JP2511717B2 - LED module - Google Patents

LED module

Info

Publication number
JP2511717B2
JP2511717B2 JP2025858A JP2585890A JP2511717B2 JP 2511717 B2 JP2511717 B2 JP 2511717B2 JP 2025858 A JP2025858 A JP 2025858A JP 2585890 A JP2585890 A JP 2585890A JP 2511717 B2 JP2511717 B2 JP 2511717B2
Authority
JP
Japan
Prior art keywords
metal substrate
insulating metal
lens plate
lens
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2025858A
Other languages
Japanese (ja)
Other versions
JPH03230586A (en
Inventor
英二 井利
亘 中岡
博昭 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP2025858A priority Critical patent/JP2511717B2/en
Publication of JPH03230586A publication Critical patent/JPH03230586A/en
Application granted granted Critical
Publication of JP2511717B2 publication Critical patent/JP2511717B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Led Device Packages (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は自動車のハイマウントストップランプ、テー
ルランプ等に、或はバーコードリーダー用光源、LEDデ
ィスプレイ等に使用されるLED(発光ダイオード)モジ
ュールに関するものである。
Description: TECHNICAL FIELD The present invention relates to an LED (light emitting diode) module used for a high mount stop lamp, a tail lamp, etc. of an automobile, or a light source for a bar code reader, an LED display, etc. It is a thing.

(従来の技術および解決しようとする課題) LEDチップに電気リードおよび小反射鏡を取り付け、
これらを樹脂モールドした、いわゆる樹脂モールドLED
の多数個をボードに配設したLEDモジュールは製作が面
倒でコスト高となる所から、本願発明者等は、例えばア
ルミから成る金属基板層とその上の絶縁層と更にその上
に設けた電極回路パターンとから成る絶縁金属基板に多
数個のくぼみを設け、くぼみの底部にLEDチップを設置
しくぼみの側壁面を反射面とすると共に、絶縁金属板の
前面に例えばエポキシ樹脂より成り多数個のレンズを備
えたレンズ板をレンズの位置がLEDチップの位置に対応
するように設け、量産に適し、低コストで生産し得るLE
Dモジュールを特願昭62−328018号等において提案し
た。
(Prior art and problem to be solved) Attach electric lead and small reflector to LED chip,
So-called resin-molded LEDs that are resin-molded with these
Since the LED module in which a large number of the above are arranged on the board is troublesome to manufacture and costly, the inventors of the present invention have proposed, for example, a metal substrate layer made of aluminum, an insulating layer thereover, and electrodes provided thereon. A large number of dents are provided on an insulating metal substrate consisting of a circuit pattern, an LED chip is installed on the bottom of the dent, and the side wall surface of the dent is used as a reflecting surface, and the front surface of the insulating metal plate is made of, for example, epoxy resin. LE with a lens plate equipped with a lens so that the lens position corresponds to the LED chip position, suitable for mass production and low cost
A D module was proposed in Japanese Patent Application No. 62-328018.

本発明はこのLEDモジュールの改良に係るものであ
る。
The present invention relates to an improvement of this LED module.

上記のLEDモジュールにおいては、絶縁金属基板の金
属基板層とエポキシ樹脂等より成るレンズ板との熱膨張
係数の差が大きく、しかも金属基板層の厚さはくぼみを
設ける加工(通常、しぼり加工)を容易にするため比較
的薄く選ばれ、金属基板層がアルミより成る場合で通常
1mm程度であり、レンズ板はこれより厚く例えば非レン
ズ部で1.9mm、レンズ部では4.0mmに達するため、モジュ
ールの温度上昇時或は下降時に膨張係数が大きいレンズ
板の膨張力、収縮力により絶縁金属基板が屈曲し、LED
モジュール全体が変形し、その光放射パターン変化し、
悪化する。また温度サイクルにより屈曲を繰り返してい
る中にレンズ板と絶縁基板との接着が剥離したり、LED
の電極と電極回路パターンとを接続するボンディングワ
イヤがレンズ板の下部で擦られてボンディングワイヤが
切断することもある。
In the above LED module, the difference in the coefficient of thermal expansion between the metal substrate layer of the insulating metal substrate and the lens plate made of epoxy resin or the like is large, and the thickness of the metal substrate layer is provided with a depression (usually a squeezing process) It is usually chosen to be relatively thin to facilitate
It is about 1 mm, and the lens plate is thicker than this, for example, 1.9 mm in the non-lens part and 4.0 mm in the lens part, so the expansion coefficient and the contraction force of the lens plate have a large expansion coefficient when the temperature of the module rises or falls. Insulated metal substrate bends, LED
The entire module is deformed, its light emission pattern is changed,
Getting worse. Also, during repeated bending due to temperature cycling, the adhesion between the lens plate and the insulating substrate may peel off,
In some cases, the bonding wire that connects the electrode and the electrode circuit pattern is rubbed under the lens plate to cut the bonding wire.

本発明はこれらの不都合を解消することを目的とする
ものである。
The present invention aims to eliminate these disadvantages.

(課題を解決するための手段) 本発明のLEDモジュールは、金属基板層2の上に電気
絶縁層3、電極パターン4を順次設けた絶縁金属基板1
に周縁部6を残して凹部7を形成し、その底部に多数の
くぼみ8を設け、該くぼみ8の底部にLED11を設置し、
くぼみ8の側壁面10を反射面とすると共に、絶縁金属基
板1の前面にレンズ板16を結合してなり、該レンズ板16
は、各LED11の中心位置にそれぞれ対応するように位置
決めされた複数のレンズ17と、前記絶縁金属基板1の金
属基板層2よりも肉厚が厚い非レンズ部とからなり、さ
らにレンズ板16には絶縁金属基板1の周縁部6に直接結
合されていることを特徴とする。
(Means for Solving the Problems) The LED module of the present invention is an insulating metal substrate 1 in which an electric insulating layer 3 and an electrode pattern 4 are sequentially provided on a metal substrate layer 2.
A concave portion 7 is formed leaving the peripheral edge portion 6 in the bottom, a large number of depressions 8 are provided at the bottom thereof, and an LED 11 is provided at the bottom of the depression 8,
The side wall surface 10 of the recess 8 is used as a reflecting surface, and the lens plate 16 is coupled to the front surface of the insulating metal substrate 1.
Is composed of a plurality of lenses 17 positioned so as to correspond to the central positions of the LEDs 11, respectively, and a non-lens portion having a thickness larger than that of the metal substrate layer 2 of the insulating metal substrate 1, and the lens plate 16 further includes Is directly bonded to the peripheral edge portion 6 of the insulating metal substrate 1.

(作用) 本発明においては絶縁金属基板に凹部を形成したこと
により絶縁金属基板の耐屈曲強度が向上するので、温度
上昇時或は降下時のレンズ板の膨張収縮による絶縁金属
基板の屈曲が防止され、モジュールの屈曲変形により放
射光パターンが変化し、悪化するようなことがない。屈
曲の繰り返しによるレンズ板と絶縁金属基板との接着の
剥離或はボンディングワイヤの切断の惧れもない。
(Function) In the present invention, since the bending resistance of the insulating metal substrate is improved by forming the concave portion in the insulating metal substrate, the bending of the insulating metal substrate due to the expansion and contraction of the lens plate when the temperature rises or falls is prevented. Therefore, the radiated light pattern does not change due to the bending deformation of the module and is not deteriorated. There is no fear of peeling the adhesion between the lens plate and the insulating metal substrate or cutting the bonding wire due to repeated bending.

(実施例) 図面に基づき本発明のLEDモジュールの構成および実
施例を以下に詳細に説明する。
(Example) The structure and example of the LED module of the present invention will be described in detail below with reference to the drawings.

第1図は本発明のLEDモジュールの一例の縦断面図、
第2図はそのLEDを配設した絶縁金属基板の上面図を示
す。
FIG. 1 is a longitudinal sectional view of an example of the LED module of the present invention,
FIG. 2 shows a top view of an insulating metal substrate on which the LED is arranged.

図において、絶縁金属基板1は、アルミ、銅、鉄、ス
テンレス等の金属から成る金属基板層2とエポキシ樹
脂、ガラス繊維入りエポキシ樹脂、ポリエチレン、架橋
ポリエチレン、ポリイミド、ポリアミドイミド、ポリエ
ステル、ポリウレタン等の電気絶縁性材料から成る電気
絶縁層3とアルミニウム、銅、金、ニッケル等の導電性
金属から成る電極パターン4およびリード回路パターン
5とから成る。絶縁金属基板1はその周縁部6を残して
陥没状の凹部7が形成されており、凹部7の底部には多
数個のくぼみ8が設けられている。絶縁金属基板1に所
望の耐屈曲強度を付与する凹部7の深さは金属基板層2
を構成する金属の種類により、まず厚さ等により異る
が、金属基板層が厚さ0.5mm〜2.0mmのアルミより成る場
合で、凹部の深さは0.5mm〜1.5mmである。くぼみ8の大
きさおよび深さは設置するLEDの寸法により異るが、通
常は底径が0.4mm〜1.0mm、くぼみ上部の開口径が1.0mm
〜2.0mm、深さ0.2mm〜0.5mmである。これらの凹部7お
よびくぼみ8はプレスによるしぼり加工等により同時に
成形することができる。
In the figure, an insulating metal substrate 1 is made of a metal substrate layer 2 made of a metal such as aluminum, copper, iron or stainless steel and an epoxy resin, epoxy resin containing glass fiber, polyethylene, crosslinked polyethylene, polyimide, polyamide imide, polyester, polyurethane or the like. An electrical insulating layer 3 made of an electrically insulating material, an electrode pattern 4 made of a conductive metal such as aluminum, copper, gold and nickel, and a lead circuit pattern 5. The insulating metal substrate 1 is formed with a recessed concave portion 7 leaving the peripheral edge portion 6 thereof, and a large number of recesses 8 are provided in the bottom portion of the concave portion 7. The depth of the concave portion 7 that imparts a desired bending resistance to the insulating metal substrate 1 is determined by the metal substrate layer 2
First, depending on the type of metal constituting the layer, it depends on the thickness, etc., but when the metal substrate layer is made of aluminum with a thickness of 0.5 mm to 2.0 mm, the depth of the recess is 0.5 mm to 1.5 mm. The size and depth of the recess 8 depend on the size of the LED to be installed, but normally the bottom diameter is 0.4 mm to 1.0 mm, and the opening diameter at the top of the recess is 1.0 mm.
~ 2.0 mm, depth 0.2 mm ~ 0.5 mm. These recesses 7 and depressions 8 can be simultaneously formed by pressing or the like.

くぼみの底部9とくぼみの側壁面10は電極パターン4
により覆われ、電極パターンは図示のようにテール状の
延長部41がくぼみ8の外側に延長している。くぼみ8の
側壁面10を覆う電極パターン4は光反射面として機能す
る。従って必要があれば光の反射効率を高めるために光
沢研磨或はニッケル、クロム、金等の光沢メッキを施
す。
The bottom 9 of the recess and the side wall 10 of the recess are the electrode pattern 4
The electrode pattern has a tail-shaped extension 41 extending to the outside of the recess 8 as shown in the drawing. The electrode pattern 4 covering the side wall surface 10 of the recess 8 functions as a light reflecting surface. Therefore, if necessary, gloss polishing or gloss plating of nickel, chromium, gold or the like is performed to enhance the light reflection efficiency.

くぼみの底部9の電極パターン4上にはLED11が設置
され、例えば導電性接着材(たとえば銀ペースト等)に
よりこれに接着され、LEDの表面電極12は隣接するくぼ
みの電極パターンの延長部41にボンディングワイヤ13に
よって接続される。図に示すように多数個のLEDがリー
ド回路パターン5の間に直列に接続されると共に、直列
に接続されたLEDの列がリード回路パターン5により並
列に接続されている。リード回路パターン5は電源回路
(図示せず)に接続されている。14はリード回路パター
ン5とLED11との間に接続された抵抗で、直列に接続さ
れたLEDに流れる電流を制限するためのものである。
The LED 11 is installed on the electrode pattern 4 on the bottom 9 of the recess and is adhered thereto by, for example, a conductive adhesive (such as silver paste), and the surface electrode 12 of the LED is extended to the extension 41 of the electrode pattern of the adjacent recess. It is connected by a bonding wire 13. As shown in the figure, a large number of LEDs are connected in series between the lead circuit patterns 5, and a series of LEDs connected in series is connected in parallel by the lead circuit patterns 5. The lead circuit pattern 5 is connected to a power supply circuit (not shown). Reference numeral 14 is a resistor connected between the lead circuit pattern 5 and the LED 11 for limiting the current flowing through the LEDs connected in series.

15は絶縁金属基板1の凹部7全体を、或は少くともく
ぼみ8とボンディングワイヤ13を封止する封止樹脂で、
例えばシリコン樹脂、エポキシ樹脂、ポリマーボネート
樹脂等の光透過性の有機高分子より成る。
Reference numeral 15 is a sealing resin for sealing the entire concave portion 7 of the insulating metal substrate 1, or at least the recess 8 and the bonding wire 13,
For example, it is made of a light-transmitting organic polymer such as a silicone resin, an epoxy resin, and a polymer bonate resin.

16は多数のレンズ17を備えたレンズ板で、レンズ17の
位置がくぼみ8、LED11の中心位置に対応するように位
置決めして絶縁金属基板1の前面に結合される。図では
レンズ板16は絶縁金属基板1の周縁部6に接着材18によ
り接着されている。レンズ板16は多数のレンズ17と非レ
ンズ部とからなる1枚ものの板であり、該非レンズ部は
レンズ板16に相当の機械的強度を具備させるために相応
の厚さを具備させる必要があり、絶縁金属基板1の金属
基板層2よりも厚肉とされる。例えば、金属基板層2の
厚さが1mm程度ならば、非レンズ部は1.9mm程度の厚さと
される。前述のようにレンズ板16と金属基板層2との膨
張係数の差が大きいので、絶縁金属基板1とレンズ板16
との結合を強固にするために、絶縁金属基板の凹部7の
全体を充填する封止樹脂と上記周縁部6との全面に接着
材を塗布しレンズ板16を接着してもよいが、接着材の塗
布により光透過性が損われないように留意する必要があ
る。レンズ板16はポリカーボネート、ポリイミド、エポ
キシ樹脂、アクリル樹脂、ポリプロピレン、ナイロンポ
リエチレンテレフタレート、塩化ビニリデン樹脂、三ふ
っ化塩化エチレン樹脂、四ふっ化エチレン−エチレン共
重合樹脂、四ふっ化エチレン−六ふっ化ポリプロピレン
共重合樹脂等の光透過性の有機光分子より成る。
Reference numeral 16 is a lens plate provided with a large number of lenses 17, and the lens 17 is positioned so that the position of the lens 17 corresponds to the center of the recess 8 and the LED 11 and is coupled to the front surface of the insulating metal substrate 1. In the figure, the lens plate 16 is adhered to the peripheral edge portion 6 of the insulating metal substrate 1 with an adhesive material 18. The lens plate 16 is a single plate composed of a large number of lenses 17 and a non-lens portion, and the non-lens portion needs to have a corresponding thickness in order to provide the lens plate 16 with a considerable mechanical strength. The insulating metal substrate 1 is thicker than the metal substrate layer 2. For example, if the metal substrate layer 2 has a thickness of about 1 mm, the non-lens portion has a thickness of about 1.9 mm. Since the difference in expansion coefficient between the lens plate 16 and the metal substrate layer 2 is large as described above, the insulating metal substrate 1 and the lens plate 16 are
In order to strengthen the bond with the lens board 16, an adhesive may be applied to the entire surface of the sealing resin filling the entire concave portion 7 of the insulating metal substrate and the peripheral edge portion 6, and the lens plate 16 may be adhered. Care must be taken not to impair the light transmission by applying the material. Lens plate 16 is polycarbonate, polyimide, epoxy resin, acrylic resin, polypropylene, nylon polyethylene terephthalate, vinylidene chloride resin, trifluoroethylene chloride resin, tetrafluoroethylene-ethylene copolymer resin, tetrafluoroethylene-hexafluoropropylene It is composed of a light-transmitting organic photomolecule such as a copolymer resin.

LED11から放出された光は、くぼみ8の側壁面10およ
びレンズ17により反射、集光されて前方に放射される。
The light emitted from the LED 11 is reflected and condensed by the side wall surface 10 of the recess 8 and the lens 17, and is emitted forward.

上記説明した本発明のLEDモジュールは以下に述べる
ような種々の変形(但し、これに限られない)が可能で
ある。
The LED module of the present invention described above can be variously modified (but not limited to) as described below.

絶縁金属基板1は第3図に斜視図(但し、電極パター
ン、リード回路パターンの図示を省略)を示すように凹
部7を設けると共に縁辺に曲げリブ19を設けてもよく、
この場合には絶縁基板の耐捻れ性、耐屈曲性が更に向上
する。凹部7の形状についても第1〜3図に示した陥没
状の凹部に限られず、所望の耐屈曲性を付与し得る限り
種々の変形が可能である。電極パターン4およびくぼみ
8の側壁面10における反射面の形成についても、電極パ
ターンはくぼみの底部9だけを覆い、電極パターンのテ
ール状の延長部41がくぼみの側壁面10に沿ってくぼみの
外側に延長し、金属基板層2のくぼみの側壁面自体が光
の反射面を形成するようにしてもよい。この場合は絶縁
層3は光透過性の絶縁材料により構成する必要があるこ
とは勿論であり、また金属基板層2の表面が光沢性に富
むものであることが望ましい。レンズ板16も第1図に示
すレンズ板とは逆にレンズ17が絶縁金属基板側に向って
凸であってもよく、或は絶縁金属基板側、こると反対側
の双方に凸部を有するものであってもよい。要は、LED1
1の光反射パターンおよびくぼみ8の側壁面10に形成さ
れた反射面の形状と相俟って、LEDの放射光を前方方向
に効率よく集中、放射できればよい訳である。
The insulating metal substrate 1 may be provided with a concave portion 7 and a bending rib 19 on an edge thereof as shown in a perspective view of FIG. 3 (however, an electrode pattern and a lead circuit pattern are not shown).
In this case, the twist resistance and bending resistance of the insulating substrate are further improved. The shape of the recess 7 is not limited to the recessed recess shown in FIGS. 1 to 3, and various modifications are possible as long as desired flex resistance can be imparted. Also regarding the formation of the reflection surface on the side wall surface 10 of the electrode pattern 4 and the depression 8, the electrode pattern covers only the bottom 9 of the depression, and the tail-like extension 41 of the electrode pattern extends along the sidewall surface 10 of the depression to the outside of the depression. The side wall surface of the recess of the metal substrate layer 2 itself may form a light reflecting surface. In this case, it is needless to say that the insulating layer 3 is made of a light-transmissive insulating material, and it is desirable that the surface of the metal substrate layer 2 has a high gloss. In contrast to the lens plate 16 shown in FIG. 1, the lens plate 16 may be such that the lens 17 is convex toward the insulating metal substrate side, or has convex portions on both the insulating metal substrate side and the opposite side. It may be one. In short, LED1
In combination with the light reflection pattern of 1 and the shape of the reflection surface formed on the side wall surface 10 of the recess 8, the emitted light of the LED can be efficiently concentrated and emitted in the forward direction.

レンズ板と絶縁金属基板との結合については、上述し
たような接着材等による結合に加えて、温度変化による
膨脹収縮に基づくレンズとLEDとの位置ずれを防止する
ための機械的な係合固定手段を付加することが望まし
い。本願発明者が検討した所によれば、温度変化による
LEDモジュールの伸縮によりレンズ板のレンズの位置が
絶縁金属基板のくぼみおよびLEDに対して位置ずれを生
じるためにモジュールが前方に放射する光量が低下する
という不都合があり、この位置ずれによる光量の低下は
絶縁金属基板に凹部を設けた絶縁金属基板の曲げ強度を
向上させただけでは充分に抑止できない。これを充分に
抑止するためには矢張り位置ずれを充分に抑止できる係
合固定手段が必要である。第4図(イ)および(ロ)に
こような係合固定手段を備えた絶縁金属基板およびレン
ズ板の斜視図を示している。図の符号のうち第1〜3図
の符号と同一の符号は同一部分を表わしている。絶縁金
属基板1にはその周縁部6に歯型状の溝20が設けられて
いる。一方レンズ板15は上記の歯型状の溝20にぴったり
と嵌合する脚21を備えている。絶縁金属基板1とレンズ
板16とは溝20と脚21との嵌合により係合固定され、温度
変化による伸縮に基づく位置ずれが抑止され、後記の実
験例に示すように位置ずれによる光量の低下がほぼ完全
に防止される。このような係合固定部としては、絶縁金
属基板の周縁部6に多数個の穴を設け、レンズ板にはこ
の穴に挿通される脚もしくはピンを設けたものでもよ
く、或は絶縁金属基板とレンズ板との双方の対応位置に
穴を設け、これらにロックピンを挿通したものでもよ
い。これらの係合固定部はLEDモジュールの組立時にお
ける絶縁金属基板のくぼみ、LEDとレンズ板のレンズと
の位置合せが簡単にできるという利点をもたらす。
Regarding the connection between the lens plate and the insulating metal substrate, in addition to the connection by the adhesive material as described above, mechanical engagement fixing to prevent the displacement of the lens and the LED due to expansion and contraction due to temperature change It is desirable to add means. According to a study by the inventor of the present application,
Due to the expansion and contraction of the LED module, the position of the lens on the lens plate is displaced with respect to the recess of the insulating metal substrate and the LED, which reduces the amount of light emitted forward by the module, which reduces the amount of light. Cannot be sufficiently suppressed only by improving the bending strength of the insulating metal substrate having the recessed portion on the insulating metal substrate. In order to sufficiently suppress this, it is necessary to provide an engaging and fixing means capable of sufficiently suppressing the displacement of the arrow tension position. FIGS. 4 (a) and 4 (b) are perspective views of an insulating metal substrate and a lens plate provided with such engaging and fixing means. Of the reference numerals in the drawings, the same reference numerals as those in FIGS. 1 to 3 represent the same parts. The insulating metal substrate 1 is provided with a tooth-shaped groove 20 on its peripheral edge portion 6. On the other hand, the lens plate 15 is provided with legs 21 that fit snugly into the tooth-shaped groove 20 described above. The insulating metal substrate 1 and the lens plate 16 are engaged and fixed by fitting the groove 20 and the leg 21, and the positional displacement due to expansion and contraction due to temperature change is suppressed, and the amount of light due to the positional displacement is suppressed as shown in an experimental example described later. The drop is almost completely prevented. As such an engaging and fixing portion, a large number of holes may be provided in the peripheral portion 6 of the insulating metal substrate, and the lens plate may be provided with legs or pins to be inserted into the holes, or the insulating metal substrate It is also possible to provide holes at corresponding positions of both the lens plate and the lens plate and insert the lock pin into them. These engaging and fixing portions bring about an advantage that the recess of the insulating metal substrate and the alignment of the LED with the lens of the lens plate can be easily performed when the LED module is assembled.

(実験例1) 第1図および第2図に示すような構造を有する本発明
のLEDモジュールであって凹部の深さを異にする試料
と、凹部を有しない点を除けば同様な構造を有する従来
のLEDモジュールの試料について、−40℃で30分保存し
た後、100℃で30分保存するのを1サイクルとし、これ
を10サイクル繰り返すヒートシヨック試験を実施し、LE
Dモジュールに生じる屈曲すなわち反りの状況を観察し
た結果は第1表の通りであった。
(Experimental Example 1) An LED module of the present invention having a structure as shown in FIG. 1 and FIG. 2 has a similar structure except for a sample having different recess depths and having no recess. For the conventional LED module sample, the sample was stored at -40 ° C for 30 minutes and then stored at 100 ° C for 30 minutes as one cycle, and a heat shock test was repeated for 10 cycles.
Table 1 shows the results of observing the condition of bending or warpage occurring in the D module.

各試料とも金属基板層がアルミより成り、その厚さは
約1.0mmであり、レンズ板はエポキシ樹脂より成り、板
厚は約1.9mmで、8個のレンズを備え、レンズの頂点か
らレンズ板下面迄の厚さは4.0mmであった。LEDモジュー
ルの縦、横の寸法はそれぞれ80mmと10mmであった。
In each sample, the metal substrate layer is made of aluminum, the thickness is about 1.0mm, the lens plate is made of epoxy resin, the plate thickness is about 1.9mm, it has 8 lenses, and the lens plate is from the top of the lens. The thickness up to the bottom surface was 4.0 mm. The vertical and horizontal dimensions of the LED module were 80 mm and 10 mm, respectively.

(実験例2) 実験例1と同じ構造、寸法のLEDモジュールで、凹部
の有無、係合固定部の有無および位置を異にする下記の
試料1〜4について実験例1と同様にヒートシヨック試
験を実施し、モジュールが放射する光量の変化を測定し
た。その結果を第2表に示す。第2表においてはヒート
シヨック試験実施前の光量を100%としたときの光量の
減少割合を%で示している。
(Experimental Example 2) The same heat shock test as in Experimental Example 1 was performed on the following Samples 1 to 4 having the same structure and dimensions as those in Experimental Example 1 but different in presence / absence of concave portions, presence / absence of engaging / fixing portions, and positions. Was carried out and the change in the amount of light emitted by the module was measured. Table 2 shows the results. In Table 2, the reduction rate of the light amount is shown in% when the light amount before the heat shock test is 100%.

試料1:凹部および係合固定部なし。Specimen 1: No recess and engaging and fixing part.

試料2:凹部の深さ1.0mm、係合固定部なし。Specimen 2: Depth of recess is 1.0 mm, no engaging and fixing part.

試料3:凹部の深さ1.0mm、レンズとレンズとの中間の位
置に歯型状の溝による係合固定部。
Specimen 3: Depth of recessed part was 1.0 mm, and engaging and fixing part was formed by a tooth-shaped groove at an intermediate position between lenses.

試料4:凹部の深さ1.0mm、レンズの真横に歯型状の溝に
よる係合固定部。
Specimen 4: Depth of the recess is 1.0 mm, and the engaging and fixing part is a tooth-shaped groove just beside the lens.

(発明の効果) 本発明のLEDモジュールは、非レンズ部の肉厚を金属
基板層よりも厚肉とすることにより、レンズ板の機械的
強度を強くすることができ、またレンズ板と基板周縁部
とを直接結合させることにより、レンズと各LEDとの光
軸合せが容易になるという利点がある。そしてこれら構
成を採用したことにより懸念される問題‥‥レンズ板の
厚肉化による熱膨張・収縮力の増大、レンズ板と基板と
の直接結合によるモジュールの変形等‥‥は、上記実験
例1からも明らかなように、絶縁金属基板に充分な深さ
の凹部を形成することにより絶縁金属基板の耐屈曲強度
を向上させ、温度変化によるレンズ板の膨脹、収縮によ
るLEDモジュールの屈曲が抑止でき、モジュールの屈曲
によりモジュールから放射する光のパターンが変化し、
悪化するようなことがない。また熱のON、OFFにより屈
曲の繰り返しが生じレンズ板と絶縁金属基板との接着が
剥離する、或はボンディングワイヤが切断される惧れも
ない。しかも、絶縁金属基板に設ける凹部とこれの底部
に設ける多数のくぼみとをしぼり加工等により同時に成
形することが可能であり、LEDモジュールの量産性を損
うことなく必要な耐屈曲強度を付与することができる。
(Advantages of the Invention) In the LED module of the present invention, the mechanical strength of the lens plate can be increased by making the thickness of the non-lens portion thicker than the metal substrate layer, and the lens plate and the peripheral edge of the substrate can be increased. There is an advantage that the optical axis of the lens and each LED can be easily aligned by directly connecting the parts. The problems of concern due to the adoption of these configurations are the increase in thermal expansion / contraction force due to the thickening of the lens plate, the deformation of the module due to the direct coupling between the lens plate and the substrate, etc. As is clear from the above, by forming a recess of sufficient depth in the insulating metal substrate, the bending resistance of the insulating metal substrate is improved, and bending of the LED module due to expansion and contraction of the lens plate due to temperature changes can be suppressed. , The pattern of light emitted from the module changes due to the bending of the module,
It doesn't get worse. Further, there is no fear that the bending of the lens plate and the insulating metal substrate may be peeled off due to ON / OFF of heat and the bonding wire may be cut. Moreover, it is possible to simultaneously form the concave portion provided on the insulating metal substrate and the large number of depressions provided at the bottom portion of the insulating metallic substrate by squeezing processing or the like, and impart the necessary bending strength without impairing the mass productivity of the LED module. be able to.

更に本発明のLEDモジュールにおいて絶縁金属基板に
上記凹部を設けると共に絶縁金属基板とレンズ板とを係
合する係合固定部を設けた場合には、実験例2から明ら
かなように、温度変化による伸縮に基づくレンズとLED
との位置ずれによりLEDモジュールの放射光量が減少す
るという不都合をもほぼ完全に解消できる。そしてこれ
らの係合固定部は本発明のLEDモジュールの組立におい
てレンズ板の位置決めを簡単に行うことができる量産上
の利点をももたらす。
Further, in the LED module of the present invention, when the concave portion is provided in the insulating metal substrate and the engaging fixing portion that engages the insulating metal substrate and the lens plate is provided, it is clear from Experimental Example 2 that the temperature change Lens and LED based on expansion and contraction
It is possible to almost completely eliminate the inconvenience that the amount of radiated light of the LED module decreases due to the misalignment between and. Further, these engaging and fixing portions also bring an advantage in mass production in which the lens plate can be easily positioned in the assembly of the LED module of the present invention.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明のLEDモジュールの一例の縦断面図、第
2図はそのLEDを配設した絶縁金属基板の上面図、第3
図は本発明における絶縁金属基板の他の例の斜視図、第
4図(イ)および(ロ)は更に他の例の絶縁金属基板お
よびレンズ板の斜視図である。 (符号の説明) 1:絶縁金属基板、2:金属基板層、3:絶縁層、4:電極パタ
ーン、5:リード回路パターン、7:凹部、8:くぼみ、10:
側壁面、11:LED、13:ボンディングワイヤ、16:レンズ
板、17:レンズ、19:曲げリブ、20:歯型状の溝、21:脚
FIG. 1 is a vertical sectional view of an example of an LED module of the present invention, FIG. 2 is a top view of an insulating metal substrate on which the LED is arranged, and FIG.
FIG. 4 is a perspective view of another example of the insulating metal substrate according to the present invention, and FIGS. 4 (a) and 4 (b) are perspective views of the insulating metal substrate and the lens plate of still another example. (Explanation of symbols) 1: Insulating metal substrate, 2: Metal substrate layer, 3: Insulating layer, 4: Electrode pattern, 5: Lead circuit pattern, 7: Recess, 8: Dimple, 10:
Side wall surface, 11: LED, 13: bonding wire, 16: lens plate, 17: lens, 19: bending rib, 20: toothed groove, 21: leg

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】金属基板層2の上に電気絶縁層3、電極パ
ターン4を順次設けた絶縁金属基板1に周縁部6を残し
て凹部7を形成し、その底部に多数のくぼみ8を設け、
該くぼみ8の底部にLED11を設置し、くぼみ8の側壁面1
0を反射面とすると共に、絶縁金属基板1の前面にレン
ズ板16を結合してなり、該レンズ板16は、各LED11の中
心位置にそれぞれ対応するように位置決めされた複数の
レンズ17と、前記絶縁金属基板1の金属基板層2よりも
肉厚が厚い非レンズ部とからなり、さらにレンズ板16に
は絶縁金属基板1の周縁部6に直接結合されていること
を特徴とするLEDモジュール。
1. A recess 7 is formed in an insulating metal substrate 1 in which an electric insulating layer 3 and an electrode pattern 4 are sequentially provided on a metal substrate layer 2 while leaving a peripheral edge portion 6 and a large number of recesses 8 are provided in the bottom portion thereof. ,
The LED 11 is installed on the bottom of the depression 8 and the side wall surface 1 of the depression 8
In addition to 0 as a reflecting surface, a lens plate 16 is coupled to the front surface of the insulating metal substrate 1, and the lens plate 16 has a plurality of lenses 17 positioned so as to correspond to the center positions of the LEDs 11, respectively. An LED module comprising a non-lens portion having a thickness larger than that of the metal substrate layer 2 of the insulating metal substrate 1, and further being directly coupled to the peripheral portion 6 of the insulating metal substrate 1 to the lens plate 16. .
【請求項2】絶縁金属基板1の金属基板層2が厚さ0.5m
m〜2.0mmのアルミ板より成り、凹部7の深さが0.5mm〜
1.5mmであることを特徴とする請求項1記載のLEDモジュ
ール。
2. The metal substrate layer 2 of the insulating metal substrate 1 has a thickness of 0.5 m.
Made of an aluminum plate of m ~ 2.0 mm, the depth of the recess 7 is 0.5 mm ~
The LED module according to claim 1, wherein the LED module has a size of 1.5 mm.
【請求項3】絶縁金属基板1とレンズ板16とに互いに係
合する係合固定部を設けたことを特徴とする請求項1又
は2記載のLEDモジュール。
3. The LED module according to claim 1, wherein the insulating metal substrate 1 and the lens plate 16 are provided with engagement fixing portions which are engaged with each other.
JP2025858A 1990-02-05 1990-02-05 LED module Expired - Lifetime JP2511717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025858A JP2511717B2 (en) 1990-02-05 1990-02-05 LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2025858A JP2511717B2 (en) 1990-02-05 1990-02-05 LED module

Publications (2)

Publication Number Publication Date
JPH03230586A JPH03230586A (en) 1991-10-14
JP2511717B2 true JP2511717B2 (en) 1996-07-03

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JP2001332769A (en) * 2000-05-22 2001-11-30 Mitsubishi Cable Ind Ltd Light emitting diode lighting equipment
TW591990B (en) * 2001-07-25 2004-06-11 Sanyo Electric Co Method for making an illumination device
JP2005268405A (en) * 2004-03-17 2005-09-29 Dow Corning Toray Co Ltd Metal base circuit board for optical device and manufacturing method thereof
TWI249257B (en) 2004-09-24 2006-02-11 Epistar Corp Illumination apparatus
US7866853B2 (en) 2004-11-19 2011-01-11 Fujikura Ltd. Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light
JP4628877B2 (en) * 2005-06-07 2011-02-09 株式会社フジクラ Light-emitting element mounting enamel substrate, light-emitting element module, lighting device, display device, and traffic signal device
JP2007042669A (en) * 2005-07-29 2007-02-15 Toyoda Gosei Co Ltd Light source apparatus
JP5352938B2 (en) * 2005-08-25 2013-11-27 東芝ライテック株式会社 Light emitting diode device
US20080074884A1 (en) * 2006-09-25 2008-03-27 Thye Linn Mok Compact high-intensty LED-based light source and method for making the same
JP5057818B2 (en) * 2007-03-28 2012-10-24 京セラ株式会社 Light emitting device
TW200843135A (en) * 2007-04-23 2008-11-01 Augux Co Ltd Method of packaging light emitting diode with high heat-dissipating efficiency and the structure thereof
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JP2013235878A (en) * 2012-05-02 2013-11-21 Ibiden Co Ltd Electronic component mounting substrate, case unit, and manufacturing method of electronic component mounting substrate
JP6139979B2 (en) * 2013-05-23 2017-05-31 シャープ株式会社 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD

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