JP2025514595A5 - - Google Patents

Info

Publication number
JP2025514595A5
JP2025514595A5 JP2024552344A JP2024552344A JP2025514595A5 JP 2025514595 A5 JP2025514595 A5 JP 2025514595A5 JP 2024552344 A JP2024552344 A JP 2024552344A JP 2024552344 A JP2024552344 A JP 2024552344A JP 2025514595 A5 JP2025514595 A5 JP 2025514595A5
Authority
JP
Japan
Prior art keywords
circuit board
structure according
substrate film
light source
lenses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024552344A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025514595A (ja
Filing date
Publication date
Priority claimed from US17/704,329 external-priority patent/US11460185B1/en
Application filed filed Critical
Publication of JP2025514595A publication Critical patent/JP2025514595A/ja
Publication of JP2025514595A5 publication Critical patent/JP2025514595A5/ja
Pending legal-status Critical Current

Links

JP2024552344A 2022-03-25 2023-03-21 光学機能モジュールを含む一体化された多層構造及び関連する製造方法 Pending JP2025514595A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/704,329 2022-03-25
US17/704,329 US11460185B1 (en) 2022-03-25 2022-03-25 Integrated multilayer structure containing optically functional module and related method of manufacture
PCT/FI2023/050159 WO2023180628A1 (en) 2022-03-25 2023-03-21 Integrated multilayer structure containing optically functional module and related method of manufacture

Publications (2)

Publication Number Publication Date
JP2025514595A JP2025514595A (ja) 2025-05-09
JP2025514595A5 true JP2025514595A5 (https=) 2026-03-05

Family

ID=83451137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024552344A Pending JP2025514595A (ja) 2022-03-25 2023-03-21 光学機能モジュールを含む一体化された多層構造及び関連する製造方法

Country Status (8)

Country Link
US (2) US11460185B1 (https=)
EP (1) EP4501076A1 (https=)
JP (1) JP2025514595A (https=)
KR (1) KR20240163646A (https=)
CN (1) CN118947226A (https=)
MX (1) MX2024011734A (https=)
TW (1) TW202400932A (https=)
WO (1) WO2023180628A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3864939A1 (en) * 2018-10-09 2021-08-18 Covestro LLC Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features
US12262505B2 (en) * 2020-03-20 2025-03-25 Agency For Science, Technology And Research Additive manufacturing system for three-dimensional printing
EP4561269A1 (en) * 2023-11-22 2025-05-28 Grupo Antolin-Ingenieria, S.A. Method for manufacturing trim panels for vehicles having an electronic function
US20260009905A1 (en) * 2024-07-08 2026-01-08 Htc Corporation Optical tracking device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR700E (fr) 1902-05-07 1903-02-28 Garaboux Henri Système de bouchage pour forte pression dénommé "l'eureka"
US20090073713A1 (en) * 2007-09-07 2009-03-19 Glovatsky Andrew Z LED Multidimensional Printed Wiring Board Using Standoff Boards
EP2232592B1 (en) * 2007-12-12 2013-07-17 Innotec Corporation Method for overmolding a circuit board
CN102959708B (zh) * 2010-06-29 2016-05-04 柯立芝照明有限公司 具有易弯曲基板的电子装置
US9698563B2 (en) * 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
FR2984251B1 (fr) * 2011-12-19 2014-01-10 Saint Gobain Vitrage eclairant pour vehicule
US9439299B2 (en) * 2014-03-29 2016-09-06 Bridgelux, Inc. Low-profile outdoor lighting module with light emitting diodes
KR101589017B1 (ko) * 2015-03-20 2016-01-28 성재덕 차량램프용 메탈 pcb 조립체 및 조립체
KR101716954B1 (ko) * 2015-05-14 2017-03-15 최훈 메탄올을 이용한 led 조명기구의 방열장치
DE102017208973A1 (de) * 2017-05-29 2018-11-29 Osram Gmbh Elektronische baugruppe für beleuchtungsanwendungen, beleuchtungseinrichtung sowie verfahren zur herstellung einer elektronischen baugruppe
US11088066B2 (en) * 2018-03-19 2021-08-10 Tactotek Oy Multilayer structure and related method of manufacture for electronics
US10485094B1 (en) * 2018-08-27 2019-11-19 Tactotek Oy Multilayer structure with embedded sensing functionalities and related method of manufacture
JP7239804B2 (ja) * 2018-08-31 2023-03-15 日亜化学工業株式会社 レンズ及び発光装置並びにそれらの製造方法
US11166363B2 (en) * 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
US11528802B2 (en) * 2019-12-23 2022-12-13 Tactotek Oy Integrated functional multilayer structure and method of manufacture therefor

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