】金属ケースとアース端子とは接触部位にて弾性
接触するが、アース端子へ直接的に接触する部分は片持
ちばね構造であるため、ばね圧の調整が容易である。そ
して、アース端子と間接的に接触するばね部は、二つの
スリット間に形成された両持ちのばね構造となっている
ため、両端で電圧差が生じることがなく、アース効果が
良好である。The metal case and the ground terminal make elastic contact with each other at the contact portion, but the portion directly in contact with the ground terminal has a cantilever spring structure, so that the spring pressure can be easily adjusted. Since the spring portion indirectly in contact with the ground terminal has a double-sided spring structure formed between the two slits, a voltage difference does not occur at both ends, and the ground effect is good.
【0008】[0008]
【実施例】以下、本考案の一実施例を図1乃至図5に従
って詳述する。尚、説明の都合上、従来と同一構成部分
についても同時に説明する。図1はシールドケース11
を示したものであり、該シールドケース11内には基板
12が設けられ、同図に於いて該基板12の背面側に各
種電子部品(図示せず)が装着されている。該基板12
の背面側には所々にシールド板13,13…が設けられ
ており、夫々のシールド板13,13…のアース端子1
4,14…は、該基板12を貫通して基板12の正面側
へ突出している。前記シールドケース11には金属カバ
ー15が装着されており、該基板12から突出したアー
ス端子14,14…に弾性接触して、アース電流をシー
ルドケース11の接栓16,16或いはアース接続部
(図示せず)へ導通するように形成する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. For convenience of explanation, the same components as those of the related art will be described at the same time. FIG. 1 shows a shield case 11
A board 12 is provided in the shield case 11, and various electronic components (not shown) are mounted on the back side of the board 12 in FIG. The substrate 12
Are provided in some places on the rear side of the shield plate, and ground terminals 1 of the respective shield plates 13, 13.
., Project through the substrate 12 to the front side of the substrate 12. A metal cover 15 is mounted on the shield case 11, and elastically contacts the ground terminals 14, 14,... Protruding from the substrate 12, and ground current is supplied to the plugs 16, 16 of the shield case 11 or the ground connection portion ( (Not shown).
【0009】金属カバー15とアース端子14との接触
部位は、平行なスリットを開穿してこのスリット間にば
ね部を形成してある。例えば接触部位17は、図2及び
図3に示すように、平行なスリット17a,17b間に
ばね部17cを形成し、スリット17aの外側中央部に
コ字形の切欠部17dを開穿してある。そして、該切欠
部17dに囲繞された部位に、ばね部17cの片側中央
部を突設して片持ちの接触部17eを形成し、該接触部
17eの下面を基板12側へ突出して断面視C字形に形
成する。A contact portion between the metal cover 15 and the ground terminal 14 has a parallel slit formed therein, and a spring portion is formed between the slits. For example, as shown in FIGS. 2 and 3, the contact portion 17 has a spring portion 17c formed between the parallel slits 17a and 17b, and a U-shaped cutout portion 17d is formed in the center of the outside of the slit 17a. . A cantilevered contact portion 17e is formed by projecting a central portion on one side of the spring portion 17c at a portion surrounded by the notch portion 17d, and a lower surface of the contact portion 17e is projected toward the substrate 12 to be viewed in cross section. Form a C-shape.
【0010】而して、図3に示すように基板12側へ突
出した接触部17eを、前記アース端子14へ弾性接触
させながら金属カバー15をシールドケース11へ装着
する。然るとき、C字形の接触部17eは塑性変形しな
がらアース端子14へ接触し、ばね部17cを捩る方向
へ押し戻す。即ち、アース端子14へ直接的に接触する
接触部17eは片持ちばね構造であり、ばね部17c全
体を捩じりながらたわむため、ばね圧の調節が容易であ
り、アース端子14へ間接的に接触するばね部17cは
両持ちばね構造であるため、両端で電圧差が生じること
がなく、アース効果が低下することはない。Then, as shown in FIG. 3, the metal cover 15 is mounted on the shield case 11 while making the contact portion 17e projecting toward the substrate 12 elastically contact the ground terminal 14. At that time, the C-shaped contact portion 17e contacts the ground terminal 14 while being plastically deformed, and pushes the spring portion 17c back in the twisting direction. That is, since the contact portion 17e that directly contacts the ground terminal 14 has a cantilever spring structure and bends while twisting the entire spring portion 17c, it is easy to adjust the spring pressure and indirectly contact the ground terminal 14. Since the contacting spring portion 17c has a double-ended spring structure, no voltage difference occurs at both ends, and the grounding effect does not decrease.
【0011】次に、図1に於いて符号18で示した接触
部位は、前記接触部位17と平面視同一形状であるが、
接触部17eに相当する接触部18eにC字形断面の湾
曲部がなく、金属カバー15の表面と接触部18eとを
同一平面に形成する。然るときは、アース端子14の位
置を高く突出させておき、金属カバー15をシールドケ
ース11へ装着すれば、アース端子14が接触部18e
を押し上げるようにして弾性接触する。Next, the contact portion indicated by reference numeral 18 in FIG. 1 has the same shape as the contact portion 17 in plan view.
The contact portion 18e corresponding to the contact portion 17 e is no curved portion of the C-shaped cross section, to form a contact portion 18e and the surface of the metal cover 15 on the same plane. In such a case, if the position of the ground terminal 14 is made to protrude high and the metal cover 15 is attached to the shield case 11, the ground terminal 14 is brought into contact with the contact portion 18e.
To make elastic contact.
【0012】又、接触部位18の変形として、同図に示
す接触部位19は、前記接触部18eに相当する接触部
19eが片側のスリット19a内へ突出せず、且つ、前
記接触部位17の切欠部17dに相当する切り欠きがな
く、スリット19aは同一幅で直線的に開穿されてい
る。更に、同図に示す接触部位20は、前記接触部位1
9と同様に、平行なスリット20a,20bが直線的に
開穿されているが、図4及び図5に示すように、接触部
20eの基部に基板12方向へ突出した凸部20fを設
けてある。然るときは、該凸部20fがアース端子14
へ弾性接触するため、より確実なアース効果を得ること
ができる。As a deformation of the contact portion 18, a contact portion 19e shown in FIG. 1 does not protrude into the slit 19a on one side, and the contact portion 19e corresponds to the contact portion 18e. There is no notch corresponding to the portion 17d, and the slit 19a is linearly opened with the same width. Further, the contact portion 20 shown in FIG.
Like FIG. 9, the parallel slits 20a and 20b are opened in a straight line. However, as shown in FIGS. 4 and 5, a protrusion 20f projecting toward the substrate 12 is provided at the base of the contact portion 20e. is there. If so, the projection 20f is connected to the ground terminal 14.
The elastic contact makes it possible to obtain a more reliable grounding effect.
【0013】尚、本考案は、本考案の精神を逸脱しない
限り種々の改変を為すことができ、そして、本考案が該
改変されたものに及ぶことは当然である。The present invention can be variously modified without departing from the spirit of the present invention, and it goes without saying that the present invention extends to the modified one.
【0014】[0014]
【考案の効果】本考案は上記一実施例に詳述したよう
に、アース端子へ直接的に接触する部位は片持ちばね構
造であるため、ばね圧の調整が容易であり、アース端子
へ間接的に接触するばね部は両持ちばね構造であるた
め、両端で電圧差が生じることがなく、アース効果が低
下することがない。As described in detail in the above embodiment, the present invention has a cantilever spring structure for directly contacting the ground terminal, so that the spring pressure can be easily adjusted and the ground terminal is indirectly connected to the ground terminal. Since the spring portion that comes into contact with the spring has a double-ended spring structure, no voltage difference occurs at both ends, and the grounding effect does not decrease.
【0015】斯くして、片持ちばねの長所と両持ちばね
の長所を共有し、金属カバーの変形を防止して、良好な
シールド特性を得ることが可能となる。In this manner, the advantages of the cantilever spring and the advantages of the double-support spring are shared, thereby preventing deformation of the metal cover and obtaining good shielding characteristics.
【図1】本考案の一実施例であるシールドケースの一部
切欠正面図。FIG. 1 is a partially cutaway front view of a shield case according to an embodiment of the present invention.
【図2】接触部位の要部を示す正面図。FIG. 2 is a front view showing a main part of a contact portion.
【図3】図2のA−A線断面図。FIG. 3 is a sectional view taken along line AA of FIG. 2;
【図4】変形例である接触部位の要部を示す正面図。FIG. 4 is a front view showing a main part of a contact portion according to a modification.
【図5】図4のB−B線断面図。FIG. 5 is a sectional view taken along line BB of FIG. 4;
【図6】従来例であるシールドケースの一部切欠正面
図。FIG. 6 is a partially cutaway front view of a conventional shield case.
【図7】図6のC−C線断面図。FIG. 7 is a sectional view taken along line CC of FIG. 6;
【図8】図6のD−D線断面図。FIG. 8 is a sectional view taken along line DD of FIG. 6;
11 シールドケース 12 基板 14 アース端子 15 金属カバー 17,18,19,20 接触部位 17a,17b スリット 19a,20a,20b スリット 17c ばね部 17e,18e 接触部 19e,20e 接触部 DESCRIPTION OF SYMBOLS 11 Shield case 12 Substrate 14 Earth terminal 15 Metal cover 17, 18, 19, 20 Contact part 17a, 17b Slit 19a, 20a, 20b Slit 17c Spring part 17e, 18e Contact part 19e, 20e Contact part
Claims (1)
端子に弾性接触する金属カバーを装着したシールドケー
スに於いて、前記アース端子との接触部位に、平行なス
リットを開穿してこのスリット間に両持ちのばね部を形
成し、更に、該ばね部の片側中央部に片持ちの接触部を
形成して前記アース端子を弾性接触させたことを特徴と
するシールドケース。In a shield case in which a ground terminal is protruded from a substrate and a metal cover is elastically contacted with the ground terminal, a parallel slit is opened in a contact portion with the ground terminal to form a gap between the slit and the ground terminal. A shield case, wherein a double- sided spring portion is formed on the spring portion, and a cantilevered contact portion is formed at a central portion on one side of the spring portion to elastically contact the ground terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992085994U JP2581455Y2 (en) | 1992-12-15 | 1992-12-15 | Shield case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992085994U JP2581455Y2 (en) | 1992-12-15 | 1992-12-15 | Shield case |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0652187U JPH0652187U (en) | 1994-07-15 |
JP2581455Y2 true JP2581455Y2 (en) | 1998-09-21 |
Family
ID=13874220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1992085994U Expired - Fee Related JP2581455Y2 (en) | 1992-12-15 | 1992-12-15 | Shield case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2581455Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007141719A (en) * | 2005-11-21 | 2007-06-07 | Smk Corp | Biasing mechanism and connector for memory card |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0451519Y2 (en) * | 1988-01-28 | 1992-12-03 | ||
JP2516196Y2 (en) * | 1990-07-27 | 1996-11-06 | ミツミ電機株式会社 | Circuit device cover contact structure |
JP3025295U (en) * | 1994-10-07 | 1996-06-11 | 直樹 北嶋 | Cut-out eraser cover |
JP3119963U (en) * | 2005-08-18 | 2006-03-23 | 高岡 宣之 | Do not get steamed |
-
1992
- 1992-12-15 JP JP1992085994U patent/JP2581455Y2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0652187U (en) | 1994-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |