JP2024527418A - プリント回路基板用の電流センサ - Google Patents

プリント回路基板用の電流センサ Download PDF

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Publication number
JP2024527418A
JP2024527418A JP2024502568A JP2024502568A JP2024527418A JP 2024527418 A JP2024527418 A JP 2024527418A JP 2024502568 A JP2024502568 A JP 2024502568A JP 2024502568 A JP2024502568 A JP 2024502568A JP 2024527418 A JP2024527418 A JP 2024527418A
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JP
Japan
Prior art keywords
current
pcb
current sensor
conductive
conductive path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024502568A
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English (en)
Japanese (ja)
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JP2024527418A5 (enExample
Inventor
マルティン、リンダール
Original Assignee
アルストム・ホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルストム・ホールディングス filed Critical アルストム・ホールディングス
Publication of JP2024527418A publication Critical patent/JP2024527418A/ja
Publication of JP2024527418A5 publication Critical patent/JP2024527418A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
    • G01R15/181—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers using coils without a magnetic core, e.g. Rogowski coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2024502568A 2021-07-22 2022-06-23 プリント回路基板用の電流センサ Pending JP2024527418A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE2150966-6 2021-07-22
SE2150966A SE545826C2 (en) 2021-07-22 2021-07-22 Current Sensor for a Printed Circuit Board
PCT/EP2022/067197 WO2023001482A1 (en) 2021-07-22 2022-06-23 Current sensor for a printed circuit board

Publications (2)

Publication Number Publication Date
JP2024527418A true JP2024527418A (ja) 2024-07-24
JP2024527418A5 JP2024527418A5 (enExample) 2025-06-23

Family

ID=82308365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502568A Pending JP2024527418A (ja) 2021-07-22 2022-06-23 プリント回路基板用の電流センサ

Country Status (6)

Country Link
US (1) US20240237215A1 (enExample)
EP (1) EP4374177A1 (enExample)
JP (1) JP2024527418A (enExample)
CN (1) CN117813519A (enExample)
SE (1) SE545826C2 (enExample)
WO (1) WO2023001482A1 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4917183B2 (ja) * 2006-03-31 2012-04-18 株式会社ダイヘン 電流・電圧検出用プリント基板及びそれを用いた電流・電圧検出器
US7564233B2 (en) * 2006-11-06 2009-07-21 Cooper Technologies Company Shielded Rogowski coil assembly and methods
JP2010008120A (ja) * 2008-06-25 2010-01-14 Daihen Corp 電流検出用プリント基板および電流検出器
KR101169301B1 (ko) * 2011-03-04 2012-07-30 주식회사 셀픽 로고스키 코일을 이용한 전류센서
FR2979792B1 (fr) * 2011-09-07 2013-10-11 Commissariat Energie Atomique Capteur de courant
AU2020319634B2 (en) * 2019-07-29 2025-02-27 Georgia Tech Research Corporation Current sensors employing Rogowski coils and methods of using same
KR102156929B1 (ko) * 2019-09-16 2020-09-17 주식회사 코본테크 비정상 전류를 검출하는 복합 전류 검출소자

Also Published As

Publication number Publication date
WO2023001482A1 (en) 2023-01-26
SE2150966A1 (en) 2023-01-23
EP4374177A1 (en) 2024-05-29
SE545826C2 (en) 2024-02-13
CN117813519A (zh) 2024-04-02
US20240237215A1 (en) 2024-07-11

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