JP2508608Y2 - Solid-state image sensor storage package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in the following order.

A. Industrial field of use B. Overview of the device C. Prior art [Fig. 4] D. Problems to be solved by the device E. Means for solving the problem F. Action G. Example [first 1 to 3] H. Effect of the Invention (A. Field of Industrial Application) The present invention relates to a solid-state image sensor storage package, and more particularly to a solid-state image sensor storage package for storing a slender solid-state image sensor used as a line sensor. .

(B. Overview of the Invention) In the present invention, in the above solid-state image pickup device housing package, in order to prevent the bonded solid-state image pickup device from warping, the solid-state image pickup device support area becomes higher toward the inside. It is formed in a concave shape having no portion.

(C. Prior art) [Fig. 4] The line sensor is extremely slender (for example, 40 mm long,
In many cases, a solid-state image sensor with a width of 1 mm) is housed in a ceramic package and sealed with glass.

4 (A), (B), and (C) show a solid-state imaging device housing package, FIG. 4 (A) is a plan view, and FIG. 4 (B) is a line BB in FIG. 4 (A). Is a cross-sectional view taken along the line C-C of FIG. On the same side, 1 is a ceramic package, which is formed by appropriately printing wiring films on a plurality of green ceramic sheets, stacking the plurality of green ceramic sheets, and then sintering the same. A die pad portion 2 for supporting the element is provided, and 3 is a solid-state image pickup element die-bonded to the die pad portion 2 via a thermosetting resin. The wiring films 4, 4, ... Are formed higher than the die pad forming surface of the ceramic package 1, and the space between the wiring films 4, 4 ,. They are connected by gold connect wires 5, 5, .... Reference numeral 6 denotes a transparent plate which is fixed to the upper end surface of the ceramic package 1 and seals the solid-state image sensor 3 in the ceramic package 1.
For example, it is made of glass.

The conventional solid-state image sensor housing package has an inner bottom surface that supports the solid-state image sensor of the ceramic package 1.
That is, the surface of the die pad portion 2 was formed to be flat.

(D. Problems to be Solved by the Invention) However, when the solid-state image sensor 3 is die-bonded to the conventional solid-state image sensor housing package described above, a warp that cannot be ignored is generated on the surface of the solid-state image sensor 3. was there. Such warpage causes curvature of field and adversely affects optical characteristics.

Then, the inventor of the present application has sought out the cause of such warpage, and found the following.

Since the solid-state image pickup device 3 is adhered to the ceramic package 1 via the thermosetting resin, it is heated during the adhesion.
The coefficient of thermal expansion is different between the ceramic and the silicon forming the solid-state image sensor 3, and the solid-state image sensor 3 is extremely elongated. Therefore, due to the difference in the coefficient of thermal expansion, the solid-state imaging device 3 causes a warp that cannot be ignored due to a change in temperature after adhesion. When the warp of the die pad portion 2 of the ceramic package is 0, the solid-state imaging device 3 warps positively (here, the positive warp means a warp in which the surface is convexly curved, and conversely, the negative warp is a concavely curved surface. Warp), the die pad portion 2 of the ceramic package
If the warp of the solid-state image pickup device becomes positive, the warp of the solid-state imaging device tends to become more positive.

The present invention has been made to solve such a problem, and an object of the present invention is to prevent the solid-state imaging device housed in the package from being warped.

(E. Means for Solving Problems) In order to solve the above-mentioned problems, the solid-state image sensor housing package of the present invention has a solid-state image sensor support area to which the solid-state image sensor is adhered via an adhesive on the entire back surface. It is characterized in that the surface is formed in a concave shape having no portion that becomes higher toward the inside.

(F. Action) According to the solid-state image sensor housing package of the present invention, since the surface of the solid-state image sensor support area is formed in a concave shape, the surface of the solid-state image sensor is made substantially flat due to the warpage caused by the adhesion of the solid-state image sensor. Can be. That is,
The solid-state image sensor tends to warp in the positive direction due to adhesion, but in anticipation of this, the surface of the solid-state image sensor support area is given a negative warp in advance, so there is almost no warp of the solid-state image sensor after bonding. It is possible.

(G. Embodiment) [FIGS. 1 to 3] Hereinafter, a solid-state image sensor housing package of the present invention will be described in detail with reference to illustrated embodiments.

FIG. 1 is a sectional view showing a first embodiment of a package for housing a solid-state image sensor according to the present invention.

The present solid-state imaging device storage package is one in which the die pad portion 2 is given a negative warp. Specifically, a negative warp of about 40 μm was given to the die pad portion 2 that supports the solid-state imaging device 3 having a width of 1 mm, a length of about 40 mm, and a thickness of 0.4 mm.

Then, the surface of the solid-state image sensor 3 after the solid-state image sensor 3 was bonded to the die pad portion 2 of the ceramic package 1 was flat, that is, the warpage was zero.

That is, as described above, the solid-state image sensor 3 is mounted on the die pad unit 2.
When the thermosetting resin 7 is adhered to the solid-state image pickup device 3, the solid-state image pickup device 3 tends to warp due to the difference in the thermal expansion coefficient between the ceramic package 1 and the solid-state image pickup device 3, but it becomes the base of the solid-state image pickup device 3. By imparting a negative warp to the surface of the die pad portion 2 in advance, the warp in the positive direction due to the temperature change after the adhesion can make the warp on the surface of the solid-state image pickup device 3 substantially zero.

As a method of providing such a warp on the die pad portion 2 of the ceramic package 1, a method of providing an appropriate warp on the shape of a portion of the die for molding the die pad portion 2 is preferable.

FIG. 2 is a sectional view showing a second embodiment of the solid-state image pickup device accommodating package of the present invention.

In this embodiment, the die pad portion 2 is not warped by the shape of the die for forming the green ceramic sheet, but the die pad portion 2 is selectively printed to have a thickness of, for example, 40 mm.
By forming the metallized films 8 having a thickness of 8 μm, stepwise concave portions are provided. According to this, the surface of the die pad portion 2 does not have a concave curved surface, but has a shape in which the middle portion is depressed stepwise, but after the bonding, the solid-state imaging device 3
The effect of flattening the surface can be obtained as in the case of the first embodiment. The purpose of flattening the surface of the solid-state image sensor 3 is to simply increase the number of printing steps once without using a green ceramic sheet forming die having a warp (plus warp) at a portion corresponding to the die pad portion. Can be achieved.

FIG. 3 is a sectional view showing a third embodiment of the solid-state image sensor storage package of the present invention.

In the present embodiment, unlike the second embodiment, the stepwise concave portions are not formed by the metallized film 8, but the stepwise portions 9 and 9 are formed integrally with the inner surface of the ceramic package 1 so as to form the stepwise concave portions. The concave portion is provided.
Even in this case, the effect that the surface of the solid-state image sensor 3 becomes flat is obtained as in the case of the first and second embodiments.

For forming the stepwise concave portion of the present solid-state image pickup device housing package, a method of forming by a shape of a mold for forming a green ceramic sheet and a projection on a surface of a first layer sheet which is a base of the ceramic package 1 are formed. Either a method of printing a paste for forming a portion or a method of laminating a green ceramic sheet for forming a protrusion can be adopted.

Thus, the present invention can be implemented in various ways. The present invention is also extremely effective for a line sensor package that pairs a plurality of solid-state image pickup devices. This is because multiple solid-state image sensors are paired and used for multicolor copying, but in that case, if there is a deviation in the amount of warpage between the paired solid-state image sensors, the quality of the reproduced image will deteriorate. Will be done. However, according to the present invention, since the warp of the surface of each solid-state image pickup device can be made substantially zero, such deterioration of quality can be prevented.

(H. Effect of the Invention) As described above, in the solid-state image pickup device housing package of the present invention, the surface of the solid-state image pickup device support region where the solid-state image pickup device is adhered via the adhesive on the entire back surface is moved inward. It is characterized in that it is formed in a concave shape having no moderately high portion.

Therefore, according to the solid-state image sensor housing package of the present invention, the surface of the solid-state image sensor support area is formed in a concave shape so that the surface of the solid-state image sensor becomes substantially flat due to the warpage that occurs after the solid-state image sensor is bonded. can do.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of a solid-state image sensor housing package of the present invention, FIG. 2 is a sectional view showing a second embodiment of a solid-state image sensor housing package of the present invention, and FIG. Sectional drawing which shows the 3rd Example of a solid-state image sensor storage package, FIGS. 4 (A) to 4 (C) show a conventional example of a solid-state image sensor storage package, and FIG. FIG. 6B is a sectional view taken along the line BB of FIG. 7A, and FIG. 7C is a sectional view taken along the line C-C of FIG. Explanation of reference numerals 1 ... Solid-state image sensor housing package, 2 ... Solid-state image sensor support area (die pad part), 3 ... Solid-state image sensor.

Claims (1)

(57) [Scope of utility model registration request] 1. A solid-state image pickup device is formed by forming a concave shape having no portion which becomes higher toward an inner side of a surface of a solid-state image pickup device supporting region which is adhered via an adhesive on the entire back surface. Solid-state image sensor storage package