JP2511545Y2 - Particle getter jig cap - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention covers the exposed portion of a jig used in order to prevent generation of particles originating from the jig used to mount the equipment in a thin film forming apparatus by vapor phase growth. The present invention relates to a jig cap to which a particle getter is attached or which is composed of the particle getter itself.

[0002]

2. Description of the Related Art Conventionally, vapor phase growth technology has been used to form many thin films such as thin films for electrodes and diffusion barriers of integrated circuits, magnetic thin films for magnetic recording media, and ITO transparent conductive films for liquid crystal display devices. in use. The thin film forming technology by this vapor phase growth method includes thermal decomposition method, hydrogen reduction method, non-uniformization reaction method,
There are chemical vapor deposition such as plasma CVD method, vacuum deposition method, sputtering method, ion beam method, and discharge polymerization method.

At present, such a thin film forming process by the vapor phase growth method has been established as a mass production technique, but there is a problem that coarse particles generally called particles are deposited on the formed film.

The particles mean particles scattered in the apparatus when forming a thin film and deposited on the substrate in clusters. In many cases, the clustered particles have a diameter of several μm. Therefore, when this is deposited on the substrate, for example, in the case of an LSI, problems such as short-circuiting of wiring or conversely disconnection occur, which causes an increase in defective rate. These particles have various factors such as those caused by the thin film forming method itself and those caused by the thin film forming apparatus.

[0005]

As the particles caused by the above-mentioned thin film forming apparatus, scattered particles adhered to the periphery of the substrate, the inner wall (furnace wall) of the apparatus, shutters, shields, and other equipment, and were generated. One of the major factors is that the adhered film peels off and is scattered again and adheres to the substrate to become a pollution source. In order to prevent particles resulting from such re-peel of the adhered substance, it is necessary to always clean the inner wall of the thin film forming apparatus and the equipment surface. It is actually very difficult to keep such an inner wall clean at all times, it takes a lot of time to get completely clean,
In addition, depending on the inner wall and parts of the equipment, there are places where cleaning cannot be practically performed.

As one of the countermeasures, Al foil and electrolytic Fe
The use of pollution control materials with disposable foil foil was considered. It was considered possible to keep the inner wall in a clean state by attaching these foils to the inner wall in advance and removing this after the thin film formation (covering operation). However, fatal defects were found in these disposable foils. That is, the thin film-forming scattered material deposited on the installed foil is easily separated, and particles are still generated on the deposited film on the substrate. To prevent this peeling, the foil must be changed frequently,
The operability of thin film formation deteriorated significantly.

Under these circumstances, the present applicant first replaced the conventional metal foil by (1) treating electrolytic copper foil (the matte surface (matte surface) of the electrolytic copper foil was further subjected to electrolytic treatment to obtain a matte surface). Electrolyzed copper foil in which fine particles of copper or copper oxide are randomly deposited on the minute lump-shaped protrusions (knobs) present in
(2) A surface of the treated electrolytic copper foil further coated with the same material as the thin film to be formed in the thin film forming apparatus or a similar material that is harmless, (3) a bellows-shaped metal foil,
It has been proposed to use (4) a metal foil having a large number of irregularities formed by embossing and (5) a metal sprayed film having a mesh on one surface. These are called particle getters because they are remarkably excellent in trapping action and retaining action of flying particles and effectively prevent the generation of particles.

[0008]

By mounting such a particle getter on the inner wall of the apparatus (furnace wall), equipment such as shutters and shields, the generation of particles is remarkably reduced and the thin film formed is Improvements in yield and reliability have been confirmed. However, at present, no measures are taken for jigs such as bolts and screws used for mounting and fixing the above-mentioned devices such as the shutter and the shield. Therefore, it was confirmed that particles were generated due to the exfoliation of the deposit on the exposed surface of the jig. In addition, the removal of the jig is hindered due to the fact that these deposits cover the surface of the jig, and the work of removing the devices is not quick.

An object of the present invention is to further improve the yield and reliability of the thin film formed in the apparatus by preventing the deposits on the exposed surface of the jig from being peeled off in the thin film forming apparatus. It is to facilitate the removal of the jig.

[0010]

Means for Solving the Problems The present inventor has used a jig cap which completely covers an exposed portion of the jig when it is used and can be attached / detached thereto by one-touch or a simple operation. It was devised to attach a particle getter to or to construct the jig cap itself with a particle getter, and as a result of the trial, a satisfactory result was obtained. Thus, the present invention provides (1) a jig cap for covering an exposed portion of a jig used in a thin film forming apparatus by vapor phase growth during use, and a particle getter attached to the outer surface of the jig cap. A particle getter jig cap provided with an elastic snap-fitting type attaching / detaching means provided on the jig cap, and (2) covering an exposed portion of a jig used in a thin film forming apparatus by vapor phase growth during use. Provided is a particle getter jig cap including a jig cap composed of a particle getter and an elastic fitting type attaching / detaching means provided on the jig cap.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A "thin film forming apparatus by vapor phase growth" in the present invention is a chemical vapor deposition method (CVD) such as a thermal decomposition method, a hydrogen reduction method, a non-uniform reaction method, a transport reaction method, plasma CVD, low pressure CVD and the like. ), Vapor phase epitaxy (VPE) method, vacuum deposition method, sputtering method, molecular beam epitaxy (MB
E) means a thin film forming apparatus by a vapor phase growth method such as a method, an ion beam method or a discharge polymerization method. Devices such as a substrate support, a shutter, a shield, a shutter opening / closing means, and a valve are mounted and fixed in such a device by fasteners such as bolts, nuts, washers, screws, and retaining rods. In the present invention, the term "jig" refers to a fastener used for mounting and fixing devices and parts and members related thereto.

Particles for preventing the generation of particles by capturing scattered particles generated in the apparatus during the thin film forming operation on the surface of the equipment and the inner wall of the apparatus and holding them so that the adhered film is not peeled off. Getters are worn. However, conventionally, no attention has been paid to the jig or attention has been paid to it, and for example, the head of the jig remains exposed when the jig is used. In the present invention, a jig cap that covers the exposed portion of the jig in use is used, and a particle getter is attached to the jig cap or the jig itself is composed of a particle getter.
Since the jig cap must be able to be quickly and easily attached / detached to / from the jig exposed portion, the jig cap is provided with an elastic fitting type attaching / detaching means.

Referring to FIG. 1, there is shown an example of a flat bolt as an example of a jig and a jig cap of the present invention for the flat bolt. Here, the flat bolt 6 is a device 7 such as a shield.
Is used to fix the to the support 8. Particle getters 9 are attached to the exposed surfaces of the device 7 and the support 8 by means such as spot welding. When the flat bolt is tightened, its head is exposed. According to the invention, this exposed head is covered by the jig cap. Two
Two types of jig caps are shown at the top, and a particle getter 3 is attached to the right jig cap 1 by spot welding or the like, and the side surface of the jig cap is elastic around the flat nut head. The taper 5 is formed to such an extent that it can be fitted into the. The taper 5 constitutes an elastic fitting type attaching / detaching means. The jig cap may be made of any material such as stainless steel and aluminum as long as it can be used in a vacuum apparatus. On the other hand, the jig cap 4 on the left side is itself made of a particle getter and is also formed with a taper 5. In this case, the cap is composed of a thicker particle getter.

The jig caps 1 and 4 to which the particle getter is attached or which is composed of the particle getter itself.
However, it is attached with one touch by elastically fitting around the exposed head of the flat bolt. In this way, not only the equipment but also the jig exposed part is covered with the particle getter, so that particles flying during the thin film forming operation are captured by the particle getter and the generated adhesion film is held so as not to peel off. . After forming the thin film, the jig caps 1 and 4 are removed from the jig head with one touch. There is no attached film on the exposed jig head, so that there is no hindrance to removal of the jig for device replacement. The jig cap is disposable and the jig itself is reused.

FIG. 2 shows a state in which the jig cap 4 having the particle getter 3 attached to the hexagon socket head cap screw 16 is attached. In this case, the elastic fitting type attaching / detaching means has the projection 1 that is elastically fitted and inserted into the hexagonal hole formed in the bolt head.
It consists of 5. The projection 15 has a slit for elasticity.

FIG. 3 shows a flat jig cap 4 fitted with a particle getter 3 as applied to a hexagon socket embedded bolt 16. Here again, the elastic fitting type attaching / detaching means is composed of the protrusion 15 elastically fitted and inserted into the hexagonal hole formed in the head portion of the bolt.

As described above, the proper jig cap is selected according to the type of jig and the condition of the exposed portion, and the appropriate elastic fitting type attaching / detaching means is selected. As the elastic fitting type attachment means, a taper action other than the form shown in the figure, a meshing action between the groove and the projection, the use of a spring material, and a combination thereof can also be used. Various forms of the groove and the manner of forming the slit of the protrusion are possible.

As the particle getter, the above listed (1) treat electrolytic copper foil (2) treat electrolytic copper foil surface is further coated with the same material as the thin film to be formed in the thin film forming apparatus or a similar material which is harmless. (3) bellows-shaped metal foil, (4) embossed metal foil and (5) combination of 1 or 2 and 3 or 4, (6) metal sprayed film having mesh on one surface is typically used. It

The treated electrolytic copper foil is obtained by further subjecting the matte surface (matte surface) of the electrolytic copper foil to electrolytic treatment to form fine lump-shaped protrusions (knobs) present on the matte surface into fine particles of copper or copper oxide. Is a treated electrolytic copper foil that is additionally deposited at random,
When observed with an electron microscope, it is observed that fine particles (nodules) of copper or copper oxide are deposited on the knob-shaped rough surface. Examples of conditions for electrolytic treatment applied to electrolytic copper foils are: (A) Water-soluble copper sulfate plating bath CuSO ₄ .5H ₂ O, g / l (as Cu): 23 NaCl, ppm (as Cl) : 32 H ₂ SO ₄ , g / l: 70 glue, g / l: 0.75 pure water: balance (B) plating conditions current density: 60-100 A / ft ² bath temperature: 70-80 ° F time : 10 to 100 seconds The treated electrolytic copper foil has a surface roughness Rz of 5.0 to 10.0.
It is desirable to set it in the range of μm. Due to the presence of the protrusions due to this roughness, the surface area is increased and the adhesion effect with the adhesion film formed by depositing the scattered substances is improved by the anchor effect, and the peeling phenomenon is less likely to occur.

The coated treated electrolytic copper foil, which is obtained by further coating the surface of the treated electrolytic copper foil with the same material as the thin film to be formed in the thin film forming apparatus or a similar material which is harmless, can prevent contamination caused by the copper foil in the apparatus. In order to prevent it more completely, the vapor phase growth method etc.
It is formed by additionally forming a pollution prevention film such as a thin metal of 00000Å, an alloy, a silicide, or an oxide.

The bellows-shaped metal foil has a surface area remarkably increased by forming the metal foil into a bellows shape by a forming process such as roll forming, and the amount of adhesion per unit area is reduced. It suppresses the increase of stress and reduces the cracking of the adhered film and thus the peeling. The bellows shape imparts elasticity to the metal foil, reduces the internal stress itself due to the adhered matter, and prevents peeling.

The embossed metal foil is formed by forming irregularities having random or regularity on the metal foil by a forming process such as press working or roll forming.
As a result, the surface area is remarkably increased, the amount of adhesion per unit area is reduced, the increase of internal stress due to the increase of the amount of adhesion is suppressed, and the cracks of the adhered film and thus the peeling are reduced. Furthermore, isotropic stretchability is imparted to the metal foil, the internal stress itself due to the adhered matter is reduced, and peeling hardly occurs.

The metal sprayed film having a mesh on one surface is obtained by reinforcing the sprayed film with a mesh to give the sprayed film a self-supporting property. The sprayed film has appropriate irregularities, the adhesion effect with the adhesion film formed by depositing the scattered material is improved by the anchor effect, and the peeling phenomenon hardly occurs.

It goes without saying that the treated electrolytic copper foil may be subjected to bellows processing or embossing processing to improve its function as a particle getter.

The thickness of the particle getter is preferably 20 to 350 μm, and more preferably 50 to 250 μm, from the viewpoint of handleability. When the cap itself is composed of a particle getter, it is made thick enough to ensure independence. It goes without saying that the exposed surface is a matte surface (in the case of electrolytic copper foil) or a sprayed surface.

The particle getter is attached to the jig cap by spot welding, brazing or the like, but may be adhered when the inside of the apparatus is maintained at a low temperature.

(Examples and Comparative Examples) A film forming test was conducted in a sputtering thin film forming apparatus using a W-Ti target. 10 μm of the presence or absence of peeling of adhered matter when the heads of the jigs (bolts) for fixing the shield and shutter are covered with a jig cap to which treat electrolytic copper foil is attached (A) and not (B). ,
Comparisons were made after forming 100 μm and 500 μm films.
The results were as follows: Exfoliation from jig 10 μm 100 μm 500 μm A No No No No B No Yes Yes

[0028]

[Effect of device] 1. It is possible to prevent peeling of the attached film attached to the jig in the thin film forming apparatus, further reduce the generation of particles on the formed thin film, and further improve the yield and reliability of the product. 2. Since the jig cap can be attached to the jig by a simple operation, there is almost no increase in work time. 3. After use, the jig has no foreign matter attached, so there is no problem in removing it and the jig can be reused. 4. Since the device and the particle getter of the jig are separated from each other, it is convenient in terms of work when modifying the device.

[Brief description of drawings]

FIG. 1 shows a state in which two types of jig caps of the present invention are attached to a flat bolt.

FIG. 2 shows a state where a jig cap having a particle getter is attached to a hexagon socket head cap bolt.

FIG. 3 shows a state where a flat jig cap having a particle getter is attached to an embedded bolt having a hexagonal hole.

[Explanation of symbols]

 1 Jig Cap 3 Particle Getter 4 Jig Cap 5 Taper (Elastic Fitting Attachment / Detachment Means) 6 Flat Bolt 7 Equipment 8 Support 9 Particle Getter 15 Projection (Elastic Fitting Attachment / Detachment Means) 16 Hexagon Socket Head Cap Screw

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-298335 (JP, A) JP-A2-118076 (JP, A) Fukuihei 4-109523 (JP, U)

Claims (2)

(57) [Scope of utility model registration request] 1. A jig cap for covering an exposed portion of a jig used in a vapor phase thin film forming apparatus during use,
A particle getter jig cap comprising a particle getter attached to the outer surface of the jig cap, and a resilient fitting type attachment / detachment means provided on the jig cap. 2. A jig cap which covers an exposed portion of a jig used in a thin film forming apparatus by vapor phase growth and which is composed of a particle getter, and an elastic fitting type provided on the jig cap. A particle getter jig cap having a detaching means.