JP2024531534A - 上部コンタクトを有する金属－絶縁体－金属キャパシタ - Google Patents
上部コンタクトを有する金属－絶縁体－金属キャパシタ Download PDFInfo
- Publication number
- JP2024531534A JP2024531534A JP2024513832A JP2024513832A JP2024531534A JP 2024531534 A JP2024531534 A JP 2024531534A JP 2024513832 A JP2024513832 A JP 2024513832A JP 2024513832 A JP2024513832 A JP 2024513832A JP 2024531534 A JP2024531534 A JP 2024531534A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- mesa
- top contact
- insulator
- mim capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/495—Capacitive arrangements or effects of, or between wiring layers
- H10W20/496—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
- H10W20/42—Vias, e.g. via plugs
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/470,274 | 2021-09-09 | ||
| US17/470,274 US11973020B2 (en) | 2021-09-09 | 2021-09-09 | Metal-insulator-metal capacitor with top contact |
| PCT/US2022/074289 WO2023039319A1 (en) | 2021-09-09 | 2022-07-29 | Metal-insulator-metal capacitor with top contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024531534A true JP2024531534A (ja) | 2024-08-29 |
| JP2024531534A5 JP2024531534A5 (enExample) | 2025-07-08 |
Family
ID=83283119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024513832A Pending JP2024531534A (ja) | 2021-09-09 | 2022-07-29 | 上部コンタクトを有する金属－絶縁体－金属キャパシタ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11973020B2 (enExample) |
| EP (1) | EP4399742A1 (enExample) |
| JP (1) | JP2024531534A (enExample) |
| KR (1) | KR20240053592A (enExample) |
| CN (1) | CN117897812A (enExample) |
| TW (1) | TW202331977A (enExample) |
| WO (1) | WO2023039319A1 (enExample) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100224960A1 (en) | 2009-03-04 | 2010-09-09 | Kevin John Fischer | Embedded capacitor device and methods of fabrication |
| US9397038B1 (en) | 2015-02-27 | 2016-07-19 | Invensas Corporation | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates |
| US10043863B2 (en) | 2017-01-06 | 2018-08-07 | International Business Machines Corporation | Grated MIM capacitor to improve capacitance |
| US10804411B2 (en) * | 2017-11-29 | 2020-10-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and method of forming the same |
| US10483344B1 (en) * | 2018-04-26 | 2019-11-19 | International Business Machines Corporation | Fabrication of a MIM capacitor structure with via etch control with integrated maskless etch tuning layers |
| US11222946B2 (en) | 2018-11-30 | 2022-01-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device including a high density MIM capacitor and method |
| US11362064B2 (en) * | 2019-09-28 | 2022-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package with shared barrier layer in redistribution and via |
| US11424319B2 (en) * | 2020-05-29 | 2022-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multilayer capacitor electrode |
| US11527459B2 (en) * | 2021-04-28 | 2022-12-13 | Micron Technology, Inc. | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods |
-
2021
- 2021-09-09 US US17/470,274 patent/US11973020B2/en active Active
-
2022
- 2022-07-28 TW TW111128453A patent/TW202331977A/zh unknown
- 2022-07-29 WO PCT/US2022/074289 patent/WO2023039319A1/en not_active Ceased
- 2022-07-29 KR KR1020247007095A patent/KR20240053592A/ko active Pending
- 2022-07-29 CN CN202280058663.1A patent/CN117897812A/zh active Pending
- 2022-07-29 EP EP22769507.9A patent/EP4399742A1/en active Pending
- 2022-07-29 JP JP2024513832A patent/JP2024531534A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20230072667A1 (en) | 2023-03-09 |
| US11973020B2 (en) | 2024-04-30 |
| CN117897812A (zh) | 2024-04-16 |
| KR20240053592A (ko) | 2024-04-24 |
| WO2023039319A1 (en) | 2023-03-16 |
| EP4399742A1 (en) | 2024-07-17 |
| TW202331977A (zh) | 2023-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250630 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250630 |