JP2025506612A - 垂直集積パッチアンテナ（単数又は複数）を備えたパッケージ基板を採用するアンテナモジュール、及び関連する製造方法 - Google Patents

垂直集積パッチアンテナ（単数又は複数）を備えたパッケージ基板を採用するアンテナモジュール、及び関連する製造方法 Download PDF

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Publication number
JP2025506612A
JP2025506612A JP2024541875A JP2024541875A JP2025506612A JP 2025506612 A JP2025506612 A JP 2025506612A JP 2024541875 A JP2024541875 A JP 2024541875A JP 2024541875 A JP2024541875 A JP 2024541875A JP 2025506612 A JP2025506612 A JP 2025506612A
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JP
Japan
Prior art keywords
metallization layers
package substrate
patch antenna
metallization
metal interconnects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024541875A
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English (en)
Japanese (ja)
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JP2025506612A5 (https=
Inventor
ファン、スヒョン
ファン、クン
ヨン、ジェヒョン
キム、チン－クワン
ヤン、テシク
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Qualcomm Inc
Original Assignee
Qualcomm Inc
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Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of JP2025506612A publication Critical patent/JP2025506612A/ja
Publication of JP2025506612A5 publication Critical patent/JP2025506612A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
JP2024541875A 2022-02-16 2023-02-02 垂直集積パッチアンテナ（単数又は複数）を備えたパッケージ基板を採用するアンテナモジュール、及び関連する製造方法 Pending JP2025506612A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/651,324 2022-02-16
US17/651,324 US12300873B2 (en) 2022-02-16 2022-02-16 Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods
PCT/US2023/061800 WO2023158927A1 (en) 2022-02-16 2023-02-02 Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods

Publications (2)

Publication Number Publication Date
JP2025506612A true JP2025506612A (ja) 2025-03-13
JP2025506612A5 JP2025506612A5 (https=) 2026-01-14

Family

ID=85476135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541875A Pending JP2025506612A (ja) 2022-02-16 2023-02-02 垂直集積パッチアンテナ（単数又は複数）を備えたパッケージ基板を採用するアンテナモジュール、及び関連する製造方法

Country Status (7)

Country Link
US (1) US12300873B2 (https=)
EP (1) EP4480038A1 (https=)
JP (1) JP2025506612A (https=)
KR (1) KR20240150756A (https=)
CN (1) CN118541871A (https=)
TW (1) TW202335238A (https=)
WO (1) WO2023158927A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12512593B2 (en) * 2023-04-13 2025-12-30 Qualcomm Incorporated Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods
US20250062521A1 (en) * 2023-08-16 2025-02-20 Mediatek Inc. Antenna package structure
WO2025090270A1 (en) * 2023-10-27 2025-05-01 Google Llc Meshed patch antenna array
US12567671B2 (en) 2024-02-06 2026-03-03 Google Llc Angled meshed patch antenna array

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070080864A1 (en) 2005-10-11 2007-04-12 M/A-Com, Inc. Broadband proximity-coupled cavity backed patch antenna
ITMI20111416A1 (it) 2011-07-28 2013-01-29 St Microelectronics Srl Circuito integrato dotato di almeno una antenna integrata
KR101905507B1 (ko) 2013-09-23 2018-10-10 삼성전자주식회사 안테나 장치 및 그를 구비하는 전자 기기
KR102151425B1 (ko) 2014-08-05 2020-09-03 삼성전자주식회사 안테나 장치
CN106486775A (zh) 2016-11-25 2017-03-08 华南理工大学 一种低剖面双频带滤波贴片天线及其构成mimo天线
US10879592B2 (en) 2016-11-25 2020-12-29 Sony Mobile Communications Inc. Vertical antenna patch in cavity region
KR102207151B1 (ko) 2019-07-31 2021-01-25 삼성전기주식회사 안테나 장치
IL271269A (en) 2019-12-09 2021-06-30 Arbe Robotics Ltd Radom for a planar antenna for car radar
US11569562B2 (en) 2019-12-12 2023-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and manufacturing method thereof
CN111129712B (zh) 2020-01-10 2024-09-13 深圳市信维通信股份有限公司 5g毫米波双极化天线模组及手持设备
US12040547B2 (en) * 2020-04-10 2024-07-16 Lg Electronics Inc. Electronic device with antenna
KR102737545B1 (ko) 2020-05-28 2024-12-03 삼성전기주식회사 안테나 기판

Also Published As

Publication number Publication date
CN118541871A (zh) 2024-08-23
EP4480038A1 (en) 2024-12-25
TW202335238A (zh) 2023-09-01
KR20240150756A (ko) 2024-10-16
WO2023158927A1 (en) 2023-08-24
US12300873B2 (en) 2025-05-13
US20230307817A1 (en) 2023-09-28

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