JP2024063054A - Photosensitive transfer member, circuit wiring manufacturing method, and touch panel manufacturing method - Google Patents

Abstract

[Problem] The present invention aims to provide a photosensitive transfer member capable of producing a resin pattern with superior resolution. Another object of the present invention is to provide a method for producing circuit wiring and a method for producing a touch panel. [Solution] The photosensitive transfer member of the present invention comprises a temporary support and a photosensitive resin layer, the layer thickness of the photosensitive resin layer being 8 μm or less, the photosensitive resin layer containing a polymer A having a structural unit derived from styrene and a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups, the content of the structural unit derived from styrene relative to the total mass of the polymer A being more than 40 mass%, and the mass ratio of the content of the polymerizable compound B1 relative to the content of the polymerizable compound B having a polymerizable group in the photosensitive resin layer being 55 mass% or more. [Selected Figure] None

Description

The present invention relates to a photosensitive transfer member, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel.

In display devices (such as organic electroluminescence (EL) display devices and liquid crystal display devices) equipped with a touch panel such as a capacitance-type input device, an electrode pattern corresponding to a sensor of a visible portion, and conductive layer patterns such as wiring of a peripheral wiring portion and an extraction wiring portion are provided inside the touch panel.
Conventionally, in forming a patterned layer, the number of steps required to obtain a desired pattern shape is small, so a method has been widely adopted in which a layer of a photosensitive resin composition (photosensitive layer) is provided on a substrate using a photosensitive transfer member, the photosensitive layer is exposed to light through a mask having a desired pattern, and then the layer is developed.

Patent document 1 describes a pattern-forming material having a cushion layer and a photosensitive layer in this order on a support, in which the photosensitive layer contains a fluorescent brightening agent as a sensitizer, and the minimum energy of light used for exposure when the photosensitive layer is exposed and developed is specified.

JP 2007-178459 A

The present invention aims to provide a photosensitive transfer member that can produce a resin pattern with superior resolution. It also aims to provide a method for manufacturing circuit wiring and a method for manufacturing a touch panel.

The means for solving the above problems include the following aspects:

[1] A photosensitive transfer member comprising a temporary support and a photosensitive resin layer, the photosensitive resin layer having a thickness of 8 μm or less, the photosensitive resin layer containing a polymer A having a structural unit derived from styrene and a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups, the content of the structural unit derived from styrene relative to the total mass of the polymer A being more than 40 mass%, and the mass ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound B having a polymerizable group in the photosensitive resin layer being 55 mass% or more.
[2] The photosensitive transfer member according to [1], wherein the photosensitive resin layer is a negative photosensitive resin layer whose solubility in a developer is reduced by exposure to light.
[3] The photosensitive transfer member according to [1] or [2], wherein the transmittance of light with a wavelength of 365 nm in the photosensitive resin layer is 30% or more.
[4] The photosensitive transfer member according to any one of [1] to [3], wherein the polymerizable compound B1 has a bisphenol structure.
[5] The photosensitive transfer member according to any one of [1] to [4], wherein the content of the structural unit derived from styrene relative to the total mass of the polymer A is 50 mass % or more.
[6] The photosensitive transfer member according to any one of [1] to [5], wherein the acid value of the polymer A is less than 190.
[7] The photosensitive transfer member according to any one of [1] to [6], wherein the photosensitive resin layer further contains a fluorine-based nonionic surfactant.
[8] The photosensitive transfer member according to any one of [1] to [7], further comprising a thermoplastic resin layer between the temporary support and the photosensitive resin layer.
[9] The photosensitive transfer member according to [8], further comprising an intermediate layer between the photosensitive resin layer and the thermoplastic resin layer.
[10] The photosensitive transfer member according to [8] or [9], wherein the thermoplastic resin layer has a thickness of 10 μm or less.
[11] The photosensitive transfer member according to any one of [1] to [10], further comprising a cover film in contact with a surface of the photosensitive resin layer that does not face the temporary support, and the arithmetic mean roughness Ra value of the surface of the cover film in contact with the photosensitive resin layer is 0.05 μm or less.
[12] A method for producing a resin pattern, comprising the steps of: bonding the photosensitive transfer member according to any one of [1] to [11] to a substrate having a conductive layer by contacting the substrate to a surface of the photosensitive resin layer that does not face the temporary support; exposing the photosensitive resin layer to a pattern; and developing the exposed photosensitive resin layer to form a resin pattern.
[13] The method for producing a resin pattern according to [12], wherein the photosensitive transfer member according to any one of [1] to [11] is a photosensitive transfer member produced by a production method including the steps of: applying a thermoplastic resin composition containing at least one solvent selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent to a surface of a temporary support, and then drying the coating of the thermoplastic resin composition to form a thermoplastic resin layer; applying an intermediate layer composition containing at least one solvent selected from the group consisting of water and a water-miscible organic solvent to the surface of the thermoplastic resin layer, and then drying the coating of the intermediate layer composition to form an intermediate layer; and applying a photosensitive resin composition containing a polymer A, a polymerizable compound B1, and at least one solvent selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent to the surface of the intermediate layer, and then drying the coating of the photosensitive resin composition to form a photosensitive resin layer.
[14] A method for producing circuit wiring, comprising a step of etching a conductive layer in an area where a resin pattern is not arranged in a laminate in which a substrate, a conductive layer, and a resin pattern produced by the production method according to [12] or [13] are laminated in this order.
[15] A method for producing a touch panel, comprising a step of forming wiring for a touch panel by etching the conductive layer in an area where a resin pattern is not arranged in a laminate having a substrate, a conductive layer, and a resin pattern produced by the production method according to [12] or [13] laminated in this order.

The present invention provides a photosensitive transfer member capable of producing a resin pattern with superior resolution. The present invention also provides a method for producing circuit wiring and a method for producing a touch panel.

FIG. 2 is a schematic diagram showing an example of a configuration of a photosensitive transfer member. FIG. 2 is a schematic diagram showing an example of a mask pattern for manufacturing a touch panel. 10 is a schematic diagram showing another example of a pattern of a mask for manufacturing a touch panel. FIG.

The present invention will be described below. The description will be made with reference to the attached drawings, but reference numerals may be omitted.

In the description of groups (atomic groups) in this specification, when a notation does not indicate whether it is substituted or unsubstituted, it includes both unsubstituted and substituted groups. For example, the notation "alkyl group" includes not only alkyl groups without a substituent (unsubstituted alkyl groups) but also alkyl groups with a substituent (substituted alkyl groups).
In this specification, "(meth)acrylic acid" refers to both or either one of acrylic acid and methacrylic acid, and "(meth)acrylate" refers to both or either one of acrylate and methacrylate.
In addition, chemical structural formulas in this specification may be described as simplified structural formulas in which hydrogen atoms are omitted.

In this specification, when a component contains multiple substances, the amount (content, etc.) of each component means the total amount (total content, etc.) of those multiple substances, unless otherwise specified.
In this specification, a numerical range expressed using "to" means a range that includes the numerical values before and after "to" as the lower and upper limits.
In this specification, "mass %" and "weight %" are synonymous, and "parts by mass" and "parts by weight" are synonymous.

In this specification, the term "step" does not mean only an independent step, and even if a step cannot be clearly distinguished from other steps, it is included in this term as long as it achieves a desired purpose.
In this specification, unless otherwise specified, "exposure" includes not only exposure using light, but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light represented by an excimer laser, extreme ultraviolet light (EUV (Extreme ultraviolet lithography) light), and actinic rays (active energy rays) such as X-rays.

In this specification, unless otherwise specified, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are molecular weights obtained by detecting a compound in a THF (tetrahydrofuran) solvent with a differential refractometer using a gel permeation chromatography (GPC) analyzer using columns of TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all of which are product names manufactured by Tosoh Corporation) and converting the molecular weight using polystyrene as a standard substance.
As used herein, a combination of two or more preferred aspects is a more preferred aspect.

[Photosensitive Transfer Member]
The photosensitive transfer member according to the present invention comprises at least a temporary support and a photosensitive resin layer.
In the photosensitive transfer member, the temporary support and the photosensitive resin layer may be laminated directly without any other layer therebetween, or may be laminated via another layer. Also, another layer may be laminated on the surface of the photosensitive resin layer opposite to the surface facing the temporary support.
Examples of layers other than the temporary support and the photosensitive resin layer include a thermoplastic resin layer, an intermediate layer, and a cover film.

[Temporary Support]
The photosensitive transfer member according to the present invention includes a temporary support.
The temporary support is a peelable support that supports the photosensitive resin layer or the laminate including the photosensitive resin layer.

The temporary support preferably has light transmittance from the viewpoint of enabling exposure of the photosensitive resin layer through the temporary support when the photosensitive resin layer is subjected to patternwise exposure. In this specification, "having light transmittance" means that the transmittance of light of a wavelength used for patternwise exposure is 50% or more.
From the viewpoint of improving the exposure sensitivity of the photosensitive resin layer, the temporary support preferably has a transmittance of light having a wavelength used for pattern exposure (more preferably a wavelength of 365 nm) of 60% or more, and more preferably 70% or more.
The transmittance of the layer of the photosensitive transfer member is the ratio of the intensity of the emitted light that passes through the layer to the intensity of the incident light when light is incident in a direction perpendicular to the main surface of the layer (thickness direction), and is measured using an MCPD Series manufactured by Otsuka Electronics Co., Ltd.

Examples of materials constituting the temporary support include a glass substrate, a resin film, and paper. From the viewpoints of strength, flexibility, and light transmittance, a resin film is preferred.
Examples of the resin film include a polyethylene terephthalate (PET) film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Of these, a PET film is preferred, and a biaxially stretched PET film is more preferred.

The thickness (layer thickness) of the temporary support is not particularly limited, and may be selected according to the material from the standpoints of strength as a support, flexibility required for bonding to a substrate for forming circuit wiring, and light transmittance required in the initial exposure step.
The thickness of the temporary support is preferably in the range of 5 to 100 μm, and from the viewpoints of ease of handling and versatility, it is more preferably in the range of 10 to 50 μm.

Furthermore, it is preferable that the film used as the temporary support is free from deformation such as wrinkles and scratches.
From the viewpoint of pattern formability during pattern exposure through the temporary support and the transparency of the temporary support, it is preferable that the number of fine particles, foreign matter, and defects contained in the temporary support is small. The total number of fine particles, foreign matter, and defects having a diameter of 1 μm or more is preferably 50 pieces/ ¹⁰ mm2 or less, more preferably 10 pieces/ ¹⁰ mm2 or less, even more preferably 3 pieces/ ¹⁰ mm2 or less, and particularly preferably 0 pieces/ ¹⁰ mm2.

Preferred embodiments of the temporary support include, for example, those described in paragraphs 0017 to 0018 of JP 2014-085643 A, paragraphs 0019 to 0026 of JP 2016-027363 A, paragraphs 0041 to 0057 of WO 2012/081680 A, and paragraphs 0029 to 0040 of WO 2018/179370 A, the contents of which are incorporated herein by reference.

[Photosensitive resin layer]
The photosensitive transfer member according to the present invention comprises a photosensitive resin layer.
The photosensitive resin layer used in the present invention has a layer thickness of 8 μm or less, and contains a polymer A having a structural unit derived from styrene and a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups. Furthermore, the content of the structural unit derived from styrene in the polymer A exceeds a predetermined amount, and the mass ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound B having a polymerizable group is equal to or greater than a predetermined amount.

As a result of extensive investigations, the present inventors have found that by using a photosensitive transfer member having the above-mentioned configuration, a resin pattern having superior resolution can be produced.
Without being bound by theory, it is presumed that the photosensitive resin layer contains a predetermined amount of polymer A and a predetermined amount of polymerizable compound B1, thereby increasing the content of aromatic rings in the photosensitive resin layer and suppressing swelling of the photosensitive resin layer during development, thereby improving the resolution of the resin pattern.

Each component contained in the photosensitive resin layer will be described below.
The photosensitive resin layer is preferably a negative photosensitive resin layer in which the solubility of the exposed portion in a developer is reduced by exposure and the non-exposed portion is removed by development. However, the photosensitive resin layer is not limited to a negative photosensitive resin layer, and may be a positive photosensitive resin layer in which the solubility of the exposed portion in a developer is increased by exposure and the exposed portion is removed by development.

<Ingredients>
(Polymer A)
Polymer A has structural units derived from styrene, and the content of the structural units derived from styrene relative to the total mass of Polymer A (hereinafter also referred to as "styrene content") is more than 40 mass%.
Polymer A may be composed of only structural units derived from styrene, or may have structural units other than structural units derived from styrene. That is, the upper limit of the styrene content of polymer A is not particularly limited, and the styrene content may be 100 mass% or less.

The styrene content of polymer A is preferably 50% by mass or more, since this suppresses swelling of the photosensitive resin layer by the developer, thereby resulting in better resolution of the formed resin pattern (hereinafter also simply referred to as "resolution").
The styrene content of polymer A is preferably 70% by mass or less, and more preferably 60% by mass or less, since this provides better releasability of the resin pattern from the substrate (hereinafter also simply referred to as "releasability").

Polymer A may have a structural unit derived from a polymerizable monomer other than styrene that is polymerizable with styrene.

From the viewpoint of excellent developability, the polymer A preferably has a structural unit having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group.
In particular, polymer A preferably has a structural unit having a carboxy group, and more preferably has a structural unit derived from (meth)acrylic acid.

The content of structural units having an acid group in polymer A (more preferably structural units derived from (meth)acrylic acid) is preferably 10 to 40% by mass, more preferably 20 to 30% by mass, based on the total mass of polymer A.

From the viewpoint of excellent compatibility, it is preferable that polymer A further contains a structural unit derived from a (meth)acrylic acid ester.
Examples of (meth)acrylic acid esters include (meth)acrylic acid alkyl esters having an alkyl group having 1 to 8 carbon atoms, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. As the (meth)acrylic acid ester, a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms is preferred, and methyl (meth)acrylate or ethyl (meth)acrylate is more preferred.

The polymer A may have one type of structural unit derived from a (meth)acrylic acid ester alone, or may have two or more types.
The content of the structural unit derived from a (meth)acrylic acid ester in the polymer A is preferably from 5 to 40% by mass, and more preferably from 10 to 30% by mass, based on the total mass of the polymer A.

It is preferable that polymer A has both structural units derived from (meth)acrylic acid and structural units derived from (meth)acrylic acid esters. In this case, the total content of structural units derived from (meth)acrylic acid and structural units derived from (meth)acrylic acid esters is 60% by mass or less, and is preferably less than 50% by mass because this provides better resolution.

The method for producing polymer A is not particularly limited, and for example, polymer A may be produced by a known method of radically polymerizing styrene and an optional polymerizable monomer other than styrene in the presence of a polymerization initiator. Examples of the polymerization method include bulk polymerization, suspension polymerization, emulsion polymerization, and solution polymerization.

The acid value of polymer A is preferably 220 mgKOH/g or less, more preferably less than 200 mgKOH/g, and even more preferably less than 190 mgKOH/g, from the viewpoint of suppressing swelling of the photosensitive resin layer by the developer and thereby achieving superior resolution.
The lower limit of the acid value of polymer A is not particularly limited, but from the viewpoint of superior developability, it is preferably 60 mgKOH/g or more, more preferably 155 mgKOH/g or more, and even more preferably 170 mgKOH/g or more.

The acid value is the mass [mg] of potassium hydroxide required to neutralize 1 g of a sample, and is expressed in units of mgKOH/g in this specification. The acid value can be calculated, for example, from the average content of acid groups in a compound.
The acid value of the polymer A may be adjusted by changing the type of structural unit constituting the polymer A and the content of the structural unit containing an acid group.

The weight average molecular weight (Mw) of polymer A is preferably 1,000 or more, more preferably 10,000 to 100,000, and even more preferably 20,000 to 50,000.

The photosensitive resin layer may contain one type of polymer A alone, or may contain two or more types of polymer A.
From the viewpoint of photosensitivity, the content of polymer A in the photosensitive resin layer is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, and even more preferably 30 to 70% by mass, based on the total mass of the photosensitive resin layer.

(Polymerizable Compound B)
The photosensitive resin layer contains a polymerizable compound B having a polymerizable group. A part or the whole of the polymerizable compound B contained in the photosensitive resin layer is a polymerizable compound B1 described later.
In this specification, the term "polymerizable compound" refers to a compound that undergoes polymerization under the action of a polymerization initiator described below, and is different from the resin A described above.

The polymerizable group contained in the polymerizable compound B is not particularly limited as long as it is a group that participates in a polymerization reaction, and examples thereof include groups having an ethylenically unsaturated group, such as a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group; and groups having a cationic polymerizable group, such as an epoxy group and an oxetane group.
The polymerizable group is preferably a group having an ethylenically unsaturated group, and more preferably an acryloyl group or a methacryloyl group.

As the polymerizable compound B, a compound having one or more ethylenically unsaturated groups (ethylenically unsaturated compound) is preferred, and a compound having two or more ethylenically unsaturated groups in one molecule (polyfunctional ethylenically unsaturated compound) is more preferred, in that the photosensitivity of the photosensitive resin layer is superior.
From the viewpoint of obtaining superior resolution and peelability, the number of ethylenically unsaturated groups contained in one molecule of the ethylenically unsaturated compound is preferably 6 or less, more preferably 3 or less, and even more preferably 2 or less.

The photosensitive resin layer preferably contains a bifunctional or trifunctional ethylenically unsaturated compound having two or three ethylenically unsaturated groups in one molecule, and more preferably contains a bifunctional ethylenically unsaturated compound having two ethylenically unsaturated groups in one molecule, in that the photosensitive resin layer has a better balance between the photosensitivity, resolution, and peelability.
The content of the bifunctional ethylenically unsaturated compound relative to the content of the polymerizable compound B in the photosensitive resin layer is preferably 60% by mass or more, more preferably more than 70% by mass, and even more preferably 90% by mass or more, from the viewpoint of excellent peelability. The upper limit is not particularly limited, and may be 100% by mass. That is, all of the polymerizable compound B contained in the photosensitive resin layer may be a bifunctional ethylenically unsaturated compound.
As the ethylenically unsaturated compound, a (meth)acrylate compound having a (meth)acryloyl group as a polymerizable group is preferred.

--Polymerizable compound B1--
The photosensitive resin layer according to the present invention contains a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups. The polymerizable compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule, among the above-mentioned polymerizable compounds B.

In the photosensitive resin layer according to the present invention, the mass ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound B is 55 mass % or more.
The content of the polymerizable compound B1 in the photosensitive resin layer relative to the content of the polymerizable compound B is preferably more than 60% by mass, more preferably more than 70% by mass, and even more preferably more than 80% by mass from the viewpoint of better resolution. The upper limit is not particularly limited, but is preferably 99% by mass or less, more preferably 95% by mass or less from the viewpoint of peelability.

Examples of the aromatic ring that the polymerizable compound B1 has include aromatic hydrocarbon rings such as a benzene ring, a naphthalene ring, and an anthracene ring, aromatic heterocycles such as a thiophene ring, a furan ring, a pyrrole ring, an imidazole ring, a triazole ring, and a pyridine ring, and condensed rings thereof, and the aromatic hydrocarbon ring is preferred, and the benzene ring is more preferred. The aromatic ring may have a substituent.
The polymerizable compound B1 may have only one aromatic ring, or may have two or more aromatic rings.

The polymerizable compound B1 preferably has a bisphenol structure, since this suppresses swelling of the photosensitive resin layer due to a developer, thereby improving the resolution.
Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (2,2-bis(4-hydroxyphenyl)propane), a bisphenol F structure derived from bisphenol F (2,2-bis(4-hydroxyphenyl)methane), and a bisphenol B structure derived from bisphenol B (2,2-bis(4-hydroxyphenyl)butane), with the bisphenol A structure being preferred.

An example of the polymerizable compound B1 having a bisphenol structure is a compound having a bisphenol structure and two polymerizable groups (preferably (meth)acryloyl groups) bonded to both ends of the bisphenol structure.
Both ends of the bisphenol structure may be directly bonded to the two polymerizable groups, or may be bonded via one or more alkyleneoxy groups. The alkyleneoxy groups added to both ends of the bisphenol structure are preferably ethyleneoxy groups or propyleneoxy groups, and more preferably ethyleneoxy groups. The number of alkyleneoxy groups added to the bisphenol structure is not particularly limited, but is preferably 4 to 16, and more preferably 6 to 14 per molecule.
The polymerizable compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP-A-2016-224162, the contents of which are incorporated herein by reference.

As the polymerizable compound B1, a bifunctional ethylenically unsaturated compound having a bisphenol A structure is preferable, and 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane is more preferable.
Examples of 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (FA-324M, Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane, 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (BPE-500, Shin-Nakamura Chemical Co., Ltd.), and 2,2-bis(4-(methacryloxydodecaethoxy)phenyl)propane. Examples of such bisphenol A diacrylate include 2,2-bis(4-(tetrapropoxy)phenyl)propane (FA-3200MY, manufactured by Hitachi Chemical Co., Ltd.), 2,2-bis(4-(methacryloxypentadecaethoxy)phenyl)propane (BPE-1300, manufactured by Shin-Nakamura Chemical Co., Ltd.), 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane (BPE-200, manufactured by Shin-Nakamura Chemical Co., Ltd.), and ethoxylated (10) bisphenol A diacrylate (NK Ester A-BPE-10, manufactured by Shin-Nakamura Chemical Co., Ltd.).

The polymerizable compound B1 may be used alone or in combination of two or more kinds.
The content of the polymerizable compound B1 in the photosensitive resin layer is preferably 10% by mass or more, more preferably 20% by mass or more, based on the total mass of the photosensitive resin layer, from the viewpoint of better resolution. The upper limit is not particularly limited, but is preferably 70% by mass or less, more preferably 60% by mass or less, from the viewpoint of transferability and edge fusion (phenomenon in which the photosensitive resin seeps out from the edge of the transfer member).

The photosensitive resin layer may contain a polymerizable compound B other than the above-mentioned polymerizable compound B1.
The polymerizable compound B other than the polymerizable compound B1 is not particularly limited and can be appropriately selected from known compounds. For example, a compound having one ethylenically unsaturated group in one molecule (monofunctional ethylenically unsaturated compound), a bifunctional ethylenically unsaturated compound having no aromatic ring, and a trifunctional or higher ethylenically unsaturated compound can be mentioned.

Examples of monofunctional ethylenically unsaturated compounds include ethyl (meth)acrylate, ethylhexyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and phenoxyethyl (meth)acrylate.

Examples of difunctional ethylenically unsaturated compounds having no aromatic ring include alkylene glycol di(meth)acrylates, polyalkylene glycol di(meth)acrylates, urethane di(meth)acrylates, and trimethylolpropane diacrylate.
Examples of alkylene glycol di(meth)acrylates include tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), ethylene glycol dimethacrylate, 1,10-decanediol diacrylate, and neopentyl glycol di(meth)acrylate.
Examples of polyalkylene glycol di(meth)acrylates include polyethylene glycol di(meth)acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di(meth)acrylate.
Examples of urethane di(meth)acrylates include propylene oxide modified urethane di(meth)acrylates, and ethylene oxide and propylene oxide modified urethane di(meth)acrylates. Commercially available products include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.).

Examples of the tri- or higher functional ethylenically unsaturated compound include dipentaerythritol (tri/tetra/penta/hexa)(meth)acrylate, pentaerythritol (tri/tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, trimethylolethane tri(meth)acrylate, isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate, and alkylene oxide modified versions of these.
Here, "(tri/tetra/penta/hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, and "(tri/tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

Examples of alkylene oxide modified ethylenically unsaturated compounds having three or more functionalities include caprolactone modified (meth)acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., etc.), alkylene oxide modified (meth)acrylate compounds (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) manufactured by Daicel-Allnex Corporation), 135, etc.), ethoxylated glycerin triacrylate (A-GLY-9E, etc., manufactured by Shin-Nakamura Chemical Co., Ltd.), Aronix (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix M-520 (manufactured by Toagosei Co., Ltd.), and Aronix M-510 (manufactured by Toagosei Co., Ltd.).

As the polymerizable compound B other than the polymerizable compound B1, a polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 may be used.

The polymerizable compound B may be used alone or in combination of two or more kinds.
The content of the polymerizable compound B in the photosensitive resin layer is preferably from 10 to 70% by mass, more preferably from 20 to 60% by mass, and even more preferably from 20 to 50% by mass, based on the total mass of the photosensitive resin layer.

The weight average molecular weight (Mw) of the polymerizable compound B, including the polymerizable compound B1, is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200.

(Optional ingredients)
The photosensitive resin layer may contain components other than the polymer A and the polymerizable compound B.

- Photopolymerization initiator -
The photosensitive resin layer preferably contains a photopolymerization initiator.
The photopolymerization initiator is a compound that initiates polymerization of a polymerizable compound when exposed to active light such as ultraviolet light, visible light, and X-rays. The photopolymerization initiator is not particularly limited, and any known photopolymerization initiator can be used.
Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferred.

Examples of photoradical polymerization initiators include photopolymerization initiators having an oxime ester structure, photopolymerization initiators having an α-aminoalkylphenone structure, photopolymerization initiators having an α-hydroxyalkylphenone structure, photopolymerization initiators having an acylphosphine oxide structure, and photopolymerization initiators having an N-phenylglycine structure.

From the viewpoints of photosensitivity, visibility of exposed and non-exposed areas, and resolution, the photosensitive resin layer preferably contains, as a photoradical polymerization initiator, at least one selected from the group consisting of 2,4,5-triarylimidazole dimers and derivatives thereof. Note that the two 2,4,5-triarylimidazole structures in the 2,4,5-triarylimidazole dimer and derivatives thereof may be the same or different.
Examples of derivatives of 2,4,5-triarylimidazole dimers include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer.

As the photoradical polymerization initiator, for example, the polymerization initiators described in paragraphs 0031 to 0042 of JP2011-095716A and paragraphs 0064 to 0081 of JP2015-014783A may be used.

Examples of photoradical polymerization initiators include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p,p'-dimethoxybenzyl), TAZ-110 (product name: manufactured by Midori Chemical Co., Ltd.), benzophenone, TAZ-111 (product name: manufactured by Midori Chemical Co., Ltd.), Irgacure OXE01, OXE02, OXE03 (manufactured by BASF), Omnirad 651 and 369 (product names: manufactured by IGM Resins B.V.), and 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.).

Commercially available photoradical polymerization initiators include, for example, 1-[4-(phenylthio)]-1,2-octanedione-2-(O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-01, manufactured by BASF), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (trade name: IRGACURE OXE-02, manufactured by BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, manufactured by IGM Resins B.V.), and 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907, manufactured by IGM Resins B.V.), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one (trade name: Omnirad 127, manufactured by IGM Resins B.V.), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1 (trade name: Omnirad 369, manufactured by IGM Resins B.V.), 2-hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173, manufactured by IGM Resins B.V.), 1-hydroxycyclohexyl phenyl ketone (trade name: Omnirad 184, manufactured by IGM Resins B.V.) B.V.), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad 651, manufactured by IGM Resins B.V.), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H, manufactured by IGM Resins B.V.), bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819, manufactured by IGM Resins B.V.), oxime ester-based photopolymerization initiator (trade name: Lunar 6, manufactured by DKSH Japan Co., Ltd.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole (2-(2-chlorophenyl)-4,5-diphenylimidazole dimer) (trade name: B-CIM, manufactured by Hampford Co., Ltd.), and 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer (trade name: BCTB, manufactured by Tokyo Chemical Industry Co., Ltd.).

A photocationic polymerization initiator (photoacid generator) is a compound that generates an acid when exposed to active light. As the photocationic polymerization initiator, a compound that generates an acid in response to active light having a wavelength of 300 nm or more is preferred, and a compound that generates an acid in response to active light having a wavelength of 300 to 450 nm is more preferred, but the chemical structure is not limited. In addition, even if a photocationic polymerization initiator is not directly sensitive to active light having a wavelength of 300 nm or more, it can be preferably used in combination with a sensitizer as long as it is a compound that responds to active light having a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer.
As the photocationic polymerization initiator, a photocationic polymerization initiator that generates an acid having a pKa of 4 or less is preferable, a photocationic polymerization initiator that generates an acid having a pKa of 3 or less is more preferable, and a photocationic polymerization initiator that generates an acid having a pKa of 2 or less is even more preferable. Although the lower limit of the pKa is not particularly set, for example, it is preferably −10.0 or more.

The photocationic polymerization initiator includes an ionic photocationic polymerization initiator and a nonionic photocationic polymerization initiator.
Examples of the ionic photocationic polymerization initiator include onium salt compounds such as diaryliodonium salt compounds and triarylsulfonium salt compounds, and quaternary ammonium salt compounds.
As the ionic photocationic polymerization initiator, the ionic photocationic polymerization initiators described in paragraphs 0114 to 0133 of JP-A-2014-085643 may be used.

Examples of nonionic photocationic polymerization initiators include trichloromethyl-s-triazine compounds, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. As the trichloromethyl-s-triazine compounds, diazomethane compounds, and imide sulfonate compounds, the compounds described in paragraphs 0083 to 0088 of JP 2011-221494 A may be used. As the oxime sulfonate compounds, the compounds described in paragraphs 0084 to 0088 of WO 2018/179640 A may be used.

The photosensitive resin layer preferably contains a photoradical polymerization initiator, and more preferably contains at least one selected from the group consisting of 2,4,5-triarylimidazole dimers and derivatives thereof.

The photosensitive resin layer may contain one type of photopolymerization initiator alone, or may contain two or more types of photopolymerization initiators.
The content of the photopolymerization initiator in the photosensitive resin layer is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more, based on the total mass of the photosensitive resin layer. The upper limit is not particularly limited, but is preferably 10% by mass or less, and more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.

- Pigments -
From the viewpoints of visibility of exposed and unexposed parts, pattern visibility after development, and resolution, the photosensitive resin layer preferably contains a dye (also simply referred to as "dye N") whose maximum absorption wavelength in the wavelength range of 400 to 780 nm during color development is 450 nm or more and whose maximum absorption wavelength changes with an acid, a base, or a radical. When dye N is contained, the adhesion with adjacent layers (e.g., temporary support and intermediate layer) is improved, and the resolution is more excellent, although the detailed mechanism is unknown.

In this specification, the dye "whose maximum absorption wavelength changes due to an acid, a base, or a radical" may mean any of an embodiment in which a dye in a colored state is decolorized by an acid, a base, or a radical, a dye in a decolorized state is colored by an acid, a base, or a radical, and a dye in a colored state is changed to a colored state of another hue.
Specifically, the dye N may be a compound that changes from a decolorized state to a colored state by exposure, or may be a compound that changes from a colored state to a decolored state by exposure. In this case, the dye may be a dye whose colored or decolored state changes when an acid, base, or radical is generated and acts in the photosensitive resin layer by exposure, or a dye whose colored or decolored state changes when the state (e.g., pH) in the photosensitive resin layer changes due to an acid, base, or radical. Alternatively, the dye may be a dye whose colored or decolored state changes when it is directly stimulated by an acid, base, or radical without exposure.

Among these, from the viewpoints of the visibility and resolution of exposed and unexposed areas, dye N is preferably a dye whose maximum absorption wavelength changes in response to an acid or a radical, and more preferably a dye whose maximum absorption wavelength changes in response to a radical.
From the viewpoints of visibility of exposed and unexposed areas and resolution, the photosensitive resin layer preferably contains both a dye N whose maximum absorption wavelength changes due to radicals, and a photoradical polymerization initiator.
From the viewpoint of visibility of exposed and unexposed areas, it is preferable that the dye N is a dye that develops color in response to an acid, a base, or a radical.

An example of the color-developing mechanism of dye N is a mode in which a photoradical polymerization initiator, a cationic photopolymerization initiator (photoacid generator), or a photobase generator is added to a photosensitive resin layer, and after exposure, a radical-reactive dye, an acid-reactive dye, or a base-reactive dye (e.g., a leuco dye) develops color due to the radicals, acids, or bases generated from the photoradical polymerization initiator, the cationic photopolymerization initiator, or the photobase generator.

From the viewpoint of visibility of exposed and unexposed areas, the dye N preferably has a maximum absorption wavelength in the wavelength range of 400 to 780 nm upon color development of 550 nm or more, more preferably 550 to 700 nm, and even more preferably 550 to 650 nm.
Furthermore, the dye N may have only one maximum absorption wavelength in the wavelength range of 400 to 780 nm when it develops color, or may have two or more maximum absorption wavelengths. When the dye N has two or more maximum absorption wavelengths in the wavelength range of 400 to 780 nm when it develops color, it is sufficient that the maximum absorption wavelength having the highest absorbance among the two or more maximum absorption wavelengths is 450 nm or more.

The maximum absorption wavelength of dye N is obtained by measuring the transmission spectrum of a solution containing dye N (liquid temperature 25°C) in the range of 400 to 780 nm using a spectrophotometer UV3100 (manufactured by Shimadzu Corporation) in an atmospheric environment and detecting the wavelength at which the light intensity is minimal (maximum absorption wavelength).

Examples of the dye that develops or loses color upon exposure to light include leuco compounds.
Examples of dyes that are decolorized by exposure to light include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes.
As the dye N, a leuco compound is preferred from the viewpoint of visibility of exposed and non-exposed areas.

Examples of the leuco compound include leuco compounds having a triarylmethane skeleton (triarylmethane-based dyes), leuco compounds having a spiropyran skeleton (spiropyran-based dyes), leuco compounds having a fluoran skeleton (fluoran-based dyes), leuco compounds having a diarylmethane skeleton (diarylmethane-based dyes), leuco compounds having a rhodamine lactam skeleton (rhodamine lactam-based dyes), leuco compounds having an indolylphthalide skeleton (indolylphthalide-based dyes), and leuco compounds having a leucoauramine skeleton (leucoauramine-based dyes).
Among these, triarylmethane dyes or fluoran dyes are preferred, and leuco compounds having a triphenylmethane skeleton (triphenylmethane dyes) or fluoran dyes are more preferred.

From the viewpoint of visibility of exposed and non-exposed parts, the leuco compound preferably has a lactone ring, a sultine ring, or a sultone ring. This allows the lactone ring, sultine ring, or sultone ring of the leuco compound to react with a radical generated from a photoradical polymerization initiator or an acid generated from a photocationic polymerization initiator, thereby changing the leuco compound to a ring-closed state and decolorizing, or changing the leuco compound to a ring-open state and developing color. As the leuco compound, a compound having a lactone ring, a sultine ring, or a sultone ring, which is opened by a radical or an acid to develop color, is preferred, and a compound having a lactone ring, which is opened by a radical or an acid to develop color, is more preferred.

Examples of the dye N include the following dyes and leuco compounds.
Specific examples of dyes among the dyes N include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, rose bengal, metanil yellow, thymolsulfophthalein, xylenol blue, methyl orange, paramethyl red, Congo red, benzopurpurin 4B, α-naphthyl red, Nile blue 2B, Nile blue A, methyl violet, malachite green, parafuchsin, Victoria Pure Blue-naphthalenesulfonate, Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Co., Ltd.), Oil Blue #603 (manufactured by Orient Chemical Co., Ltd.), Oil Pink #312 (manufactured by Orient Chemical Co., Ltd.), Oil Red 5B (manufactured by Orient Chemical Co., Ltd.), and Oil Scarlet #308 (manufactured by Orient Chemical Co., Ltd.). Examples of the oil-soluble pigments include Orient Chemical Industry Co., Ltd.), Oil Red OG (Orient Chemical Industry Co., Ltd.), Oil Red RR (Orient Chemical Industry Co., Ltd.), Oil Green #502 (Orient Chemical Industry Co., Ltd.), Spiron Red BEH Special (Hodogaya Chemical Industry Co., Ltd.), m-cresol purple, cresol red, rhodamine B, rhodamine 6G, sulforhodamine B, auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p-N,N-bis(hydroxyethyl)amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino-5-pyrazolone, and 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone.

Specific examples of leuco compounds among the dyes N include p,p',p"-hexamethyltriaminotriphenylmethane (leuco crystal violet), Pergascript Blue SRB (manufactured by Ciba-Geigy), crystal violet lactone, malachite green lactone, benzoyl leuco methylene blue, 2-(N-phenyl-N-methylamino)-6-(N-p-tolyl-N-ethyl)aminofluoran, 2-anilino-3-methyl-6-(N-ethyl-p-toluidino)fluoran, 3,6-dimethoxyfluoran, 3-(N,N-diethylamino)-5-methyl-7-(N,N-dibenzylamino)fluoran, 3-(N-cyclohexyl-N-methylamino)- 6-methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-anilinofluoran, 3-(N,N-diethylamino)-6-methyl-7-xylidinofluoran, 3-(N,N-diethylamino)-6-methyl-7-chlorofluoran, 3-(N,N-diethylamino)-6-methoxy-7-aminofluoran, 3-(N,N-diethylamino)-7-(4-chloroanilino)fluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-(N,N-diethylamino)-7-chlorofluoran, 3-(N,N-diethylamino)-7-benzylaminofluoran, 3-(N,N-diethylamino)-7,8-benzofluoran, 3-(N,N-dibutylamino)-6-methyl-7-anilinofluoran, 3-(N,N-dibutylamino)-6-methyl-7-xylidinofluoran, 3-piperidino-6-methyl-7-anilinofluoran, 3-pyrrolidino-6-methyl-7-anilinofluoran, 3,3-bis(1-ethyl-2-methylindol-3-yl)phthalide, 3,3-bis(1-n-butyl-2-methylindol-3-yl)phthalide, Chilindol-3-yl)phthalide, 3,3-bis(p-dimethylaminophenyl)-6-dimethylaminophthalide, 3-(4-diethylamino-2-ethoxyphenyl)-3-(1-ethyl-2-methylindol-3-yl)-4-zaphthalide, 3-(4-diethylaminophenyl)-3-(1-ethyl-2-methylindol-3-yl)phthalide, and 3',6'-bis(diphenylamino)spiroisobenzofuran-1(3H),9'-[9H]xanthen-3-one are included.

From the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, dye N is preferably a dye whose maximum absorption wavelength changes in response to radicals, and more preferably a dye that develops color in response to radicals.
As dye N, leuco crystal violet, crystal violet lactone, or Victoria Pure Blue-naphthalene sulfonate is preferred.

The dye N may be used alone or in combination of two or more kinds.
From the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, the content of dye N is preferably 0.1 mass % or more, more preferably 0.1 to 10 mass %, even more preferably 0.1 to 5 mass %, and particularly preferably 0.1 to 1 mass %, relative to the total mass of the photosensitive resin layer.

The content of dye N means the content of dye when all of the dye N contained in the photosensitive resin layer is in a color-developing state. A method for quantifying the content of dye N will be described below using a dye that develops color by radicals as an example.
A solution was prepared by dissolving 0.001 g and 0.01 g of dye in 100 mL of methyl ethyl ketone. A photoradical polymerization initiator Irgacure OXE01 (product name, BASF Japan Co., Ltd.) was added to each of the obtained solutions, and radicals were generated by irradiating light of 365 nm, causing all of the dyes to develop color. Then, in an air atmosphere, the absorbance of each solution at a liquid temperature of 25° C. was measured using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation) to create a calibration curve.
Next, the absorbance of the solution in which all the dye has been colored is measured in the same manner as above, except that 3 g of the photosensitive resin layer is dissolved in methyl ethyl ketone instead of the dye. The content of the dye contained in the photosensitive resin layer is calculated based on the absorbance of the obtained solution containing the photosensitive resin layer and the calibration curve.

-Surfactants-
From the viewpoint of thickness uniformity, the photosensitive resin layer preferably contains a surfactant.
Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants, with nonionic surfactants being preferred.

Examples of nonionic surfactants include polyoxyethylene higher alkyl ether compounds, polyoxyethylene higher alkyl phenyl ether compounds, higher fatty acid diester compounds of polyoxyethylene glycol, silicone-based nonionic surfactants, and fluorine-based nonionic surfactants.
The photosensitive resin layer preferably contains a fluorine-based nonionic surfactant in terms of better resolution. It is believed that the inclusion of a fluorine-based nonionic surfactant in the photosensitive resin layer suppresses the penetration of the etching solution into the photosensitive resin layer, thereby reducing side etching.
Commercially available fluorine-based nonionic surfactants include, for example, Megafac F-551, F-552 and F-554 (all manufactured by DIC Corporation).

As the surfactant, the surfactant described in paragraphs 0120 to 0125 of WO 2018/179640, the surfactant described in paragraph 0017 of Japanese Patent No. 4502784, and the surfactant described in paragraphs 0060 to 0071 of JP 2009-237362A can also be used.

The photosensitive resin layer may contain one type of surfactant alone or two or more types of surfactants.
The content of the surfactant is preferably from 0.001 to 10% by mass, and more preferably from 0.01 to 3% by mass, based on the total mass of the photosensitive resin layer.

-Additive-
The photosensitive resin layer may contain known additives, if necessary, in addition to the above components.
Examples of the additives include a polymerization inhibitor, a sensitizer, a plasticizer, a heterocyclic compound, a resin other than the polymer A, and a solvent.

The photosensitive resin layer may contain a polymerization inhibitor.
Examples of the polymerization inhibitor include the thermal polymerization inhibitors described in paragraph 0018 of Japanese Patent No. 4502784. Among them, phenothiazine, phenoxazine, or 4-methoxyphenol is preferred.
The photosensitive resin layer may contain one type of polymerization inhibitor alone, or may contain two or more types of polymerization inhibitors.
When the photosensitive resin layer contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 3 mass %, more preferably 0.01 to 1 mass %, and even more preferably 0.01 to 0.8 mass %, based on the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain a sensitizer.
The sensitizer is not particularly limited, and known sensitizers, dyes, and pigments can be used. Examples of the sensitizer include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds (e.g., 1,2,4-triazole), stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

The photosensitive resin layer may contain one type of sensitizer alone or two or more types of sensitizers.
When the photosensitive resin layer contains a sensitizer, the content of the sensitizer can be appropriately selected depending on the purpose. From the viewpoints of improving the sensitivity to the light source and improving the curing rate by balancing the polymerization rate and chain transfer, the content of the sensitizer is preferably 0.01 to 5 mass %, and more preferably 0.05 to 1 mass %, relative to the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain at least one selected from the group consisting of plasticizers and heterocyclic compounds.
Examples of the plasticizer and heterocyclic compound include the compounds described in paragraphs 0097 to 0103 and 0111 to 0118 of WO 2018/179640.

The photosensitive resin layer may contain a resin other than the polymer A. That is, the photosensitive resin layer may contain a resin having a styrene content of 40% by mass or less.
Examples of resins other than polymer A include acrylic resins, styrene-acrylic copolymers (with the styrene content being 40 mass% or less), polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, polyamide resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamine, and polyalkylene glycols.

The photosensitive resin layer may contain a solvent. When the photosensitive resin layer is formed from a photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive resin layer.

In addition, the photosensitive resin layer may further contain known additives such as metal oxide particles, antioxidants, dispersants, acid multipliers, development accelerators, conductive fibers, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, thickeners, crosslinking agents, and organic or inorganic suspending agents.
Additives contained in the photosensitive resin layer are described in paragraphs 0165 to 0184 of JP2014-085643A, the contents of which are incorporated herein by reference.

<Physical Properties>
The thickness of the photosensitive resin layer is 8 μm or less, which can improve the developability of the photosensitive resin layer and the resolution.
From the viewpoint of superior resolution and peelability, the thickness of the photosensitive resin layer is preferably 6 μm or less, more preferably less than 5 μm, and even more preferably 4 μm or less. The lower limit is not particularly limited, but from the viewpoint of superior visibility of exposed and non-exposed areas and superior adhesion to adjacent layers, the thickness is preferably 0.8 μm or more, and more preferably 2 μm or more.
The thickness of each layer of the photosensitive transfer member is measured by observing a cross section perpendicular to the main surface of the photosensitive transfer member with a scanning electron microscope (SEM), measuring the thickness of each layer at 10 or more points based on the obtained observation image, and calculating the average value.

In addition, in terms of superior adhesion, the transmittance of the photosensitive resin layer for light with a wavelength of 365 nm is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more. There is no particular upper limit, but a value of 99.9% or less is preferred.

<Forming method>
The method for forming the photosensitive resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above components.
Examples of methods for forming the photosensitive resin layer include a method in which a photosensitive resin composition containing polymer A, polymerizable compound B1, and a solvent is prepared, the photosensitive resin composition is applied to the surface of a temporary support, and the coating of the photosensitive resin composition is dried to form the layer.

The photosensitive resin composition used to form the photosensitive resin layer may be, for example, a composition containing the polymer A, the polymerizable compound B1, the optional components described above, and a solvent.
The photosensitive resin composition preferably contains a solvent in order to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive resin layer.

(solvent)
The solvent contained in the photosensitive resin composition is not particularly limited as long as it can dissolve or disperse the polymer A, the polymerizable compound B1, and the above-mentioned optional components, and any known solvent can be used.
Examples of the solvent include alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (methanol, ethanol, etc.), ketone solvents (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbon solvents (toluene, etc.), aprotic polar solvents (N,N-dimethylformamide, etc.), cyclic ether solvents (tetrahydrofuran, etc.), ester solvents, amide solvents, lactone solvents, and mixed solvents containing two or more of these.
When preparing a photosensitive transfer member having a temporary support, a thermoplastic resin layer, an intermediate layer and a photosensitive resin layer, the photosensitive resin composition preferably contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. Among them, a mixed solvent containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent and at least one selected from the group consisting of a ketone solvent and a cyclic ether solvent is more preferable, and a mixed solvent containing at least three of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, a ketone solvent, and a cyclic ether solvent is even more preferable.

Examples of alkylene glycol ether solvents include ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, and dipropylene glycol dialkyl ethers.
Examples of alkylene glycol ether acetate solvents include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, and dipropylene glycol monoalkyl ether acetate.
As the solvent, the solvents described in paragraphs 0092 to 0094 of WO 2018/179640 and the solvents described in paragraph 0014 of JP 2018-177889 A may be used, the contents of which are incorporated herein by reference.

The photosensitive resin composition may contain one type of solvent alone or two or more types of solvents.
The content of the solvent when applying the thermoplastic resin composition is preferably 50 to 1,900 parts by mass, and more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content in the thermoplastic resin composition.

The method for preparing the photosensitive resin composition is not particularly limited, and examples thereof include a method in which each component is dissolved in the above-mentioned solvent to prepare a solution in advance, and the obtained solutions are mixed in a predetermined ratio to prepare the photosensitive resin composition.
The photosensitive resin composition is preferably filtered using a filter having a pore size of 0.2 to 30 μm before forming the photosensitive resin layer.

The method for applying the photosensitive resin composition is not particularly limited, and may be any known method, such as slit coating, spin coating, curtain coating, or inkjet coating.
The photosensitive resin layer may be formed by applying a photosensitive resin composition onto a cover film described below and drying it.

[Thermoplastic resin layer]
The photosensitive transfer member may include a thermoplastic resin layer.
The photosensitive transfer member preferably has a thermoplastic resin layer between the temporary support and the photosensitive resin layer. By providing the thermoplastic resin layer between the temporary support and the photosensitive resin layer, the photosensitive transfer member has improved conformability to the substrate in the bonding step, and the inclusion of air bubbles between the substrate and the photosensitive transfer member is suppressed, improving the adhesion to an adjacent layer (e.g., temporary support).

<Ingredients>
(Alkali-soluble resin)
The thermoplastic resin layer contains an alkali-soluble resin as a thermoplastic resin.
In this specification, "alkali-soluble" means that the solubility in 100 g of a 1% by mass aqueous solution of sodium carbonate at 22°C is 0.1 g or more.
Examples of the alkali-soluble resin include acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, polyamide resin, epoxy resin, polyacetal resin, polyhydroxystyrene resin, polyimide resin, polybenzoxazole resin, polysiloxane resin, polyethyleneimine, polyallylamine, and polyalkylene glycol.

As the alkali-soluble resin, from the viewpoints of developability and adhesion to adjacent layers, an acrylic resin is preferred.
Here, the acrylic resin means a resin having at least one type of structural unit selected from the group consisting of structural units derived from (meth)acrylic acid, structural units derived from (meth)acrylic acid esters, and structural units derived from (meth)acrylic acid amides.
As for the acrylic resin, the total content of the structural units derived from (meth)acrylic acid, the structural units derived from (meth)acrylic acid ester, and the structural units derived from (meth)acrylic acid amide is preferably 50 mass% or more relative to the total mass of the acrylic resin.
In particular, the total content of the structural units derived from (meth)acrylic acid and the structural units derived from (meth)acrylic acid esters is preferably 30 to 100 mass%, and more preferably 50 to 100 mass%, based on the total mass of the acrylic resin.

The alkali-soluble resin is preferably a polymer having an acid group.
Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group, with the carboxy group being preferred.
From the viewpoint of developability, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH/g or more, and more preferably a carboxy group-containing acrylic resin having an acid value of 60 mgKOH/g or more.
The upper limit of the acid value of the alkali-soluble resin is not particularly limited, but is preferably 200 mgKOH/g or less, and more preferably 150 mgKOH/g or less.

The carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more is not particularly limited, and can be appropriately selected from known resins.
Examples of the alkali-soluble resin include a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more among the polymers described in paragraph 0025 of JP-A-2011-095716, a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more among the polymers described in paragraphs 0033 to 0052 of JP-A-2010-237589, and a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more among the binder polymers described in paragraphs 0053 to 0068 of JP-A-2016-224162.
The copolymerization ratio of the structural unit having a carboxy group in the carboxy group-containing acrylic resin is preferably from 5 to 50% by mass, more preferably from 10 to 40% by mass, and even more preferably from 12 to 30% by mass, based on the total mass of the acrylic resin.
As the alkali-soluble resin, from the viewpoints of developability and adhesion to adjacent layers, an acrylic resin having a structural unit derived from (meth)acrylic acid is particularly preferred.

The alkali-soluble resin may have a reactive group. The reactive group may be any group capable of addition polymerization, and examples of such reactive groups include ethylenically unsaturated groups; polycondensable groups such as hydroxyl groups and carboxyl groups; and polyaddition reactive groups such as epoxy groups and (blocked) isocyanate groups.

The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and even more preferably 20,000 to 50,000.

The thermoplastic resin layer may contain one type of alkali-soluble resin alone or two or more types of alkali-soluble resins.
From the viewpoints of developability and adhesion to adjacent layers, the content of the alkali-soluble resin is preferably from 10 to 99% by mass, more preferably from 20 to 90% by mass, even more preferably from 40 to 80% by mass, and particularly preferably from 50 to 70% by mass, based on the total mass of the thermoplastic resin layer.

(Pigments)
The thermoplastic resin layer preferably contains a dye (also simply referred to as "dye B") that has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 to 780 nm when colored and whose maximum absorption wavelength changes in response to an acid, a base, or a radical.
Preferred embodiments of dye B are the same as preferred embodiments of dye N, except for the points described below.

From the viewpoints of visibility of exposed and unexposed areas and resolution, dye B is preferably a dye whose maximum absorption wavelength changes in response to an acid or a radical, and more preferably a dye whose maximum absorption wavelength changes in response to an acid.
From the viewpoints of visibility and resolution of exposed and unexposed areas, the thermoplastic layer preferably contains both a dye, as dye B, whose maximum absorption wavelength changes in response to acid, and a compound that generates acid when exposed to light, as described below.

The dye B may be used alone or in combination of two or more kinds.
From the viewpoint of visibility of exposed and non-exposed areas, the content of dye B is preferably 0.2 mass % or more, more preferably 0.2 to 6 mass %, even more preferably 0.2 to 5 mass %, and particularly preferably 0.25 to 3.0 mass %, relative to the total mass of the thermoplastic resin layer.

Here, the content of dye B means the content of dye when all of dye B contained in the thermoplastic resin layer is in a colored state. A method for quantifying the content of dye B will be described below using a dye that develops color by radicals as an example.
A solution was prepared by dissolving 0.001 g and 0.01 g of dye in 100 mL of methyl ethyl ketone. A photoradical polymerization initiator Irgacure OXE01 (trade name, BASF Japan Co., Ltd.) was added to each of the obtained solutions, and radicals were generated by irradiating light of 365 nm, causing all of the dyes to develop color. Then, in an air atmosphere, the absorbance of each solution at a liquid temperature of 25° C. was measured using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation) to create a calibration curve.
Next, the absorbance of the solution in which all the dye has been colored is measured in the same manner as above, except that 0.1 g of the thermoplastic resin layer is dissolved in methyl ethyl ketone instead of the dye. The amount of the dye contained in the thermoplastic resin layer is calculated based on the calibration curve from the absorbance of the solution containing the thermoplastic resin layer obtained.

(Compounds that generate acids, bases or radicals when exposed to light)
The thermoplastic resin layer may contain a compound that generates an acid, a base or a radical when exposed to light (also simply referred to as "compound C").
Compound C is preferably a compound that generates an acid, a base, or a radical upon exposure to actinic rays such as ultraviolet light and visible light.
Known photoacid generators, photobase generators, and photoradical polymerization initiators (photoradical generators) can be used as compound C. Among them, photoacid generators are preferred.

- Photoacid generator -
From the viewpoint of resolution, the thermoplastic resin layer preferably contains a photoacid generator.
As the photoacid generator, the above-mentioned cationic photopolymerization initiator which may be contained in the photosensitive resin layer can be mentioned, and the preferred embodiments are also the same except for the points described below.

From the viewpoints of sensitivity and resolution, the photoacid generator preferably contains at least one compound selected from the group consisting of an onium salt compound and an oxime sulfonate compound, and from the viewpoints of sensitivity, resolution and adhesion, it is more preferable that the photoacid generator contains an oxime sulfonate compound.
As the photoacid generator, a photoacid generator having the following structure is also preferred.

- Photoradical polymerization initiator -
The thermoplastic resin layer may contain a photoradical polymerization initiator (photoradical polymerization initiator).
As the photoradical polymerization initiator, the above-mentioned photoradical polymerization initiators which may be contained in the photosensitive resin layer can be mentioned, and the preferred embodiments are also the same.

- Photobase generator -
The thermoplastic resin layer may contain a photobase generator.
The photobase generator is not particularly limited as long as it is a known photobase generator, and examples thereof include 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, O-carbamoylhydroxylamide, O-carbamoyloxime, [[(2,6-dinitrobenzyl)oxy]carbonyl]cyclohexylamine, bis[[(2-nitrobenzyl)oxy]carbonyl]hexane 1,6-diamine, 4-(methylthiobenzoyl)-1-methyl-1-morpholinoethane, (4-morpholinobenzoyl)- Examples of suitable aryloxyalkylene compounds include 1-benzyl-1-dimethylaminopropane, N-(2-nitrobenzyloxycarbonyl)pyrrolidine, hexaamminecobalt(III) tris(triphenylmethylborate), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl-4-(2,4-dinitrophenyl)-1,4-dihydropyridine.

The thermoplastic resin layer may contain one type of compound C alone, or may contain two or more types of compound C.
The content of compound C is preferably 0.1 to 10% by mass, and more preferably 0.5 to 5% by mass, based on the total mass of the thermoplastic resin layer, from the viewpoints of visibility and resolution of exposed and non-exposed areas.

(Plasticizer)
The thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to adjacent layers, and developability.
The plasticizer preferably has a smaller molecular weight (weight average molecular weight (Mw) in the case of an oligomer or polymer) than the alkali-soluble resin. The molecular weight (weight average molecular weight (Mw)) of the plasticizer is preferably 200 to 2,000.
The plasticizer is not particularly limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity, but from the viewpoint of imparting plasticity, a plasticizer having an alkyleneoxy group in the molecule is preferred, and a polyalkylene glycol compound is more preferred. The alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

From the viewpoints of resolution and storage stability, the plasticizer preferably contains a (meth)acrylate compound. From the viewpoints of compatibility, resolution, and adhesion to adjacent layers, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth)acrylate compound.
Examples of the (meth)acrylate compound used as the plasticizer include the (meth)acrylate compounds described above as the polymerizable compound B contained in the photosensitive resin layer.
In the photosensitive transfer member, when the thermoplastic resin layer and the photosensitive resin layer are laminated in direct contact with each other, it is preferable that both the thermoplastic resin layer and the photosensitive resin layer contain the same (meth)acrylate compound, because the thermoplastic resin layer and the photosensitive resin layer each contain the same (meth)acrylate compound, which suppresses component diffusion between the layers and improves storage stability.

When the thermoplastic resin layer contains a (meth)acrylate compound as a plasticizer, it is preferable that the (meth)acrylate compound does not polymerize even in the exposed area after exposure, from the viewpoint of adhesion to adjacent layers.
In addition, the (meth)acrylate compound used as a plasticizer is preferably a polyfunctional (meth)acrylate compound having two or more (meth)acryloyl groups in one molecule, from the viewpoints of resolution, adhesion to adjacent layers, and developability.
Furthermore, as the (meth)acrylate compound used as the plasticizer, a (meth)acrylate compound having an acid group or a urethane (meth)acrylate compound is also preferred.

The thermoplastic resin layer may contain one type of plasticizer alone or two or more types of plasticizers.
From the viewpoints of resolution, adhesion to adjacent layers, and developability, the content of the plasticizer is preferably 1 to 70% by mass, more preferably 10 to 60% by mass, and even more preferably 20 to 50% by mass, relative to the total mass of the thermoplastic resin layer.

(Surfactant)
From the viewpoint of thickness uniformity, the thermoplastic resin layer preferably contains a surfactant.
As the surfactant, the surfactant which may be contained in the photosensitive resin layer described above can be mentioned, and the preferred embodiments are also the same.

The thermoplastic resin layer may contain one type of surfactant alone or two or more types of surfactants.
The content of the surfactant is preferably from 0.001 to 10% by mass, and more preferably from 0.01 to 3% by mass, based on the total mass of the thermoplastic resin layer.

(Sensitizer)
The thermoplastic resin layer may contain a sensitizer.
The sensitizer is not particularly limited, and examples thereof include the sensitizers that may be contained in the photosensitive resin layer described above.

The thermoplastic resin layer may contain one type of sensitizer alone or two or more types of sensitizers.
The content of the sensitizer can be appropriately selected depending on the purpose. From the viewpoints of improving the sensitivity to the light source and the visibility of the exposed and non-exposed areas, the content is preferably in the range of 0.01 to 5 mass %, and more preferably in the range of 0.05 to 1 mass %, relative to the total mass of the thermoplastic resin layer.

(Additive)
The thermoplastic resin layer may contain known additives, if necessary, in addition to the above components.
In addition, the thermoplastic resin layer is described in paragraphs 0189 to 0193 of JP 2014-085643 A, the contents of which are incorporated herein by reference.

<Physical Properties>
The thickness of the thermoplastic resin layer is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of adhesion with adjacent layers. The upper limit is not particularly limited, but is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less, from the viewpoint of developability and resolution.

<Forming method>
The method for forming the thermoplastic resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above-mentioned components.
Examples of methods for forming the thermoplastic resin layer include a method in which a thermoplastic resin composition containing the above-mentioned components and a solvent is prepared, the thermoplastic resin composition is applied to the surface of the temporary support, and the coating of the thermoplastic resin composition is dried to form a layer.
The thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

(solvent)
The solvent contained in the thermoplastic resin composition is not particularly limited as long as it can dissolve or disperse the above-mentioned components contained in the thermoplastic resin layer.
As the solvent contained in the thermoplastic resin composition, the above-mentioned solvents which may be contained in the photosensitive resin composition can be mentioned, and the preferred embodiments are also the same.

The solvent contained in the thermoplastic resin composition may be one type alone or two or more types.
The content of the solvent when applying the thermoplastic resin composition is preferably 50 to 1,900 parts by mass, and more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content in the thermoplastic resin composition.

The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out in accordance with the above-mentioned method for preparing the photosensitive resin composition and the method for forming the photosensitive resin layer.
For example, a solution is prepared in advance by dissolving each component contained in the thermoplastic resin layer in the above-mentioned solvent, and the obtained solution is mixed in a predetermined ratio to prepare a thermoplastic resin composition. The obtained thermoplastic resin composition is then applied to the surface of a temporary support, and the coating of the thermoplastic resin composition is dried to form a thermoplastic resin layer.
Alternatively, after forming a photosensitive resin layer and an intermediate layer on a cover film described below, a thermoplastic resin layer may be formed on the surface of the intermediate layer.

[Middle class]
The photosensitive transfer member preferably has an intermediate layer between the thermoplastic resin layer and the photosensitive resin layer, which can prevent the components from mixing when applying multiple layers and during storage after application.
The intermediate layer is preferably a water-soluble layer from the viewpoints of developability and suppressing mixing of components when applying a plurality of layers and during storage after application.
In this specification, the term "water-soluble" means that the solubility in 100 g of water having a liquid temperature of 22° C. and a pH of 7.0 is 0.1 g or more.

The intermediate layer may be an oxygen-blocking layer having an oxygen-blocking function, which is described as a "separation layer" in JP-A-5-072724. When the intermediate layer is an oxygen-blocking layer, the sensitivity during exposure is improved, the time load of the exposure machine is reduced, and productivity is improved, which is preferable.
The oxygen barrier layer used as the intermediate layer may be appropriately selected from known layers such as those described in the above publications. Among them, an oxygen barrier layer that exhibits low oxygen permeability and disperses or dissolves in water or an alkaline aqueous solution (a 1% by mass aqueous solution of sodium carbonate at 22° C.) is preferred.

The intermediate layer preferably contains a resin.
Examples of resins contained in the intermediate layer include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, acrylamide-based resins, polyethylene oxide-based resins, gelatin, vinyl ether-based resins, polyamide resins, and copolymers thereof.
The resin contained in the intermediate layer is preferably a water-soluble resin.
In addition, from the viewpoint of suppressing mixing of components between multiple layers, it is preferable that the resin contained in the intermediate layer is a resin different from both the polymer A contained in the photosensitive resin layer and the thermoplastic resin (alkali-soluble resin) contained in the thermoplastic resin layer.

From the viewpoints of oxygen barrier properties and suppressing mixing of components when applying multiple layers and during storage after application, the intermediate layer preferably contains polyvinyl alcohol, and more preferably contains both polyvinyl alcohol and polyvinylpyrrolidone.

The intermediate layer may contain one type of the above resin alone or two or more types of them.
The resin content in the intermediate layer is not particularly limited, but from the viewpoints of oxygen barrier properties and suppressing mixing of components when multiple layers are applied and during storage after application, the resin content is preferably 50 to 100 mass %, more preferably 70 to 100 mass %, even more preferably 80 to 100 mass %, and particularly preferably 90 to 100 mass %, relative to the total mass of the intermediate layer.
Furthermore, the intermediate layer may contain additives such as a surfactant, if necessary.

The thickness of the intermediate layer is not particularly limited, but is preferably 0.1 to 5 μm, and more preferably 0.5 to 3 μm.
When the thickness of the intermediate layer is within the above range, the oxygen barrier properties are not reduced, mixing of components can be suppressed when multiple layers are applied and during storage after application, and an increase in the time required to remove the intermediate layer during development can be suppressed.

The method for forming the intermediate layer is not particularly limited, and examples thereof include a method in which an intermediate layer composition containing the above-mentioned resin and any additives is prepared, applied to the surface of a thermoplastic resin layer or a photosensitive resin layer, and the coating of the intermediate layer composition is dried to form an intermediate layer.
The intermediate layer composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

The solvent contained in the intermediate layer composition is not particularly limited as long as it is capable of dissolving or dispersing the above-mentioned resin, and is preferably at least one selected from the group consisting of water and water-miscible organic solvents, and more preferably water or a mixed solvent of water and a water-miscible organic solvent.
Examples of the water-miscible organic solvent include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin, with alcohols having 1 to 3 carbon atoms being preferred, and methanol or ethanol being more preferred.

[Cover film]
The photosensitive transfer member preferably includes a cover film in contact with the surface of the photosensitive resin layer that does not face the temporary support.
Hereinafter, in this specification, the surface of the photosensitive resin layer facing the temporary support is also referred to as the "first surface", and the surface opposite to the first surface is also referred to as the "second surface".

Materials constituting the cover film include resin films and paper, with resin films being preferred from the standpoints of strength and flexibility.
Examples of the resin film include a polyethylene film, a polypropylene film, a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Among these, a polyethylene film, a polypropylene film, or a polyethylene terephthalate film is preferable.

The thickness (layer thickness) of the cover film is not particularly limited, but is preferably from 5 to 100 μm, and more preferably from 10 to 50 μm.
In addition, the arithmetic mean roughness Ra value of the surface of the cover film in contact with the photosensitive resin layer (hereinafter also simply referred to as the "surface of the cover film") is preferably 0.3 μm or less, more preferably 0.1 μm or less, and even more preferably 0.05 μm or less, from the viewpoint of superior resolution. It is considered that the uniformity of the layer thickness of the photosensitive resin layer and the formed resin pattern is improved by the Ra value of the surface of the cover film being within the above range.
The lower limit of the Ra value of the surface of the cover film is not particularly limited, but it is preferably 0.001 μm or more.

The Ra value of the surface of the cover film is measured by the following method.
Using a three-dimensional optical profiler (New View 7300, manufactured by Zygo), the surface of the cover film is measured under the following conditions to obtain a surface profile of the optical film. As the measurement and analysis software, Microscope Application of MetroPro ver. 8.3.2 is used. Next, the Surface Map screen is displayed in the analysis software, and histogram data is obtained in the Surface Map screen. From the obtained histogram data, the arithmetic average roughness is calculated to obtain the Ra value of the surface of the cover film.
When a cover film is attached to the photosensitive transfer member, the cover film is peeled off from the photosensitive transfer member, and the Ra value of the surface on the peeled side may be measured.

The photosensitive transfer member may include layers other than the layers described above (hereinafter, also referred to as "other layers"). Examples of the other layers include a contrast enhancement layer.
The contrast enhancement layer is described in paragraph 0134 of WO 2018/179640. The other layers are described in paragraphs 0194 to 0196 of JP 2014-085643 A. The contents of these publications are incorporated herein by reference.

[Method of Manufacturing Photosensitive Transfer Member]
The method for producing the photosensitive transfer member according to the present disclosure is not particularly limited, and any known production method, for example, any known method for forming each layer, can be used.
Hereinafter, a method for producing a photosensitive transfer member according to the present disclosure will be described with reference to Fig. 1. However, the photosensitive transfer member according to the present disclosure is not limited to the configuration shown in Fig. 1.
Fig. 1 is a schematic diagram showing an example of the configuration of a photosensitive transfer member according to the present disclosure. The photosensitive transfer member 100 shown in Fig. 1 has a configuration in which a temporary support 10, a thermoplastic resin layer 12, an intermediate layer 14, a photosensitive resin layer 16, and a cover film 18 are laminated in this order.

Examples of a method for manufacturing the photosensitive transfer member 100 include a process including the steps of applying a thermoplastic resin composition to the surface of the temporary support 10 and then drying the coating of the thermoplastic resin composition to form a thermoplastic resin layer 12, applying an intermediate layer composition to the surface of the thermoplastic resin layer 12 and then drying the coating of the intermediate layer composition to form an intermediate layer 14, and applying a photosensitive resin composition containing a polymer A and a polymerizable compound B1 to the surface of the intermediate layer 14 and then drying the coating of the photosensitive resin composition to form a photosensitive resin layer 16.
In the above manufacturing method, it is preferable to use a thermoplastic resin composition containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, an intermediate layer composition containing at least one selected from the group consisting of water and a water-miscible organic solvent, and a photosensitive resin composition containing a polymer A, a polymerizable compound B1, and at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. This makes it possible to suppress mixing of the components contained in the thermoplastic resin layer 12 and the components contained in the intermediate layer 14 during the application of the intermediate layer composition to the surface of the thermoplastic resin layer 12 and/or the storage period of a laminate having a coating film of the intermediate layer composition, and also to suppress mixing of the components contained in the intermediate layer 14 and the components contained in the photosensitive resin layer 16 during the application of the photosensitive resin composition to the surface of the intermediate layer 14 and/or the storage period of a laminate having a coating film of the photosensitive resin composition.

A cover film 18 is pressure-bonded to the photosensitive resin layer 16 of the laminate produced by the above-mentioned production method, thereby producing a photosensitive transfer member 100 .
As a manufacturing method for a photosensitive transfer member according to the present disclosure, it is preferable to manufacture a photosensitive transfer member 100 comprising a temporary support 10, a thermoplastic resin layer 12, an intermediate layer 14, a photosensitive resin layer 16 and a cover film 18, by including a step of providing a cover film 18 in contact with the second surface of the photosensitive resin layer 16.
After the photosensitive transfer member 100 is manufactured by the above-mentioned manufacturing method, a photosensitive transfer member in a roll form may be manufactured and stored by winding up the photosensitive transfer member 100. The photosensitive transfer member in a roll form can be provided in its original form to a lamination step with a substrate in a roll-to-roll system described later.

[Method for producing resin pattern and method for producing circuit wiring]
The method for producing a resin pattern is not particularly limited as long as it is a method for producing a resin pattern using the above-mentioned photosensitive transfer member.
As a method for producing a resin pattern, a method including, in this order, a step of bonding a photosensitive transfer member and a substrate (preferably a substrate having electrical conductivity) by contacting the substrate with the second surface of the photosensitive resin layer, i.e., the surface not facing the temporary support (hereinafter also referred to as the "bonding step"), a step of exposing the photosensitive resin layer to a pattern (hereinafter also referred to as the "exposure step"), and a step of developing the exposed photosensitive resin layer to form a resin pattern (hereinafter also referred to as the "development step").

The method for producing the circuit wiring is not particularly limited as long as it is a method for producing the circuit wiring using the above-mentioned photosensitive transfer member.
As a method for manufacturing circuit wiring, a method including a step of etching the conductive layer in an area where the resin pattern is not arranged in a laminate in which a substrate, a conductive layer, and a resin pattern manufactured using the above-mentioned photosensitive transfer member are laminated in this order (hereinafter also referred to as an "etching step") is preferred, and this is more preferred when using a resin pattern manufactured by a manufacturing method including the above-mentioned lamination step, the above-mentioned exposure step, and the above-mentioned development step.
Below, we will explain each process included in the method for manufacturing a resin pattern and the method for manufacturing a circuit wiring. Unless otherwise specified, the contents explained for each process included in the method for manufacturing a resin pattern also apply to each process included in the method for manufacturing circuit wiring.

[Laminating process]
The method for producing the resin pattern preferably includes a lamination step.
In the lamination step, it is preferable to bring the second surface of the photosensitive resin layer into contact with a substrate (or the conductive layer if the conductive layer is provided on the surface of the substrate) and press the photosensitive transfer member and the substrate together. In the above embodiment, the adhesion between the second surface of the photosensitive resin layer and the substrate is improved, so that the photosensitive transfer member can be suitably used as an etching resist when etching the conductive layer of the photosensitive resin layer patterned after exposure and development.

When the photosensitive transfer member has a cover film, the cover film may be removed from the surface of the photosensitive resin layer before lamination.
In addition, in the case where the photosensitive transfer member further comprises a layer other than the cover film (e.g., a high refractive index layer and/or a low refractive index layer) on the surface of the photosensitive resin layer that does not face the temporary support, the bonding process is carried out in such a manner that the surface of the photosensitive resin layer that does not have the temporary support is bonded to the substrate via that layer.

The method for bonding the substrate and the photosensitive transfer member by pressure is not particularly limited, and known transfer methods and lamination methods can be used.
The photosensitive transfer member is preferably laminated to the substrate by placing the substrate on the second surface side of the photosensitive resin layer and applying pressure and heat using a roll or other means. For the lamination, a known laminator such as a laminator, a vacuum laminator, or an autocut laminator that can further increase productivity can be used.

The method for producing a resin pattern and the method for producing a circuit wiring, which include the lamination step, are preferably carried out by a roll-to-roll process.
The roll-to-roll method will be described below.
The roll-to-roll method refers to a method in which a substrate that can be wound up and unwound is used as the substrate, and includes a step of unwinding the substrate or a structure including the substrate (also referred to as an "unwinding step") before any step included in the method for manufacturing a resin pattern or a method for manufacturing a circuit wiring, and a step of winding up the substrate or the structure including the substrate (also referred to as a "winding step") after any step, in which at least any step (preferably all steps, or all steps other than the heating step) is performed while transporting the structure including the substrate or the substrate.
The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and any known method may be used in a production method that employs a roll-to-roll system.

<Substrate>
As the substrate used in forming a resin pattern using the photosensitive transfer member according to the present disclosure, any known substrate may be used, but a substrate having a conductive layer is preferred, and a substrate having a conductive layer on the surface thereof is more preferred.
The substrate may have any layer other than the conductive layer, if necessary.

Examples of the base material constituting the substrate include glass, silicon, and films.
The base material constituting the substrate is preferably transparent. In this specification, the term "transparent" means that the transmittance of light having a wavelength of 400 to 700 nm is 80% or more.
The refractive index of the base material constituting the substrate is preferably 1.50 to 1.52.

An example of a transparent glass substrate is a tempered glass such as Corning Gorilla Glass. In addition, the materials used in JP-A-2010-086684, JP-A-2010-152809, and JP-A-2010-257492 can be used as a transparent glass substrate.

When a film substrate is used as the substrate, it is preferable to use a film substrate that has small optical distortion and/or high transparency. Examples of such film substrates include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

When manufacturing the substrate by the roll-to-roll method, a film substrate is preferable as the substrate. When manufacturing circuit wiring for a touch panel by the roll-to-roll method, the substrate is preferably a sheet-shaped resin composition.

The conductive layer of the substrate may be a conductive layer used for known circuit wiring or touch panel wiring.
As the conductive layer, from the viewpoints of electrical conductivity and fine line formability, at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer is preferable, a metal layer is more preferable, and a copper layer or a silver layer is even more preferable.
The substrate may have one conductive layer or two or more conductive layers. When the substrate has two or more conductive layers, the conductive layers are preferably made of different materials.

Materials for the conductive layer include metals and conductive metal oxides.
Metals include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag and Au.
Conductive metal oxides include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and _SiO2 .
In this specification, the term "conductive" refers to a volume resistivity of less than 1 x ¹⁰⁶ Ωcm. The volume resistivity of the conductive metal oxide is preferably less than 1 x ¹⁰⁴ Ωcm.

When a resin pattern is produced using a substrate having a plurality of conductive layers, at least one of the plurality of conductive layers preferably contains a conductive metal oxide.
The conductive layer is preferably an electrode pattern corresponding to a sensor in a visual recognition portion used in a capacitive touch panel or wiring in a peripheral extraction portion.

[Exposure process]
The method for producing a resin pattern preferably includes, after the lamination step, a step of pattern-exposing the photosensitive resin layer (exposure step).

The detailed arrangement and specific size of the pattern in the pattern exposure are not particularly limited. In order to improve the display quality of a display device (e.g., a touch panel) equipped with an input device having circuit wiring manufactured by the circuit wiring manufacturing method and to reduce the area occupied by the lead wiring, it is preferable that at least a part of the pattern (more preferably the electrode pattern of the touch panel and/or the lead wiring part) includes thin lines having a width of 20 μm or less, and more preferably includes thin lines having a width of 10 μm or less.

The light source used for exposure can be appropriately selected and used as long as it irradiates light with a wavelength (e.g., 365 nm or 405 nm) that can expose the photosensitive resin layer. Specific examples include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, and LEDs (Light Emitting Diodes).

The exposure dose is preferably from 5 to 200 mJ/ ^cm2 , and more preferably from 10 to 100 mJ/ ^cm2 .

In the exposure step, the temporary support may be peeled off from the photosensitive resin layer before pattern exposure, or the temporary support may be peeled off after pattern exposure through the temporary support. In order to prevent contamination of the photosensitive resin layer due to contact between the photosensitive resin layer and the mask, and to avoid influence of foreign matter attached to the mask on exposure, it is preferable to perform pattern exposure through the temporary support. Note that the pattern exposure may be exposure through a mask, or direct exposure using an exposure means such as a laser.

[Developing process]
The method for producing a resin pattern preferably includes, after the above-mentioned exposure step, a step of developing the exposed photosensitive resin layer to form a resin pattern (development step).
When the photosensitive transfer member has a thermoplastic resin and an intermediate layer, the thermoplastic resin layer and the intermediate layer in the non-exposed area are removed together with the photosensitive resin layer in the non-exposed area in the development step. In addition, the thermoplastic resin layer and the intermediate layer in the exposed area may also be removed in a form dissolved or dispersed in the developer in the development step.

In the development step, the exposed photosensitive resin layer can be developed using a developer.
The developer is not particularly limited as long as it can remove the non-image areas (non-exposed areas) of the photosensitive resin layer, and known developers such as the developer described in JP-A-5-072724 can be used.
The developer is preferably an aqueous alkaline developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 to 5 mol/L (liter). The developer may contain a water-soluble organic solvent and/or a surfactant. The developer is also preferably the developer described in paragraph 0194 of WO 2015/093271.

The development method is not particularly limited, and may be any of paddle development, shower development, shower and spin development, and dip development. Shower development is a development treatment in which a developer is sprayed by shower onto the photosensitive resin layer after exposure to remove the unexposed area.
After the development step, it is preferable to remove development residues by spraying a cleaning agent by showering and scrubbing with a brush.
The temperature of the developer is not particularly limited, but is preferably from 20 to 40°C.

[Etching process]
The method for manufacturing circuit wiring preferably includes a step of etching the conductive layer in an area where the resin pattern is not arranged in a laminate in which a substrate, a conductive layer, and a resin pattern (more preferably, a resin pattern manufactured by a manufacturing method including the lamination step, the exposure step, and the development step) are laminated in this order (etching step).

In the etching process, the resin pattern formed from the photosensitive resin layer is used as an etching resist to etch the conductive layer.
As the etching method, known methods can be applied, for example, the method described in paragraphs 0209 to 0210 of JP-A-2017-120435, the method described in paragraphs 0048 to 0054 of JP-A-2010-152155, a wet etching method in which the substrate is immersed in an etching solution, and a dry etching method such as plasma etching can be mentioned.

The etching solution used in the wet etching may be an acidic or alkaline etching solution that is appropriately selected depending on the target to be etched.
Examples of the acidic etching solution include an aqueous solution of an acidic component selected from hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, and phosphoric acid, and an aqueous solution of a mixture of an acidic component and a salt selected from ferric chloride, ammonium fluoride, and potassium permanganate. The acidic component may be a combination of a plurality of acidic components.
Examples of the alkaline etching solution include an aqueous solution of an alkaline component selected from sodium hydroxide, potassium hydroxide, ammonia, an organic amine, and a salt of an organic amine (e.g., tetramethylammonium hydroxide), and an aqueous solution of a mixture of an alkaline component and a salt (e.g., potassium permanganate). The alkaline component may be a combination of a plurality of alkaline components.

[Removal process]
In the method for producing circuit wiring, it is preferable to carry out a step of removing the remaining resin pattern (removal step).
The removal step is not particularly limited and may be carried out as necessary, but is preferably carried out after the etching step.
The method for removing the remaining resin pattern is not particularly limited, but includes a method of removing it by chemical treatment, and a method of removing it using a removing liquid is preferable.
As a method for removing the photosensitive resin layer, a method in which the substrate having the remaining resin pattern is immersed for 1 to 30 minutes in a stirring removal liquid having a liquid temperature of preferably 30 to 80°C, more preferably 50 to 80°C, can be mentioned.

Examples of the removal liquid include removal liquids in which an inorganic or organic alkaline component is dissolved in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution thereof. Examples of the inorganic alkaline component include sodium hydroxide and potassium hydroxide. Examples of the organic alkaline component include primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds.
Alternatively, the removal may be performed by a known method such as a spray method, a shower method, or a paddle method using a removal liquid.

[Other steps]
The method for producing a circuit wiring may include any steps (other steps) other than the steps described above, such as, but not limited to, the following steps.
Furthermore, examples of the exposure step, development step and other steps that can be applied to the method for producing circuit wiring include the steps described in paragraphs 0035 to 0051 of JP-A No. 2006-023696.

<Cover film peeling process>
When the photosensitive transfer member has a cover film, the method for producing a resin pattern preferably includes a step of peeling off the cover film from the photosensitive transfer member. The method for peeling off the cover film is not limited, and a known method can be applied.

<Step of reducing visible light reflectance>
The method for producing circuit wiring may include a step of performing a treatment to reduce the visible light reflectance of some or all of the multiple conductive layers of the substrate.
Examples of treatments for reducing the visible light reflectance include oxidation treatments. When the substrate has a copper-containing conductive layer, the copper is oxidized to copper oxide, and the conductive layer is blackened, thereby reducing the visible light reflectance of the conductive layer.
Treatments for reducing visible light reflectance are described in paragraphs 0017 to 0025 of JP 2014-150118 A and paragraphs 0041, 0042, 0048, and 0058 of JP 2013-206315 A, and the contents of these publications are incorporated herein by reference.

<Step of forming insulating film, step of forming new conductive layer on the surface of the insulating film>
The method for producing the circuit wiring preferably includes the steps of forming an insulating film on the surface of the circuit wiring, and forming a new conductive layer on the surface of the insulating film.
By the above steps, a second electrode pattern insulated from the first electrode pattern can be formed.
The step of forming the insulating film is not particularly limited, and may be a known method for forming a permanent film. Alternatively, an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having insulating properties.
The step of forming a new conductive layer on the insulating film is not particularly limited, and for example, a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.

The manufacturing method for circuit wiring preferably uses a substrate having multiple conductive layers on both surfaces of the substrate, and sequentially or simultaneously forms circuits on the conductive layers formed on both surfaces of the substrate. With this configuration, it is possible to form a circuit wiring for a touch panel in which a first conductive pattern is formed on one surface of the substrate and a second conductive pattern is formed on the other surface. It is also preferable to form the circuit wiring for a touch panel having this configuration from both sides of the substrate by roll-to-roll.

[Circuit wiring applications]
The circuit wiring manufactured by the manufacturing method of the circuit wiring can be applied to various devices. An example of a device equipped with the circuit wiring manufactured by the manufacturing method is an input device, preferably a touch panel, more preferably a capacitive touch panel. The input device can also be applied to a display device such as an organic EL display device or a liquid crystal display device.

[Method of manufacturing touch panel]
The method for producing a touch panel is not particularly limited as long as it is a method for producing a touch panel using the above-mentioned photosensitive transfer member.
As a method for manufacturing a touch panel, a method including a step of forming wiring for a touch panel by etching the conductive layer in an area where the resin pattern is not arranged in a laminate in which a substrate, a conductive layer, and a resin pattern manufactured using the above-mentioned photosensitive transfer member are laminated in this order is preferred, and this is more preferable when using a resin pattern manufactured by a manufacturing method including the above-mentioned lamination step, the above-mentioned exposure step, and the above-mentioned development step.

Specific aspects of each step in the method for manufacturing a touch panel, and the order in which each step is performed, are as described above in the section "Method for manufacturing circuit wiring," and the same applies to preferred aspects.
The method for manufacturing the touch panel may refer to a known method for manufacturing a touch panel, except that the wiring for the touch panel is formed by the above-mentioned method.
Furthermore, the method for manufacturing a touch panel may include any steps (other steps) other than those described above.

An example of a mask pattern used in manufacturing a touch panel is shown in FIG. 2 and FIG.
In the pattern A shown in FIG. 2 and the pattern B shown in FIG. 3, SL and G are non-image areas (light-shielding areas), and DL is a virtual representation of an alignment frame. In a method for manufacturing a touch panel, for example, a photosensitive resin layer is exposed through a mask having the pattern A shown in FIG. 2 to manufacture a touch panel in which circuit wiring having the pattern A corresponding to SL and G is formed. Specifically, it can be manufactured by the method shown in FIG. 1 of International Publication No. 2016/190405. In one example of the manufactured touch panel, G is a portion where a transparent electrode (electrode for touch panel) is formed, and SL is a portion where wiring of the peripheral extraction portion is formed.

The above-mentioned method for producing a touch panel produces a touch panel having at least a wiring for a touch panel. The touch panel preferably has a transparent substrate, an electrode, and an insulating layer or a protective layer.
Examples of detection methods for touch panels include known methods such as a resistive film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method, etc. Among these, the capacitance method is preferable.

Examples of touch panel types include the so-called in-cell type (for example, those described in Figures 5, 6, 7, and 8 of JP-T-2012-517051), the so-called on-cell type (for example, those described in Figure 19 of JP-A-2013-168125 and those described in Figures 1 and 5 of JP-A-2012-089102), the OGS (One Glass Solution) type, the TOL (Touch-on-Lens) type (for example, those described in Figure 2 of JP-A-2013-054727), various out-cell types (so-called GG, G1/G2, GFF, GF2, GF1, G1F, etc.), and other configurations (for example, those described in Figure 6 of JP-A-2013-164871).
An example of the touch panel is described in paragraph 0229 of JP 2017-120345 A.

The following examples further illustrate the embodiments of the present invention. The materials, amounts used, ratios, processing contents, and processing procedures shown in the following examples can be changed as appropriate without departing from the spirit of the embodiments of the present invention. Therefore, the scope of the embodiments of the present invention is not limited to the specific examples shown below. Note that, unless otherwise specified, "parts" and "%" are based on mass.

[material]
[Polymer A]
Polymer A-1 was synthesized according to the following method. In the synthesis method of polymer A-1, the following abbreviations represent the following compounds, respectively.
St: styrene (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MAA: Methacrylic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MMA: Methyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
V-601: 2,2'-azobis(isobutyrate) dimethyl (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., polymerization initiator)
PGMEA: Propylene glycol monomethyl ether acetate

<Polymer A-1>
PGMEA (116.5 parts) was placed in a three-neck flask and heated to 90 ° C. under a nitrogen atmosphere. While maintaining the liquid temperature in the three-neck flask at 90 ° C. ± 2 ° C., a mixture of St (52.0 parts), MMA (19.0 parts), MAA (29.0 parts), V-601 (4.0 parts) and PGMEA (116.5 parts) was added dropwise to the three-neck flask over 2 hours. After completion of the dropwise addition, the mixture was stirred for 2 hours while maintaining the liquid temperature at 90 ° C. ± 2 ° C. to obtain a composition containing 30.0% by mass of polymer A-1.

<Polymers A-2 to A-9>
Polymers A-2 to A-9 were synthesized according to the synthesis method for Polymer A-1, except that the types and amounts of monomers used in the synthesis of the polymers were changed as shown in Table 1 below, and compositions containing Polymers A-2 to A-9 in an amount of 30.0 mass% were obtained.
The amount of each monomer used shown in Table 1 is expressed in mass %.
Table 1 shows the acid values (unit: mgKOH/g) of the obtained polymers A-1 to A-9.

[Polymerizable compound B]
B-1: NK Ester BPE-500 (2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane, manufactured by Shin-Nakamura Chemical Co., Ltd.)
B-2: Aronix M-270 (polypropylene glycol diacrylate, manufactured by Toagosei Co., Ltd.)
B-3: NK Ester A-TMPT (trimethylolpropane triacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.)
B-4: UA306H (pentaerythritol triacrylate hexamethylene diisocyanate urethane prepolymer, manufactured by Kyoeisha Chemical Co., Ltd.)
B-5: SR454NS (ethoxylated (3) trimethylolpropane triacrylate, manufactured by Tomoe Engineering Co., Ltd.)
B-6: SR494NS (ethoxylated (4) pentaerythritol tetraacrylate, manufactured by Tomoe Engineering Co., Ltd.)
B-7: NK Ester A-BPE-10 (ethoxylated (10) bisphenol A diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.)

[Photopolymerization initiator]
C-1: B-CIM (photoradical polymerization initiator, 2-(2-chlorophenyl)-4,5-diphenylimidazole dimer, manufactured by Hampford)
C-2: EAB-F (photoradical polymerization initiator (sensitizer), 4,4'-bis(diethylamino)benzophenone, manufactured by Tokyo Chemical Industry Co., Ltd.)

[Dye]
D-1: LCV (Leuco Crystal Violet, manufactured by Yamada Chemical Industry Co., Ltd., a dye that develops color in response to radicals)

[Surfactant]
E-1: Megafac F552 (DIC Corporation)
E-2: Megafac F551 (DIC Corporation)

[Example 1]
[Preparation of Composition]
<Photosensitive resin composition RC-1>
The following components were mixed to prepare a photosensitive resin composition RC-1.
Polymer A-1 (solid content concentration 30.0%): 21.87 parts B-1: 4.85 parts B-2: 0.51 parts C-1: 0.89 parts C-2: 0.05 parts D-1: 0.053 parts E-1: 0.02 parts Phenothiazine (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.): 0.025 parts 1-phenyl-3-pyrazolidone (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.): 0.001 parts Methyl ethyl ketone (MEK, manufactured by Sankyo Chemical Industries, Ltd.): 30.87 parts PGMEA (manufactured by Showa Denko K.K.): 33.92 parts Tetrahydrofuran (THF, manufactured by Mitsubishi Chemical Corporation): 6.93 parts

<Intermediate Layer Composition>
An intermediate layer composition was prepared by mixing the following components:
Ion-exchanged water: 38.12 parts Methanol (manufactured by Mitsubishi Gas Chemical Co., Ltd.): 57.17 parts Kuraray Poval PVA-205 (polyvinyl alcohol, manufactured by Kuraray Co., Ltd.): 3.22 parts Polyvinylpyrrolidone K-30 (manufactured by Nippon Shokubai Co., Ltd.): 1.49 parts Megafac F-444 (fluorine-based nonionic surfactant, manufactured by DIC Corporation): 0.0015 parts

<Thermoplastic resin composition>
A thermoplastic resin composition was prepared by mixing the following components.
Copolymer of benzyl methacrylate, methacrylic acid and acrylic acid (solid content concentration 30.0%, Mw 30000, acid value 153 mg KOH / g): 42.85 parts NK Ester A-DCP (tricyclodecane dimethanol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.): 4.63 parts 8UX-015A (multifunctional urethane acrylate compound, manufactured by Taisei Fine Chemical Co., Ltd.): 2.31 parts ARONIX TO-2349 (multifunctional acrylate compound having a carboxy group, manufactured by Toagosei Co., Ltd.): 0.77 parts Compound having the structure shown below (photoacid generator, compound synthesized according to the method described in paragraph 0227 of JP2013-047765A): 0.32 parts

Compound having the structure shown below (a coloring agent that changes color when exposed to acid): 0.08 parts

E-1: 0.03 parts MEK (manufactured by Sankyo Chemical Co., Ltd.): 39.50 parts PGMEA (manufactured by Showa Denko K.K.): 9.51 parts

[Preparation of Photosensitive Transfer Member]
A PET film having a thickness of 30 μm was prepared as a temporary support. The above-mentioned thermoplastic resin composition was applied to the surface of the temporary support using a slit nozzle so that the coating width was 1.0 m and the layer thickness after drying was 4.0 μm. The formed coating film of the thermoplastic resin composition was dried at 80° C. for 40 seconds to form a thermoplastic resin layer.
The intermediate layer composition was applied to the surface of the formed thermoplastic resin layer using a slit nozzle so that the coating width was 1.0 m and the layer thickness after drying was 1.2 μm. The coating of the intermediate layer composition was dried at 80° C. for 40 seconds to form an intermediate layer.
The photosensitive resin composition RC-1 was applied onto the surface of the intermediate layer using a slit nozzle so that the coating width was 1.0 m and the layer thickness after drying was 3.0 μm. The coating of the photosensitive resin composition RC-1 was dried at 80° C. for 40 seconds to form a photosensitive resin layer.
A PET film (manufactured by Toray Industries, Inc., Lumirror 16QS62, arithmetic mean roughness (Ra value) 0.02 μm) was pressure-bonded as a cover film to the surface of the formed photosensitive resin layer, thereby producing the photosensitive transfer member of Example 1.
The obtained photosensitive transfer member was wound up to prepare a roll-shaped photosensitive transfer member.

The Ra value of the cover film was measured by the following method.
Using a three-dimensional optical profiler (New View 7300, manufactured by Zygo), the surface of the cover film was measured under the following conditions to obtain a surface profile of the cover film. Note that, as the measurement and analysis software, Microscope Application of MetroPro ver. 8.3.2 was used. Next, the Surface Map screen was displayed in the above software, and histogram data was obtained in the Surface Map screen. From the obtained histogram data, the arithmetic average roughness (Ra value) of the surface of the cover film was calculated.

(Measurement condition)
Objective lens: 50x Zoom: 0.5x Measurement area: 1.00mm x 1.00mm

(Analysis conditions)
Removed: cylinder
Filter:off
FilterType: average
Remove spikes: on
Spike Height(xRMS):7.5

[Evaluation of Photosensitive Transfer Member]
The resolution and peelability of the photosensitive transfer member were evaluated by the following method.
First, a copper layer having a thickness of 200 nm was formed on a polyethylene terephthalate (PET) film having a thickness of 100 μm by a sputtering method, thereby preparing a PET substrate having a copper layer.

<Resolution>
The photosensitive transfer member in the form of a roll prepared was unwound, and the cover film was peeled off from the photosensitive transfer member. Next, the photosensitive transfer member and the above-mentioned PET substrate with the copper layer were bonded together so that the photosensitive resin layer and the copper layer exposed by the peeling off of the cover film were in contact with each other, to obtain a laminate. This bonding process was carried out under the conditions of a roll temperature of 100°C, a linear pressure of 1.0 MPa, and a linear speed of 4.0 m/min.

The photosensitive resin layer was exposed to light from the temporary support side of the obtained laminate through a photomask using an ultra-high pressure mercury lamp (main exposure wavelength: 365 nm). The photomask used for exposure had a line and space pattern in which the ratio of the width of the transmission region to the width of the light-shielding region (duty ratio) was 1:1 and the line width (and space width) changed stepwise from 1 μm to 20 μm at 1 μm intervals.
The exposure dose to the photosensitive resin layer was adjusted so that the line width of the resin pattern formed by exposure to irradiation light that passed through an area of the photomask where the line width and space width of the line and space pattern were 20 μm would be 20 μm.
After the temporary support was peeled off from the exposed laminate, the laminate was subjected to shower development for 30 seconds using a 1.0% aqueous sodium carbonate solution at a liquid temperature of 25° C. By this development step, the unexposed photosensitive resin layer, as well as the intermediate layer and thermoplastic resin layer laminated on the unexposed photosensitive resin layer, were removed from the laminate, and a resin pattern having the above-mentioned stepwise changing line and space pattern was produced on the surface of the copper layer.

The resin pattern formed by the above method was observed for each line width using a scanning electron microscope (SEM) for the pattern shape and the presence or absence of photosensitive resin layer residues in the space portion. The minimum line width (hereinafter also referred to as "resolution") among the line widths of the resin pattern in which the cured photosensitive resin layer was not peeled off in the line portion and there was no photosensitive resin layer residue was determined, and the resolution of the resin pattern was evaluated based on the following criteria.
5: Resolution is 4 μm or less 4: Resolution is 5 μm or 6 μm
3: Resolution is 7 μm or 8 μm
2: Resolution is 9 μm or 10 μm
1: Resolution is 11 μm or more. The higher the score, the better the resolution. A resolution of 3 or more is preferable.

<Removability>
A resin pattern was formed on the surface of the copper layer of a PET substrate with a copper layer according to the method described above (Evaluation of resolution), except for using a photomask having a line-and-space pattern with a duty ratio of 1:1 and a line width of 10 μm. The obtained resin pattern had a line-and-space pattern with a duty ratio of 1:1 and a line width of 10 μm.

The laminate having the resin pattern was immersed in a stripping solution (KP-301 manufactured by Kanto Chemical Co., Ltd.) at 40° C., and the stripping solution was stirred at 100 rpm. The time required from the start of immersion of the laminate in the stripping solution until the resin pattern was completely peeled off from the surface of the copper layer was measured, and the releasability of the resin pattern was evaluated based on the following criteria.
5: Peel time is 0.5 minutes or less 4: Peel time is more than 0.5 minutes or less and 1 minute or less 3: Peel time is more than 1 minute or less and 2 minutes or less 2: Peel time is more than 2 minutes or less and 5 minutes or less 1: Peel time is more than 5 minutes The higher the score, the better the releasability. A releasability of 3 or more is preferable.

[Examples 2 to 15, Comparative Examples 1 to 3]
<Preparation of Photosensitive Resin Compositions RC-2 to RC-15>
Photosensitive resin compositions RC-2 to RC-15 were prepared according to the method described in Example 1, except that the types and contents of each component were changed to those shown in Table 2.

The "styrene content" column for "Polymer A" in Table 2 indicates the mass ratio (unit: mass %) of the content of structural units derived from styrene to the total mass of Polymer A contained in the photosensitive resin layer.
In addition, the "Ratio 1" column for "Polymerizable compound B" in Table 2 indicates the mass ratio (unit: mass %) of the content of polymerizable compound B1 to the total content of polymerizable compound B contained in the photosensitive resin layer.

Next, a laminate having a resin pattern was produced according to the method described in Example 1, except that the photosensitive resin composition used, the thickness of the photosensitive resin layer, and the cover film were changed to the forms described in Table 3.

The "Thickness" column of the "Photosensitive resin layer" in Table 3 indicates the thickness (unit: μm) of the photosensitive resin layer provided in the photosensitive transfer member.
The "Transmittance" column of "Photosensitive resin layer" in Table 3 indicates the transmittance of light having a wavelength of 365 nm that passes through the photosensitive resin layer.
The "Cover Film" column in Table 3 indicates that the following cover films were used in preparing the photosensitive transfer members.
CF-1: Lumirror 16QS62 (manufactured by Toray Industries, Inc., PET film, Ra value: 0.02 μm)
CF-2: Lumirror 16FB40 (manufactured by Toray Industries, Inc., PET film, Ra value: 0.05 μm)
CF-3: Alphan E501 (manufactured by Oji F-Tex Co., Ltd., PET film, Ra value: 0.138 μm)

According to the method described in Example 1, the resolution and peelability of the resin patterns produced in Examples 2 to 15 and Comparative Examples 1 to 4 were evaluated.
Table 3 shows the evaluation results of the resolution and peelability of the resin patterns in Examples 1 to 15 and Comparative Examples 1 to 4.

As shown in Table 3 above, it was confirmed that the photosensitive transfer member of the present invention provides excellent resolution of the resulting resin pattern.

It was confirmed that a thickness of less than 5 μm for the photosensitive resin layer is preferable because it provides better resolution of the resin pattern and better peelability of the resin pattern from the substrate (comparison between Example 2 and Example 7).

It was confirmed that a styrene content of 50 mass % or more is preferable in terms of obtaining a resin pattern with better resolution (comparison of Examples 3 and 9 with Example 7).
In addition, in terms of better peelability of the resin pattern from the substrate, it was confirmed that the styrene content is preferably 70 mass% or less (comparison between Example 10 and Example 11), and more preferably 60 mass% or less (comparison between Example 11 and Example 7).

It was confirmed that the acid value of polymer A is preferably less than 200 mgKOH/g in terms of obtaining a resin pattern with better resolution (comparison between Example 4 and Example 7).
In addition, it was confirmed that from the viewpoints of obtaining better resolution of the resin pattern and better releasability from the substrate, the acid value of polymer A is preferably 155 mgKOH/g or more (comparison between Example 5 and Example 6), and from the viewpoint of obtaining even better releasability of the resin pattern from the substrate, the acid value of polymer A is more preferably 170 mgKOH/g or more (comparison between Example 5 and Example 7).

From the viewpoint of obtaining a resin pattern with better resolution, it was confirmed that ratio 1 (the mass ratio of the content of polymerizable compound B1 to the total content of polymerizable compound B) is preferably more than 60 mass% (comparison between Example 12 and Example 13), and more preferably more than 70 mass% (comparison between Example 7 and Example 12).
From the viewpoint of better peelability of the resin pattern from the substrate, it was confirmed that ratio 1 (the mass ratio of the content of polymerizable compound B1 to the total content of polymerizable compound B) is preferably 99 mass% or less (comparison between Example 7 and Example 19).
From the viewpoint of better peelability of the resin pattern from the substrate, it was confirmed that the content of the bifunctional ethylenically unsaturated compound relative to the content of the polymerizable compound B is preferably more than 70 mass% (comparison of Examples 7 and 12 with Examples 16 to 18).

It was confirmed that it is preferable for the photosensitive resin layer to contain a fluorine-based nonionic surfactant, as this results in better resolution of the resin pattern (comparison between Example 7 and Example 8).

It was confirmed that the arithmetic mean roughness Ra value of the surface of the cover film in contact with the photosensitive resin layer is preferably 0.1 μm or less in order to obtain a better resolution of the resin pattern (comparison between Example 7 and Example 15).

[Example 101]
A 150 nm thick ITO film was formed as a second conductive layer on a 100 μm thick PET substrate by sputtering, and a 200 nm thick copper layer was formed on top of that as a first conductive layer by vacuum deposition to obtain a circuit-forming substrate.
After peeling off the cover film from the photosensitive transfer member obtained in Example 1, the photosensitive transfer member and the substrate were bonded together with the copper layer in contact with the surface of the photosensitive resin layer (laminating roll temperature 100°C, linear pressure 0.8 MPa, linear speed 3.0 m/min.) to produce a laminate.
Without peeling off the temporary support from the obtained laminate, a contact pattern was exposed to the photosensitive resin layer of the laminate through the temporary support using a photomask having a pattern A shown in Fig. 2, which has a configuration in which conductive layer pads are connected in one direction. For exposure, a high-pressure mercury lamp with an i-line (365 nm) as the dominant exposure wavelength was used.

Then, the temporary support was peeled off from the laminate, and development and rinsing with water were performed to obtain pattern A (resin pattern). Next, the copper layer in the area where pattern A was not arranged was etched using a copper etching solution (Cu-02, manufactured by Kanto Chemical Co., Ltd.), and then the ITO layer in the area where the resin pattern was not arranged was etched using an ITO etching solution (ITO-02, manufactured by Kanto Chemical Co., Ltd.), thereby obtaining a substrate on which both copper and ITO were drawn with pattern A.

Next, another photosensitive transfer member obtained in Example 1 was prepared, and after peeling off the cover film, the photosensitive transfer member and the laminate with the remaining resist (cured photosensitive resin layer) were again laminated under the same conditions as above. In the aligned state, the photosensitive resin layer of the laminate was exposed to pattern light through the temporary support using a photomask with pattern B shown in FIG. 3 without peeling off the temporary support. For exposure, a high-pressure mercury lamp with i-line (365 nm) as the dominant exposure wavelength was used.
Thereafter, the temporary support was peeled off from the laminate, and development and washing with water were carried out to obtain a pattern B (resin pattern). Next, Cu-02 was used to etch the copper wiring in the area where the pattern B was not arranged. Next, the remaining resist was peeled off using a stripping solution (KP-301 manufactured by Kanto Chemical Co., Ltd.) to obtain a circuit wiring board.
The obtained circuit wiring board was observed under a microscope and found to have a beautiful pattern without peeling or chipping.

10 Temporary support 12 Thermoplastic resin layer 14 Intermediate layer 16 Photosensitive resin layer 18 Cover film 100 Photosensitive transfer member SL Non-image area (exposed area)
G Non-image area (exposed area)
DL Alignment frame

Claims (14)

A temporary support and a photosensitive resin layer are provided,
The thickness of the photosensitive resin layer is 8 μm or less,
the photosensitive resin layer contains a polymer A having a structural unit derived from styrene, a structural unit derived from (meth)acrylic acid, and a structural unit derived from a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms, and a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups;
the content of the structural unit derived from styrene relative to the total mass of the polymer A is 50 to 60 mass%;
In the photosensitive resin layer, a mass ratio of the content of the polymerizable compound B1 to a content of the polymerizable compound B having a polymerizable group is more than 70 mass%,
A photosensitive transfer member, in which the transmittance of light having a wavelength of 365 nm in the photosensitive resin layer is 30% or more (excluding the case where the photosensitive resin layer is a photosensitive resin layer formed using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator containing at least one selected from the group consisting of 2,4,5-triarylimidazole dimer and derivatives thereof, and a nitroxyl compound having a 2,2,6,6-tetramethylpiperidine-1-oxyl structure). The photosensitive transfer member according to claim 1, wherein the acid value of the polymer A is 155 mg KOH/g or more. The photosensitive transfer member according to claim 1 or 2, wherein the photosensitive resin layer is a negative photosensitive resin layer whose solubility in a developer decreases upon exposure to light. The photosensitive transfer member according to any one of claims 1 to 3, wherein the polymerizable compound B1 has a bisphenol structure. The photosensitive transfer member according to any one of claims 1 to 4, wherein the acid value of the polymer A is less than 190 mg KOH/g. The photosensitive transfer member according to any one of claims 1 to 5, wherein the photosensitive resin layer further contains a fluorine-based nonionic surfactant. The photosensitive transfer member according to any one of claims 1 to 6, further comprising a thermoplastic resin layer between the temporary support and the photosensitive resin layer. The photosensitive transfer member according to claim 7, further comprising an intermediate layer between the photosensitive resin layer and the thermoplastic resin layer. The photosensitive transfer member according to claim 7 or 8, wherein the thickness of the thermoplastic resin layer is 10 μm or less. Further, a cover film is provided in contact with a surface of the photosensitive resin layer that does not face the temporary support,
The arithmetic average roughness Ra value of the surface of the cover film in contact with the photosensitive resin layer is 0.05 μm or less.
The photosensitive transfer member according to any one of claims 1 to 9. A step of bonding the photosensitive transfer member according to any one of claims 1 to 10 and a substrate having a conductive layer by contacting the substrate with a surface of the photosensitive resin layer that does not face the temporary support;
A step of pattern-exposing the photosensitive resin layer;
and developing the exposed photosensitive resin layer to form a resin pattern.
A method for producing a resin pattern. The photosensitive transfer member according to any one of claims 1 to 10,
a step of applying a thermoplastic resin composition containing at least one solvent selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent to a surface of the temporary support, and then drying the coating of the thermoplastic resin composition to form a thermoplastic resin layer;
a step of applying an intermediate layer composition containing at least one solvent selected from the group consisting of water and a water-miscible organic solvent to a surface of the thermoplastic resin layer, and then drying the coating of the intermediate layer composition to form an intermediate layer;
a step of applying a photosensitive resin composition containing the polymer A, the polymerizable compound B1, and at least one solvent selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent to a surface of the intermediate layer, and then drying the coating of the photosensitive resin composition to form the photosensitive resin layer.
The method for producing a resin pattern according to claim 11 . A method for manufacturing a laminate in which a substrate, a conductive layer, and a resin pattern manufactured by the manufacturing method according to claim 11 or 12 are laminated in this order, comprising the step of etching the conductive layer in an area where the resin pattern is not disposed.
A method for manufacturing circuit wiring. The method includes a step of forming wiring for a touch panel by etching the conductive layer in an area where the resin pattern is not arranged in a laminate in which a substrate, a conductive layer, and a resin pattern manufactured by the manufacturing method according to claim 11 or 12 are laminated in this order.
A method for manufacturing a touch panel.