JP2509647Y2 - ダイオ―ド - Google Patents
ダイオ―ドInfo
- Publication number
- JP2509647Y2 JP2509647Y2 JP4944790U JP4944790U JP2509647Y2 JP 2509647 Y2 JP2509647 Y2 JP 2509647Y2 JP 4944790 U JP4944790 U JP 4944790U JP 4944790 U JP4944790 U JP 4944790U JP 2509647 Y2 JP2509647 Y2 JP 2509647Y2
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- diode
- electrode
- layer
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 150000003377 silicon compounds Chemical class 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Photovoltaic Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Light Receiving Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4944790U JP2509647Y2 (ja) | 1990-05-11 | 1990-05-11 | ダイオ―ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4944790U JP2509647Y2 (ja) | 1990-05-11 | 1990-05-11 | ダイオ―ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH048451U JPH048451U (enrdf_load_stackoverflow) | 1992-01-27 |
| JP2509647Y2 true JP2509647Y2 (ja) | 1996-09-04 |
Family
ID=31567148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4944790U Expired - Fee Related JP2509647Y2 (ja) | 1990-05-11 | 1990-05-11 | ダイオ―ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509647Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-05-11 JP JP4944790U patent/JP2509647Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH048451U (enrdf_load_stackoverflow) | 1992-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3031768B2 (ja) | 車両の透光性パネル | |
| US20090120500A1 (en) | Solar cell package for solar concentrator | |
| US5994641A (en) | Solar module having reflector between cells | |
| US5167724A (en) | Planar photovoltaic solar concentrator module | |
| US4118249A (en) | Modular assembly of a photovoltaic solar energy receiver | |
| US9464783B2 (en) | Concentrated photovoltaic panel | |
| US8586858B2 (en) | Passively cooled, high concentration photovoltaic solar cell package | |
| US20090120499A1 (en) | Systems to retain an optical element on a solar cell | |
| US20080178922A1 (en) | Method and system for manufacturing solar panels using an integrated solar cell using a plurality of photovoltaic regions | |
| EP0608282A1 (en) | Photovoltaic device with increased light absorption and method for its manufacture | |
| JP2001119054A (ja) | 集光型太陽光発電装置 | |
| WO2014020708A1 (ja) | 太陽電池モジュール | |
| JPH05152596A (ja) | 太陽電池モジユール | |
| JP2509647Y2 (ja) | ダイオ―ド | |
| JPS63276279A (ja) | 半導体装置 | |
| TW583703B (en) | Optoelectronic unit and transparent conductive substrate of the same | |
| JPH0718458U (ja) | 太陽電池モジュ−ル | |
| JP2012174724A (ja) | 配線付き絶縁シートとその製造方法、太陽電池セル一体型配線付き絶縁シートとその製造方法、太陽電池モジュールおよびその製造方法 | |
| JPH09331079A (ja) | フレームレス太陽電池モジュール | |
| JPH0456351U (enrdf_load_stackoverflow) | ||
| JPS61203668A (ja) | イメ−ジセンサ | |
| JPH0234975A (ja) | 光起電力素子 | |
| JPH1032344A (ja) | 太陽電池モジュール及びその製造方法 | |
| CN115066758A (zh) | 太阳能电池模块 | |
| JP2000196113A (ja) | 太陽電池 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |