JP2024064082A5 - - Google Patents
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- Publication number
- JP2024064082A5 JP2024064082A5 JP2022172413A JP2022172413A JP2024064082A5 JP 2024064082 A5 JP2024064082 A5 JP 2024064082A5 JP 2022172413 A JP2022172413 A JP 2022172413A JP 2022172413 A JP2022172413 A JP 2022172413A JP 2024064082 A5 JP2024064082 A5 JP 2024064082A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- composition according
- diameter particles
- composite filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims 23
- 229920000647 polyepoxide Polymers 0.000 claims 23
- 239000002245 particle Substances 0.000 claims 18
- 239000000203 mixture Substances 0.000 claims 15
- 239000000945 filler Substances 0.000 claims 11
- 239000002131 composite material Substances 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022172413A JP2024064082A (ja) | 2022-10-27 | 2022-10-27 | エポキシ樹脂組成物、半導体装置および半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022172413A JP2024064082A (ja) | 2022-10-27 | 2022-10-27 | エポキシ樹脂組成物、半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024064082A JP2024064082A (ja) | 2024-05-14 |
| JP2024064082A5 true JP2024064082A5 (enrdf_load_stackoverflow) | 2025-03-07 |
Family
ID=91034810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022172413A Pending JP2024064082A (ja) | 2022-10-27 | 2022-10-27 | エポキシ樹脂組成物、半導体装置および半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2024064082A (enrdf_load_stackoverflow) |
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2022
- 2022-10-27 JP JP2022172413A patent/JP2024064082A/ja active Pending