JP2024037598A - Substrate holder and substrate processing equipment - Google Patents

Abstract

The present invention provides a technology that can suppress the generation of particles. A substrate holder according to an aspect of the present disclosure is a substrate holder capable of stacking a plurality of substrates in multiple stages at intervals in the vertical direction, and is provided on the same circumference and a plurality of support sections extending horizontally, each of the plurality of support sections being provided at intervals in the vertical direction on each of the plurality of support sections; , a mounting surface on which the substrate is mounted, and an inclined surface provided on at least a part of the outer edge of the mounting surface, the inclined surface being inclined downward as it moves away from the mounting surface. a first inclined surface, and a second inclined surface located between the placement surface and the first inclined surface and inclined downward from the placement surface toward the first inclined surface, The second value obtained by dividing the height of the second inclined surface by the horizontal length of the second inclined surface is the first value obtained by dividing the height of the first inclined surface by the horizontal length of the first inclined surface. smaller than [Selection diagram] Figure 1

Description

The present disclosure relates to a substrate holder and a substrate processing apparatus.

2. Description of the Related Art In a heat treatment boat used in a vertical heat treatment apparatus, a technique is known in which the edge portions of grooves that come into contact with wafers are rounded (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 7-161654

The present disclosure provides a technique that can suppress the generation of particles.

A substrate holder according to one aspect of the present disclosure is a substrate holder capable of stacking a plurality of substrates in multiple stages with intervals in the vertical direction, and the plurality of substrates are provided on the same circumference and extend along the vertical direction. and a plurality of support parts provided at intervals in the vertical direction on each of the plurality of support pillars and each extending in the horizontal direction, and each of the plurality of support parts is arranged so that the substrate is A first inclined surface that has a mounting surface on which the mounting surface is placed, and an inclined surface provided on at least a portion of the outer edge of the mounting surface, and the inclined surface slopes downward as it moves away from the mounting surface. and a second sloped surface located between the placement surface and the first sloped surface and inclined downward from the placement surface toward the first sloped surface, and the second sloped surface A second value obtained by dividing the height of the surface by the horizontal length of the second inclined surface is smaller than a first value obtained by dividing the height of the first inclined surface by the horizontal length of the first inclined surface.

According to the present disclosure, generation of particles can be suppressed.

FIG. 1 is a schematic diagram showing a substrate processing apparatus according to an embodiment. FIG. 2 is a sectional view taken along the line II--II in FIG. FIG. 3 is a sectional view taken along the line III--III in FIG. 2. FIG. 4 is an enlarged view of a part of FIG. 3. FIG. 5 is a sectional view taken along the line VV in FIG. 3. FIG. 6 is a diagram showing the results of measuring the number of particles.

Non-limiting exemplary embodiments of the present disclosure will now be described with reference to the accompanying drawings. In all the attached drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and redundant explanation will be omitted.

(particle)
In an apparatus that performs various processes on a plurality of substrates W at once, a substrate holder is used that can stack a plurality of substrates W in multiple stages with intervals in the vertical direction. The substrate holder holds each substrate using a support section provided on each of a plurality of columns extending in the vertical direction. In this case, particles are likely to be generated on the substrate near the support portion.

As a result of analyzing the behavior of substrate deformation through simulation, the present inventors found that due to the difference in the amount of thermal deformation between the substrate holder and the substrate, the supporting part of the substrate holder rubs against the back surface of the substrate, generating particles. It was found that it adhered to the substrate located below the rubbed area. As a result of intensive studies to suppress the generation of particles, the present inventors came up with a substrate processing apparatus and a substrate holder according to the following embodiments.

(Substrate processing equipment)
With reference to FIG. 1, a substrate processing apparatus 1 according to an embodiment will be described. FIG. 1 is a schematic diagram showing a substrate processing apparatus 1 according to an embodiment.

The substrate processing apparatus 1 is an apparatus that performs various processes on a plurality of substrates W at once. The substrate W is, for example, a semiconductor wafer. The various treatments include, for example, film formation treatment, etching treatment, or a combination thereof. The substrate processing apparatus 1 has an overall vertically elongated shape. The substrate processing apparatus 1 includes a processing container 10 that is long and extends in the vertical direction. The processing container 10 is made of quartz, for example. The processing container 10 has, for example, a double tube structure including an inner tube 11 having a cylindrical shape and an outer tube 12 with a ceiling placed concentrically outside the inner tube 11.

The lower end of the processing container 10 is held airtight by a manifold 20. The manifold 20 is made of metal such as stainless steel, for example. The manifold 20 is fixed to a base plate (not shown), for example.

The manifold 20 includes an injector 30 that introduces a processing gas and a purge gas such as an inert gas (for example, N ₂ gas) into the processing container 10 , and a gas exhaust section 40 that exhausts the inside of the processing container 10 . The type of processing gas is not particularly limited, and can be appropriately selected by those skilled in the art depending on the type of film to be formed.

An introduction pipe 31 for introducing processing gas is connected to the injector 30 . The introduction pipe 31 is provided with a flow rate adjusting section such as a mass flow controller (not shown), a valve (not shown), etc. for adjusting the gas flow rate.

An exhaust pipe 41 is connected to the gas exhaust section 40 . The exhaust pipe 41 is provided with a pressure regulating valve 42, a vacuum pump 43, and the like.

A furnace port 21 is formed at the lower end of the manifold 20 . A lid 50 is provided at the furnace mouth 21 . The lid body 50 has a disc shape. The lid body 50 is made of metal such as stainless steel, for example. The lid body 50 can be raised and lowered by a lifting mechanism 51. The lid body 50 is configured to be able to airtightly seal the furnace mouth 21 .

A heat-retaining cylinder 60 made of, for example, quartz is installed on the lid 50. A substrate holder 80 is placed on the heat retaining cylinder 60. The substrate holder 80 stacks a plurality of substrates W in multiple stages at intervals in the vertical direction. The substrate holder 80 can be stored within the processing container 10. The substrate holder 80 is carried into the processing container 10 by lifting the lid 50 . The substrate holder 80 is carried out from inside the processing container 10 by lowering the lid 50. The substrate holder 80 will be described later.

A heater 70 is provided around the processing container 10 . The heater 70 heats each substrate W within the processing container 10 . The heater 70 has, for example, a cylindrical shape.

The substrate processing apparatus 1 includes a control section 90 . The control unit 90 performs various processes on the substrate W by controlling the operations of each unit of the substrate processing apparatus 1 . The control unit 90 may be, for example, a computer. A computer program for operating each part of the substrate processing apparatus 1 is stored in a storage medium. The storage medium may be, for example, a flexible disk, a compact disk, a hard disk, a flash memory, a DVD, or the like.

(Substrate holder)
The substrate holder 80 will be described with reference to FIGS. 1 to 5. FIG. 2 is a sectional view taken along the line II--II in FIG. FIG. 3 is a sectional view taken along the line III--III in FIG. 2. FIG. 4 is an enlarged view of a part of FIG. 3. FIG. 5 is a sectional view taken along the line VV in FIG. 3.

The substrate holder 80 is configured to be able to stack a plurality of substrates W in multiple stages at intervals in the vertical direction. The substrate holder 80 holds each substrate W in a horizontal position. The substrate holder 80 is made of quartz, for example. The plurality of substrates W held by the substrate holder 80 constitute one batch, and various processes are performed on each batch. The substrate holder 80 includes a top plate 81 , a bottom plate 82 , a plurality of support columns 83 , and a plurality of support parts 84 .

The top plate 81 is placed in a horizontal position. The top plate 81 has, for example, a disk shape. The diameter of the top plate 81 is larger than the diameter of the substrate W, for example.

The bottom plate 82 is disposed below the top plate 81 and facing the top plate 81. The bottom plate 82 has, for example, a disk shape. The diameter of the bottom plate 82 may be the same as the diameter of the top plate 81, for example.

A plurality of pillars 83 are provided between the top plate 81 and the bottom plate 82, respectively. Each support column 83 extends along the vertical direction. Each support column 83 has an upper end connected to the top plate 81 and a lower end connected to the bottom plate 82. The plurality of support columns 83 are provided on the same circumference. In the illustrated example, there are three pillars 83.

The plurality of support parts 84 are provided on each support column 83 at intervals in the vertical direction. The number of supporting parts 84 is, for example, the same as the number of substrates W held by the substrate holding part 80. Each support portion 84 extends horizontally from the strut 83 toward the center of the boat. Each support portion 84 has, for example, a fan shape in plan view. Each support portion 84 supports a peripheral portion of the substrate W. Each support portion 84 has a mounting surface 84a and an inclined surface 84b.

The mounting surface 84a has a base end connected to the support column 83. The mounting surface 84a is, for example, a flat surface along the horizontal direction. A peripheral portion of the substrate W is placed on the placement surface 84a.

The inclined surface 84b is inclined downward from the mounting surface 84a toward the outer edge of the support portion 84. The boundary between the inclined surface 84b and the mounting surface 84a is chamfered. The inclined surface 84b has a first inclined surface 84c and a second inclined surface 84d. The first inclined surface 84c slopes downward as it moves away from the mounting surface 84a. The second inclined surface 84d is located between the mounting surface 84a and the first inclined surface 84c. The second inclined surface 84d slopes downward from the mounting surface 84a toward the first inclined surface 84c.

The second value obtained by dividing the height H2 of the second inclined surface 84d by the horizontal length L2 of the second inclined surface 84d is the height H1 of the first inclined surface 84c divided by the horizontal length L1 of the first inclined surface 84c. is smaller than the first value. In other words, the second angle θ2 of the second slope 84d with respect to the horizontal plane is smaller than the first angle θ1 of the first slope 84c with respect to the horizontal plane. In this case, generation of particles due to friction between the support portion 84 and the back surface of the substrate W can be suppressed. This is considered to be because when the second value is smaller than the first value, the boundary between the mounting surface 84a and the inclined surface 84b becomes smooth.

The first inclined surface 84c is, for example, a rounded surface. In this case, the boundary between the first inclined surface 84c and the second inclined surface 84d tends to be smooth. The radius of curvature of the first inclined surface 84c may be, for example, 5 mm or more and 15 mm or less, and preferably 10 mm. The first inclined surface 84c may be a C-plane.

The second inclined surface 84d is, for example, a rounded surface. In this case, the boundary between the mounting surface 84a and the second inclined surface 84d tends to be smooth, and the boundary between the first inclined surface 84c and the second inclined surface 84d tends to become smooth. The radius of curvature of the second inclined surface 84d is, for example, larger than the radius of curvature of the first inclined surface 84c. The radius of curvature of the second inclined surface 84d may be, for example, 15 mm or more and 25 mm or less, and preferably 20 mm. The second inclined surface 84d may be a C-plane. The horizontal length L2 of the second inclined surface 84d is shorter than the horizontal length L1 of the first inclined surface 84c, for example.

(Example)
The substrate holders A1, A2, and B holding a plurality of substrates W are housed in the processing container 10 described above, and after forming a film on the plurality of substrates W in the processing container 10, a film is deposited on each substrate W. The number of particles was measured.

The substrate holders A1 and A2 have a support portion 84 having a mounting surface 84a, a first inclined surface 84c with a radius of curvature of 10 mm (R10), and a second inclined surface 84d with a radius of curvature of 20 mm (R20). . The substrate holder A1 and the substrate holder A2 are substrate holders with the same specifications and are different individuals.

The substrate holder B has a support portion that has a mounting surface 84a and a first inclined surface 84c with a radius of curvature of 10 mm (R10), but does not have a second inclined surface 84d.

FIG. 6 is a diagram showing the results of measuring the number of particles. FIG. 6 shows the number of particles attached to the substrate W when the substrate holder B, substrate holder A1, and substrate holder A2 are used in order from the left. The number of particles in FIG. 6 is the average number of particles attached to a predetermined number of substrates W out of the plurality of substrates W held by each substrate holder A1, A2, and B.

As shown in FIG. 6, the number of particles when using substrate holder B is 44, the number of particles when using substrate holder A1 is 5, and the number of particles when using substrate holder A2 is 44. In this case, the number of particles was 6. From this result, when the second inclined surface 84d is provided between the mounting surface 84a and the first inclined surface 84c and the second inclined surface 84d has a larger radius of curvature than the first inclined surface 84c, the second inclined surface 84d is not provided. It was shown that the generation of particles could be suppressed more than the conventional method.

Further, as shown in FIG. 6, the number of particles was approximately the same in the case where the substrate holder A1 was used and the case where the substrate holder A2 was used. This result showed that individual differences had little effect on particle generation.

Next, the substrate holders A1, A2, and B holding a plurality of substrates W are stored in the processing container 10 described above, and when a film is formed on the plurality of substrates W in the processing container 10, each substrate W is The thickness of the formed film and the in-plane uniformity of the film thickness were measured. As a result of the measurement, the film thickness and the in-plane uniformity of the film thickness were approximately the same regardless of which substrate holder A1, A2, or B was used. From this result, it is considered that providing the second inclined surface 84d, which has a larger radius of curvature than the first inclined surface 84c, between the mounting surface 84a and the first inclined surface 84c does not affect the film characteristics.

The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The embodiments described above may be omitted, replaced, or modified in various forms without departing from the scope and spirit of the appended claims.

In the above embodiment, the processing container has a double pipe structure, but the present disclosure is not limited thereto. For example, the processing container may have a single tube structure.

In the embodiment described above, the processing gas is supplied upward from the injector disposed below the processing container, but the present disclosure is not limited thereto. For example, the processing gas may be supplied horizontally from an injector arranged along the longitudinal direction of the processing container.

In the embodiments described above, the substrate processing apparatus does not include a plasma generation section, but the present disclosure is not limited thereto. For example, the substrate processing apparatus may include a plasma generation section that generates plasma from a processing gas supplied into a processing container.

1 Substrate processing apparatus 80 Substrate holder 83 Support column 84 Support part 84a Placement surface 84b Inclined surface 84c First inclined surface 84d Second inclined surface W Substrate

Claims (5)

A substrate holder capable of stacking a plurality of substrates in multiple stages with intervals in the vertical direction,
A plurality of pillars provided on the same circumference and extending along the vertical direction;
a plurality of support parts provided at intervals in the vertical direction on each of the plurality of support columns, each of which extends in the horizontal direction;
has
Each of the plurality of supporting parts is
a mounting surface on which the substrate is mounted;
an inclined surface provided on at least a portion of the outer edge of the placement surface;
has
The inclined surface is
a first slope that slopes downward as it moves away from the placement surface;
a second inclined surface located between the placement surface and the first inclined surface and inclined downward from the placement surface toward the first inclined surface;
has
The second value obtained by dividing the height of the second inclined surface by the horizontal length of the second inclined surface is the first value obtained by dividing the height of the first inclined surface by the horizontal length of the first inclined surface. smaller than,
Board holder. The first inclined surface and the second inclined surface are R surfaces,
The radius of curvature of the second inclined surface is larger than the radius of curvature of the first inclined surface.
The substrate holder according to claim 1. The horizontal length of the second inclined surface is shorter than the horizontal length of the first inclined surface.
The substrate holder according to claim 1 or 2. The support portion has a fan shape in plan view.
The substrate holder according to claim 1 or 2. a substrate holder capable of stacking a plurality of substrates in multiple stages with intervals in the vertical direction;
a processing container capable of accommodating the substrate holder;
Equipped with
The substrate holder is
A plurality of pillars provided on the same circumference and extending along the vertical direction;
a plurality of support parts provided at intervals in the vertical direction on each of the plurality of support columns, each of which extends in the horizontal direction;
has
Each of the plurality of supporting parts is
a mounting surface on which the substrate is mounted;
an inclined surface provided on at least a portion of the outer edge of the placement surface;
has
The inclined surface is
a first slope that slopes downward as it moves away from the placement surface;
a second inclined surface located between the placement surface and the first inclined surface and inclined downward from the placement surface toward the first inclined surface;
has
The second value obtained by dividing the height of the second inclined surface by the horizontal length of the second inclined surface is the first value obtained by dividing the height of the first inclined surface by the horizontal length of the first inclined surface. smaller than,
Substrate processing equipment.

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