JP2506518B2 - Polishing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing the surface of a material to be polished with a rotary polishing head.

[0002]

BACKGROUND OF THE INVENTION or a composite material such as FRP (fiber reinforced plastic), metal, wood, as a polishing apparatus for polishing the surface of the stone or the like, disk-shaped for sliding contact with the surface of the object to be polished on the lower surface <br There is one that includes a rotary polishing head and a motor that rotationally drives the polishing head, and polishes the surface of the material to be polished by the polishing head while moving on the material to be polished.

This polishing apparatus is used for sanding before coating,
It is used for various polishing such as buffing and deburring.
The polishing material (polishing cloth or the like) on the polishing head or the sliding surface of the polishing material is replaced according to the material of the polishing material and the polishing item.

This polishing apparatus is classified into a so-called hand-held tool type which is manually moved on the material to be polished and an automatic polishing machine which is moved on the material to be polished by mechanical moving means. In any of the conventional polishing apparatuses, the polishing head drive motor is vertically supported by the apparatus main body, and the polishing head is attached to the rotary shaft of this motor.

The above-mentioned hand-held tool-type polishing apparatus is one in which a handle portion provided on the apparatus body is manually moved to be moved on a material to be polished. The surface of the material to be polished is contacted with a contact pressure corresponding to the force pressing the side.

Further, the polishing apparatus for the above-mentioned automatic polishing machine is such that the apparatus main body is supported by a mechanical moving means such as a robot and is moved on a material to be polished by this moving means. It is pressed downward by a pressure mechanism such as a spring or hydraulic cylinder.The contact pressure of the polishing head with respect to the material to be polished is detected by a contact type or non-contact type sensor that detects the gap between the main body of the equipment and the material to be polished. A predetermined pressure is maintained by controlling the pressing force of the pressurizing mechanism according to the detected value.

[0007]

However, in the conventional polishing apparatus described above, both of the hand-held tool type and the automatic polishing machine, the relative surface between the surface to be polished (the surface of the material to be polished) and the main body of the apparatus. There is a problem that the surface of the material to be polished cannot be uniformly polished because the contact pressure of the polishing head with respect to the surface to be polished varies due to the change in posture.

This is because the polishing head drive motor is supported by the main body of the apparatus that is moved on the material to be polished by manual or mechanical movement means, and the polishing head is attached to the rotary shaft of this motor.

In a hand-held tool type polishing apparatus, it is difficult to always keep the posture of the apparatus main body constant with respect to the surface to be polished. Therefore, the contact pressure of the polishing head with respect to the surface to be polished is biased due to the change of the posture of the apparatus main body. As a result, the polishing head comes into strong contact with the material to be polished on one side, causing shaving and biting to damage the material to be polished.

On the other hand, in a polishing apparatus for an automatic polishing machine, the posture of the apparatus main body can always be kept constant.
If the surface to be polished is an uneven surface, the relative postures of the apparatus main body and the surface to be polished change depending on the angle of the surface to be polished.

That is, a composite material such as FRP, a metal material,
The surface to be polished such as wood and stone is not necessarily a flat surface,
It is often a surface with slight undulations that cannot be seen at first glance, but the posture of the main body of the polishing device is always constant, so the polishing device is not When the surface to be polished reaches a portion where the surface to be polished is inclined with respect to the horizontal plane, the relative postures of the apparatus main body and the surface to be polished change.

In the conventional polishing apparatus, the contact pressure of the polishing head with respect to the surface to be polished is deviated as the posture of the apparatus body relative to the surface to be polished is biased. Therefore, when the polishing apparatus comes to the undulating portion of the surface to be polished, The polishing head strongly contacts the material to be polished on one side, causing shaving and biting, which damages the material to be polished.

An object of the present invention is to constantly flatten a surface of a material to be polished by always bringing a polishing head into flat contact with the surface to be polished irrespective of a relative posture change between the apparatus body and the surface to be polished. An object of the present invention is to provide a polishing device capable of performing the polishing.

[0014]

A polishing apparatus according to the present invention is a first swinging apparatus which is moved on a material to be polished and which swings in one direction with its both sides pivotally supported by the apparatus body. A ring is provided, and inside the first swing ring, both side portions in a direction orthogonal to the swing axis are pivotally supported by the first swing ring, and the swing direction of the first swing ring. A second oscillating ring that oscillates in a direction orthogonal to is provided, and the second oscillating ring supports a polishing head drive motor on the housing, and the rotary shaft of the motor has a disk-shaped polishing head. a polishing unit fitted with a vertically slidably is held on, and the apparatus body, below the polishing head is pressed downwardly to the housing of the polishing unit by a spring force
A polishing unit pressing mechanism for pressing the surface against the material to be polished is provided.

[0015]

That is, according to the polishing apparatus of the present invention, the polishing unit swings in the direction orthogonal to the swinging direction of the first swinging ring swinging in one direction and the swinging direction of the first swinging ring. The polishing unit is supported by the apparatus main body via the second swinging ring to allow the polishing unit to swing and tilt in all directions with respect to the apparatus main body. The ring is slidably held in the vertical direction, and the polishing unit pressing mechanism presses the polishing unit against the material to be polished with a spring force. According to this polishing apparatus, the polishing head of the polishing unit is used. While pressing against the material to be polished, it changes its posture by following its surface.Therefore, the polishing head is always brought into flat contact with the surface to be polished, regardless of the relative change in posture between the main body of the device and the surface to be polished. Research It can be uniformly polish the surface of the wood.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings regarding a polishing apparatus for an automatic polishing machine.

First, the structure of the automatic polishing machine will be described. FIG. 7 is a perspective view of the automatic polishing machine. The automatic polishing machine is laid along with a work piece mounting base 1 and the mounting base 1. It is composed of a robot 3 traveling on a track 2. The robot 3 is a general-purpose work robot, and includes a polishing device 10
Is attached to the wrist 3b at the tip of the arm 3a of the robot 3.

In this automatic polishing machine, the material A to be polished is placed on the mounting table 1 with the surface to be polished facing upward, and the arm 3a of the robot 3 is lowered to a predetermined height and the tip of the arm 3a is lowered. After the polishing apparatus 10 is brought into contact with the surface (surface to be polished) of the material A to be polished, the polishing apparatus 10 is scanned and moved in the width direction of the material A to be polished by the forward and backward movement of the arm 3a, and the traveling movement of the robot 3 is performed. The polishing apparatus 10 is used to polish the entire surface of the material to be polished A by the polishing apparatus 10 while moving the polishing apparatus 10 in the length direction of the material to be polished A. The polishing apparatus 10 causes the robot 3 to move the locus of its wrist 3b. By preliminarily teaching the posture and the posture, the workpiece A is moved while being kept in a substantially constant posture (a substantially vertical posture in this embodiment).

The material A to be polished shown in FIG. 7 is a flap material used for the tail of an aircraft, and this flap material is
It is made of FRP using carbon fiber or aramid fiber or the like, or light metal such as super duralumin or superplastic aluminum alloy.

Next, the structure of the polishing apparatus 10 will be described. 1 to 6 show the structure of a polishing apparatus 10. FIG. 1 is a vertical front view, FIG. 2 is a front view, FIG. 3 is a bottom view, and FIG. 4 is a sectional view taken along line IV-IV of FIG. 5 is a sectional view taken along line VV of FIG. 2, and FIG. 6 is a front view of the polishing unit in a state in which the polishing unit is tilted in one direction.

The polishing apparatus 10 of this embodiment is supported by the arm 3a of the robot 3 shown in FIG.
The device main body 11 which is moved on the material A to be polished by the above, the first swing ring 12 which is swingably provided in the lower part of the device main body 11 in one direction, and the first swing ring 12 A second swing ring 14 provided inside so as to be swingable in a direction orthogonal to the swing direction, and a polishing member held in the second swing ring 14 so as to be vertically slidable. It comprises a unit 16 and a polishing unit pressing mechanism 25 for pressing the polishing unit 16 downward.

The apparatus main body 11 includes a top plate 11a attached to the attachment 4 at the tip of the arm 3a of the robot 3 and a plurality of upper plates 11a standing downward from the outer periphery of the top plate 11a (4 in the figure). Book) columns 11b, and the outer peripheral portion is fixed to the lower ends of the columns 11b to fix the top plate 11b.
It is composed of a circular ring member 11c provided in parallel with a.

The first oscillating ring (hereinafter referred to as the first oscillating ring) 12 is a circular ring having a diameter slightly smaller than the ring member 11c at the lower end of the apparatus main body 11, and the first oscillating ring 12 is Both sides thereof are respectively supported by a horizontal support shaft 13 on a ring member 11c of the apparatus main body 11, and the support shaft 13 is provided to be swingable up and down with a swing axis x (see FIG. 3) as an axis. ing.

The second swing ring (hereinafter referred to as the second swing ring) 14 is a circular ring having a diameter slightly smaller than that of the first swing ring 12, and the second swing ring 14 is
Both side portions of the first swing ring 12 in the direction orthogonal to the swing axis x are pivotally supported by the first swing ring 12 by horizontal support shafts 15, respectively, and the axis line of the support shaft 15 is set as the swing shaft. y (see FIG. 3) is provided so as to be vertically swingable.

On the other hand, the polishing unit 16 includes the housing 1
7, a polishing head drive motor 18 provided in the housing 17, and a rotary polishing head 20 attached to the lower end of a rotary shaft 18a of the motor 18, and the lower surface of the polishing head 20 (to be polished). The material sliding contact surface) projects slightly below the lower end of the housing 17.

The housing 17 has a cylindrical base member 17a fitted in the second swing ring 14 so as to be vertically slidable, and a motor cover 17b provided on the base member 17a. The base member 17a is made of thick metal so that the polishing unit 16 has a certain weight.

The polishing head drive motor 18 has its rotary shaft (hereinafter referred to as motor shaft) 18a inserted into the base member 17a and is vertically fixed and supported on the base member 17a. A flywheel 19 for stabilizing the rotation is fixed to the lower end.

Further, the rotary polishing head 20 is composed of a disk-shaped rotary plate, and a polishing cloth 21 is replaceably attached to the lower surface thereof, that is, the sliding contact surface of the material to be polished, with an adhesive tape or the like. .

In the polishing head 20, a shaft 20a vertically projecting from the center of the upper surface of the polishing head 20 is eccentrically fixed to the flywheel 19 from its rotation center (center of the motor shaft 18a), and the flywheel 19 is fixed. Through the motor shaft 18
It is attached to a and is rotatably driven by the motor 18 to rotate eccentrically with respect to the motor shaft 18a. That is,
In FIG. 3, M indicates the center of the motor shaft 18a, and H indicates the center of the polishing head 20. The polishing head 20 has the locus indicated by the alternate long and short dash line (motor shaft center) with the motor shaft center M as the rotation center. It rotates while revolving around a circular locus whose radius is the distance between M and the center H of the polishing head.

Further, the polishing head 20 is provided with a plurality of dust suction holes 22 penetrating from the lower surface to the upper surface thereof, and the housing 17 is provided with an exhaust passage 23 for exhausting the air in the base member 17a. And this exhaust path 2
A dust suction hose 24 is connected to 3. The dust suction hose 24 is connected to a dust collector (not shown), and dust generated during polishing of the material A to be polished by the polishing head 20 causes dust collection holes 22 provided in the polishing head 20 as shown by arrows in FIG. And around the polishing head 20 from the base member 17a
It is sucked in and is collected by the dust collector through the dust suction hose 24.

In the polishing unit 16, the base member 17a of the housing 17 is fitted to the second swing ring 14, and the second swing ring 14 is held slidably in the vertical direction. This polishing unit 16
Swings together with the second swing ring 14 and moves in the swing direction of the first swing ring 12 (the second swing ring 14).
(Orthogonal to the swinging direction of)).

That is, in the polishing unit 16, the swing of the first swing ring 12 with respect to the apparatus main body 11 and the swing of the second swing ring with respect to the first swing ring 12 cause
The oscillating axes x and y of the two oscillating rings 12 and 14 swing and tilt in all directions around the intersection.

Further, as shown in FIG. 3, the center M of the motor shaft 18a is on the intersection of the rocking axes x and y of the two rocking rings 12 and 14, and therefore the polishing head 2
0 rotates around the tilt center of the polishing unit 16.

The polishing head 20 is pressed against the material to be polished A with a constant pressing force by the polishing unit pressing mechanism 25 provided under the top plate 11a of the apparatus main body 11.

The polishing unit pressing mechanism 25 presses the housing 17 of the polishing unit 16 downward by a spring force. The polishing unit pressing mechanism 25 is shown in FIG.
As shown in FIG. 5 and FIG.
Two constant force springs 27 are provided in a cross shape under the disc-shaped slide plate 26 that moves in parallel in all directions along the direction.

The constant load spring 27 is a strip plate spring having both side edges curved toward the one side over the entire length and having a property of being spirally wound with a constant spring force.
7 are a pair of flanged spring-wound shafts 28 whose both ends are arranged below the outer periphery of the slide plate 26.
And is stretched by a constant spring force between the two spring winding shafts 28.

Further, the slide plate 26 has a shaft portion 31 of a pressing mechanism supporting plate 31 described later at the center thereof.
A circular hole 26a having a diameter sufficiently larger than a is bored, and at least four bearings 29 (eight in FIG. 5) are arranged at equal intervals surrounding the circular hole 26a. The bearing 29 is a base member rotatably holding a ball, and each bearing 29 has the base member fixed to the slide plate 26 with the ball slightly protruding from the upper surface of the slide plate 26. .

On the other hand, a guide plate 30 for guiding the movement of the slide plate 26 is fixed to the lower surface of the upper surface plate 11a of the apparatus main body 11, and this guide plate 30 is fixed.
A pressing mechanism support plate 31 is provided under the and parallel to the guide plate 30. The pressing mechanism support plate 31 is supported by the guide plate 30 by fixing a shaft portion 31 a protruding at the center of the upper surface thereof to the center of the guide plate 30.

The slide plate 26 of the polishing unit pressing mechanism 25 is sandwiched between the guide plate 30 and the pressing mechanism supporting plate 31 with a very small gap therebetween. The two constant force springs 27 provided below the polishing unit 1 are provided at the intersection where both springs 27 vertically overlap.
6 is in contact with a spring bearing surface 32 formed at the center of the top of the housing 17 (top of the motor cover 17b).

The spring bearing surface 32 is the constant load spring 2 described above.
7 is a square surface slightly wider than the width of 7, and spring receiving grooves for holding the constant force springs 27 so as not to laterally shift are formed in a cross shape on the spring receiving surface 32.

The spring bearing surface 32 at the top of the housing is
It is at a position sufficiently higher than the withdrawal position of the constant load spring 27 wound around the spring winding shaft 28 of the polishing unit pressing mechanism 25, and the constant load spring 27 is bent in a mountain shape between the pair of spring winding shafts 28 and the middle thereof. The housing 17 of the polishing unit 16 is pressed downward by a force (constant force) that abuts on the spring receiving surface 32 at the portion (the top of the chevron) and tries to wind the spring winding shaft 28.

The slide plate 26 of the polishing unit pressing mechanism 25 receives the constant force spring 27 from below by the housing 17 of the polishing unit 16 so that the spring force (spring winding) of the constant force spring 27 is increased. Axis 2
8 is pressed upward by the force of trying to wrap around 8 and therefore the slide plate 26 is separated from the pressing mechanism support plate 31 on the lower surface side thereof, and is guided by the guide plate 30 on the upper surface side via the bearing 29. It abuts and moves in all directions on the surface of the guide plate 30 with very little movement resistance.

Then, the polishing unit pressing mechanism 25 swings the polishing unit 16 about the intersection of the swing axis x of the first swing ring 12 and the swing axis y of the second swing ring 14 to tilt the polishing unit 16. Accordingly, the polishing unit 16 moves laterally in the tilting direction.

That is, FIG. 6 shows a state in which the polishing unit 16 is tilted and tilted in one direction. For example, when the polishing unit 16 is tilted in the direction of arrow a, its housing 1
The spring bearing surface 32 at the top of 7 is displaced while inclining in the tilting direction of the polishing unit 16, and the constant force spring 27 abutting on this spring bearing surface 32 is pushed in the lateral direction, and the constant force spring 27 is interposed. The polishing unit pressing mechanism 25 moves in the direction of arrow b.

In this case, even if the spring bearing surface 32 at the top of the housing tilts due to the tilting of the polishing unit 16, the constant force spring 2 along the tilt direction of the spring bearing surface 32.
7 always comes into flat contact with the spring bearing surface 32 only by changing the angle according to the inclination of the spring bearing surface 32, and the constant force spring 27 in the direction intersecting the tilt direction of the spring bearing surface 32 is The spring bearing surface 32 is twisted and deformed in the width direction according to the inclination of the spring bearing surface 32, and always comes into flat contact with the spring bearing surface 32. This is also the case when the spring bearing surface 32 is tilted in a direction that obliquely intersects the length directions of both constant load springs 27, in which case both constant load springs 27 are twisted and deformed in the width direction. Then, the spring bearing surface 32 is always flatly contacted.

Next, the polishing of the material A to be polished by the polishing apparatus 10 having the above structure will be described.
Are supported by the arm 3a of the robot 3 shown in FIG. 7 and abutted on the surface (surface to be polished) of the material A to be polished, and always in a fixed posture (abutting perpendicularly to the surface of the material A to be polished). posture)
While being maintained, the material to be polished A is moved in the width direction and the length direction.

Then, in polishing the material A to be polished, the polishing head drive motor 18 is driven to rotate the disk-shaped polishing head 20 at a high speed, and the lower surface of the polishing head 20 is attached to the material A to be polished.
It is carried out by making a sliding contact with a constant contact pressure.

The contact pressure of the polishing head 20 against the material A to be polished is given by the own weight of the polishing unit 16 and the pressing force of the polishing unit 16 by the polishing unit pressing mechanism 16, and the own weight of the polishing unit 16 (with the housing 17). The self-weight of the motor 18 and the polishing head 20 is constant, and the polishing unit pressing mechanism 16 also always presses the housing 17 of the polishing unit 16 with a constant pressing force by the constant force spring 27, so that the polishing head 20 is always constant. The material A to be polished is brought into sliding contact with the contact pressure.

The pressing reaction force of the polishing unit 16 by the constant force spring 27, that is, the pushing force acting on the apparatus main body 11, is controlled so that the angle and height with respect to the surface of the material A to be polished are always constant. Robot 3 arm 3a
Received by.

Then, in the polishing apparatus 10, the polishing unit 16 is moved in a direction orthogonal to the first swing ring 12 swinging in one direction and the swing direction of the first swing ring 12. The polishing unit 1 is supported by being supported by the apparatus main body 11 via the swinging second swing ring 14.
6 is allowed to swing and tilt with respect to the apparatus main body 11 in all directions, and the polishing unit 16 is held by the second swing ring 14 so as to be vertically slidable,
Since the polishing unit pressing mechanism 25 presses the polishing unit 16 against the material A to be polished with a constant pressing force, the polishing unit 16 is always pressed regardless of the relative posture change between the apparatus body 11 and the surface to be polished. The surface of the material to be polished can be uniformly polished by bringing the polishing head 20 into flat contact with the surface at a constant contact pressure.

That is, in the automatic polishing machine shown in FIG. 7, as described above, the main body 11 of the polishing apparatus 10 is supported by the arm 3a of the robot 3 and is kept on the workpiece A while always maintaining a constant posture. If the surface of the material to be polished A, that is, the surface to be polished is an uneven surface, the polishing apparatus 10 causes the polishing device 10 to have an uneven portion of the surface to be polished (a portion where the surface to be polished is inclined with respect to a horizontal plane). 2), the relative postures of the apparatus main body 11 and the surface to be polished change.

However, in the polishing apparatus 10, since the polishing unit 16 swings and tilts in all directions with respect to the apparatus main body 11, when the polishing apparatus 10 reaches the undulating portion of the surface to be polished, the polishing unit 16 is rotated. Since the polishing head 20 is pressed against the material A to be polished with a constant pressing force and its posture is changed as shown in FIG. 6 by following the surface of the material A, the undulating portion of the surface to be polished can be uniformly polished.

In this case, the polishing unit pressing mechanism 2
When 5 is always in a fixed position, the constant force spring 27 pressing the housing 17 of the polishing unit 16 causes the polishing unit 1 to move.
Since the tilting of No. 6 acts to suppress the tilting of the polishing head 20 with respect to the surface to be polished, in the above embodiment, the polishing unit pressing mechanism 25 moves the polishing unit 16 together with the tilting of the polishing unit 16. Since the polishing unit pressing mechanism 25 is provided so as to move laterally in the tilting direction of the unit 16, the polishing unit pressing mechanism 25 does not resist the tilting of the polishing unit 16, and therefore the polishing head 20 can be favorably attached to the surface to be polished. Can be imitated.

Further, since the polishing head 20 is eccentrically rotated with respect to the motor shaft 18a of the polishing head drive motor 18, the eccentric rotation of the polishing head 20 causes the polishing unit 16 to tilt its center (first swing ring 12). Swing axis x
And a swinging axis y of the second swinging ring 14) as the center of the swinging vibration in the lateral direction. In the above-described embodiment, the housing 17 of the polishing unit 16 has its lower portion (the base member 1).
7a), the distance from the polishing head 20 to the tilt center of the polishing unit 16 is small because it is supported by the apparatus main body 11 via the second swing ring 14 and the first swing ring 12, and therefore the polishing head 20 The swing vibration of the polishing unit 16 due to the eccentric rotation can be reduced.

That is, the magnitude (amplitude) of the swing vibration of the polishing unit 16 due to the eccentric rotation of the polishing head 20 is
The moment corresponds to the magnitude of the moment generated in the polishing unit 16 by the eccentric rotation of the polishing head 20, and this moment is proportional to the distance from the polishing head 20 to the tilt center of the polishing unit 16. Therefore, if this distance is reduced,
The swing vibration of the polishing unit 16 due to the eccentric rotation of the polishing head 20 can be reduced.

When the polishing unit 16 swings and vibrates due to the eccentric rotation of the polishing head 20, the polishing head 2
0 also vibrates up and down to cause a bias in the contact pressure with respect to the surface to be polished. If the vibration of the polishing unit 16 is small, the vibration of the polishing head 20 is also small.
The unevenness of the contact pressure with respect to the surface to be polished can be almost eliminated, and the following property of the polishing head 20 with respect to the surface to be polished can be further improved.

The polishing head 2 in the above polishing apparatus
Even if the distance from the polishing head 20 to the tilt center of the polishing unit 16 is large to some extent, the bias of the polishing head contact pressure on the surface to be polished caused by the eccentric rotation of 0 is different from that of the surface to be polished in the conventional polishing apparatus. The contact pressure of the polishing head due to the change of the relative posture with respect to the apparatus main body is extremely small compared with the bias, and therefore, the tilt center of the polishing unit 16 may be located at a position higher than that in the above embodiment.

Further, in the above embodiment, the polishing unit pressing mechanism 25 is configured so that the constant load spring 27 causes the polishing unit 16 to move.
However, other springs such as a coil spring may be used for the polishing unit pressing mechanism.

Further, in the above embodiment, the polishing unit pressing mechanism 25 is provided so as to move laterally with the tilting of the polishing unit 16 so that the polishing unit pressing mechanism 25 does not resist the tilting of the polishing unit 16. However, if a coil spring that bends and deforms freely is used as the pressing spring of the polishing unit 16 or if the housing 17 of the polishing unit 16 is slidably slidably contacted with the polishing unit pressing mechanism, the polishing unit pressing force is increased. Even if the mechanism is not moved laterally, this polishing unit is used as the pressing mechanism polishing unit 16
There is no resistance to the tilting of.

FIG. 7 shows an automatic polishing machine using the robot 3 as a mechanical moving means for moving the polishing apparatus 10 in the longitudinal direction of the material A to be polished. The present invention can be applied to an automatic polishing machine that moves the polishing apparatus by other mechanical moving means, and the present invention is also applied to a hand-held tool-type polishing apparatus that holds the apparatus body by hand and moves it over the material to be polished. can do.

[0061]

According to the polishing apparatus of the present invention, a housing supports a polishing head drive motor, and the rotation shaft of the motor is a disk.
The polishing unit fitted with Jo polishing head, a first swinging ring swinging in one direction, a second rocking swinging in a direction perpendicular to the swinging direction of the first swinging ring The polishing unit can be pivotally tilted in all directions with respect to the apparatus main body by being supported by the apparatus main body via a moving ring, and the polishing unit can be vertically moved on the second swing ring. Since it is slidably held and the polishing unit pressing mechanism presses the polishing unit against the material to be polished with a spring force, regardless of the relative posture change between the apparatus body and the surface to be polished. , Always make the bottom surface of the polishing head contact the surface to be polished flat.
The surface of the material to be polished can be uniformly polished.

[Brief description of drawings]

FIG. 1 is a vertical sectional front view of a polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the polishing apparatus.

FIG. 3 is a bottom view of the polishing apparatus.

4 is a sectional view taken along line IV-IV in FIG.

5 is a sectional view taken along line VV of FIG.

FIG. 6 is a front view of a state where the polishing unit of the polishing apparatus tilts in one direction.

FIG. 7 is a perspective view of an automatic polishing machine using the polishing apparatus.

[Explanation of symbols]

10 ... Polishing device, 11 ... Device body, 12 ... First swing ring, 14 ... Second swing ring, 16 ... Polishing unit, 17
... housing, 18 ... polishing head drive motor, 19 ... flywheel, 20 ... polishing head, 25 ... polishing unit pressing mechanism, 27 ... constant force spring, A ... material to be polished.

Claims (1)

(57) [Claims] 1. A circle which is in sliding contact with the surface of the material to be polished on the lower surface.
In a polishing device comprising a plate-shaped rotary polishing head and a motor for rotationally driving the polishing head, and polishing the surface of the polishing target by the polishing head while being moved on the polishing target by manual or mechanical moving means, A first swing ring, which is pivotally supported by the device body on both sides to swing in one direction, is provided on the device body that is moved on the material to be polished, and inside the first swing ring, second oscillating swinging in a direction orthogonal to both side portions in the direction perpendicular to the pivot shaft is rotatably supported on the first swinging ring against the swinging direction of the first swinging ring With a ring,
The second swing ring holds the motor in a housing, and a polishing unit having a disk-shaped polishing head attached to the rotary shaft of the motor is slidably held in the vertical direction, and the apparatus body is provided with: A polishing apparatus comprising a polishing unit pressing mechanism for pressing the housing of the polishing unit downward by a spring force to press the lower surface of the polishing head against the material to be polished.