JP2024104589A5 - - Google Patents
Info
- Publication number
- JP2024104589A5 JP2024104589A5 JP2023008888A JP2023008888A JP2024104589A5 JP 2024104589 A5 JP2024104589 A5 JP 2024104589A5 JP 2023008888 A JP2023008888 A JP 2023008888A JP 2023008888 A JP2023008888 A JP 2023008888A JP 2024104589 A5 JP2024104589 A5 JP 2024104589A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- conductive layer
- thickness
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023008888A JP2024104589A (ja) | 2023-01-24 | 2023-01-24 | 配線板、配線板の製造方法、電子モジュールおよび電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023008888A JP2024104589A (ja) | 2023-01-24 | 2023-01-24 | 配線板、配線板の製造方法、電子モジュールおよび電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024104589A JP2024104589A (ja) | 2024-08-05 |
| JP2024104589A5 true JP2024104589A5 (https=) | 2026-01-29 |
Family
ID=92144477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023008888A Pending JP2024104589A (ja) | 2023-01-24 | 2023-01-24 | 配線板、配線板の製造方法、電子モジュールおよび電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2024104589A (https=) |
-
2023
- 2023-01-24 JP JP2023008888A patent/JP2024104589A/ja active Pending
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