CN118541871A - 采用具有竖直集成贴片天线的封装基板的天线模块和相关制造方法 - Google Patents

采用具有竖直集成贴片天线的封装基板的天线模块和相关制造方法 Download PDF

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Publication number
CN118541871A
CN118541871A CN202380016701.1A CN202380016701A CN118541871A CN 118541871 A CN118541871 A CN 118541871A CN 202380016701 A CN202380016701 A CN 202380016701A CN 118541871 A CN118541871 A CN 118541871A
Authority
CN
China
Prior art keywords
package substrate
metallization layers
metal
patch antenna
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380016701.1A
Other languages
English (en)
Chinese (zh)
Inventor
S·黄
方堃
J·杨
C-K·金
杨泰熙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN118541871A publication Critical patent/CN118541871A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
CN202380016701.1A 2022-02-16 2023-02-02 采用具有竖直集成贴片天线的封装基板的天线模块和相关制造方法 Pending CN118541871A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/651,324 2022-02-16
US17/651,324 US12300873B2 (en) 2022-02-16 2022-02-16 Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods
PCT/US2023/061800 WO2023158927A1 (en) 2022-02-16 2023-02-02 Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods

Publications (1)

Publication Number Publication Date
CN118541871A true CN118541871A (zh) 2024-08-23

Family

ID=85476135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380016701.1A Pending CN118541871A (zh) 2022-02-16 2023-02-02 采用具有竖直集成贴片天线的封装基板的天线模块和相关制造方法

Country Status (7)

Country Link
US (1) US12300873B2 (https=)
EP (1) EP4480038A1 (https=)
JP (1) JP2025506612A (https=)
KR (1) KR20240150756A (https=)
CN (1) CN118541871A (https=)
TW (1) TW202335238A (https=)
WO (1) WO2023158927A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12512593B2 (en) * 2023-04-13 2025-12-30 Qualcomm Incorporated Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods
US20250062521A1 (en) * 2023-08-16 2025-02-20 Mediatek Inc. Antenna package structure
WO2025090270A1 (en) * 2023-10-27 2025-05-01 Google Llc Meshed patch antenna array
US12567671B2 (en) 2024-02-06 2026-03-03 Google Llc Angled meshed patch antenna array

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070080864A1 (en) 2005-10-11 2007-04-12 M/A-Com, Inc. Broadband proximity-coupled cavity backed patch antenna
ITMI20111416A1 (it) 2011-07-28 2013-01-29 St Microelectronics Srl Circuito integrato dotato di almeno una antenna integrata
KR101905507B1 (ko) 2013-09-23 2018-10-10 삼성전자주식회사 안테나 장치 및 그를 구비하는 전자 기기
KR102151425B1 (ko) 2014-08-05 2020-09-03 삼성전자주식회사 안테나 장치
CN106486775A (zh) 2016-11-25 2017-03-08 华南理工大学 一种低剖面双频带滤波贴片天线及其构成mimo天线
US10879592B2 (en) 2016-11-25 2020-12-29 Sony Mobile Communications Inc. Vertical antenna patch in cavity region
KR102207151B1 (ko) 2019-07-31 2021-01-25 삼성전기주식회사 안테나 장치
IL271269A (en) 2019-12-09 2021-06-30 Arbe Robotics Ltd Radom for a planar antenna for car radar
US11569562B2 (en) 2019-12-12 2023-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and manufacturing method thereof
CN111129712B (zh) 2020-01-10 2024-09-13 深圳市信维通信股份有限公司 5g毫米波双极化天线模组及手持设备
US12040547B2 (en) * 2020-04-10 2024-07-16 Lg Electronics Inc. Electronic device with antenna
KR102737545B1 (ko) 2020-05-28 2024-12-03 삼성전기주식회사 안테나 기판

Also Published As

Publication number Publication date
EP4480038A1 (en) 2024-12-25
TW202335238A (zh) 2023-09-01
KR20240150756A (ko) 2024-10-16
WO2023158927A1 (en) 2023-08-24
US12300873B2 (en) 2025-05-13
JP2025506612A (ja) 2025-03-13
US20230307817A1 (en) 2023-09-28

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