JP2024526883A - ３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物 - Google Patents

３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物 Download PDF

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Publication number
JP2024526883A
JP2024526883A JP2024503551A JP2024503551A JP2024526883A JP 2024526883 A JP2024526883 A JP 2024526883A JP 2024503551 A JP2024503551 A JP 2024503551A JP 2024503551 A JP2024503551 A JP 2024503551A JP 2024526883 A JP2024526883 A JP 2024526883A
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Japan
Prior art keywords
substituted
film
unsubstituted
group
gpa
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Pending
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JP2024503551A
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Japanese (ja)
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JP2024526883A5 (https=
Inventor
ジエ バイ、
キジュオ ジュオ、
ジェームス ソンウク チャン、
ギュ チャン シム、
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of JP2024526883A publication Critical patent/JP2024526883A/ja
Publication of JP2024526883A5 publication Critical patent/JP2024526883A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/02—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024503551A 2021-07-21 2022-07-21 ３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物 Pending JP2024526883A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163224366P 2021-07-21 2021-07-21
US63/224,366 2021-07-21
PCT/US2022/037829 WO2023014509A2 (en) 2021-07-21 2022-07-21 Resin composition for non-conductive film with excellent high temperature properties for 3d tsv packages

Publications (2)

Publication Number Publication Date
JP2024526883A true JP2024526883A (ja) 2024-07-19
JP2024526883A5 JP2024526883A5 (https=) 2025-07-29

Family

ID=85156441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024503551A Pending JP2024526883A (ja) 2021-07-21 2022-07-21 ３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物

Country Status (6)

Country Link
US (1) US20240209166A1 (https=)
JP (1) JP2024526883A (https=)
KR (1) KR20240037994A (https=)
CN (1) CN118019790A (https=)
TW (1) TW202323359A (https=)
WO (1) WO2023014509A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025516430A (ja) * 2023-04-18 2025-05-30 エルジー・ケム・リミテッド 非導電性フィルム、半導体装置およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008138124A (ja) * 2006-12-04 2008-06-19 Shin Etsu Chem Co Ltd 接着剤組成物及び接着性フィルム
WO2008130894A1 (en) * 2007-04-16 2008-10-30 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
JP5970875B2 (ja) * 2012-03-09 2016-08-17 三菱化学株式会社 三次元集積回路用の層間充填材組成物、塗布液及び三次元集積回路の製造方法
JP6660156B2 (ja) * 2015-11-13 2020-03-04 日東電工株式会社 積層体および合同体・半導体装置の製造方法
JP6005312B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025516430A (ja) * 2023-04-18 2025-05-30 エルジー・ケム・リミテッド 非導電性フィルム、半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2023014509A2 (en) 2023-02-09
US20240209166A1 (en) 2024-06-27
KR20240037994A (ko) 2024-03-22
TW202323359A (zh) 2023-06-16
WO2023014509A3 (en) 2023-05-04
CN118019790A (zh) 2024-05-10

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