JP2024044602A - Processing device - Google Patents

Abstract

To provide a processing device which confirms an execution status of alignment by display of a monitor, even if an alignment function is accelerated.SOLUTION: In a laser processing device, control means 100 has an alignment function using imaging means 6. The alignment function includes a reference pattern storage part 112 for storing characteristic regions from regions on a wafer where a plurality of devices 12 and a plurality of scheduled division lines 14 are formed as reference patterns Q1 and Q2, and includes at least a pattern matching part 113 for finding out at least two patterns P1 the same as the reference patterns from the regions imaged by the imaging means, and a parallel positioning part 114 for rotating a chuck table so that a line connecting the two same patterns becomes parallel to an X-axis direction or a Y-axis direction. When execution states of the pattern matching part and the parallel poisoning part are displayed on a monitor 8, the control means has a selection function capable of selecting any one of a low speed mode and a high speed mode.SELECTED DRAWING: Figure 2

Description

The present invention relates to a processing device equipped with an alignment function that detects the area to be processed on a wafer.

Wafer surfaces are divided into multiple IC, LSI and other devices along planned division lines, and are then divided into individual device chips using processing equipment such as dicing equipment and laser processing equipment, for use in electronic devices such as mobile phones and personal computers.

The dicing device or laser processing device is equipped with a rotatable chuck table that holds a wafer, processing means that performs processing (cutting in the case of a dicing device, laser processing in the case of a laser processing device) to divide the wafer held on the chuck table into individual device chips, X-axis feed means that feeds the chuck table and the processing means relatively in the X-axis direction, imaging means that images the wafer held on the chuck table, a display screen that displays the image captured by the imaging means, and control means, and can divide the wafer with high precision.

In addition to controlling the rotation of the chuck table, controlling the X-axis feeding means, and controlling the Y-axis feeding means, the control means controls the image pickup means to capture an image of the wafer held on the chuck table. Based on this, the wafer has an alignment function that detects the region to be processed on the wafer, and can automatically detect the region to be processed (see, for example, Patent Documents 1 and 2).

Japanese Patent Application Laid-Open No. 07-106405 JP 2005-166991 A

The alignment performed by the above-mentioned alignment function takes a certain amount of time and has an impact on productivity, so there is a general demand to speed up the alignment function and shorten the time required for alignment.

However, as the speed of the alignment function increases, even if an operator tries to check the alignment implementation status displayed on the monitor, the implementation status changes too quickly to check the content of each operation from the monitor, and even if there is a problem with the alignment function, it is not possible to confirm from the monitor display whether the alignment is being performed properly. Furthermore, an operator who is unfamiliar with alignment performed in processing equipment will not be able to follow the implementation status of the alignment function even if he or she looks at the monitor display, and will be unable to learn how the alignment function works.

The present invention has been made in view of the above facts, and its main technical problem is to provide a processing device that makes it possible to check the alignment implementation status on a monitor display even when the alignment function is sped up. It's about doing.

In order to solve the above-mentioned main technical problem, the present invention provides a chuck table that holds a wafer and is equipped with a rotating means, a processing means that processes the wafer held on the chuck table, a chuck table and the processing unit. an X-axis feeding means for processing and feeding the chuck table and the processing means relatively in the X-axis direction; a Y-axis feeding means for processing and feeding the chuck table and the processing means relatively in the Y-axis direction orthogonal to the X-axis direction; A processing device comprising: an imaging means for taking an image of a wafer held on the chuck table; a monitor for displaying an image taken by the imaging means; and a control means, the control means controlling the rotation means. In addition to control, control of the X-axis feeding means, and control of the Y-axis feeding means, an alignment function detects an area of the wafer to be processed based on an image taken by the imaging means of the wafer held on the chuck table. The alignment function includes a reference pattern storage unit that stores a characteristic region as a reference pattern from a region in which a plurality of devices formed on the wafer and a plurality of dividing lines dividing the individual devices are formed. a pattern matching section that searches for at least two patterns that are the same as the reference pattern from the area imaged by the imaging means; a parallel positioning section that rotates the chuck table, and the control means is configured to select either a low speed mode or a high speed mode when displaying the implementation status of the pattern matching section and the parallel positioning section on a monitor. A processing device is provided.

It is preferable that the control means, in the implementation state of the pattern matching unit, displays the reference pattern stored in the reference pattern storage unit semi-transparently on the monitor. Also, it is preferable that the reference pattern storage unit stores a first reference pattern with a relatively low magnification and a second reference pattern with a relatively high magnification, the pattern matching unit includes a first pattern matching unit that searches for a pattern identical to the first reference pattern, and a second pattern matching unit that searches for a pattern identical to the second reference pattern, and the parallel positioning unit includes a first parallel positioning unit that rotates the chuck table so that a line connecting two identical patterns based on the first reference pattern is parallel to the X-axis direction or the Y-axis direction, and a second parallel positioning unit that further rotates the chuck table so that a line connecting two identical patterns based on the second reference pattern is parallel to the X-axis direction or the Y-axis direction.

The alignment function preferably includes a spacing confirmation unit that performs index feed to confirm the spacing of the planned division lines, in addition to the pattern matching unit and the parallel positioning unit, and the implementation status of the spacing confirmation unit is preferably implemented in either the low-speed mode or the high-speed mode. Also, it is preferable that the control means includes a video recording unit that records the implementation status, the implementation status in the high-speed mode is recorded in the video recording unit, and the low-speed mode is configured to play back the implementation status in the high-speed mode in slow motion using the video recording unit and display it on the monitor.

The processing apparatus of the present invention is a processing apparatus comprising a chuck table having a rotating means for holding a wafer, a processing means for processing the wafer held on the chuck table, an X-axis feed means for feeding the chuck table and the processing means relatively in the X-axis direction, a Y-axis feed means for feeding the chuck table and the processing means relatively in the Y-axis direction perpendicular to the X-axis direction, an imaging means for imaging the wafer held on the chuck table, a monitor for displaying an image captured by the imaging means, and a control means, in addition to controlling the rotation means, the X-axis feed means, and the Y-axis feed means, the control means is provided with an alignment function for detecting an area to be processed on the wafer based on an image captured by the imaging means of the wafer held on the chuck table, and the alignment function is provided for detecting a plurality of devices formed on the wafer and a plurality of division pre-cuts that divide the individual devices. The alignment system includes at least a reference pattern storage unit that stores a characteristic area from an area where a fixed line is formed as a reference pattern, a pattern matching unit that searches for at least two patterns identical to the reference pattern from the area captured by the imaging unit, and a parallel positioning unit that rotates the chuck table so that a line connecting the two identical patterns is parallel to the X-axis direction or the Y-axis direction. The control unit has a selection function that allows the operator to select either a low-speed mode or a high-speed mode when displaying the implementation status of the pattern matching unit and the parallel positioning unit on a monitor. This allows the operator to check the actual implementation status of the pattern matching unit and the parallel positioning unit in the alignment at a low speed that the operator can follow with his eyes, making it possible to check the implementation status when there is a problem with the alignment function, and for an operator who is unfamiliar with the work to learn the mechanism of alignment.

1 is an overall perspective view of a laser processing apparatus according to an embodiment of the present invention; FIG. 2 is a conceptual diagram of a laser beam irradiation means and a control means arranged in FIG. 1. FIG. FIG. 3 is a conceptual diagram showing an embodiment of a first pattern matching section. FIG. 13 is a conceptual diagram showing an embodiment of a second pattern matching unit. FIG. 13 is a conceptual diagram showing an embodiment of a gap confirmation unit.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a processing apparatus constructed based on the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a laser processing apparatus 1 shown as an example of the processing apparatus of this embodiment. As shown in FIG. 2 in addition to FIG. 1, the workpiece processed by the laser processing apparatus 1 of this embodiment has a plurality of devices 12 partitioned by dividing lines 14 and formed on the surface 10a, for example, is a 200 mm silicon wafer 10, which is held in an annular frame F with an adhesive tape T interposed therebetween. Note that the present invention is not limited to the laser processing apparatus 1 described below, and may be any processing apparatus having an alignment function for processing a wafer on which a plurality of devices are partitioned by dividing lines and formed on the surface. For example, it is also possible to apply the present invention to a dicing device (not shown).

A notch 16 indicating the crystal orientation is formed in the wafer 10, and the notch 16 is positioned on the straight part side of the frame F where the cutouts 15a and 15b are formed and is attached to the adhesive tape T. , the planned dividing line 14 of the wafer 10 is positioned at approximately a predetermined angle with respect to the frame F.

The laser processing apparatus 1 includes a chuck table 35 that holds a wafer 10 and is equipped with a rotation means, a laser beam irradiation means 7 provided as a processing means for processing the wafer 10 held on the chuck table 35, and a chuck table 35. and the laser beam irradiation means 7 relative to each other in the X-axis direction, and the chuck table 35 and the laser beam irradiation means 7 to be processed and fed relatively in the Y-axis direction perpendicular to the X-axis direction. It includes a Y-axis feeding means 4b, an imaging means 6 for taking an image of the wafer 10 held on the chuck table 35, a monitor 8 for displaying an image taken by the imaging means 6, and a control means 100.

The chuck table 35 is disposed on the holding means 3 and is a means for holding the wafer 10 with the XY plane specified by the X and Y coordinates as the holding surface. As shown in FIG. 1, the holding means 3 includes a rectangular X-axis direction movable plate 31 mounted on the base 2 so as to be movable in the X-axis direction, a rectangular Y-axis direction movable plate 32 mounted on the X-axis direction movable plate 31 so as to be movable in the Y-axis direction, a cylindrical support 33 fixed to the upper surface of the Y-axis direction movable plate 32, and a rectangular cover plate 34 fixed to the upper end of the support 33. The cover plate 34 is provided with a chuck table 35 extending upward through an elongated hole formed on the cover plate 34. The chuck table 35 is configured to be rotatable by a rotating means (not shown) housed in the support 33. On the upper surface of the chuck table 35, a circular suction chuck 36 is disposed, which is made of a porous material having air permeability and has the XY plane specified by the X and Y coordinates as the holding surface. The suction chuck 36 is connected to a suction means (not shown) by a flow path that passes through the support 33, and four clamps 37 are arranged at equal intervals around the suction chuck 36 to grip and secure the frame F when holding the wafer 10 on the chuck table 35.

The X-axis feeding means 4a converts the rotational motion of the motor 42 into linear motion via the ball screw 43 and transmits the linear motion to the X-axis direction movable plate 31, and is disposed on the base 2 along the X-axis direction. The X-axis movable plate 31 is moved in the X-axis direction along the pair of guide rails 2A, 2A. The Y-axis feeding means 4b converts the rotational motion of the motor 44 into a linear motion via the ball screw 45 and transmits the linear motion to the Y-axis movable plate 32, and moves the rotary motion of the motor 44 along the Y-axis direction on the X-axis movable plate 31. The Y-axis movable plate 32 is moved in the Y-axis direction along the pair of guide rails 31a, 31a.

Further, on the base 2, on the sides of the X-axis feeding means 4a and the Y-axis feeding means 4b, there is a frame 5 consisting of a vertical wall portion 5a and a horizontal wall portion 5b extending horizontally from the upper end of the vertical wall portion 5a. A monitor 8 is disposed on the frame 5 and displays an image taken by the imaging means 6. Inside the horizontal wall portion 5b of the frame 5, an optical system (not shown) constituting the laser beam irradiation means 7 and an imaging means 6 are housed. A condenser 71, which constitutes a part of the laser beam irradiation means 7, is disposed on the lower surface side of the tip of the horizontal wall portion 5b. The imaging means 6 of this embodiment is arranged at a position adjacent to the above-mentioned condenser 71 in the X-axis direction indicated by the arrow The camera is a camera that detects the position and orientation of the wafer 10 by capturing an image of the wafer 10 and detects the processing position where the laser beam should be irradiated. It is possible to image the wafer 10.

The control means 100 is configured by a computer and includes a central processing unit (CPU) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, a readable/writable random access memory (RAM) for temporarily storing detected values, calculation results, and the like, an input interface, and an output interface (details are not shown). As shown in FIG. 2, the control means 100 includes an alignment function unit 110 that performs an alignment function of detecting the area to be processed on the wafer 10 based on an image captured by the imaging means 6 of the wafer 10 held on the chuck table 35, a feed control unit 120 that controls the X-axis feed means 4a, the Y-axis feed means 4b, and a rotation means (not shown) that rotates the chuck table 35, a speed mode selection unit 130 that realizes a selection function that allows the selection of either a low-speed mode or a high-speed mode regarding the alignment speed when displaying the alignment implementation status, and a video recording unit 140 that records the implementation status of the alignment performed by the alignment function unit 110. In the standard state, the speed mode selection unit 130 is set to high-speed mode to prioritize productivity, and alignment is performed in high-speed mode, but if the low-speed mode is selected in the speed mode selection unit 130, alignment is performed at a low speed (e.g., 1/10 of the execution speed).

The above-mentioned alignment function unit 110 stores a characteristic region as a reference pattern from a region in which a plurality of devices 12 formed on the wafer 10 and a plurality of dividing lines 14 that partition the individual devices 12 are formed. A pattern storage unit 112, a pattern matching unit 113 that searches for at least two patterns that are the same as the reference pattern from the area imaged by the imaging means 6, and a pattern matching unit 113 that searches for at least two patterns that are the same as the reference pattern in the area imaged by the imaging means 6, and a pattern matching unit 113 that searches for a pattern that is the same as the reference pattern in at least two places, and a line that connects the same pattern in the two places is parallel to the X-axis direction or the Y-axis direction. The wafer 10 includes a parallel positioning section 114 that rotates the chuck table so that the chuck table 35 is rotated, and an interval confirmation section 115 that indexes the chuck table 35 and confirms the interval between the scheduled dividing lines 14 on the wafer 10.

As shown in FIG. 2, the imaging data of the surface 10a of the wafer 10 held on the chuck table captured by the imaging means 6 is transmitted to the control means 100 and displayed on the monitor 8. The image displayed on the monitor 8 shown in FIG. 2 conceptually shows the size of the search area in which a pattern search should be performed when executing the pattern matching unit 113 described below, and does not show the status of alignment. As shown in FIG. 2, the reference pattern storage unit 112 of the control means 100 stores image data of a first reference pattern Q1 and a second reference pattern Q2. The first reference pattern Q1 is a relatively large-sized reference pattern used for alignment performed by capturing an image of the surface 10a of the wafer 10 at a relatively low magnification (e.g., 20x), and the second reference pattern Q2 is a relatively small-sized reference pattern used for alignment performed by capturing an image of the surface 10a of the wafer 10 at a relatively high magnification (e.g., 200x).

As the reference patterns Q1 and Q2 of this embodiment, the characteristic patterns P1 and P2 (see FIG. 2) in the search area described above are selected. The reference patterns are selected from the circuits, electrode shapes, intentionally added characters, figures, etc. formed on the device 12 and the division planned line 14, and a characteristic pattern that has a low degree of match when compared with other patterns is selected to prevent alignment errors. For convenience of explanation, the first and second reference patterns Q1 and Q2 shown in FIG. 2 are relatively simple patterns. Note that the first and second reference patterns Q1 and Q2 may be set as a single pattern as shown in the figure, or may be set as a composite pattern combining multiple patterns. In addition, in the embodiment shown in FIG. 2, the patterns P1 and P2 on the device 12 are selected as the first and second reference patterns Q1 and Q2, but if a characteristic pattern is formed on the division planned line 14, the pattern on the division planned line 14 may be selected as the reference pattern. Furthermore, the reference pattern storage unit 112 also stores the distances from each pattern P1, P2 to the center of the planned division line 14 formed in the X-axis and Y-axis directions.

The laser processing device 1 of this embodiment has a configuration generally as described above, and the alignment function performed by the laser processing device 1 is described below.

The wafer 10 held by the frame F as described above is carried into the laser processing apparatus 1, placed on the chuck table 35, and the frame F is fixed by the clamp 37, and the above-described suction means is activated to suction and hold the wafer 10. . Once the wafer 10 is held on the chuck table 35, the control program constituting the alignment function section 110 of the control means 100 is activated to execute the alignment function. In the embodiment described below, when performing the alignment, the high speed mode is selected in the speed mode selection section 130 of the control means 100, and when the implementation of the alignment is started, the operation of the video recording section 140 is started. The image displayed on the monitor 8 is recorded as moving image data. Furthermore, as described above, the wafer 10 is positioned and attached at a predetermined angle to the frame F, and the planned dividing line 14 is approximately aligned in the X-axis and Y-axis directions on the chuck table 35. However, the direction of the planned dividing line 14, the X-axis direction, and the Y-axis direction include an error of, for example, about ±1.5° when viewed in the rotational direction.

When starting the alignment, first, the X-axis feeding means 4a and the Y-axis feeding means 4b are controlled, and as shown in FIG. let At this time, the magnification for imaging by the imaging means 6 is set to a low magnification (for example, 20 times), and the predetermined area is displayed on the monitor 8 at a low magnification (operation 1). Note that, as described above, the image displayed on the monitor 8 shown in FIG. 2 is not the image displayed in this operation 1.

Next, the first pattern matching section 113a of the pattern matching section 113 is activated, and while moving the cursor for pattern matching pixel by pixel within the area displayed on the monitor 8, a pattern identical to the first reference pattern Q1 is selected. Explore. If the same pattern is not found in the area displayed on the monitor 8, the area for performing pattern matching is moved to an area adjacent to the displayed area, and a pattern that is the same as the first reference pattern Q1 is found. The search is repeated until the end (operation 2).

If a pattern P1A identical to the first reference pattern Q1 is found by performing the above-mentioned operation 2 as shown in FIG. 3(a), the X-axis feed means 4a and the Y-axis feed means 4b are operated to align the center P1a of the pattern P1A with the center of the monitor 8, and the semi-transparent first reference pattern Q1 is displayed in the center so that the operator can check whether the pattern matching is being performed properly (operation 3). In addition, the monitor 8 always displays a hairline 82 that passes through the center of the monitor 8 and extends horizontally (in the X-axis direction). In the illustrated embodiment, the planned division line 14 is inclined with respect to the hairline 82 along the X-axis direction, and it can be understood that the planned division line 14 of the wafer 10 is not held accurately along the X-axis direction on the chuck table 35.

Once operation 3 above is completed, the X-axis feed means 4a is operated to move the chuck table 35 a predetermined distance in the X-axis direction (for example, 20 times the spacing between the planned division lines 14 = 100 mm), and the imaging means 6 is positioned in an area on the wafer 10 corresponding to the area where the above-mentioned pattern P1A was found, an image is captured, and the image is displayed on the monitor 8 (operation 4).

Next, in the same way as in operation 2 described above, the first pattern matching unit 113a is activated, and while the cursor for pattern matching is moved pixel by pixel within the area displayed on the monitor 8, the first reference pattern Q1 and Search for identical patterns. If the same pattern is not found in the area displayed on the monitor 8, the display area is moved to an area adjacent to the area displayed on the monitor 8 until the same pattern as the first reference pattern Q1 is found. A search is performed (operation 5). In addition, in this operation 5, since the pattern P1A was discovered in the above-mentioned operation 3, there is a high possibility that the imaging area will be positioned near the area where the same pattern P1B exists in the operation 4, and it will be possible to locate the imaging area in a relatively short time. Pattern matching is performed.

By performing operation 5, if a pattern P1B that is the same as the first reference pattern Q1 is found as shown in FIG. 3(b), the X-axis feeding means 4a and the Y-axis feeding means 4b are activated. Then, the center P1b of the pattern P1B is aligned with the center of the monitor 8, and the translucent first reference pattern Q1 (indicated by a broken line) is displayed in the center, so that the operator can check whether the pattern matching is being performed properly. Make it possible to confirm (operation 6).

When operation 6 is completed and the above-mentioned pattern P1A and pattern P1B are found, the first parallel positioning section 114a that constitutes the parallel positioning section 114 of the alignment function section 110 is executed, and the center P1a of the above-mentioned pattern P1A is executed. A straight line (not shown) connecting the coordinates of the center P1b of the pattern P1B and the coordinates of the center P1b of the pattern P1B is generated, and the angular deviation θ with respect to the X-axis direction (hairline 82) is calculated. As described above, when the operation 6 is completed, the center P1b of the pattern P1B matches the hairline 82 displayed on the monitor 8, so the angular deviation θ is It can be calculated based on the amount of deviation in the Y-axis direction and the distance in the X-axis direction between the center P1a of the pattern P1A and the center P1b of the pattern P1B. After calculating the angular deviation θ, the above-mentioned rotating means is operated to rotate the chuck table 35 so that the angular deviation θ becomes 0, and as shown in FIG. 3(c), the center P1a of the pattern P1A is and the coordinates of the center P1b of the pattern P1B (not shown) is positioned so that it is parallel to the X-axis direction (operation 7).

After performing the above operations 1 to 7, if necessary, the reference pattern to be used is changed to the second reference pattern Q2, and more precise alignment is performed. First, a predetermined area of the wafer 10 is positioned directly below the imaging means 6 and displayed on the monitor 8. At this time, the magnification of the image captured by the imaging means 6 is changed from the low magnification described above to a high magnification (e.g., 200x) (operation 8).

Next, the second pattern matching section 113b constituting the pattern matching section 113 is activated, and while moving the cursor for pattern matching pixel by pixel within the area displayed on the monitor 8, Explore patterns. If the same pattern is not found in the area displayed on the monitor 8, move the area displayed on the monitor 8 within the area corresponding to the search area described above to an adjacent area, and find a pattern that is the same as the second reference pattern Q2. Repeated searches are performed until a pattern is discovered (operation 9).

If a pattern P2A identical to the second reference pattern Q2 is found by the above-mentioned operation 9, as shown in FIG. 4(a), the X-axis feed means 4a and the Y-axis feed means 4b are operated to align the center P2a of the pattern P2A with the center of the monitor 8, and the semi-transparent second reference pattern Q2 (shown by a dashed line) is displayed in the center, allowing the operator to check whether the pattern matching has been performed properly (operation 10).

When the above operation 10 is completed, the X-axis feeding means 4a is operated to move the chuck table 35 in the X-axis direction by a predetermined distance (for example, 20 times the interval between the scheduled dividing lines 14 = 100 mm), and the wafer 10, the imaging means 6 is positioned in an area corresponding to the area where the above-described pattern P2A is found, and an image is taken, and the image is displayed on the monitor 8. As described above, at this time, the magnification for imaging by the imaging means 6 is set to a high magnification (for example, 200 times) (operation 11).

Next, the second pattern matching section 113b constituting the pattern matching section 113 is activated, and while moving the cursor for pattern matching pixel by pixel within the area displayed on the monitor 8, Explore patterns. If the same pattern is not found in the area displayed on the monitor 8, move the display area to an adjacent area in the same manner as in operation 9 above, and search until a pattern identical to the second reference pattern Q2 is found. (operation 12). In addition to the fact that the pattern P2A has already been found in the above-described operation 10, this operation 12 is performed by executing the above-described first pattern matching 113a and the first parallel positioning section 114a, thereby adjusting the angle of the wafer 10 described above. Since the deviation θ has been substantially corrected, there is a high possibility that the imaging area will be positioned near the area where the pattern P2B, which is the same as the pattern P1A, is present by the above-described operation 11, and pattern matching will be accomplished in a relatively short time. .

As shown in FIG. 4(b), if the same pattern P2B as the second reference pattern Q2 is found in the displayed area, the X-axis feeding means 4a and the Y-axis feeding means 4b are activated. , the center P2b of the pattern P2B is aligned with the center of the monitor 8, and the translucent second reference pattern Q2 is displayed in the center so that the operator can confirm whether the pattern matching is being performed properly ( Action 13).

When operation 13 is completed and patterns P2A and P2B are found, the parallel positioning unit 114 of the alignment function unit 110 is executed to generate a straight line (not shown) connecting the coordinates of the center P2a of pattern P2A and the coordinates of the center P2b of pattern P2B, and calculate the angle deviation θ from the X-axis direction (hairline 82). The angle deviation θ is calculated by the procedure described in operation 7 above. Note that the angle deviation θ has been almost eliminated by the action of the first parallel positioning unit 114a executed in operation 7 above, and the angle deviation θ calculated by this calculation is an extremely small angle compared to the angle deviation θ calculated by operation 7 above. Once the angular deviation θ has been calculated, the above-mentioned rotation means is operated to rotate the chuck table 35 so that the angular deviation θ becomes 0, and as shown in FIG. 4(c), the straight line (not shown) connecting the coordinates of the center P2a of pattern P2A and the coordinates of the center P2b of pattern P2B is positioned so that it is parallel to the X-axis direction (operation 14).

After performing operation 14, the Y-axis feed means 4b is operated based on information regarding the distance between the second reference pattern Q2 stored in the reference pattern memory unit 112 of the control means 100 and the planned division line 14 formed in the X-axis direction, so that the planned division line 14 adjacent to the pattern P2B is aligned with the hairline 82 displayed on the monitor 8 as shown in Figure 5 (operation 15).

Next, the interval confirmation unit 115 is executed based on information about the intervals of the planned dividing lines 14 in the Y-axis direction of the wafer 10 previously stored in the control means 100, and the chuck table 35 is repeatedly indexed by the Y-axis feed means 4b in the direction indicated by the arrow R1 in FIG. 5 and displayed on the monitor 8 (operation 16). The operation displayed on the monitor 8 makes it possible to confirm whether the adjacent planned dividing lines 14 always coincide with the hairline 82, and the positions of the planned dividing lines 14 in a specified direction to be laser-processed by the laser processing device 1 are confirmed, and the position information is stored in the control means 100.

After performing the above-mentioned operations 1 to 16, the chuck table 35 is rotated by 90° to position the other planned division line 14 perpendicular to the predetermined direction planned division line 14 positioned parallel to the X-axis direction by the above-mentioned operations 1 to 16 in the X-axis direction. Next, alignment similar to the above-mentioned operations 1 to 16 is performed. The first reference pattern Q1 and the second reference pattern Q2 used at this time can be the patterns P1 and P2 used in the previous alignment rotated by 90°. After rotating the chuck table 35 by 90°, the alignment described in the above-mentioned operations 1 to 16 is performed to confirm the position of the other planned division line 14 to be laser-processed by the laser processing device 1, and the position information is stored in the control means 100, completing the alignment of this embodiment.

In the alignment described above, the speed mode selection unit 130 is set to the high speed mode, and the alignment is executed at high speed. However, in the laser processing apparatus 1 of this embodiment, when it is necessary to confirm whether alignment is being performed properly or when an operator who is inexperienced with alignment is learning the mechanism of the alignment function, the speed mode can be selected. At section 130, a low speed mode can be selected. When the low-speed mode is selected in this way, the alignment operations 1 to 16 described above are executed at a low speed (for example, 1/10 execution speed of the high-speed mode), and the display on the monitor 8 and the actual chuck table 35 are It is possible to confirm the operation of the alignment function while observing movement in the X-axis direction, movement in the Y-axis direction, rotational movement, etc. In particular, since the pattern matching unit 113 and the parallel positioning unit 114 are executed in a low-speed mode, the execution speed is low so that the operator can visually follow the actual implementation status of the pattern matching unit 113 and the parallel positioning unit 114 in alignment. This allows you to check the implementation status if there is a problem with the alignment function, and allows operators who are unfamiliar with the work to learn how alignment works.

Furthermore, in this embodiment, all of the above-mentioned alignment implementation statuses are recorded in the video recording unit 140. The video data related to the alignment recorded in the video recording unit 140 can be played back by the operator instructing the control means 100. It is possible to select whether to play back the alignment in high-speed mode as it was actually performed by selecting high-speed mode in the speed mode selection unit 130, or to play back in slow motion by selecting low-speed mode. When displaying the implementation status of the pattern matching unit 113 and the parallel positioning unit 114 on the monitor 8, the actual implementation status of the pattern matching unit 113 and the parallel positioning unit 114 in the alignment can be confirmed by playing back at a low speed (for example, 1/10 playback speed) that the operator can follow with his eyes by selecting low-speed mode in the speed mode selection unit 130. In other words, even if the alignment implementation speed is not necessarily performed in low-speed mode, by playing back the video recorded in the video recording unit 140 in low-speed mode, it is possible to check the implementation status when there is a problem with the alignment function, or for an operator who is not familiar with the work to learn the mechanism of alignment.

In the above-described embodiment, the reference pattern stored in the reference pattern storage unit 112 is displayed semitransparently on the monitor, and the actually searched pattern is also displayed, so that the detection of the reference pattern is properly performed. It is possible to easily check whether the Further, in the embodiment described above, the first reference pattern Q1 with a relatively low magnification and the second reference pattern Q2 with a relatively high magnification are stored, and the first pattern matching section 113a and the second reference pattern Since the matching part 113b, the first parallel positioning part 114a, and the second parallel positioning part 114b are implemented, it is possible to perform alignment to more precisely detect the planned dividing line 14, which is the processing position. It is possible. Furthermore, in this embodiment, an interval confirmation section 115 is provided which confirms the interval between the scheduled division lines 14 by index feeding, and the implementation status of the interval confirmation section 115 is also displayed in a low-speed mode. , the implementation status of the interval confirmation unit 115 can also be visually confirmed by the operator.

In the above embodiment, the reference pattern storage unit 112 stores image data of a relatively large first reference pattern Q1 used for alignment performed by imaging at a relatively low magnification (e.g., 20x), and a relatively small second reference pattern Q2 used for alignment performed by imaging at a relatively high magnification (e.g., 200x). However, the present invention is not limited to this, and if alignment accuracy is not required to be very high, only the first reference pattern Q1 may be stored and the alignment function may be configured using only the first reference pattern Q1. In that case, the above-mentioned operations 8 to 14 may be omitted.

1: Laser processing device 2: Base 3: Holding means 35: Chuck table 4a: X-axis feeding means 4b: Y-axis feeding means 5: Frame 6: Imaging means 7: Laser beam irradiation means 8: Monitor 10: Wafer 12: Device 14: Scheduled dividing line 16: Notch 100: Control means 110: Alignment function section 112: Reference pattern storage section 113: Pattern matching section 113a: First pattern matching section 113b: Second pattern matching section 114: Parallel positioning section 114a: First parallel positioning section 114b: Second parallel positioning section 115: Interval confirmation section 120: Feed control section 130: Speed mode selection section 140: Video recording section

Claims (5)

A chuck table that holds a wafer and is equipped with a rotating means, a processing means that processes the wafer held on the chuck table, and an X-axis that relatively feeds the chuck table and the processing means in the X-axis direction. a feeding means; a Y-axis feeding means for processing and feeding the chuck table and the processing means relative to each other in a Y-axis direction perpendicular to the X-axis direction; and an imaging means for taking an image of the wafer held on the chuck table; A processing device comprising a monitor for displaying an image taken by the imaging means, and a control means,
In addition to controlling the rotating means, the X-axis feeding means, and the Y-axis feeding means, the control means controls the wafer based on the image taken by the imaging means of the wafer held on the chuck table. Equipped with an alignment function to detect the area to be processed,
The alignment function includes a reference pattern storage unit that stores a characteristic region as a reference pattern from a region in which a plurality of devices formed on the wafer and a plurality of dividing lines that partition the individual devices are formed. a pattern matching section that searches for at least two patterns that are the same as the reference pattern in the area imaged by the imaging means; and a chuck table that is arranged so that a line connecting the two same patterns becomes parallel to the X-axis direction or the Y-axis direction. comprising at least a rotating parallel positioning section;
The processing device includes a selection function in which the control means can select either a low-speed mode or a high-speed mode when displaying the implementation status of the pattern matching section and the parallel positioning section on a monitor. The processing device according to claim 1, wherein the control means displays the reference pattern stored in the reference pattern storage unit semi-transparently on the monitor when the pattern matching unit is in operation. A first reference pattern with relatively low magnification and a second reference pattern with relatively high magnification are stored in the reference pattern storage unit,
The pattern matching section includes a first pattern matching section that searches for a pattern that is the same as the first reference pattern, and a second pattern matching section that searches for the same pattern as the second reference pattern,
The parallel positioning section rotates the chuck table so that a line connecting two identical patterns based on the first reference pattern is parallel to the X-axis direction or the Y-axis direction. and a second parallel positioning unit that further rotates the chuck table so that it is parallel to the X-axis direction or Y-axis direction that connects the same pattern at two locations based on the second reference pattern. Item 1. Processing device according to item 1. The alignment function includes, in addition to the pattern matching section and the parallel positioning section, an interval confirmation section that performs index feeding to confirm the interval between the lines to be divided. The processing apparatus according to claim 1, wherein the processing apparatus is operated in any one of the high-speed mode and the high-speed mode. The control means includes a video recording unit that records the implementation status, the implementation status in the high speed mode is recorded in the video recording unit, and the low speed mode records the implementation status in the high speed mode in slow motion. 2. The processing apparatus according to claim 1, wherein the processing apparatus reproduces the image and displays the image on the monitor.

Images