JP2024041494A - Inspection method - Google Patents

Abstract

[Problem] To provide an inspection method that can conveniently check whether the orientation of an imaging unit is misaligned with respect to the X-axis direction of the device. [Solution] In an apparatus that includes a holding table, an imaging unit that images a workpiece 100 held on the holding table, and an X-axis movement unit that moves the holding table and the imaging unit relatively in the X-axis direction, an inspection method for inspecting the orientation of the imaging unit includes a holding table rotation step of rotating the holding table so that the streets 102 of the workpiece 100 and the X-axis direction of the imaging unit are parallel, and a deviation determination step of moving the imaging unit and the holding table relatively in the X-axis direction after the holding table rotation step to image the streets 102, and determining that the orientation of the imaging unit 20 is misaligned if the streets 102 have moved by a predetermined amount or more in the Y-axis direction perpendicular to the X-axis direction. [Selected Figure] Figure 7

Description

The present invention relates to an inspection method for checking whether the orientation of an imaging unit is deviated with respect to the X-axis direction of an apparatus.

An imaging unit is used that is connected to a lens (microscope/objective lens) by screws or the like so as to be parallel to the X-axis direction of a device such as a processing device that processes a workpiece (for example, see Patent Document 1).

JP2018-046110A

However, if the screw loosens while the device is in operation, the orientation of the imaging unit will shift with respect to the X-axis direction of the device, and the cut groove (kerf) after cutting the workpiece will be imaged diagonally. However, there was a problem in that it was not possible to accurately measure the width of the kerf, chipping, etc.

The present invention has been made in view of such problems, and its purpose is to provide an inspection method that can suitably check whether the orientation of the imaging unit is deviated with respect to the X-axis direction of the device. .

In order to solve the above-mentioned problems and achieve the purpose, an inspection method of the present invention includes: a holding table; an imaging unit that images a workpiece held on the holding table; the holding table; the imaging unit; An inspection method for inspecting the orientation of the imaging unit in an apparatus comprising an Holding table rotation that takes an image of the processed groove or arbitrary pattern, and uses the taken image to rotate the holding table so that the street of the workpiece and the X-axis direction of the imaging unit are parallel to each other. and after performing the holding table rotation step, the imaging unit and the holding table are moved relatively in the X-axis direction to form a processed groove or an arbitrary pattern on the street or along the street. If the street, the processed groove formed along the street, or the pattern has moved by a predetermined amount or more in the Y-axis direction perpendicular to the X-axis direction, the orientation of the imaging unit has shifted. and a shift determination step for determining.

In order to solve the above-mentioned problems and achieve the object, the inspection method of the present invention is an inspection method for inspecting the orientation of an imaging unit in an apparatus including a holding table, an imaging unit for imaging a work held on the holding table, and an X-axis movement unit for relatively moving the holding table and the imaging unit in the X-axis direction, and includes an imaging step of imaging an arbitrary mark formed on the work in a first imaging area including the mark and a second imaging area including the mark by relatively moving the imaging unit and the holding table in the X-axis direction, and a deviation determination step of determining that the orientation of the imaging unit is deviated with respect to the X-axis direction if the mark imaged in the second imaging area has moved a predetermined amount or more in the Y-axis direction perpendicular to the X-axis direction with respect to the mark imaged in the first imaging area.

The present invention images a street by moving an imaging unit and a holding table relatively in the X-axis direction, and the amount of movement of the street in the Y-axis direction perpendicular to the X-axis direction is a predetermined amount set in advance in a storage unit. If the above is the case, or if the same mark is imaged by moving the imaging unit and the holding table relatively in the X-axis direction, and the mark is shifted in the Y-axis direction in the captured image, the imaging unit By determining that the orientation of the imaging unit is deviated, it is possible to suitably check whether the orientation of the imaging unit is deviated with respect to the X-axis direction of the apparatus.

FIG. 1 is a perspective view showing a configuration example of a processing device that implements the inspection method according to the first embodiment. FIG. 2 is a perspective view showing an example of the configuration of essential parts of the processing apparatus shown in FIG. FIG. 3 is an exploded perspective view showing an example of the configuration of essential parts of the processing apparatus shown in FIG. 1. FIG. FIG. 4 is a flowchart showing the processing procedure of the inspection method according to the first embodiment. FIG. 5 is a top view illustrating the holding table rotation step of FIG. 4. FIG. 6 is a top view illustrating the holding table rotation step of FIG. 4. FIG. 7 is a top view illustrating the imaging step and shift determination step of FIG. 4. FIG. 8 is a top view illustrating the imaging step and shift determination step of the inspection method according to the second embodiment. FIG. 9 is a top view illustrating the imaging step and shift determination step of the inspection method according to the second embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
An inspection method according to Embodiment 1 of the present invention will be explained based on the drawings. FIG. 1 is a perspective view showing a configuration example of a processing apparatus 1 that implements the inspection method according to the first embodiment. FIG. 2 is a perspective view showing an example of the configuration of main parts of the processing apparatus 1 shown in FIG. FIG. 3 is an exploded perspective view showing an example of the configuration of main parts of the processing apparatus 1 of FIG. 1. As shown in FIG. As shown in FIG. 1, the processing device 1 includes a holding table 10, an imaging unit 20, a processing unit 40, an X-axis movement unit 51, a Y-axis movement unit 52, and a Z-axis movement unit 53. , a display unit 60, and a control unit 70.

As shown in FIG. 1, the workpiece 100 to be processed by the processing apparatus 1 that implements the inspection method according to the first embodiment is made of, for example, silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, etc. as a base material. These include disk-shaped semiconductor wafers and optical device wafers. As shown in FIG. 1, the workpiece 100 has a chip-sized device 103 formed in an area defined by a plurality of streets (dividing lines) 102 formed in a grid pattern on a flat surface 101. The workpiece 100 may have a characteristic key pattern 110 (see FIGS. 8 and 9) formed on the surface 101. In the first embodiment, as shown in FIG. 1, the workpiece 100 has an adhesive tape 105 attached to the back surface 104 on the back side of the front surface 101, and an annular frame 106 is attached to the outer edge of the adhesive tape 105. The present invention is not limited to this. Further, in the present invention, the workpiece 100 may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic plate, a glass plate, or the like.

The holding table 10 includes a disc-shaped frame in which a recess is formed, and a disc-shaped suction part fitted into the recess. The suction portion of the holding table 10 is made of porous ceramic or the like having a large number of porous holes, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). As shown in FIG. 1, the upper surface of the suction part of the holding table 10 is a holding surface 11 on which the work 100 is placed and which suctions and holds the placed work 100 by negative pressure introduced from a vacuum suction source. be. In the first embodiment, the workpiece 100 is placed on the holding surface 11 with the front surface 101 facing upward, and the workpiece 100 placed thereon is suction-held from the back surface 104 side via the adhesive tape 105 . The holding surface 11 and the upper surface of the frame of the holding table 10 are arranged on the same plane, and are formed parallel to the XY plane, which is a horizontal plane.

Further, as shown in FIG. 1, the holding table 10 includes a plurality of frames (shown in FIG. In the example, there are two clamps 12 which are frame holding parts.

The holding table 10 is provided movably in the X-axis direction parallel to the horizontal direction by an X-axis direction movement unit 51. By moving the holding table 10 along the X-axis direction by the X-axis direction movement unit 51, the positions of the imaging unit 20 and the processing unit 40 on the surface 101 of the workpiece 100 held on the holding table 10 are moved in the X-axis direction. (in the opposite direction to the moving direction of the holding table 10). The holding table 10 is rotatably provided by a rotary drive source 15 around a Z axis that is parallel to the vertical direction and orthogonal to the XY plane.

The imaging unit 20 images the workpiece 100 held on the holding table 10. In the first embodiment, the imaging unit 20 is fixed adjacent to the processing unit 40, as shown in FIG. As a result, the workpiece 100 is moved relative to the workpiece 100 held on the holding table 10 along the Y-axis direction and the Z-axis direction, respectively. The imaging unit 20 includes a microscope section 21, an imaging section 22, and a connecting member 23, as shown in FIGS. 2 and 3.

The microscope section 21 forms an enlarged image of the workpiece 100 held on the holding table 10. As shown in FIGS. 2 and 3, the microscope section 21 includes a cylindrical lens barrel 24 provided above the holding table 10 so as to face the workpiece 100 held on the holding table 10 in the Z-axis direction; It has a square columnar housing 25 provided above the lens barrel 24. The lens barrel 24 is arranged so that its axial direction is along the Z-axis direction. In the first embodiment, the lens barrel 24 houses, for example, an objective lens therein, and forms an enlarged image (work enlarged image) of the work 100 held on the holding table 10 by the objective lens.

The housing 25 has a cavity formed inside thereof penetrating in the Z-axis direction, and as shown in FIG. A plurality of (three in the example shown in FIG. 3) arranged screw holes 32 are formed. The housing 25 has an inner cavity that allows the imaging unit 22 to capture an enlarged image of the workpiece formed by the lens barrel 24 from above. Further, as shown in FIG. 3, the housing 25 receives insertion of the connecting portion 26 of the imaging unit 22 from the opening 31 via the connecting member 23, and the connecting member 23 is attached to the screw hole 32. , an imaging section 22 is connected above via a connecting member 23.

The imaging section 22 captures an enlarged image of the workpiece formed by the microscope section 21 . As shown in FIGS. 2 and 3, the imaging unit 22 includes a cylindrical connecting portion 26 and a quadrangular prism-shaped housing 27 provided above the connecting portion 26. The connecting portion 26 is arranged such that its axial direction is along the Z-axis direction. The connecting part 26 allows an enlarged image of the workpiece formed by the microscope part 21 to be captured from above by a cavity formed so as to penetrate in the Z-axis direction inside. Further, as shown in FIG. 3, the connecting portion 26 is inserted into the opening 31 of the housing 25 via the connecting member 23, and the connecting member 23 is attached to the screw hole 32, so that the connecting portion 26 is inserted through the connecting member 23. and is connected to the upper part of the casing 25 of the microscope section 21.

The casing 27 includes an imaging element therein that captures an enlarged image of the workpiece formed by the microscope section 21. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The image sensor in the housing 27 is electrically connected to the display unit 60 and the control unit 70 via wiring 28 so as to be able to communicate information, and outputs the captured enlarged workpiece image to the display unit 60 and the control unit 70. .

The connecting member 23 has a disk-shaped flange portion 33 and a cylindrical boss portion 34 that projects downward from the flange portion 33 . In the connecting member 23, the central axes of the flange portion 33 and the boss portion 34 overlap with each other, and the central axes are arranged along the Z-axis direction. The connecting member 23 penetrates along the Z-axis direction over the flange portion 33 and the boss portion 34, and has an insertion hole 35 formed therein into which the connecting portion 26 of the imaging unit 22 is inserted and fitted. The outer diameter of the boss part 34 is the same as or slightly smaller than the inner diameter of the opening 31 of the housing 25 of the microscope part 21, and the boss part 34 is inserted and fitted into the opening 31 of the housing 25 of the microscope part 21.

The flange portion 33 has a plurality of (three locations in the example shown in FIG. 3) Z-axis arranged at equal intervals in the circumferential direction along the outer periphery of the insertion hole 35 at each position corresponding to the screw hole 32 of the housing 25. A through hole 36 penetrating in the direction is formed. The flange portion 33 has a plurality of screw holes 37 (two in the example shown in FIG. 3) formed on the outer circumferential surface thereof, which reach the inner insertion hole 35.

In the connecting member 23, the boss portion 34 is inserted into the opening 31 of the casing 25 of the microscope section 21 and fitted together, and the screws 38 are inserted into the through holes 36 of the flange portion 33 to form the screw holes in the casing 25. By being screwed to 32, it is mounted above the casing 25 of the microscope section 21. After the connecting member 23 is mounted above the casing 25 of the microscope section 21, the connecting section 26 of the imaging section 22 is inserted into the insertion hole 35 and fitted together, and screws are inserted into each screw hole 37 of the flange section 33. 39 is inserted and tightened, the imaging section 22 and the microscope section 21 are connected and fixed so that they do not rotate around the Z-axis relative to each other.

The connecting member 23 can be connected to the imaging section 22 by loosening all the screws 39, rotating the imaging section 22 and the microscope section 21 relative to each other around the Z-axis, and then tightening all the screws 39 again. The relative positional relationship with the microscope section 21 in the rotational direction around the Z axis can be adjusted, and thereby the orientation of the imaging unit 20 can be adjusted. Here, the direction of the imaging unit 20 is the direction of the reference line 29 (see FIG. 2) of the imaging unit 20, that is, the direction of the reference line set inside the imaging unit 20, and specifically, the direction of the reference line 29 of the imaging unit 20 (see FIG. 2). This is the orientation of the imaging device inside the body 27, and rotates in accordance with the rotation of the imaging section 22 around the Z-axis with respect to the microscope section 21. In the first embodiment, the orientation of the imaging unit 20 is adjusted parallel to the X-axis direction.

The imaging unit 20 captures the enlarged image of the workpiece formed by the microscope section 21 with the imaging section 22 to obtain an image of the enlarged workpiece image, associates the obtained image with information on the orientation of the reference line 29 of the imaging unit 20, It outputs to the display unit 60 and control unit 70. The imaging unit 20 captures images for carrying out the holding table rotation step 1001 (see FIG. 4) of the inspection method according to Embodiment 1, which will be described later, and the deviation determination step 1003 (see FIG. 4) of the inspection method according to Embodiment 1. Capture images to carry out the process. In addition, the imaging unit 20 automatically confirms whether or not the processing on the workpiece 100 has been performed within a normal range, and images for performing alignment for positioning the workpiece 100 and the processing unit 40. Capturing an image for performing a processing check. The processing check is, for example, a kerf check that checks processing grooves formed by cutting or laser processing. Here, the kerf check is to detect the machined groove based on the image taken of the machined groove, and check the width of the machined groove, chipping associated with the machined groove, meandering of the machined groove, the position of the machined groove, and the position to be machined. The purpose is to detect the deviation between the

As shown in FIG. 1, the processing unit 40 is a cutting unit that includes a spindle to which a cutting blade is attached at the tip and cuts the workpiece 100 held on the holding table 10. In the processing unit 40, the cutting blade attached to the tip of the spindle is rotated around an axis parallel to one horizontal direction (the Y-axis direction in FIG. 1) by the rotational movement of the spindle, and held. A workpiece 100 held on a table 10 is cut along a street 102 oriented parallel to the X-axis direction.

The processing unit 40 is movable in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, by a Y-axis movement unit 52, and is movable in the Z-axis direction by a Z-axis movement unit 53. The processing unit 40 moves relative to the workpiece 100 held on the holding table 10 along the Y-axis and Z-axis directions, respectively, by the Y-axis movement unit 52 and the Z-axis movement unit 53.

Note that the processing unit 40 is not limited to this in the present invention, and the processing unit 40 irradiates one surface of the workpiece 100 held on the holding table 10 with a laser beam, and directs the workpiece 100 parallel to the X-axis direction using the laser beam. A laser processing unit that performs laser processing along the streets 102 may also be used.

The X-axis direction movement unit 51, the Y-axis direction movement unit 52, and the Z-axis direction movement unit 53 move the holding table 10, the imaging unit 20, and the processing unit 40 relative to each other in the X-axis direction, Y-axis direction, and Move in the Z-axis direction. In the first embodiment, the X-axis direction movement unit 51 moves the holding table 10 relative to the imaging unit 20 and the processing unit 40 along the X-axis direction. In the first embodiment, the Y-axis direction movement unit 52 and the Z-axis direction movement unit 53 move the imaging unit 20 and the processing unit 40 relative to the holding table 10 along the Y-axis direction and the Z-axis direction, respectively. let The X-axis direction movement unit 51, the Y-axis direction movement unit 52, and the Z-axis direction movement unit 53 are, for example, well-known ball screws rotatably provided around the axes of the X-axis, Y-axis, and Z-axis, respectively. A well-known pulse motor that rotates a ball screw around its axis, and a well-known guide rail that supports the holding table 10 or the imaging unit 20 and the processing unit 40 movably in the X-axis direction, Y-axis direction, or Z-axis direction. Configured with the necessary features.

The X-axis direction movement unit 51, the Y-axis direction movement unit 52, and the Z-axis direction movement unit 53 include an encoder that reads the rotational position of the pulse motor, and move the holding table 10 and the rotational position of the pulse motor based on the rotational position of the pulse motor read by the encoder. The relative positions of the imaging unit 20 and the processing unit 40 in the X-axis direction, Y-axis direction, and Z-axis direction are detected, and the detected relative positions are output to the control unit 70. Here, the device orthogonal coordinate system (XYZ coordinates) provided in the processing device 1 is used for the relative positions in the X-axis direction, Y-axis direction, and Z-axis direction. For example, the origin of the device orthogonal coordinate system is set at the center of the holding surface 11 of the holding table 10. Note that the X-axis direction movement unit 51, the Y-axis direction movement unit 52, and the Z-axis direction movement unit 53 are limited to a configuration in which the relative positions of the holding table 10, the imaging unit 20, and the processing unit 40 are detected by encoders. First, linear scales parallel to the X-axis direction, Y-axis direction, and Z-axis direction, respectively, and an X-axis direction movement unit 51, a Y-axis direction movement unit 52, and a Z-axis direction movement unit 53 are used to move the X-axis direction and the Y-axis direction, respectively. and a reading head that is provided movably in the Z-axis direction and reads the scale of the linear scale.

The display unit 60 is provided on a cover (not shown) of the processing device 1 with the display surface facing outward. The display unit 60 displays a screen for setting processing conditions of the processing apparatus 1, imaging conditions of the imaging unit 20, various conditions for implementing the inspection method according to the first embodiment, alignment, processing check, etc., and an imaging unit. 20 for carrying out the inspection method according to the first embodiment, images for carrying out alignment and processing checks, judgment results when carrying out the inspection method according to the first embodiment, and processing checks. Confirmation results, etc. are displayed for the operator to see. The display unit 60 is composed of a liquid crystal display device or the like. The display unit 60 is provided with an input unit (not shown) used by the operator to input information regarding the above-mentioned various conditions of the processing apparatus 1, information regarding image display, and the like. The input unit provided on the display unit 60 includes at least one of a touch panel provided on the display unit 60, a keyboard, and the like. Note that the display unit 60 is not fixed to the processing apparatus 1, but may be provided in any communication device, and the arbitrary communication device may be connected to the processing apparatus 1 wirelessly or by wire.

In the first embodiment, the display unit 60 displays the reference line 29 of the imaging unit 20 in the displayed image. The reference line 29 of the imaging unit 20 is set by the control unit 70 to be parallel to the horizontal direction of the screen of the display unit 60. By displaying the reference line 29 of the imaging unit 20, the display unit 60 can, for example, as shown in FIG. can be displayed visually to the operator.

The processing device 1 includes a notification unit (not shown). The notification unit is provided above a cover (not shown) of the processing device 1, for example. In the first embodiment, the notification unit is, for example, a light emitting unit made up of a light emitting diode or the like, or an audio unit made up of a speaker or the like and emitting sound. The light emitting unit as a notification unit allows the operator to recognize errors that occur during imaging by the imaging unit 20 or processing by the processing unit 40, confirmation results from processing checks, etc. by lighting or blinking the light emitting unit, color of light, etc. Report as possible. The audio unit serving as a notification unit informs the operator of an error that has occurred, a confirmation result of a processing check, etc., in a recognizable manner, using the audio of the audio unit. Note that the notification unit is not fixed to the processing apparatus 1, but may be provided in any communication device, and the arbitrary communication device may be connected to the processing apparatus 1 wirelessly or by wire.

The control unit 70 controls the operation of each component of the processing apparatus 1 and causes the processing apparatus 1 to perform various processes on the workpiece 100 including the inspection method according to the first embodiment. The control unit 70 includes a storage section 71. The storage unit 71 stores a predetermined amount that serves as a reference for determining whether the street 102 has moved by a predetermined amount or more or is tilted by a predetermined angle or more with respect to the reference line 29 of the imaging unit 20 in a shift determination step 1003 described later. and information on predetermined angles, various images captured by the imaging unit 20, information on the streets 102 of the workpiece 100 (information on the number, X coordinates and Y coordinates representing the position of each street 102 on the workpiece 100, etc.), characteristics of the workpiece 100. information regarding the characteristic key pattern 110 (for example, a reference image of the characteristic key pattern 110), information on the XY coordinates representing the position of the characteristic key pattern 110 on the workpiece 100, processing information related to the processing of the workpiece 100, etc. remember. The machining information related to machining the workpiece 100 includes machining conditions that are set in advance before machining the workpiece 100 and is referred to when machining the workpiece 100, and each configuration of the machining device 1 during and after machining the workpiece 100. Contains processing data detected by an arbitrary detector provided on the element.

In the first embodiment, the control unit 70 includes a computer system. The computer system included in the control unit 70 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input/output interface device. The arithmetic processing device of the control unit 70 performs arithmetic processing according to a computer program stored in the storage device of the control unit 70, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input/output interface device of the control unit 70. In the first embodiment, the function of the storage unit 71 is realized by the storage device of the control unit 70.

FIG. 4 is a flowchart showing the processing procedure of the inspection method according to the first embodiment. The inspection method according to the first embodiment is an example of an operation process performed by the processing apparatus 1, and as shown in FIG. 4, includes a holding table rotation step 1001, an imaging step 1002, and a deviation determination step 1003. .

In the inspection method according to the first embodiment, before carrying out the holding table rotation step 1001, the control unit 70 transports the workpiece 100 onto the holding table 10 using a transport unit (not shown), and rotates the holding surface 11 by the holding table 10. to hold the workpiece 100.

In the holding table rotation step 1001, the streets 102 formed on the workpiece 100 are imaged, and the streets 102 of the workpiece 100, the processing apparatus 1, and the imaging unit are imaged using the captured images 301 and 302 (see FIGS. 5 and 6). This is a step of rotating the holding table 10 so that the X-axis direction of the holding table 20 is parallel to the X-axis direction. Note that in the holding table rotation step 1001, the streets 102 are imaged in the first embodiment, but the present invention is not limited to this, and images are taken in processing grooves and device areas formed along the streets 102 by cutting, laser processing, etc. An arbitrary pattern formed (for example, a characteristic key pattern 110) is imaged, and the captured image is used to make the street 102 of the workpiece 100 parallel to the X-axis direction of the processing device 1 and the imaging unit 20. The holding table 10 may also be rotated.

5 and 6 are top views illustrating the holding table rotation step 1001 of FIG. 4. In the holding table rotation step 1001, as shown in FIGS. 5 and 6, the control unit 70 first aligns the imaging area of the imaging unit 20 with an area 201 including an arbitrary street 102 on the surface 101 of the workpiece 100, and adjusts the area. 201 to obtain an image 301. Next, the imaging area of the imaging unit 20 is aligned with an area 202 that is different from the area 201 including the street 102 included in the area 201, and the area 202 is imaged to obtain an image 302. get. In the holding table rotation step 1001, the control unit 70 uses the X-axis movement unit 51, the Y-axis movement unit 52, and the Z-axis movement unit 53 to move the imaging unit 20 relative to the workpiece 100 held on the holding table 10. By relatively moving, the imaging area of the imaging unit 20 is aligned with each area 201, 202.

In the holding table rotation step 1001, the control unit 70 then calculates the XY coordinates of the centers of the regions 201 and 202, the XY coordinates of the center of the street 102 in the image 301 of the region 201, and the same street 102 in the image 302 of the region 202. The XY coordinates of the centers of these two streets 102 are calculated, and the inclination angle of the extending direction of the street 102 with respect to the X-axis direction is calculated from the difference between the XY coordinates of the centers of the two streets 102. In the holding table rotation step 1001, the control unit 70, based on the calculated inclination angle of the extending direction of the street 102 with respect to the 15 rotates the holding table 10 that holds the workpiece 100.

In the holding table rotation step 1001, when the extending direction of the street 102 is inclined with respect to the X-axis direction as shown in FIG. 5, the control unit 70 rotates the holding table 10 to eliminate the inclination angle. When the holding table 10 is rotated to eliminate the inclination angle, the direction in which the streets 102 extend is not inclined with respect to the X-axis direction, as shown in FIG. On the other hand, in the holding table rotation step 1001, the control unit 70 does not need to rotate the holding table 10 if the direction in which the streets 102 extend is not inclined with respect to the X-axis direction as shown in FIG.

Note that, although the inspection method according to embodiment 1 includes step 1001 of rotating the holding table, the present invention is not limited to this, and step 1001 of rotating the holding table may be omitted.

In the first embodiment, the imaging step 1002 is a step of relatively moving the imaging unit 20 and the holding table 10 in the X-axis direction to image an arbitrary street 102 of the workpiece 100 held on the holding table 10. . Note that in the imaging step 1002, the streets 102 are imaged in the first embodiment, but the present invention is not limited to this, and images are taken in processing grooves formed along the streets 102 by cutting, laser processing, etc. or in device regions. Alternatively, a pattern may be imaged.

FIG. 7 is a top view illustrating the imaging step 1002 and the shift determination step 1003 in FIG. 4. In the imaging step 1002, the control unit 70 moves the imaging unit 20 in the Y-axis direction and Z-axis relative to the workpiece 100 held on the holding table 10 by the Y-axis direction movement unit 52 and the Z-axis direction movement unit 53. By moving the imaging unit 20 in the direction, the imaging area of the imaging unit 20 is aligned with an arbitrary street 102 on the surface 101 of the workpiece 100, and the X-axis direction movement unit 51 moves the imaging unit 20 onto the workpiece 100 held on the holding table 10. By moving the imaging area of the imaging unit 20 in the X-axis direction relative to the street 102, the imaging area of the imaging unit 20 is aligned with one or more areas including the street 102, and the imaging unit 20 images the imaging area. Or get multiple images.

In the imaging step 1002, the control unit 70, as shown in FIG. Images 311, 312, and 313 are acquired, respectively. Note that the first area 211 is an area on the workpiece 100 that corresponds to the above-mentioned area 201, the second area 212 is an area on the workpiece 100 that corresponds to the above-mentioned area 202, and the third area 213 is This is an intermediate area between the first area 211 and the second area 212.

In the first embodiment, the shift determination step 1003 is performed in the case where the street 102 imaged in the imaging step 1002 has moved by a predetermined amount or more preset in the storage unit 71 in the Y-axis direction perpendicular to the X-axis direction. This is a step of determining that the orientation is shifted with respect to the X-axis direction.

If the orientation of the imaging unit 20 is shifted from the X-axis direction, in the imaging step 1002, the imaging unit 20 is moved in the X-axis direction relative to the workpiece 100 held on the holding table 10, and the When the street 102 oriented parallel to the axial direction was imaged, the image was taken by moving the imaging area along the street 102 while the street 102 was tilted with respect to the reference line 29 of the imaging unit 20 by the amount of the deviation. An image is obtained. Therefore, by calculating the amount of movement 315, 316, 317, which is the amount by which the street 102 moves in the Y-axis direction perpendicular to the X-axis direction, for any images 311, 312, 313 captured in the image capturing step 1002, The deviation of the orientation of the imaging unit 20 with respect to the X-axis direction can be quantitatively determined.

In the shift determination step 1003, the control unit 70 determines the amount of movement of the street 102 in the Y-axis direction perpendicular to the X-axis direction for any images 311, 312, and 313 captured in the imaging step 1002, as shown in FIG. 315, 316, and 317, and if the movement amounts 315, 316, and 317 are less than a predetermined amount set in advance in the storage unit 71, it is determined that the orientation of the imaging unit 20 is not shifted with respect to the X-axis direction, When the moving amounts 315, 316, and 317 are equal to or greater than a predetermined amount set in advance in the storage section 71, it is determined that the orientation of the imaging unit 20 is shifted with respect to the X-axis direction.

In the shift determination step 1003, the control unit 70 determines the amount of movement of the street 102 in the Y-axis direction perpendicular to the X-axis direction for any images 311, 312, and 313 captured in the imaging step 1002, as shown in FIG. 315, 316, and 317, and if the movement amounts 315, 316, and 317 are less than a predetermined amount set in advance in the storage unit 71, it is determined that the orientation of the imaging unit 20 is not shifted with respect to the X-axis direction, When the moving amounts 315, 316, and 317 are equal to or greater than a predetermined amount set in advance in the storage section 71, it is determined that the orientation of the imaging unit 20 is shifted with respect to the X-axis direction.

In the first embodiment, the shift determination step 1003 determines whether the street 102 imaged in the imaging step 1002 has moved in the Y-axis direction perpendicular to the X-axis direction by a predetermined amount or more set in advance in the storage unit 71. However, the present invention is not limited to this, and instead, the inclination θ1 of the imaging unit 20 of the street 102 imaged in the imaging step 1002 with respect to the reference line 29 is greater than or equal to a predetermined angle preset in the storage unit 71. In this case, it may be determined that the orientation of the imaging unit 20 is shifted with respect to the X-axis direction.

Furthermore, by calculating the inclination θ1 of the imaging unit 20 of the street 102 with respect to the reference line 29 for any images 311, 312, and 313 taken in the imaging step 1002, the deviation of the orientation of the imaging unit 20 with respect to the X-axis direction can be quantified. It can be found exactly.

In the deviation determination step 1003, the control unit 70 calculates the slope θ1 of the street 102 with respect to the reference line 29 of the imaging unit 20 for any images 311, 312, and 313 taken in the imaging step 1002, as shown in FIG. If the inclination θ1 is less than the predetermined angle preset in the storage unit 71, it is determined that the orientation of the imaging unit 20 is not shifted with respect to the X-axis direction, and the inclination θ1 is equal to or greater than the predetermined angle preset in the storage unit 71. In this case, it may be determined that the orientation of the imaging unit 20 is shifted with respect to the X-axis direction.

If the control unit 70 determines in the deviation determination step 1003 that the orientation of the imaging unit 20 is deviated with respect to the X-axis direction, it notifies an error. The control unit 70 displays on the display unit 60 an image indicating that the direction of the imaging unit 20 has been determined to be shifted with respect to the X-axis direction in the shift determination step 1003 so that the operator can recognize it, and the notification unit displays the image in the shift determination step 1003. In step 1003, the operator is visibly notified that the orientation of the imaging unit 20 is determined to be deviated from the X-axis direction, and the operator takes a process such as tightening the screw 39. This prompts the user to adjust the relative positional relationship with the microscope section 21 in the rotational direction around the Z-axis. The control unit 70 also informs the display unit 60 and notification unit connected via any communication device that the orientation of the imaging unit 20 has been determined to be deviated from the X-axis direction in the deviation determination step 1003. You can also send it.

When the control unit 70 determines in the displacement determination step 1003 that the orientation of the imaging unit 20 is not displaced with respect to the X-axis direction, the control unit 70 displays an image to that effect on the display unit 60 so that the operator can recognize it.

Further, when the control unit 70 determines in the deviation determination step 1003 that the orientation of the imaging unit 20 is shifted with respect to the X-axis direction, the control unit 70, for example, regarding the processing check (kerf check) image acquired by the imaging unit 20, Image data is generated by rotating the image by an angle corresponding to the movement amount 315, 316, 317 (by the angle θ1), and displayed on the display unit 60, and the processed groove is determined using the rotated image data. Measure the width etc.

The inspection method according to the first embodiment having the above-mentioned configuration moves the imaging unit 20 and the holding table 10 relatively in the X-axis direction to image the street 102, and if the amount of movement 315, 316, 317 of the street 102 in the Y-axis direction perpendicular to the X-axis direction is equal to or greater than a predetermined amount previously set in the memory unit 71, or if the street 102 is inclined at an angle greater than a predetermined angle with respect to the reference line 29 of the imaging unit 20, it is determined that the orientation of the imaging unit 20 is misaligned, thereby providing the advantageous effect of being able to conveniently inspect whether the orientation of the imaging unit 20 is misaligned with respect to the X-axis direction of the device.

[Embodiment 2]
An inspection method according to Embodiment 2 of the present invention will be explained based on the drawings. 8 and 9 are top views illustrating the imaging step 1002 and the deviation determination step 1003 of the inspection method according to the second embodiment. In FIGS. 8 and 9, the same parts as those in the embodiment are denoted by the same reference numerals, and description thereof will be omitted.

The inspection method according to the second embodiment is the same as the first embodiment, except that the imaging step 1002 and the deviation determination step 1003 are respectively modified.

In the imaging step 1002 of the inspection method according to the second embodiment, as shown in FIGS. 8 and 9, arbitrary identical marks formed on the workpiece 100 are taken relative to the imaging unit 20 and the holding table 10 on the X axis. This is a step of moving in the direction and capturing images at a position where the imaging area of the imaging unit 20 becomes the first imaging area 221 and a position where the imaging area of the imaging unit 20 becomes the second imaging area 222.

In the imaging step 1002 of the second embodiment, the arbitrary mark is a characteristic key pattern 110 formed on the surface 101 as shown in FIGS. 8 and 9, but the present invention is not limited to this. It may also be a characteristic trace of a processed groove formed along the street 102 by cutting, laser processing, or the like.

In the imaging step 1002 of the second embodiment, the control unit 70 moves the imaging unit 20 to the workpiece 100 held on the holding table 10 using the X-axis movement unit 51, the Y-axis movement unit 52, and the Z-axis movement unit 53. By moving the imaging area of the imaging unit 20 in the X-axis direction, Y-axis direction, and Z-axis direction relative to The first imaging area 221 is imaged by the imaging unit 20 in accordance with the area 221 to obtain an image 321, and the X-axis movement unit 51 moves the imaging unit 20 relative to the workpiece 100 held on the holding table 10. in the X-axis direction to align the imaging area of the imaging unit 20 with a second imaging area 222 that is different from the first imaging area 221 that includes the same mark (key pattern 110). An image 322 is obtained by capturing an image of the imaging area 222 .

In the deviation determination step 1003 of the inspection method according to the second embodiment, the mark imaged in the second imaging area 222 is aligned with the mark imaged in the first imaging area 221 on the Y axis perpendicular to the X axis direction. If the imaging unit 20 has moved by a predetermined amount or more in the direction, it is determined in this step that the orientation of the imaging unit 20 has shifted with respect to the X-axis direction.

If the orientation of the imaging unit 20 is misaligned in the X-axis direction, in imaging step 1002, the imaging unit 20 is moved in the X-axis direction relative to the workpiece 100 held on the holding table 10 to image the key pattern 110, and an image is obtained in which the key pattern 110 has moved in the Y-axis direction in conjunction with the movement of the imaging area in the X-axis direction, depending on the inclination of the street 102 relative to the reference line 29 of the imaging unit 20, i.e., the amount of misalignment. Therefore, by calculating the amount of movement 325 (see FIG. 8) of the key pattern 110 in the Y-axis direction for the images 321 and 322 captured in imaging step 1002 of embodiment 2, the misalignment of the orientation of the imaging unit 20 in the X-axis direction can be quantitatively determined.

In the shift determination step 1003 of the second embodiment, the control unit 70 determines the amount of movement of the imaging area in the X-axis direction for the images 321 and 322 captured in the imaging step 1002 of the second embodiment, as shown in FIGS. The amount of movement 325 of the key pattern 110 in the Y-axis direction with respect to 326 is calculated. In the shift determination step 1003 of the second embodiment, the control unit 70 determines that the direction of the imaging unit 20 is set to If it is determined that there is no deviation with respect to the axial direction, and as shown in FIG. It is determined that there is a deviation.

Furthermore, by calculating the amount of movement 325 of the key pattern 110 in the Y-axis direction relative to the amount of movement 326 of the imaging area in the The inclination of the direction of the imaging unit 20 with respect to the reference line 29 can be calculated, and also by this, the deviation of the orientation of the imaging unit 20 with respect to the X-axis direction can be quantitatively determined.

Note that in the deviation determination step 1003 of the inspection method according to the second embodiment, the mark imaged in the second imaging area 222 is perpendicular to the X-axis direction with respect to the mark imaged in the first imaging area 221. Although the determination is made based on whether or not the mark has moved by a predetermined amount or more in the Y-axis direction, the present invention is not limited to this. If the mark imaged in the second imaging area 222 is tilted by a predetermined angle or more, it may be determined that the orientation of the imaging unit 20 is shifted with respect to the X-axis direction. Here, the inclination of the mark imaged in the second imaging area 222 with respect to the mark imaged in the first imaging area 221 is the amount of movement 325 of the mark in the Y-axis direction relative to the amount of movement 326 of the imaging area in the X-axis direction. That is, it represents the value obtained by dividing the amount of movement 325 of the mark in the Y-axis direction by the amount of movement 326 of the imaging area in the X-axis direction.

In this case, in the shift determination step 1003 of the second embodiment, the control unit 70, as shown in FIGS. 8 and 9, The amount of movement 325 of the key pattern 110 in the Y-axis direction with respect to the amount of movement 326 of is calculated, and based on this, the inclination of the imaging unit 20 of the apparatus in the X-axis direction with respect to the reference line 29 is calculated. In the shift determination step 1003 of the second embodiment, as shown in FIG. If it is determined that the orientation of the imaging unit 20 is not shifted relative to the X-axis direction, and as shown in FIG. judge.

In the inspection method according to the second embodiment having the above configuration, the imaging unit 20 and the holding table 10 are relatively moved in the X-axis direction to image the same mark (key pattern 110), and the imaged image is If the mark (key pattern 110) is shifted in the Y-axis direction, it is determined that the orientation of the imaging unit 20 is shifted, so that the orientation of the imaging unit 20 is not shifted with respect to the X-axis direction of the device. This has the advantage of being able to suitably inspect the situation.

Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the invention.

1 Processing device 10 Holding table 20 Imaging unit 29 Reference line 51 X-axis direction movement unit 100 Work 102 Street 110 Key pattern 211 First area 212 Second area 213 Third area 221 First imaging area 222 Second imaging area 301 , 302, 311, 312, 313, 321, 322 Image 315, 316, 317, 325, 326 Movement amount

Claims (2)

a holding table;
an imaging unit that images the workpiece held on the holding table;
An apparatus comprising an X-axis direction movement unit that relatively moves the holding table and the imaging unit in the X-axis direction,
An inspection method for inspecting the orientation of the imaging unit, the method comprising:
A street formed on the workpiece, a machining groove formed along the street, or an arbitrary pattern is imaged, and the street of the workpiece and the X-axis direction of the imaging unit are determined using the imaged image. a holding table rotation step for rotating the holding table so that the holding table becomes parallel;
After performing the holding table rotation step, the imaging unit and the holding table are moved relatively in the X-axis direction to image the street, a processed groove formed along the street, or an arbitrary pattern. , if the street, the processed groove formed along the street, or the pattern has moved by a predetermined amount or more in the Y-axis direction perpendicular to the X-axis direction, it is determined that the orientation of the imaging unit has shifted. a deviation determination step;
An inspection method that includes a holding table;
an imaging unit that images the workpiece held on the holding table;
An apparatus comprising an X-axis direction movement unit that relatively moves the holding table and the imaging unit in the X-axis direction,
An inspection method for inspecting the orientation of the imaging unit, the method comprising:
An arbitrary mark formed on the workpiece is captured by moving the imaging unit and the holding table relatively in the X-axis direction to capture a first imaging area including the mark and a second imaging area including the mark. an imaging step of imaging the area;
If the mark imaged in the second imaging area has moved by a predetermined amount or more in the Y-axis direction perpendicular to the X-axis direction with respect to the mark imaged in the first imaging area, the image is captured. a misalignment determination step of determining that the orientation of the unit is misaligned with respect to the X-axis direction;
An inspection method that includes

Images