JP2510863Y2 - Contamination prevention device in dicing device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION The present invention is a dicing device equipped with a plurality of blades for cutting fragile members such as semiconductor wafers, and prevents contamination (hereinafter referred to as "contamination") due to cutting droplets between the blades. It relates to the device.

[0002]

2. Description of the Related Art As a dicing device of this type, one having a structure disclosed in Japanese Patent Application Laid-Open No. 62-53804 is well known as a conventional example. 54-
The one disclosed in Japanese Patent No. 147881 is known.

[0003]

In the above dicing apparatus, the above-disclosed blade cover is usually used by being mounted on the blade in a covered state. Then, while driving both blades and supplying the cutting fluid, for example, when a semiconductor wafer is cut, the chips cut by the first blade in the front are splashed together with the cutting fluid into a splash state by the centrifugal force, and The dirt comes out to the side of the second blade and the blade cover located at. Therefore, the second blade side has a higher degree of contamination due to the droplets than the first blade side, and the difference in contamination adherence also increases in the cutting region and the inspection means, whereby each region is cut. There is a problem that not only differences in contamination of wafers occur but also variations in detection of blade wear and the like occur.

[0004]

As a concrete means for solving the problems of the conventional example, the present invention is provided with first and second spindles, and each spindle is provided with a first and a second blade. A dicing device equipped with each blade covered with a blade cover and equipped with a detection means for each blade, wherein droplets generated when the wafer or the like is cut by the first blade reach the second blade. The present invention provides a contamination prevention device in a dicing device, characterized in that at least one droplet blocking member is provided between the first and second blade covers, and the droplet blocking member has a cross section. Forming a V shape, and providing a splash blocking member on each blade cover between the first and second blade covers, It is specified that the blade detecting means is arranged on the blade cover on the terminal side corresponding to the rotating direction of the blade, and the cutting fluid supply means is arranged on the blade cover on the starting side corresponding to the rotating direction of the blade. The configuration is as follows.

[0005]

With the above-mentioned means, that is, by providing the splash blocking member between the first and second blade covers, the first
The droplets produced by the cutting action of the blade are blocked and are not taken out to the cutting region of the second blade, so that the contamination due to the contamination can be prevented in the cutting region of the second blade. Further, since the blade detecting means is provided at the specified position, the contamination adhesion due to the droplets is reduced, and the normal detection can be performed.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A dicing apparatus is equipped with a first spindle 1 and a second spindle 2 which are driven by an appropriate drive source with an appropriate interval, and each spindle has a first blade 3 and a second blade 2. Blades 4 are attached to each of them, and each of them is configured to rotate in the direction of arrow a, and is configured to be movable in the up-down direction and the front-rear direction in relation to a chuck table 6 described later.

A workpiece 5 such as a semiconductor wafer to be cut by the blade is supported and fixed to an appropriate supporting means, for example, a chuck table 6, and the chuck table 6 is selectively moved in the left-right direction and the rotation direction. Alternatively, it is configured to be rotatable.

The first blade 3 and the second blade 4
Blade covers 7 and 8 are attached to the blade cover in a covered state, respectively, to detect cutting water or cutting liquid (coolant) supply means, that is, cutting liquid supply nozzles 9 and 10 and a broken or worn state of the blade. Detection means 1
1, 12 are provided.

With respect to the positions where the cutting fluid supply means 9 and 10 and the blade detection means 11 and 12 are arranged, the cutting fluid supply means 9 and 9 are provided on the starting end side in accordance with the rotation directions of the blades 3 and 4, respectively. 10 is provided, and blade detecting means 11 and 12 are provided on the terminal end side. That is, the vicinity of the position immediately after cutting the workpiece 5 with the blade, that is, the right side in the figure is defined as the start end in the rotation direction, and the left side is defined as the end end, and the cutting liquid supply to the right side of the blade covers 7 and 8. Means are provided, and blade detection means is provided on the left side. The blade detection means used in this case is
It is an optical detection means that makes a light emitting element and a light receiving element face each other via a blade, and a generally used one is used as it is.

Further, the blade covers 7 and 8 are provided with droplet blocking members 13 and 14 so as to be located between the first blade 3 and the second blade 4. In this case, one droplet blocking member 13 is provided on the right side of the blade cover 7, and the other droplet blocking member 14 is provided on the blade cover 8.
To the left of. And both splash blocking members 13, 14
In each case, the position can be finely adjusted by sliding the adjusting knobs 15 and 16 in the vertical direction.

The droplet blocking members 13, 1 arranged in this way
By providing both of them, it is possible to further prevent splashes. However, even if at least one splash blocking member is present, for example, by providing the splash blocking member 14 on the left side of the blade cover 8 of the second blade, the splash blocking member 4 is sufficiently splashed. Experiments have shown that it contributes to prevention. Therefore, it is important that at least one droplet blocking member is interposed between the first and second blades 3 and 4, and dirt including cutting waste generated by the driving of the first blade 3 is interposed. Almost all the particles are blocked by the splash blocking member, and it is possible to prevent the splash or the carry-in on the second blade 4.

The splash blocking members 13 and 14 can be made of flat plate material, but can also have a configuration having a V-shaped cross section as in the second embodiment shown in FIG. In the case of such a droplet blocking member having a dogleg shape,
The doglegs are arranged with the inner sides thereof facing the blade cover. Further, the droplet blocking member may be configured so as to collect the droplets and prevent the droplets from falling onto the wafer.

When the workpiece is cut by the dicing device having the contamination prevention device having the above-mentioned structure, the first and second blades 3 and 4 simultaneously act on the workpiece 5 to cut the workpiece. However, the dirt including the cutting dust generated on the first blade 3 is scattered by the rotation of the blade and becomes a droplet, and this droplet is scattered by the droplet blocking member 13 in the first stage. In addition, the splash blocking member 14 prevents the splash of the second stage. Therefore, almost no dirt is brought into the cutting region of the second blade 4, and in that region as well, the cutting process which is substantially equivalent to that of the first blade 3 is performed.

Further, by disposing the blade detecting means 11 and 12 on the terminal end side corresponding to the rotation of each blade, the amount of dirt adhering to the droplets is reduced and both blades can be detected. Is performed substantially evenly in.

[0015]

As described above, the contamination prevention device in the dicing device according to the present invention has the first and second contamination prevention devices.
A dicing apparatus comprising: a first spindle and a second blade on each spindle, each blade being covered by a blade cover, and having a detecting means for each blade; By providing at least one droplet blocking member between the first and second blade covers so that the droplets generated when the object to be cut is cut do not reach the second blade. When the cutting of the workpiece is performed,
Since the droplets containing the cutting waste by the first blade are blocked by the droplet blocking member and are not brought into the cutting region of the second blade, the cutting process by the second blade is substantially the same as the cutting process by the first blade. It is carried out under the same conditions, whereby the blade breakage and the like can be detected well, and the quality of the work piece is constant, which is an excellent effect.

Further, by forming the droplet blocking member in a V shape in cross section, or by providing a droplet blocking member on each blade cover between the first and second blade covers, It also has an excellent effect that the splash of the droplets by the blade is effectively prevented.

Further, by disposing the blade detecting means on the blade cover on the terminal side corresponding to the rotating direction of the blade, the amount of dirt adhering due to the droplets in the vicinity of the detecting means and the blade itself to be detected is reduced. The excellent effect of properly detecting the blade is obtained.

[Brief description of drawings]

FIG. 1 is a schematic side view showing a main part of a contamination prevention device according to the present invention.

FIG. 2 is a perspective view of an essential part showing a second embodiment of the splash blocking member.

[Explanation of symbols]

 1 First Spindle 2 Second Spindle 3 First Blade 4 Second Blade 5 Workpiece (Semiconductor Wafer) 6 Support Means (Chuck Table) 7,8 Blade Cover 9,10 Cutting Fluid Supply Means 11,12 Blade detection means 13,14 Adjustment knob

Claims (5)

(57) [Scope of utility model registration request] 1. A first and a second spindle are provided, each spindle is equipped with a first and a second blade, each blade is covered by a blade cover, and a detection means for each blade is provided. In the dicing device, the first blade prevents the droplets generated when the object to be cut is cut from reaching the second blade.
And at least one splash blocking member provided between the second blade cover and the contamination prevention device in the dicing device. 2. The contamination prevention device in a dicing device according to claim 1, wherein the splash blocking member is formed in a V shape in cross section. 3. The contamination prevention device in a dicing apparatus according to claim 1, wherein a splash blocking member is provided on each blade cover between the first and second blade covers. 4. The contamination prevention device in a dicing device according to claim 1, 2 or 3, wherein the blade detection means is disposed on the blade cover on the terminal side corresponding to the rotation direction of the blade. 5. The cutting fluid supply means is arranged on the blade cover on the starting end side corresponding to the rotating direction of the blade.
A contamination prevention device in the dicing device according to 2, 3, or 4.