JP2505855B2 - Electrolytic polishing equipment - Google Patents

Electrolytic polishing equipment

Info

Publication number
JP2505855B2
JP2505855B2 JP8256588A JP8256588A JP2505855B2 JP 2505855 B2 JP2505855 B2 JP 2505855B2 JP 8256588 A JP8256588 A JP 8256588A JP 8256588 A JP8256588 A JP 8256588A JP 2505855 B2 JP2505855 B2 JP 2505855B2
Authority
JP
Japan
Prior art keywords
work
current
electrode
shield plate
electrolytic polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8256588A
Other languages
Japanese (ja)
Other versions
JPH01255700A (en
Inventor
栄一 神田
政彦 乾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuo Seisakusho KK
Original Assignee
Chuo Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuo Seisakusho KK filed Critical Chuo Seisakusho KK
Priority to JP8256588A priority Critical patent/JP2505855B2/en
Publication of JPH01255700A publication Critical patent/JPH01255700A/en
Application granted granted Critical
Publication of JP2505855B2 publication Critical patent/JP2505855B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、表面積の大きいワークを電解研摩するため
に用いられる電解研摩装置に関するものである。
TECHNICAL FIELD The present invention relates to an electrolytic polishing apparatus used for electrolytic polishing a work having a large surface area.

(従来の技術) 電解研摩を行うに際しては、ワーク表面における電流
密度をある一定値以上とする必要がある。そのため一般
にワークと電極の間隔を可能な限り近づけて電解研摩を
行っている。しかし、電解研摩を行うべき面積が大きい
ワークに対して全面を同時に電解研摩するためには、膨
大な電流容量の直流電源装置が必要となり実用的に実施
することは困難である。そこで従来このような場合に
は、特開昭62−30900号公報に示されるように小面積の
電極をワークの表面に沿って順次移動させながら小電流
を小面積の電極に流すことにより小面積の電極付近のワ
ーク表面における電流密度を上げて電解研摩を行う方法
が採られている。しかしこの方法では電流を収束させる
ことができないため、この方法による場合にもワークが
大型のものとなると給電電流は大きなものとなり、移動
する電極に対して確実に給電することは非常に困難とな
る欠点があった。
(Prior Art) When performing electrolytic polishing, it is necessary to set the current density on the surface of the work to a certain value or more. Therefore, in general, electrolytic polishing is performed with the distance between the work and the electrode as close as possible. However, in order to simultaneously electrolytically polish the entire surface of a work having a large area to be electrolytically polished, a DC power supply device with an enormous current capacity is required, which is difficult to practically carry out. Therefore, in such a conventional case, as shown in JP-A-62-30900, a small current is applied to the small area electrode while sequentially moving the small area electrode along the surface of the workpiece. Electrolytic polishing is performed by increasing the current density on the surface of the work near the electrode. However, since the current cannot be converged by this method, the power supply current also becomes large when the work is large in size even by this method, and it is very difficult to reliably supply power to the moving electrode. There was a flaw.

(発明が解決しようとする課題) 本発明は上記したような従来の欠点を解決して、大型
のワークの全面を確実に電解研摩することができ、しか
も電極への給電を行うことができる電解研摩装置を提供
するためになされたものである。
(Problems to be Solved by the Invention) The present invention solves the above-mentioned drawbacks of the related art and allows electrolytic polishing of the entire surface of a large work piece to be surely performed, and moreover, it is possible to supply power to electrodes. It was made to provide a polishing device.

(課題を解決するための手段) 上記の課題を解決するために完成された本発明は、電
解液の内部に、ワークをプラス極とし電極をマイナス極
として両者を近接距離に相対向させて設置するととも
に、これらの両者間に電流をスリットの部分に収束させ
るための電流収束用遮蔽板をワークの表面に沿って移動
自在に設け、電解液の循環と電流収束用遮蔽板の移動と
を行わせながら、ワークと電極に通電するようにしたこ
とを特徴とするものである。
(Means for Solving the Problem) The present invention completed to solve the above-mentioned problems is to install inside a electrolytic solution with a work as a positive electrode and an electrode as a negative electrode, facing each other at a close distance. At the same time, a current-converging shield plate for converging the current to the slit portion is provided between the two so as to be movable along the surface of the workpiece to circulate the electrolytic solution and move the current-converging shield plate. It is characterized in that the work and the electrode are energized while being made to move.

(実施例) 以下に本発明を図示の実施例によって更に詳細に説明
する。
(Example) Hereinafter, the present invention will be described in more detail with reference to the illustrated example.

第1図は本発明の第1の実施例を示すものであり、
(1)は円筒状の電解加工タンク、(2)はその底部に
設けられた電解液供給用マニホールド、(3)はその上
端部外周に設けられた電解液回収室であって、電解液供
給タンク(4)内の電解液が循環ポンプ(5)によって
電解加工タンク(1)内を循環する構造となっている。
本実施例ではワーク(30)は円筒材であり、図示のよう
に絶縁性の支持台(6)上に設置され、その上部に給電
バー(7)が接続されて直流電源(8)のプラス電極か
ら給電されている。また本実施例では電解加工タンク
(1)自体が電極(9)となっており、給電バー(10)
を介して直流電源(8)のマイナス極に接続されてい
る。図示のように、ワーク(30)と電極(9)とは近接
距離に相対向させて配置することとなる。
FIG. 1 shows a first embodiment of the present invention,
(1) is a cylindrical electrolytic processing tank, (2) is an electrolytic solution supply manifold provided at the bottom of the tank, and (3) is an electrolytic solution recovery chamber provided at the outer periphery of the upper end of the electrolytic solution supply chamber. The electrolytic solution in the tank (4) is circulated in the electrolytic processing tank (1) by the circulation pump (5).
In this embodiment, the work (30) is a cylindrical material, which is installed on an insulating support base (6) as shown in the drawing, and a power supply bar (7) is connected to the upper part of the work support (6) to add a direct current power source (8) Power is supplied from the electrodes. Further, in this embodiment, the electrolytic processing tank (1) itself is the electrode (9), and the power supply bar (10) is provided.
Is connected to the negative pole of the DC power supply (8). As shown in the figure, the work (30) and the electrode (9) are arranged to face each other at a close distance.

本発明においては、ワーク(30)と電極(9)との間
にスリット(11)付きの絶縁性の電流収束用遮蔽板(1
2)がワーク(30)の表面に沿って移動自在に設けられ
ている。第2図に断面で示すように、本実施例の電流収
束用遮蔽板(12)は内外二重の円筒状のものであり、そ
の対称な2つの部分だけに縦長のスリット(11)が透設
させている。内外二重としたのはワーク(30)の内外両
面を同時に電解研摩するためであって、片側ずつ電解研
摩する場合や片側のみを電解研摩する場合には電流収束
用遮蔽板(12)はワーク(30)の片側のみに設ければよ
い。このような円筒状の電流収束用遮蔽板(12)は電解
加工タンク(1)の底部に設けられた受ローラー(1
5)、(15)上に回転自在に支持され、上部をガイドロ
ーラー(13)、(13)にガイドされつつ減速機付きモー
ター(14)により約180°回転される。
In the present invention, the insulating current converging shield plate (1) having the slit (11) between the work (30) and the electrode (9) is used.
2) is provided movably along the surface of the work (30). As shown in the cross section in FIG. 2, the current converging shield plate (12) of the present embodiment has a double inner and outer cylindrical shape, and the longitudinal slit (11) is formed only in the two symmetrical portions. I am setting it up. The inner / outer double structure is for electrolytically polishing both the inner and outer surfaces of the work (30) at the same time. When the electropolishing is performed on each side individually or only one side is electropolished, the current converging shield plate (12) is used as the work. It should be provided only on one side of (30). Such a cylindrical current converging shield plate (12) is provided with a receiving roller (1) provided at the bottom of the electrolytic processing tank (1).
5) It is rotatably supported on (15) and is rotated about 180 ° by a motor (14) with a reduction gear while being guided by guide rollers (13) and (13) at the upper part.

(作用) このように構成されたものは、直流電源(8)からワ
ーク(30)をプラス極、その至近距離に相対向させて設
置された電極(9)をマイナス極として直流電流を通電
しつつ両者間に置かれた絶縁性の電流収束用遮蔽板(1
2)をワーク(30)の表面に沿って移動させれば、電流
は電流収束用遮蔽板(12)のスリット(11)で収束され
てこの部分のみを通過して流れることとなり、スリット
(11)に対応するワーク(30)の表面に集中し順次電解
研摩する。従って直流電源(8)の容量を膨大なものと
しなくてもスリット(11)の面積を小さくしておけば、
ワーク(30)の表面積が大きい場合にも電流収束用遮蔽
板(12)のスリット(11)に対応するワーク(30)の表
面においては十分に大きい電流密度によって電解研摩を
行わせることができ、スリット(11)をワーク(30)の
全表面に対応させて移動させれば大型のワーク(30)を
も確実に電解研摩することができる。しかも本発明にお
いては給電対象となるワーク(30)と電極(9)とは固
定されたままであり、移動されるのは絶縁性の電流収束
用遮蔽板(12)のみであるから、従来のような移動する
電極に対して給電するうえでのトラブルを生ずるおそれ
は皆無となる。
(Operation) In the structure as described above, a DC current is supplied from a DC power source (8) with a work (30) as a positive pole and an electrode (9) installed facing each other at a short distance as a negative pole. Insulating current-shielding plate (1
If 2) is moved along the surface of the work (30), the current will be converged by the slit (11) of the current converging shield plate (12) and will flow only through this portion, and the slit (11 ) Concentrate on the surface of the work (30) corresponding to () and perform electrolytic polishing sequentially. Therefore, if the area of the slit (11) is made small without increasing the capacity of the DC power source (8),
Even if the surface area of the work (30) is large, electrolytic polishing can be performed with a sufficiently large current density on the surface of the work (30) corresponding to the slit (11) of the current converging shield plate (12), If the slit (11) is moved so as to correspond to the entire surface of the work (30), electrolytic polishing of a large work (30) can be reliably performed. Moreover, in the present invention, the work (30) and the electrode (9) to be supplied with power are still fixed, and only the insulating current converging shield plate (12) is moved. There is no possibility of causing trouble in supplying power to such moving electrodes.

なお第3図と第4図に示される第2の実施例のように
ワーク(30)が平板状のものである場合には、電流収束
用遮蔽板(12)も平板状のものとし、送りねじ(16)等
の駆動装置によって電流収束用遮蔽板(12)をワーク
(30)と電極(9)の間で平行に移動させてもよい。ま
たこの実施例では電極(9)は電解加工タンク(1)と
別体とされ、電解加工タンク(1)の内部の電解液中に
浸漬されている。このようにワーク(30)、電極
(9)、電流収束用遮蔽板(12)等の配置方法やその駆
動機構等については種々の変形が可能である。なお(1
7)、(18)は絶縁台である。
When the work (30) has a flat plate shape as in the second embodiment shown in FIGS. 3 and 4, the current converging shield plate (12) also has a flat plate shape and is fed. The current converging shield plate (12) may be moved in parallel between the work (30) and the electrode (9) by a driving device such as a screw (16). In this embodiment, the electrode (9) is separate from the electrolytic processing tank (1) and is immersed in the electrolytic solution inside the electrolytic processing tank (1). As described above, various modifications can be made to the method of arranging the work (30), the electrode (9), the current converging shield plate (12), and the drive mechanism thereof. Note that (1
7) and (18) are insulating bases.

(発明の効果) 本発明は以上の説明からも明らかなように、スリット
付きの電流収束用遮蔽板をワーク表面に沿って移動させ
つつワークの表面を順次電解研摩するものであるから、
ワークの表面積が大きい場合にもスリットの面積を小さ
くしておけば、スリットに対応するワーク表面における
電流密度を増加させることができるので、膨大な電流容
量の直流電源装置を用いる必要がない。また本発明にお
いては給電の対象物であるワークと電極とは固定された
ままでよいので、移動する電極に給電を行う必要のあっ
た従来装置とは異なり、給電を極めて容易に行うことが
できる。よって本発明は従来の問題点を一掃した電解研
摩装置として、産業の発展に寄与するところは極めて大
である。
(Effect of the invention) As is apparent from the above description, the present invention sequentially electrolytically polishes the surface of the work while moving the slitted current converging shield plate along the work surface.
Even if the surface area of the work is large, if the area of the slit is made small, the current density on the surface of the work corresponding to the slit can be increased, so that it is not necessary to use a DC power supply device having an enormous current capacity. Further, in the present invention, since the work, which is the object of power supply, and the electrode may remain fixed, the power supply can be extremely easily performed, unlike the conventional device that needs to supply power to the moving electrode. Therefore, the present invention is extremely large in that it contributes to the industrial development as an electrolytic polishing apparatus that eliminates the conventional problems.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の第1の実施例を示す断面図、第2図は
電流収束用遮蔽板のみの水平断面図、第3図は第2の実
施例を示す断面図、第4図はその一部切欠平面図であ
る。 (9):電極、(11):スリット、(12):電流収束用
遮蔽板、(30):ワーク
FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a horizontal sectional view showing only a current converging shielding plate, FIG. 3 is a sectional view showing a second embodiment, and FIG. It is the partially notched top view. (9): Electrode, (11): Slit, (12): Shield plate for current focusing, (30): Work piece

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】電解液の内部に、ワーク(30)をプラス極
とし電極(9)をマイナス極として両者を近接距離に相
対向させて設置するとともに、これらの両者間に電流を
スリット(11)の部分に収束させるための電流収束用遮
蔽板(12)をワーク(30)の表面に沿って移動自在に設
け、電解液の循環と電流収束用遮蔽板(12)の移動とを
行わせながら、ワーク(30)と電極(9)に通電するよ
うにしたことを特徴とする電解研摩装置。
1. A work (30) is used as a positive electrode and an electrode (9) is used as a negative electrode inside an electrolytic solution so that they are opposed to each other at a close distance, and a current is slit (11) between them. ) Is provided movably along the surface of the work (30) for converging the current converging shield plate (12) so as to circulate the electrolyte and move the current converging shield plate (12). However, the electrolytic polishing apparatus is characterized in that the work (30) and the electrode (9) are energized.
JP8256588A 1988-04-04 1988-04-04 Electrolytic polishing equipment Expired - Lifetime JP2505855B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8256588A JP2505855B2 (en) 1988-04-04 1988-04-04 Electrolytic polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8256588A JP2505855B2 (en) 1988-04-04 1988-04-04 Electrolytic polishing equipment

Publications (2)

Publication Number Publication Date
JPH01255700A JPH01255700A (en) 1989-10-12
JP2505855B2 true JP2505855B2 (en) 1996-06-12

Family

ID=13778010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8256588A Expired - Lifetime JP2505855B2 (en) 1988-04-04 1988-04-04 Electrolytic polishing equipment

Country Status (1)

Country Link
JP (1) JP2505855B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10154883A1 (en) * 2001-11-05 2003-05-28 Schmid Gmbh & Co Geb Process for treating electrically conductive substrates such as printed circuit boards and the like

Also Published As

Publication number Publication date
JPH01255700A (en) 1989-10-12

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