JP2503483B2 - Conductive packaging material - Google Patents

Description

The present invention relates to a conductive packaging material, and particularly to an integrated circuit (IC), a large scale integrated circuit (LSI), a very large scale integrated circuit (VLSI), a precision package. The present invention relates to packaging materials for products such as electronic parts and dust-proof covers for keyboards, etc., which are damaged by static electricity.

[Prior art]

With the sophistication and precision of electronic equipment products, IC, LSI, V
Further miniaturization, precision and weight reduction of electronic parts such as LSI have been remarkably developed. On the other hand, in these products,
Due to the manufacturing of electronic parts, static electricity often occurs during transportation. Conventionally, for packaging of these products, general-purpose film materials such as polyethylene, polypropylene, polyamide, polyvinyl chloride, polystyrene, and polycarbonate have been used alone or in layers and made into bags. However, since these materials have a volume resistivity of 10 ¹² Ω-cm or more, adhesion of dust, dust, etc., and destruction of contents by static electricity occurred. Therefore, in order to prevent this accident, the contents are packaged by using a container such as a film or a tray made of a resin composition in which conductive carbon black or the like is dispersed, a resin composition in which an ion conductive surfactant is added, or the like. By doing so, we have protected against static electricity and electrostatic damage.

However, packaging with the above materials was not sufficient because it was difficult to control the conductivity and the conductivity was not sufficiently imparted. Further, there is a problem that the contents cannot be identified due to coloring and opacity. In particular, when a material made of a resin containing metal fine particles or a filler, such as conductive carbon black, is used, it is necessary to make the conductive material into fine particles, or a ball mill, an attritor, or a roll mill to uniformly disperse the conductive material in the resin. It was necessary to take sufficient time to disperse the secondary particles into the primary particles with a dispersing device having excellent shearing force and mixing force. The conductive coating material obtained in this way has a conductivity of 10 ³ to 10 ⁶ [Ω / □], but it takes a lot of time to adjust the coating material due to a dispersing device, etc. Not only that, when a conductive coating material obtained is coated on a substrate and used as a packaging material, the transparency is not sufficient to identify and judge the contents.

On the other hand, an ionic conductive material in which a surfactant is added to the resin has a limit in imparting conductivity, and has a surface resistivity of 10 ¹⁰
Ω / □ is the minimum, especially in LSI, VLSI, etc.
It cannot be used to prevent electrostatic damage. The biggest drawback of this surfactant ion conductive material is almost 10 ¹⁴ [Ω /
□] It becomes the same as the above insulator. As described above, in a material made of a resin in which conductive carbon, metal fine particles, and a filler are added and kneaded in a resin, there are problems such as uniform dispersion of the conductive particles in the resin, film-forming property, and opacity due to coloring. In addition, the ionic conductive material of the surfactant has problems of insufficient conductivity and humidity dependency. Recently, as packaging materials for electronic devices such as circuits, not only are static electricity prevention and antistatic requirements required, but automatic transport by robots and sensors, quality control, and identification of contents are required. However, the required physical property of transparency has been required.

[Means for Solving the Invention]

The outer layer has a surface resistance of 10 on the surface of the transparent plastic material.
^A laminated body made of a material provided with a conductive layer of ³ to 10 ⁶ Ω / □, and an inner layer made of a thermoadhesive material having a surface resistance of 10 ⁸ to 10 ¹² Ω / □, wherein the conductive layer is polypyrrole. , A polymer of heterocyclic compounds such as polythiophene,
In addition, the problem was solved by imparting transparency such that the light transmittance of the laminate was 50% or more.

The transparent plastic material used for the outer layer in the material used in the present invention is polyethylene terephthalate, polyamide, polyvinyl chloride, polyvinylidene chloride, polypropylene, polystyrene, polycarbonate, polyacrylonitrile film and polyvinylidene chloride coat (K
The conductive layer provided on one surface of the coated film as a single body or a laminated material is formed by a chemical oxidation method of a heterocyclic compound polymer. The material used for the inner layer is
Anion activators, cation activators, amphoteric activators, etc. that utilize ionic conductivity are added to, kneaded with, or coated on the surface of a film, such as polyethylene or polypropylene, or a quaternary grade A film surface coated with ammonium salt, acrylic cationic polymer, etc., and has a surface resistance of 10 ⁹ to 10 ¹²
Ω / □. Of the above-mentioned inner layer materials, the kneading type is preferable because there is no problem of falling off during use. Further, not having a two-layer structure of an outer layer and an inner layer, but as an intermediate layer between them, polyvinylidene chloride high density polyethylene, those having a steam barrier property such as polypropylene, ethylene-vinyl acetate copolymer saponified polyvinyl alcohol, stretched vinylon, A conductive packaging material having water vapor and oxygen barrier properties may be obtained by using a material such as polyvinylidene chloride having excellent transparency and oxygen barrier properties. Here, if the surface resistance of the outer layer is 10 ⁶ [Ω / □] or more, the charge is transferred to the outermost layer surface by the operator who has accumulated static electricity or the electric field existing in the atmosphere, and the locally distributed charge Generates a potential difference between the outer layer and the inner layer or the contents. If the potential difference exceeds a certain value, the contents such as IC, LSI, VLSI and the like will be destroyed by electrostatic damage. Further, if the semiconductor region has a surface resistance of 10 ⁶ Ω / □ or less, an electric field in the outside air is attracted, which is not preferable.

The conductive layer having such a surface resistance, a transparent binder resin in which a certain amount of an oxidation catalyst is mixed, is coated on at least one surface of the transparent plastic material of the outer layer by gravure, roll, or blade coating method, and on this coated surface, pyrrole, By contacting with a heterocyclic compound such as thiophene, a conductive layer having a surface resistance of 10 ³ to 10 ⁶ [Ω / □] can be easily formed. Further, a protective layer may be provided on this, if necessary. The binder resin used at this time is an acrylic resin, a vinyl chloride resin, a vinyl chloride vinyl acetate resin, a urethane resin, a polyester resin, a polyamide resin, a polyolefin resin, or an epoxy resin, and in any case, it is transparent and compatible with the catalyst. It doesn't matter what you have. As a catalyst, ferric chloride, cupric chloride, iron bromide,
Any of metal salts such as copper bromide, perchlorates such as iron perchlorate, inorganic acids such as hydrochloric acid and sulfuric acid, diazonium salts such as benzenediazonium chloride, and quinones such as benzoquinone can be used. . As the inner layer, 10 ⁹ to 10
To obtain a conductivity of about ¹² [Ω / □], add an ionic conductive surfactant, etc. to polyethylene and polypropylene.
Knead to impart antistatic property with heat sealability. When the surface resistance is 10 ¹² [Ω / □] or more, dust or dust adheres to the surface of the contents IC, LSI, VLSI, and when it is 10 ⁸ [Ω / □] or less, the contents and inner layer A minute electric current of static electricity generated by the contact of etc. flows into the contents, and the circuit is broken. The surface resistance of the inner layer is
10 ⁸ to 10 ¹² [Ω / □] is preferable.

Such an outer layer and an inner layer are bonded together using a non-yellowing type adhesive to obtain a laminate. That is, the non-conductive surface of the outer layer and the inner layer can be laminated with an adhesive such as urethane, and the laminate can be easily bag-formed by heat sealing and packaged.

[Action]

The packaging materials thus obtained are used for IC, LSI, VLS
I, By packaging electronic parts, the contents can be identified, and the antistatic effect and the electrostatic damage can be prevented.

[Example 1] A polyester film having a thickness of 12 µm (P-11, manufactured by Toray Industries, Inc.) was coated on one side with a binder resin ^* containing the following catalyst by blading coat to obtain a composite film. This composite film was exposed to a pyrrole / air mixed atmosphere at 25 ° C. for a certain period of time to form a conductive layer on the coated surface. A 50 μm thick polyethylene film mixed with a surfactant (M254F manufactured by Mitsui Petrochemical Industries) was laminated with a urethane adhesive on the polyester film on the non-conductive surface side opposite to this conductive layer, and the polyethylene film layer of this laminate The inside was made into a bag by heat sealing (150 ° C-3 seconds).

* Catalyst-containing binder resin Catalyst ferric chloride hexahydrate (Kanto Chemical, reagent) 20 parts Binder resin Acrylic (BR-75, Mitsubishi Rayon) 80 parts Solvent Ethyl acetate (NC-401 Toyo Ink) 330 parts [Examples 2 to 5] The catalyst in the catalyst-containing binder resin was changed to cupric chloride, iron perchlorate, iron bromide, and copper bromide, and the same procedure as in Example 1 was performed. Below, the innermost layer, and the surface resistance value of the outermost layer,
The light transmittance, heat seal strength charging potential and charging time of the entire laminate were measured.

[Example-6] The conductive layer obtained in Example-3 was provided with an OP varnish (nitrocellulose) of 1 µm as a protective layer, and the same measurement was performed.

The results are shown in Table 1 except for the heat seal strength.

[Comparative example]

At the same time, as a comparative example, a protective layer / conductive layer / polyethylene terephthalate layer / polyethylene layer in which an antistatic agent was kneaded, and 35% by weight of conductive carbon was kneaded in the conductive layer (Comparative Example 1), 50% by weight. % Kneading (Comparative Example 2) and a surfactant kneading (Comparative Example 3) were used to make bags by heat sealing in the same manner as in Example 1, and the same physical properties as in Example 1 were measured. The results are also shown in Table 1.

The heat sealing strengths of Examples 1 to 6 were
It was more than 1.5kg / 15mm.

<Measurement atmosphere> 25 ℃ -60% RH ・ Charging potential (KV) Static Honest meter (Otodo Shokai) 10KV Applied charging potential is measured.

・ Half time (Sec) Time until the equilibrium charging potential is halved after the applied voltage is cut off.

・ Surface resistance (Ω / □) Multimeter TR-6843 (manufactured by Advanced Test), measured with 40 m / m × 40 m / m getter type electrode. /
Inner layer is Teraohmmeter R-503, Chember P-601, (V. Kawaguchi Denki) applied voltage 500V, value after 60 seconds.

-Light transmittance (%) Value at 550 nm wavelength, visible spectrophotometer.

〔effect〕

A new type of conductive layer made of a heterocyclic compound polymer in the outer layer, and a heat-sealing resin mixed with a surfactant of about 10 ⁹ to 10 ¹² [Ω / □] to prevent frictional electrification in the inner layer. The packaging material made of is a surface resistance that cannot be obtained by the conventional carbon kneading type and surfactant kneading type.
It is possible to automatically confirm the content of 10 ³ to 10 ⁶ (Ω / □) and satisfying the physical properties of 50% or more of light rays and transmission.

In addition, even if LSI or LVSI is packaged, it is possible to prevent damage due to static electricity.

Claims (1)

(57) [Claims] 1. The outer layer is made of a transparent plastic material on which a conductive layer having a surface resistance of 10 ³ to 10 ⁶ Ω / □ is provided, and the inner layer has a surface resistance of 10 ⁸ to 10 ¹² Ω / □. A laminate comprising a heat-adhesive material having, wherein the conductive layer is made of a polymer of a heterocyclic compound such as polypyrrole or polythiophene, and the light transmittance of the laminate is 50% or more. A conductive packaging material having.