JP2510416C - - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for dicing a semiconductor wafer, and more particularly, to a semiconductor wafer dicing method.
Is fixed to the dicing film with relatively strong adhesive strength, and after dicing
In addition to significantly reducing the adhesive strength of the dicing film,
Dicing semiconductor wafers that can pick up dies
About the method. Conventional technology When manufacturing an integrated circuit, a semiconductor wafer, for example, a silicon wafer
In order to obtain a dice of a predetermined size by performing dicing
Has a silicon wafer on a pressure-sensitive adhesive sheet called a so-called dicing film.
Is placed on the dicing film and cut under the pressure-sensitive adhesive.
Is picked up from the film. Therefore, silicon
In order to accurately dice the eha, use a dicing film when dicing.
Has a strong adhesive force to the silicon wafer, while the obtained die is
When picking up film from dicing film, the dicing film
We need to be weak. Without limitation, for example, silicon
When dicing a wafer, the dicing film is 100 to 500 g / 2.
Adhesive strength of about 5mm or more, while picking up dies
The dicing film has an adhesive strength of about 20 to 50 g / 25 mm or less.
It is said that it is desirable to. However, in this way, after application to the adherend, its adhesive strength is reduced if necessary.
The pressure-sensitive adhesive which can be applied is not yet known, and therefore has the required characteristics as described above.
A dicing film to be filled has not been conventionally known. On the other hand, generally in the field of adhesives, photopolymerizable oligomers, photopolymerizable monomers
UV curable adhesive consisting of photopolymerization initiator and other additives is already known
This is a solvent-free, one-part adhesive that is fast-curing and requires heating.
This adhesive is excellent in that it does not
This is performed in order to give the adhesive a required adhesive strength. Problems to be solved by the invention The present inventors have a strong adhesive strength at first, and can reduce the adhesive strength if necessary.
After extensive research into obtaining a pressure sensitive adhesive, unexpectedly,
The pressure-sensitive adhesive composition containing an ultraviolet-crosslinkable acrylic acid ester and a polymerization initiator as main components, when the ultraviolet ray is irradiated on the composition, the adhesive strength is significantly reduced.
Was found. Accordingly, a layer of the pressure-sensitive adhesive composition on a base resin sheet capable of transmitting ultraviolet light.
Is formed as a dicing film, the dicing film is
When dicing, it has a strong adhesive force to the silicon wafer.
By irradiating ultraviolet light from the back of the dicing film after icing, the pressure-sensitive adhesive
Since the product significantly reduces its adhesive strength, dice the resulting dice with a dicing film.
It can be easily picked up from. However, on the other hand, in such a method, the wafer is placed on the dicing film.
When bonding and fixing, air enters between the dicing film and the wafer.
When bubbles are formed, pressure sensitive adhesion to the dice peeled from the dicing film
The agent composition remains, so-called glue remains. Although it is not always clear,
UV-crosslinkable acrylic acid in pressure-sensitive adhesive composition in contact with wafer
Even after Tell irradiates the dicing film with ultraviolet light, air bubbles (oxygen) cause
The curing reaction is hindered, and the adhesive composition still retains sufficient adhesive strength.
As a result, it is considered that glue is transferred to the wafer and glue residue occurs.
After dicing the wafer, when peeling the dice from the dicing film,
Note that a large peeling force is required. In this way, when glue residue is left on the die, it is necessary to connect the conductor to the die.
It becomes difficult or the heat diffusion from the chip after die processing becomes poor,
It may reduce the reliability of the body device and cause a failure. Thus, the present inventors have conducted intensive research to solve such a problem, and as a result,
As described above, an adhesive composition whose adhesive strength is significantly reduced by ultraviolet irradiation is
When dicing a semiconductor wafer using a dicing film having
When bonding and fixing the wafer to the dicing film under an inert gas,
The inventors have found that no residue occurs, and have led to the present invention. Accordingly, the present invention generally relates to a method for dicing a semiconductor wafer, and
Then, fix the semiconductor wafer to the dicing film with a relatively strong adhesive force.
After dicing, the adhesive strength of the dicing film is reduced and obtained
A semiconductor wafer that can be picked up without any adhesive residue on the die
An object is to provide a dicing method. Means to solve the problem The method for dicing a semiconductor wafer according to the present invention comprises a substrate capable of transmitting ultraviolet light.
Saturated polyester resin or polyacrylate or acrylic on resin sheet
UV crosslinkable to 100 parts by weight of elastic polymer composed of acid ester copolymer
Of a pressure-sensitive adhesive containing 15 to 200 parts by weight of an acrylate and a polymerization initiator
The semiconductor wafer is placed under an inert gas on the dicing film with the layer formed.
After fixing and bonding and dicing, the ultraviolet light is applied from the back of the dicing film.
Irradiating with a wire to reduce the adhesive strength of the pressure-sensitive adhesive before picking up the dice
It is characterized by. The dicing film used in the method of the present invention is a substrate capable of transmitting ultraviolet light.
Elastomer, UV-crosslinkable acrylate and polymerization initiator
A layer of the pressure-sensitive adhesive composition containing as a component is formed,
If a semiconductor wafer is bonded and fixed to the film under an inert gas, a dicing film
Before UV irradiation, the adhesive has strong adhesive strength to enable high-precision dicing.
After that, by irradiating UV light from the back surface, the obtained die is
Adhesive strength to dies can be significantly reduced without leaving glue.
Thus, the dice can be easily picked up and thus obtained.
The dies are clean and do not interfere with the subsequent processing.
Provide reliable semiconductor devices. First, the pressure-sensitive adhesive composition will be described. Conventionally, various pressure-sensitive adhesive compositions
The object is, for example, "Adhesion Handbook (2nd edition)" (edited by Japan Adhesion Association, Nikkan Kogyo Shin
It is known as described on pages 398-414 of Monsha Publishing, 1980)
A typical pressure-sensitive adhesive composition is mainly composed of an elastic polymer, and has good compatibility with the elastic polymer.
Tackifiers and plasticizers, and if necessary, fillers, antioxidants, colorants, etc.
A mixture obtained by mixing them together. In the present invention, as such an elastic polymer,
Saturated copolyester resin or polyacrylate or acrylate
What consists of a copolymer of toluene is used. The above-mentioned saturated copolymerized polyester resin is described, for example, in “Industrial Materials”, Vol.
As described on pages 101 to 106, two or more different saturated divalent compounds are usually used.
Comparison of glass transition temperature obtained by polycondensation of carboxylic acid and saturated dihydric alcohol
This is a saturated copolymer resin having a low molecular weight.
Rubonic acid and aliphatic dihydric carboxylic acid are used in combination, and saturated dihydric alcohol
A group or alicyclic dihydric alcohol, ie, a glycol, is used. In particular, the present invention
In this case, the molar ratio of aromatic dicarboxylic acid / aliphatic dicarboxylic acid is 80/20.
Saturated divalent carboxylic acid having a ratio of from 20/80, preferably from 70/30 to 50/50
Saturated copolymer polyester obtained by polycondensation of the mixture and glycol in equimolar amounts
Resin is preferably used. In the present invention, as the aromatic divalent carboxylic acid,
Terephthalic acid, sebacic acid, adipic acid,
Ethylene glycol, 1,4-butanediol, propylene glycol, etc.
The saturated copolymer polyester resin obtained by using is preferably used. Required
In the production of a saturated copolymerized polyester resin,
Trivalent or higher saturated polycarboxylic acids or trivalent or higher polyhydric alcohols
You may. In addition, as a copolymer of polyacrylate or acrylic acid,
Elastic polymer that is the main component in adhesives known as acrylic adhesives
Includes any used as Elastic polymer in acrylic adhesive
The polymer used as is usually substantially an acrylate copolymer
is there. This copolymer usually has a low glass transition point to make it tacky.
Acrylate, butyl acrylate, acrylic acid-2-
The main monomer is an alkyl acrylate such as ethylhexyl, which has cohesive properties.
Comonomers that form hard polymers with high glass transition temperatures for example
For example, vinyl acetate, acrylonitrile, styrene, methyl acrylate, methacryl
Methyl luate, etc., and carboxylic acid groups, hydroxyl groups,
Group, a glycidyl group, a monomer having a functional group such as a hydroxylmethyl group, for example,
, Acrylic acid, methacrylic acid, itaconic acid, hydroxylethyl methacrylate
, Hydroxyl propyl methacrylate, acrylamide, glycidyl methacrylate
It is a copolymer obtained by copolymerizing a monomer such as a rate. The ultraviolet-crosslinkable acrylate ester used in the present invention is irradiated with ultraviolet light.
Acrylates or methacrylates as oligomers or monomers
Lulic acid ester, at least two acryloyl groups or methacryloyl in the molecule
It has an yl group. Specifically, such oligomers include, for example, oligoesters.
And a monomer such as 1,6-hexanediol.
Rudiacrylate, trimethylolpropane triacrylate, tetramethylo
Methanetetraacrylate, dipentaerythritol hexaacrylate, etc.
Ester of polyhydric alcohol and acrylic acid, or 1,6-hexanediol dimeta
Acrylate, trimethylolpropane trimethacrylate, tetramethylol
Tantetramethacrylate, dipentaerythritol pentamethacrylate, etc.
Esters of polyhydric alcohol and methacrylic acid can be mentioned. The pressure-sensitive adhesive composition used in the present invention is based on 100 parts by weight of the elastic polymer.
And the UV-crosslinkable acrylate is 15 to 200 parts by weight, preferably
It is contained in the range of 50 to 150 parts by weight. About 100 parts by weight of the elastic polymer,
When the UV-crosslinkable acrylate is less than 15 parts by weight, it is obtained.
Irradiation of the adhesive composition with ultraviolet light does not substantially change its adhesive strength, while 2
If the amount exceeds 100 parts by weight, the adhesive strength of the dicing film is reduced by UV irradiation.
Can be reduced, but the die after silicon wafer dicing
UV crosslinkable acrylic ester remains on the dies during pick-up.
Is not preferred. The pressure-sensitive adhesive composition used in the present invention further contains a polymerization initiator or a photosensitizer.
And optionally contains a polymerization inhibitor. The polymerization initiator is the UV-crosslinkable
It is used to promote cross-linking of acrylate by ultraviolet irradiation. This
Such polymerization initiators are generally well known in the art of ultraviolet crosslinking polymerization.
In the present invention, it is possible to use a conventionally known polymerization initiator.
it can. Specific examples of such a polymerization initiator include, for example, benzoin methyl ether
Benzoin alkyl ethers such as benzoin isopropyl ether,
Aromatic oxyketones and aromatic ketones such as zoin, benzyl and benzophenone
, Benzyldimethyl ketal, polyvinylbenzophenone, etc.
However, the present invention is not limited to these. Thermal polymerization inhibitor, the above-mentioned UV-crosslinkable acrylic acid ester does not depend on UV irradiation
Is added as necessary, for example, to prevent polymerization by heat.
As such a polymerization inhibitor, a conventionally known polymerization inhibitor may be used.
Can be used. Such polymerization inhibitors include, for example, picric acid,
Use of enol, hydroquinone, hydroquinone monomethyl ether, etc.
Can be. The amounts of the polymerization initiator and the polymerization inhibitor are determined in the technical field of ultraviolet crosslinking polymerization.
The polymerization initiator may be in accordance with a commonly used method.
1 to 20 parts by weight per 100 parts by weight of the linear crosslinkable acrylate, a polymerization inhibitor
Is used in the range of 0.1 to 1 part by weight as necessary. The pressure-sensitive adhesive composition used in the present invention preferably further contains a tackifier.
Have. The tackifier that can be used is not particularly limited, and is conventionally generally referred to as a pressure-sensitive adhesive.
What is used in the production of the pressure-sensitive adhesive composition that is used is appropriately used
. As such a tackifier, for example, xylene resin, rosin and polymerized rosin,
Modified rosin resins such as hydrogenated rosin, rosin ester, terpene resin, terpene
Terpene resins such as enol resin and rosin phenol resin, aliphatic and aromatic resins
And alicyclic petroleum resin, cumarone resin, styrene resin, alkylphenol
And the like. The tackifier is based on 100 parts by weight of the elastic polymer.
Usually, it is used in the range of 10 to 200 parts by weight. Too little tackifier
If not, the adhesion or cohesion is insufficient, while if too large,
The adhesive force after irradiating the adhesive composition with ultraviolet light has a small width of decrease,
When the adhesive composition is applied to a dicing film, the die
When picking up the dies after polishing, the tackifier may remain on the dies.
This is not preferred. The pressure-sensitive adhesive composition used in the present invention is an elastic polymer in the compounding amount described above,
UV crosslinking acrylic acid ester and polymerization initiator, if necessary, tackifier,
Along with polymerization inhibitors, fillers, antioxidants, colorants, etc., dissolve them in an appropriate organic solvent that dissolves them, for example, aromatic hydrocarbons, ketones, or a mixture thereof.
And can be obtained by As the solvent, for example, specifically, toluene and
A mixed solvent with tyl ethyl ketone is preferably used, but is not limited to this.
It is not something to be done. In addition, the content of the elastic polymer in the adhesive composition depends on the application and the like.
, But is usually in the range of 10 to 50% by weight. But this
It is not limited to this. In particular, elastic polymers and tackifiers are usually commercially available in the form of a solution,
It is convenient to use them, for example, by mixing these solutions and
To the UV-crosslinkable acrylate and polymerization initiator, and if necessary, other additives.
What is necessary is just to add, mix, and dissolve the additives uniformly. The dicing film used in the method of the present invention is a pressure-sensitive adhesive as described above.
By forming a layer of the composition on a base sheet capable of transmitting ultraviolet light in a conventional manner.
I can get it. The base sheet is not particularly limited as long as it can transmit ultraviolet rays.
Although various sheets can be used, usually, a transparent or translucent synthetic resin is used.
Sheets are used. For example, vinyl chloride resin, vinyl chloride-vinylidene chloride
Polymer resin, vinyl chloride-vinyl acetate copolymer resin, polyvinylidene chloride, poly
Olefin, polyvinyl alcohol, polyamide, polyester, polycarbonate
A resin sheet made of a sheet, acetyl cellulose or the like is preferably used. Among the various base resin sheets described above, polyvinyl chloride containing a plasticizer
Or a resin sheet made of a copolymer of vinyl chloride is flexible, and even at a low price.
Therefore, it can be particularly preferably used in the method of the present invention. In addition,
In addition to the phenyl resin sheet, a base sheet containing a plasticizer may be suitably used.
Some are. For example, vinyl chloride-vinylidene chloride copolymer resin, vinyl chloride
-Vinyl acetate copolymer resin, vinyl chloride-acrylate copolymer resin,
Examples thereof include vinylidene chloride and acetyl cellulose. Here, the plasticizer is not particularly limited.
Tallate, dioctyl phthalate, didecyl phthalate, ditridecyl phthalate
Phthalic acid diesters such as butylbenzyl phthalate, tricresyl phosphate, trioctyl phosphate, triphenyl phosphate, 2-ethylhexyl
Phosphate esters such as ludiphenyl phosphate and cresyl diphenyl phosphate
Dioctyl adipate, dioctyl sebacate, dioctyl azelate,
Fatty acid diesters such as tri-2-ethylhexyl cetyl citrate, polypropylene
Polyester plasticizers such as adipate and polypropylene sebacate, epoxidation
Salts of epoxy plasticizers such as soybean oil, chlorinated paraffin, chlorinated fatty acid esters, etc.
Elementary plasticizers and the like. However, as described above, a plasticizer is used as the base sheet of the dicing film.
When a resin sheet containing is used, the plasticizer is converted from the resin sheet into a pressure-sensitive adhesive.
Migrates into the composition, and generally, the plasticizer and the UV-crosslinkable acrylate
UV-crosslinkable acrylic acid ester contained in the pressure-sensitive adhesive composition because of its good compatibility
Tell migrates into the resin sheet, and due to such mutual migration, the dicing film
In some cases, the effect of reducing the adhesive strength of the system after ultraviolet irradiation may be significantly reduced. Therefore, in the present invention, a plasticizer is used as the base sheet of the dicing film.
When using a resin sheet containing, the base sheet and the pressure-sensitive adhesive sheet
UV light is transmitted between them, but plasticizer and UV crosslinkable acrylate are transmitted
It is preferable to interpose a barrier layer made of a resin layer that is not allowed to intervene. That is, this barrier layer does not hinder the transmission of ultraviolet light at all, but
Prevents the contained plasticizer from migrating into the pressure-sensitive adhesive composition, and
The UV-crosslinkable acrylate contained in the adhesive composition is used as a base resin sheet.
And thus, the plasticizer contained in the base resin sheet
UV-crosslinkable acrylic contained in the pressure-sensitive adhesive composition
The acid ester is held in the adhesive composition, and the pressure-sensitive adhesive sheet is irradiated with ultraviolet light.
Prevents the adhesive force from decreasing over time. As the barrier layer, a poly-α-olefin such as polyethylene and polypropylene is used.
Of polyalkylene terephthalate such as fin and polyethylene terephthalate
Lum, a resin coating, for example, a resin coating layer such as a modified polyacrylic resin is preferably used.
Can be Therefore, the barrier layer is composed of the resin exemplified above on the base resin sheet.
The film can be formed by pressing a film, applying a melt of the resin and cooling, or applying a solution of the resin and drying. Also, for example
Apply a modified polyacrylic resin solution and heat dry as necessary to form a coating film.
A barrier layer can also be obtained by forming. Various types of modified polyacrylic resin are conventionally known,
In the invention, generally, UV-crosslinkable acrylic acid having excellent solvent resistance is used.
Alkyd-modified polyester that does not dissolve or swell in the plasticizer contained in the ester or base resin sheet
A acryl resin or a thermosetting polyacryl resin is preferable. Thermosetting polyacryl
As the resin, for example, acid type, hydroxyl type, epoxy type, amide type and the like are preferably used.
Can be. However, in the present invention, as described above, the barrier layer comprises a pressure-sensitive adhesive composition.
UV-crosslinkable acrylate contained in the product and possible to be contained in the base resin sheet
As long as it does not substantially penetrate the plasticizer, it is particularly limited in its material.
It is easily understood that there is no
Is selected according to the specific UV-crosslinkable acrylate and plasticizer. Therefore, the dicing film according to the present invention is, for example, formed on a base resin sheet.
The barrier layer is laminated, and a solution of the pressure-sensitive adhesive composition as described above is coated on the substrate.
It can be obtained by coating on a sheet and drying. The method of the present invention is carried out on a dicing film as described above under an inert gas.
After placing the wafer and fixing it by pressure-sensitive bonding, dicing is performed to a specified size.
Method, and then irradiate ultraviolet light from the back side of the dicing film.
The adhesive strength of the pressure sensitive adhesive composition is reduced, and then the die is picked up.
Here, nitrogen, helium, argon or the like is used as the inert gas.
In practice, nitrogen is preferred. The means and method of irradiating the back surface of the dicing film with ultraviolet light are particularly limited.
In the technical field of UV-curable resin paints and UV-curable adhesives,
It can be by means and methods commonly used. For example, as irradiation means
UV sources such as xenon lamps, low-pressure, medium-pressure, high-pressure or ultra-high-pressure mercury lamps
May be used for several seconds to several minutes. The invention's effect As described above, the elastic polymer, the UV-crosslinkable acrylic acid ester, and the polymerization initiator
Pressure-sensitive adhesive composition containing as a main component, the reason is not necessarily obvious
Although it has no adhesive, it has strong adhesive strength before UV irradiation,
The adhesive strength is significantly reduced. Accordingly, a dicing film having a layer of such a pressure-sensitive adhesive composition was initially prepared.
For example, it has an adhesive force of several hundred g / 25 mm, but the adhesive force is remarkably increased by ultraviolet irradiation.
Especially with the proper formulation of UV-crosslinkable acrylic esters,
Can be set to about several tens g / 25 mm. Therefore, strong adhesion before UV irradiation
Utilizing the technology, semiconductor wafers can be diced with high accuracy.
UV light is applied to the back of the dicing film to adhere the dicing film.
The dice can be easily picked up from the dicing film by reducing the force.
Can be Thus, according to the method of the present invention, the dimensional accuracy is
Dies can be obtained with high productivity. In particular, according to the method of the present invention, the semiconductor wafer is placed on the dicing film under an inert gas.
The adhesive between the dicing film and the wafer allows the air to adhere between the dicing film and the wafer.
Even when bubbles are formed, the bubbles can reduce the adhesive strength of the pressure-sensitive adhesive composition due to ultraviolet irradiation.
Since the reduction effect is not hindered at all, the adherend can be removed from the pressure-sensitive adhesive sheet after UV irradiation.
When peeled, there is no adhesive residue on the adherend.
Its adhesion can be reduced, and thus according to the method of the invention,
A stable and highly reliable dice can be obtained. Example Examples are shown below, but the present invention is not limited to these examples. Ma
In Examples, “parts” means “parts by weight”. Apply a pressure-sensitive adhesive having the composition shown in Table 1 on release paper and dry at 120 ° C for 1 minute.
The pressure-sensitive adhesive layer was formed to a thickness of 10 μm as a solid content. Here, when a saturated copolyester resin is used as the elastic polymer,
Saturated divalent carboxylic acid mixture having a phthalic acid / sebacic acid molar ratio of 70/30 and ethylene
A resin having a glass transition point of about 10 ° C obtained by polycondensation of glycol with equimolar
Using. Elastic polymerization of polyacrylate or acrylate copolymer
When used as a body, polyacrylate or acrylate
Acrylic pressure-sensitive adhesive solution containing coalescence (Polysh 610SA, Sanyo Chemical Industry Co., Ltd.
Acrylate or acrylate copolymer content about 40% by weight) 1
The photocrosslinkable acrylic acid ester, the polymerization initiator,
A sensitizer and the like were dissolved to prepare a pressure-sensitive adhesive composition. This pressure-sensitive adhesive composition is applied on release paper, dried at 120 ° C. for 1 minute,
The adhesive layer was formed to a thickness of 10 μm as a solid content. Next, 100 parts of polyvinyl chloride having an average degree of polymerization of 1300, and diocty as a plasticizer were used.
Chlorination consisting of 35 parts of a ruphthalate or polyester plasticizer and an appropriate amount of a stabilizer
Apply modified acrylic resin on 0.1mm thick sheet molded from vinyl resin composition
After drying to form a barrier layer, the surface of the
The pressure-sensitive adhesive layer according to the present invention is laminated by laminating the pressure-sensitive adhesive layer on the surface.
Obtained. The release paper was peeled off from each of the pressure-sensitive adhesive sheets thus obtained.
Then, the adhesive strength under various conditions was measured as follows. Adhesion before UV irradiation The pressure-sensitive adhesive sheet is cut into 25 mm width and 100 mm length to form a test piece, which is placed under nitrogen.
To prevent the formation of air bubbles in the meantime,
Layer on a flat plate and reciprocated 5 times with a 3kg roller to press and contact, and release at room temperature for 20 minutes
After placing, a 180 ° peel test is performed with a shopper at a tensile speed of 300 mm / min.
Was. Adhesion after UV irradiation When stacking a pressure-sensitive adhesive sheet on a stainless steel plate under air or nitrogen,
Air bubbles between the test piece and the stainless steel plate, and from the vinyl chloride resin sheet side
After irradiating with ultraviolet rays for 7 seconds or 4 seconds at a main wavelength of 365 mμ and 120 W / cm,
The test piece was peeled from the stainless steel plate, and glued to the stainless steel plate visually and with a 50 × microscope.
The presence or absence of the residue was observed. Similarly, when stacking the pressure-sensitive adhesive sheet on a stainless steel plate in the same manner as described above, bubbles large enough to obtain a test piece having a width of 25 mm and a length of 100 mm are removed.
Sheet between the sheet and the stainless steel plate.
Ultraviolet rays were irradiated for 7 seconds at a wavelength of 365 μm and 120 W / cm. Next, the pressure-sensitive adhesive sheet was cut into a width of 25 mm and a length of 100 mm to form a test piece.
In the meantime, layer on a stainless steel plate with 3kg
5 times reciprocating pressure contact, left at room temperature for 20 minutes, then pulled with a shopper
A 180 ° peel test was performed at a speed of 300 mm / min. The results are shown in Table 1. [Table 1] According to the method of the present invention, this is adhered to an adherend, irradiated with ultraviolet rays, and then adhered.
When the body is peeled off, no adhesive remains on the adherend. Also, as a result, after UV irradiation
Is significantly reduced as compared with that before the ultraviolet irradiation. Therefore, the present invention
According to the method described above, after dicing the semiconductor wafer,
The dice can be peeled from the dicing film, and the resulting dice
High reliability. On the other hand, according to an adhesion test under air as a comparative example, the pressure-sensitive adhesive
After the object is adhered to the adherend and irradiated with ultraviolet rays, when the adherend is peeled off,
Adhesive residue is generated, and the adhesive strength after ultraviolet irradiation is still high.

Claims (1)

Claims (1) On a base resin sheet capable of transmitting ultraviolet light, 100 parts by weight of an elastic polymer composed of a saturated copolymerized polyester resin or a copolymer of polyacrylate or acrylate, A semiconductor wafer is placed under an inert gas on a dicing film having a pressure-sensitive adhesive layer containing 15 to 200 parts by weight of an ultraviolet-crosslinkable acrylic acid ester and a polymerization initiator, and is adhered and fixed. A dicing method for irradiating the back surface of the dicing film with ultraviolet light to reduce the adhesive force of the pressure-sensitive adhesive, and picking up the dice. (2) The claim 1 wherein the pressure-sensitive adhesive contains a tackifier.
The dicing method of a semiconductor wafer as described in the above . (3) The method for dicing a semiconductor wafer according to claim 1, wherein the inert gas is nitrogen. (4) In the dicing film, the base resin sheet contains a plasticizer, and is a resin sheet capable of transmitting ultraviolet rays, and is a pressure-sensitive resin containing an elastic polymer, an ultraviolet-crosslinkable acrylic acid ester, and a polymerization initiator. The adhesive layer does not transmit the plasticizer and the UV-crosslinkable acrylate, but through a resin layer that transmits UV light,
2. The dicing method for a semiconductor wafer according to claim 1, wherein the dicing method is formed on the base resin sheet. (5) The method for dicing a semiconductor wafer according to claim 4, wherein the base resin sheet is a resin sheet made of polyvinyl chloride or a copolymer of vinyl chloride.