JP2505070Y2 - コ―ルドプレ―ト伝熱部構造 - Google Patents

コ―ルドプレ―ト伝熱部構造

Info

Publication number
JP2505070Y2
JP2505070Y2 JP1990118442U JP11844290U JP2505070Y2 JP 2505070 Y2 JP2505070 Y2 JP 2505070Y2 JP 1990118442 U JP1990118442 U JP 1990118442U JP 11844290 U JP11844290 U JP 11844290U JP 2505070 Y2 JP2505070 Y2 JP 2505070Y2
Authority
JP
Japan
Prior art keywords
cold plate
heat transfer
base plate
contact surface
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990118442U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0474199U (cs
Inventor
肇 坂田
Original Assignee
石川島播磨重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 石川島播磨重工業株式会社 filed Critical 石川島播磨重工業株式会社
Priority to JP1990118442U priority Critical patent/JP2505070Y2/ja
Publication of JPH0474199U publication Critical patent/JPH0474199U/ja
Application granted granted Critical
Publication of JP2505070Y2 publication Critical patent/JP2505070Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990118442U 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造 Expired - Lifetime JP2505070Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990118442U JP2505070Y2 (ja) 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990118442U JP2505070Y2 (ja) 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造

Publications (2)

Publication Number Publication Date
JPH0474199U JPH0474199U (cs) 1992-06-29
JP2505070Y2 true JP2505070Y2 (ja) 1996-07-24

Family

ID=31866362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990118442U Expired - Lifetime JP2505070Y2 (ja) 1990-11-09 1990-11-09 コ―ルドプレ―ト伝熱部構造

Country Status (1)

Country Link
JP (1) JP2505070Y2 (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117090A (ja) * 1983-11-30 1985-06-24 Hitachi Ltd 放熱制御装置

Also Published As

Publication number Publication date
JPH0474199U (cs) 1992-06-29

Similar Documents

Publication Publication Date Title
US20170273218A1 (en) Electronic device and method of assembling such a device
JPH1136981A (ja) 排熱発電装置
US20090073654A1 (en) Compact surface-mount heat exchanger
US6226184B1 (en) Enclosure mounted heat sink
JP2505070Y2 (ja) コ―ルドプレ―ト伝熱部構造
US11006548B2 (en) Method and device to provide uniform cooling in rugged environments
US20040109301A1 (en) Cooling device for an integrated circuit
JPH10125962A (ja) 熱電変換装置
JP3653417B2 (ja) マルチチップモジュールの封止構造
JPH0426549B2 (cs)
JP2009059760A (ja) 電子回路基板の放熱構造体
KR200185418Y1 (ko) 무선통신 시스템의 함체 구조
JP2552329Y2 (ja) 宇宙環境下用機器冷却装置
JPS60220954A (ja) 集積回路素子冷却装置
JPS63226049A (ja) 冷却モジユ−ル構造
JP2907800B2 (ja) 電子機器
JP3077884B2 (ja) 電子機器ユニットの冷却構造
US20080028767A1 (en) Computer cooler
CN221041113U (zh) 一种半导体用高效散热器
JPS6089946A (ja) 半導体素子の冷却構造
CN209232768U (zh) 一种均热板散热一体化装置
JPH0648869Y2 (ja) 冷却構造
CN223272857U (zh) 一种运算板卡散热结构
CN214202292U (zh) 一种大数据分析系统的终端机
CN222981875U (zh) 一种路由器散热片