JP2024504652A5 - - Google Patents
Info
- Publication number
- JP2024504652A5 JP2024504652A5 JP2023542970A JP2023542970A JP2024504652A5 JP 2024504652 A5 JP2024504652 A5 JP 2024504652A5 JP 2023542970 A JP2023542970 A JP 2023542970A JP 2023542970 A JP2023542970 A JP 2023542970A JP 2024504652 A5 JP2024504652 A5 JP 2024504652A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser radiation
- focusing zone
- volume
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102021100675.9A DE102021100675B4 (de) | 2021-01-14 | 2021-01-14 | Verfahren zum Zerteilen eines transparenten Werkstücks |
| DE102021100675.9 | 2021-01-14 | ||
| PCT/EP2022/050305 WO2022152637A1 (de) | 2021-01-14 | 2022-01-10 | Verfahren zum zerteilen eines transparenten werkstücks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024504652A JP2024504652A (ja) | 2024-02-01 |
| JP2024504652A5 true JP2024504652A5 (https=) | 2024-12-17 |
Family
ID=80119358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542970A Pending JP2024504652A (ja) | 2021-01-14 | 2022-01-10 | 透明なワークピースを分割する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20230377970A1 (https=) |
| EP (1) | EP4277764A1 (https=) |
| JP (1) | JP2024504652A (https=) |
| KR (1) | KR20230130097A (https=) |
| CN (1) | CN117222493A (https=) |
| CA (1) | CA3204948A1 (https=) |
| DE (1) | DE102021100675B4 (https=) |
| WO (1) | WO2022152637A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2036015B1 (en) * | 2023-10-12 | 2025-04-30 | Micronit Holding B V | A method of manufacturing a nozzle assembly, comprising weakening a wafer at at least two focal zones in the depth direction by focusing a laser beam |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5784273B2 (ja) * | 2007-04-05 | 2015-09-24 | チャーム エンジニアリング株式会社 | レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 |
| DE102007028042B3 (de) | 2007-06-14 | 2008-08-07 | Universität Zu Lübeck | Verfahren zur Laserbearbeitung transparenter Materialien |
| RU2013102422A (ru) | 2010-07-12 | 2014-08-20 | ФАЙЛЭЙСЕР ЮЭс-Эй ЭлЭлСи | Способ обработки материалов с использованием филаментации |
| TW201343296A (zh) | 2012-03-16 | 2013-11-01 | Ipg Microsystems Llc | 使一工件中具有延伸深度虛飾之雷射切割系統及方法 |
| DE102012110971B4 (de) | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| WO2014079478A1 (en) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) * | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US9676167B2 (en) * | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9938187B2 (en) | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
| CN107073641B (zh) * | 2014-07-14 | 2020-11-10 | 康宁股份有限公司 | 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法 |
| CN107073653B (zh) | 2014-10-13 | 2019-11-26 | 艾维纳科技有限责任公司 | 用于劈开或切割基板的激光加工方法 |
| EP3221727B1 (de) | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
| JP6466369B2 (ja) * | 2016-06-14 | 2019-02-06 | イムラ アメリカ インコーポレイテッド | 超短パルスレーザでの透明材料処理 |
| EP3597353A1 (en) | 2016-09-30 | 2020-01-22 | Corning Incorporated | Apparatuses for laser processing transparent workpieces using non-axisymmetric beam spots |
| DE102017121140A1 (de) * | 2017-09-01 | 2019-03-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Laserbearbeitung eines transparenten Werkstücks |
| WO2019079417A2 (en) * | 2017-10-20 | 2019-04-25 | Corning Incorporated | METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS |
| US20190233321A1 (en) * | 2018-01-26 | 2019-08-01 | Corning Incorporated | Liquid-assisted laser micromachining of transparent dielectrics |
| US20200283325A1 (en) * | 2019-03-05 | 2020-09-10 | Corning Incorporated | Methods for linear laser processing of transparent workpieces using pulsed laser beam focal lines and chemical etching solutions |
| US20220168847A1 (en) * | 2019-06-10 | 2022-06-02 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
-
2021
- 2021-01-14 DE DE102021100675.9A patent/DE102021100675B4/de active Active
-
2022
- 2022-01-10 WO PCT/EP2022/050305 patent/WO2022152637A1/de not_active Ceased
- 2022-01-10 JP JP2023542970A patent/JP2024504652A/ja active Pending
- 2022-01-10 CA CA3204948A patent/CA3204948A1/en active Pending
- 2022-01-10 CN CN202280017510.2A patent/CN117222493A/zh active Pending
- 2022-01-10 KR KR1020237027585A patent/KR20230130097A/ko active Pending
- 2022-01-10 EP EP22701879.3A patent/EP4277764A1/de active Pending
-
2023
- 2023-07-13 US US18/221,501 patent/US20230377970A1/en active Pending
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