JP2024123567A - 酸化珪素膜用研磨液組成物 - Google Patents

酸化珪素膜用研磨液組成物 Download PDF

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Publication number
JP2024123567A
JP2024123567A JP2023031095A JP2023031095A JP2024123567A JP 2024123567 A JP2024123567 A JP 2024123567A JP 2023031095 A JP2023031095 A JP 2023031095A JP 2023031095 A JP2023031095 A JP 2023031095A JP 2024123567 A JP2024123567 A JP 2024123567A
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Japan
Prior art keywords
polishing
component
present disclosure
silicon oxide
substrate
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JP2024123567A5 (enExample
Inventor
将来 井上
Masaki Inoue
哲史 山口
Tetsushi Yamaguchi
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Kao Corp
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Kao Corp
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JP2023031095A 2023-03-01 2023-03-01 酸化珪素膜用研磨液組成物 Pending JP2024123567A (ja)

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JP2023031095A JP2024123567A (ja) 2023-03-01 2023-03-01 酸化珪素膜用研磨液組成物

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JP2024123567A true JP2024123567A (ja) 2024-09-12
JP2024123567A5 JP2024123567A5 (enExample) 2025-12-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026154642A1 (ja) * 2025-01-17 2026-07-23 株式会社レゾナック スラリ、研磨方法及び部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016029123A (ja) * 2014-07-25 2016-03-03 旭硝子株式会社 研磨剤と研磨方法、および研磨用添加液
JP2017076694A (ja) * 2015-10-14 2017-04-20 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
WO2022070926A1 (ja) * 2020-09-30 2022-04-07 昭和電工マテリアルズ株式会社 スラリ、研磨方法及び半導体部品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016029123A (ja) * 2014-07-25 2016-03-03 旭硝子株式会社 研磨剤と研磨方法、および研磨用添加液
JP2017076694A (ja) * 2015-10-14 2017-04-20 日立化成株式会社 Ｃｍｐ用研磨液及び研磨方法
WO2022070926A1 (ja) * 2020-09-30 2022-04-07 昭和電工マテリアルズ株式会社 スラリ、研磨方法及び半導体部品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026154642A1 (ja) * 2025-01-17 2026-07-23 株式会社レゾナック スラリ、研磨方法及び部品の製造方法

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