JP2024036122A - Manufacturing method of electronic device, conductive member used therefor and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic device by which a plurality of conductive members can be easily connected in desired connection locations with respect to electronic apparatus members, the conductive members and the electronic device.

SOLUTION: A bus bar 13 is prepared which comprises a terminal 15, a bend part 19 and a solder 27 restricting a motion of the bent part 19. In a state where one or more bus bars 13 are mounted to a first electronic apparatus member 3a and the solder 27 is formed in the bent part 19, the terminals 15 of the one or more bus bars 13 are aligned to openings 7b in a second electronic apparatus member 3b, and the terminals 15 are connected to the openings 7b. The solder 27 formed in the bent part 19 is excluded from the bent part 19.

SELECTED DRAWING: Figure 4

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a method of manufacturing an electronic device, a conductive member used therein, and an electronic device, and particularly relates to a method of manufacturing an electronic device including a conductive member having an elastic portion, such a conductive member, and an electronic device. The present invention relates to an electronic device to which a conductive member is applied.

In electronic devices, for example, bus bars and the like are used to electrically connect one electronic device member to another electronic device member. An electronic device includes a motor, etc. as one electronic device component, and a circuit board on which a semiconductor element such as a switching element for controlling the motor, etc. is mounted as another electronic device component. be.

In such an electronic device, stress may be applied to the bus bar due to heat generation of the semiconductor element or vibration from the outside. For this reason, the busbar is provided with an elastic portion that absorbs stress. An example of a patent document disclosing such an electronic device is, for example, Patent Document 1.

Japanese Patent Application Publication No. 2007-37211

2. Description of the Related Art Some electronic devices include a plurality of conductive members such as bus bars each having an elastic portion. In such electronic devices, when electrically connecting a conductive member such as a bus bar to an electronic device member, the conductive member may be bent by the elastic portion. Therefore, in an electronic device including a plurality of conductive members, there is a problem in that it becomes difficult and complicated to connect the plurality of conductive members to respective desired connection points on the electronic device member.

The present invention has been made to solve such problems, and one purpose is to easily connect each of a plurality of conductive members to a desired connection point with respect to an electronic device member. It is another object of the present invention to provide a method of manufacturing an electronic device that can be used to manufacture an electronic device, and another object of the invention is to provide a conductive member used in the manufacture of such an electronic device. An object of the present invention is to provide an electronic device to which the member is applied.

A method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device in which a conductive member attached to a first electronic device member is electrically connected to a second electronic device member, and includes the following steps. We are prepared. A conductive member is prepared which includes a terminal, an elastic part connected to the terminal, and a fixing member formed on the elastic part to restrain movement of the elastic part. With one or more conductive members attached to the first electronic device member and a fixing member formed on the elastic portion, the terminals of the one or more conductive members are positioned at the connection points on the second electronic device member. Make a match. Connect the terminal to the connection point. The fixing member formed on the elastic part is removed from the elastic part.

The conductive member according to the present invention is a conductive member that electrically connects a first electronic device member and a second electronic device member, and includes a terminal, an elastic portion, and a fixing member. The elastic portion is formed so as to be connected to the terminal, and is configured to reduce stress generated between the first electronic device member and the second electronic device member when the first electronic device member and the second electronic device member are connected to each other. absorb. The fixing member is formed on the elastic part and restricts movement of the elastic part.

One electronic device according to the present invention is an electronic device in which a conductive member attached to a first electronic device member is electrically connected to a second electronic device member. The conductive member includes a terminal and an elastic portion. The terminal is connected to a connection location on the second electronic device member. The elastic part is connected to the terminal. A portion of the elastic portion located on the terminal side is covered with solder.

Another electronic device according to the present invention is an electronic device in which a conductive member attached to a first electronic device member is electrically connected to a second electronic device member. The conductive member includes a terminal and an elastic portion. The terminal is connected to a connection location on the second electronic device member. The elastic part is connected to the terminal. The terminals are connected to the connection points by solder. The solder is covered with wax.

According to the method for manufacturing an electronic device according to the present invention, first, with the fixing member formed on the elastic portion, the terminals of one or more conductive members are aligned with the connection points on the second electronic device member. be done. This facilitates positioning of the terminals of the conductive member. Furthermore, after the terminal is connected to the connection location, the fixing member formed on the elastic section is removed from the elastic section. Thereby, stress acting on the conductive member can be alleviated.

According to the conductive member according to the present invention, the conductive member includes a terminal, an elastic portion, and a fixing member, and the fixing member is formed on the elastic portion and restricts movement of the elastic portion. This facilitates positioning of the terminals of the conductive member.

According to one electronic device according to the present invention, solder is used as a fixing member in the conductive member. This facilitates positioning of the terminals of the conductive member. The solder is guided from the elastic part to the connection point of the terminal and removed from the elastic part, so that the stress acting on the conductive member can be alleviated.

According to another electronic device according to the present invention, wax is used as a fixing member in the conductive member. This facilitates positioning of the terminals of the conductive member. The wax is guided from the elastic part to the connection point of the terminal and removed from the elastic part, thereby making it possible to alleviate the stress acting on the conductive member.

FIG. 2 is a perspective view showing the structure of a bus bar applied to the electronic device according to the first embodiment. FIG. 2 is a side view showing the structure of the bus bar shown in FIG. 1 in the same embodiment. FIG. 2 is a perspective view for explaining the structure of the bus bar shown in FIG. 1 in the same embodiment. FIG. 2 is a partial perspective view showing one step of the method for manufacturing an electronic device in the same embodiment. FIG. 5 is a partial perspective view showing a step performed after the step shown in FIG. 4 in the same embodiment. FIG. 6 is a sectional view of the step shown in FIG. 5 in the same embodiment. FIG. 7 is a cross-sectional view showing a step performed after the step shown in FIG. 6 in the same embodiment. FIG. 8 is a partial perspective view showing a step performed after the step shown in FIG. 7 in the same embodiment. FIG. 7 is a partial perspective view showing one step of a method for manufacturing an electronic device according to a comparative example. 10 is a partial perspective view showing a step performed after the step shown in FIG. 9. FIG. 7 is a side view showing the structure of a bus bar applied to an electronic device according to a second embodiment. FIG. FIG. 2 is a cross-sectional view showing one step of the method for manufacturing an electronic device in the same embodiment. 13 is a cross-sectional view showing a step performed after the step shown in FIG. 12 in the same embodiment. FIG. 14 is a cross-sectional view showing a step performed after the step shown in FIG. 13 in the same embodiment. FIG. In each embodiment, it is a sectional view showing one process of a manufacturing method of an electronic device to which a conductive member according to a first modification is applied. FIG. 16 is a cross-sectional view showing a step performed after the step shown in FIG. 15 in each embodiment. In each embodiment, it is a side view which shows the structure of the electroconductive member based on the 2nd modification. In each embodiment, it is a side view which shows the structure of the electroconductive member based on the 3rd modification.

Embodiment 1
(Conductive member)
First, a bus bar will be described as an example of a conductive member applied to electronic equipment. As shown in FIGS. 1 and 2, the bus bar 13 serving as the conductive member 11 includes a terminal 15 and an elastic portion 17. As shown in FIG. 3, in the bus bar 13, a curved portion 19 is formed as the elastic portion 17. Note that FIG. 3 shows the structure of the bus bar 13 without the fixing member 25. The curved portion 19 is connected to the terminal 15.

A fixing member 25 is formed on the curved portion 19 to restrain movement of the curved portion 19. As an example of the fixing member 25, solder 27 is formed to cover the curved portion 19. As will be described later, most of the solder 27 will eventually be removed from the curved portion 19.

(Electronic device manufacturing method and electronic device)
Next, an example of a method for manufacturing an electronic device electrically connected by the plurality of bus bars 13 described above will be described.

As the electronic device members 3 constituting the electronic device, a first electronic device member 3a having a substrate 5a and a second electronic device member 3b having a substrate 5b are prepared (see FIG. 4). Further, a plurality of bus bars 13 required for electrical connection between the first electronic device member 3a and the second electronic device member 3b are prepared (see FIG. 4).

As shown in FIG. 4, each of the plurality of bus bars 13 is attached to a predetermined position on the substrate 5a. Here, each of the plurality of bus bars 13 is attached to a corresponding opening 7a provided in the substrate 5a. Solder 27 is formed on the curved portion 19 of the bus bar 13 . In the bus bar 13, the movement of the curved portion 19 is restrained by the solder 27.

Next, the respective terminals 15 of the plurality of bus bars 13 attached to the substrate 5a are aligned with the corresponding openings 7b provided as the connection points 7 on the substrate 5b. Next, as shown in FIG. 5, each terminal 15 of the plurality of bus bars 13 is inserted into the corresponding opening 7b.

At this time, the movement of the curved portion 19 is restricted by the solder 27. This prevents the terminals 15 of the bus bars 13 from moving from the once aligned positions, deforming the terminals 15, etc., and allows the terminals 15 of each bus bar 13 to be easily inserted into the corresponding openings 7b. It can be inserted.

Next, the electronic device member 3 is arranged so that the terminal 15 inserted through the corresponding opening 7b is located below the solder 27 formed on the curved portion 19. That is, as shown in FIG. 6, the attitude of the electronic device member 3 is adjusted so that the terminal 15 is located below the solder 27 in the direction of gravity. Next, for example, a soldering iron (not shown) is brought into contact with the terminal 15, and the solder 27 covering the curved portion 19 is melted by the heat conducted to the curved portion 19.

As shown in FIG. 7, the molten solder flows through the terminal 15 and into the opening 7b due to gravity. In this way, as shown in FIG. 8, the terminals 15 of the bus bar 13 as the conductive member 11 are electrically connected to the second electronic device member 3b, and the electronic device 1 is manufactured. Note that, as shown in FIG. 7, a portion of the solder 27 (solder 27a) may remain in the portion of the curved portion 19 located on the terminal 15 side.

In the method of manufacturing the electronic device 1 using the conductive member 11 described above, the terminals 15 of the conductive member 11 can be easily aligned. This will be explained in comparison with a method of manufacturing an electronic device according to a comparative example.

As shown in FIG. 9, in the method for manufacturing an electronic device 101 according to the comparative example, first, a first electronic device member 103a having a plurality of bus bars 113 attached to a substrate 105a is prepared. Each of the plurality of bus bars 113 is provided with an elastic portion 117. Next, the terminals 115 of the plurality of bus bars 113 are aligned with the corresponding openings 107 in the substrate 105b of the second electronic device member 103b, and as shown in FIG. It is inserted into the opening 107.

At this time, as shown in FIG. 9, when the elastic parts 117 provided on each of the bus bars 113 are deformed, the terminals 115 of the bus bar 113 move or vibrate, causing the respective terminals 115 to correspond to each other. It becomes difficult to align the opening 107. Furthermore, the terminals 115 that have been once aligned may be displaced from the aligned positions.

This work becomes more complicated as the number of bus bars 113 (the number of terminals 115) increases. Further, the bus bar 113 is also easily damaged due to this complicated work. As a result, it takes time to manufacture the electronic device 101. Furthermore, the production cost of the electronic device 101 will increase.

In contrast to the method for manufacturing the electronic device 101 according to the comparative example, in the method for manufacturing the electronic device 1 according to the embodiment, solder 27 is formed on the curved portion 19 of the bus bar 13 . The solder 27 is formed on the curved portion 19 as a fixing member 25 that restrains the movement of the curved portion 19. Therefore, when aligning the respective terminals 15 of the plurality of bus bars 13 with the corresponding openings 7b in the substrate 5b of the second electronic device member 3b, the movement of the curved portions 19 of the bus bars 13 causes the solder 27 is in a restrained state.

As a result, deformation of the curved portion 19 is suppressed, and the terminals 15 of the bus bar 13 move or vibrate. deformation etc. is suppressed. As a result, each terminal 15 can be easily aligned with the corresponding opening 7b and inserted through the opening 7b, and manufacturing time can be shortened. Furthermore, it can contribute to reducing production costs.

Further, the solder 27 that restrains the movement of the curved portion 19 is used for electrical connection between the terminal 15 and the substrate 5b. The solder 27 formed on the curved portion 19 is melted and flows from the curved portion 19 to the terminal 15 (opening 7b), thereby being removed from the curved portion 19. With this, the conductive member 11 has a function as the elastic portion 17.

As a result, in the electronic device 1, for example, stress acting on the bus bar 13 due to heat generation from the electronic device member 3 (the first electronic device member 3a or the second electronic device member 3b) or vibration from the outside is reduced by elasticity. It can be absorbed by the curved portion 19 as the portion 17, and can contribute to stabilizing the operation of the electronic device 1. Furthermore, it can also contribute to extending the life of the electronic device 1.

Embodiment 2
(Conductive member)
As shown in FIG. 11, a bus bar as another example of the conductive member 11 includes a terminal 15 and an elastic portion 17 (curved portion 19). Wax 29 serving as a fixing member 25 for fixing the movement of the curved portion 19 is formed on the curved portion 19 so as to cover the curved portion 19 . As will be described later, the wax 29 will eventually be removed from the curved portion 19.

(Electronic device manufacturing method and electronic device)
Next, an example of a method for manufacturing an electronic device electrically connected by the plurality of bus bars 13 described above will be described.

First, similar to the step shown in FIG. 14 described above, a plurality of bus bars 13 are attached to predetermined positions on the substrate 5a of the first electronic device member 3a. Next, each terminal 15 of the plurality of bus bars 13 attached to the substrate 5a is aligned with the corresponding opening 7b provided in the substrate 5b. Next, similarly to the step shown in FIG. 5 described above, each terminal 15 of the plurality of bus bars 13 is inserted into the corresponding opening 7b.

At this time, as shown in FIG. 12, the attitude of the electronic device member 3 is adjusted so that the terminal 15 is located below the wax 29 in the direction of gravity. Next, as shown in FIG. 13, molten solder 31 is supplied to the opening 7b. The heat of the melted solder 31 is conducted to the curved portion 19, thereby melting the wax 29. As shown in FIG. 14, the melted wax 29 flows from the curved portion 19 along the terminal 15 to cover the solder 31 due to gravity. In this way, the terminal 15 of the bus bar 13 is electrically connected to the second electronic device member 3b, and the electronic device 1 is manufactured.

In the method for manufacturing the electronic device 1 described above, the curved portion 19 of the bus bar 13 is provided with wax 29 that restrains the movement of the curved portion 19 . Therefore, when aligning the terminals 15 of the plurality of bus bars 13 with the corresponding openings 7b in the substrate 5b, the movement of the curved portions 19 of the bus bars 13 is restrained by the wax 29. .

As a result, similarly to the electronic device 1 described above, each terminal 15 can be easily aligned with the corresponding opening 7b and inserted into the opening 7b, and manufacturing time can be shortened. can. Furthermore, it can contribute to reducing production costs.

Furthermore, the wax 29 that was restraining the movement of the curved portion 19 is melted and flows downward to cover the solder 31, thereby being removed from the curved portion 19. With this, the conductive member 11 has a function as the elastic portion 17.

Thereby, similarly to the electronic device 1 described above, the stress acting on the bus bar 13 can be absorbed by the curved portion 19 as the elastic portion 17, contributing to stabilization of the operation of the electronic device 1. Furthermore, it can also contribute to extending the life of the electronic device 1.

(Variations in shape of conductive member)
(First modification)
In each embodiment, the curved portion 19 has been described as an example of the elastic portion 17 in the bus bar 13 as the conductive member 11. The shape of the elastic portion 17 is not limited to the curved portion 19. As shown in FIG. 15, for example, a bus bar 13 having an elastic portion 17 that is a combination of a curved portion 19 and a bent portion 20 may be applied.

In this case, in a posture in which the terminal 15 is located under gravity, the bent portion 20 is located on the upper side and the gently curved portion 19 is located on the lower side. Since the solder 27 is formed to cover a portion of the curved portion 19 from the bent portion 20, movement of the elastic portion 17 is restricted. Thereby, similarly to the bus bar 13 described above, the terminal 15 can be easily aligned with the corresponding opening 7b and inserted into the opening 7b.

Next, as shown in FIG. 16, the solder 27 formed on the bent portion 20 and the like is melted by heat conducted from a soldering iron (not shown), and passes from the bent portion 20 to the bent portion 19 to the terminal 15. By flowing into the opening 7b, it is removed from the bent portion 20 and the like. Thereby, like the bus bar 13 described above, the conductive member 11 has a function as the elastic part 17, and can contribute to stabilizing the operation and extending the life of the electronic device 1. Note that wax may be formed instead of the solder 27.

(Second modification)
As the conductive member 11, as shown in FIG. 17, a conductive member 11 having a zigzag portion 21 that is a combination of bent portions may be used. In this case, an appropriate amount of solder is formed on the zigzag portion 21 that can restrain the movement of the zigzag portion 21 and be removed from the zigzag portion 21 . Further, wax may be formed instead of solder.

(Third modification)
As the conductive member 11, as shown in FIG. 18, a conductive member 11 having a spiral portion 23 may be used. In this case, an appropriate amount of solder is formed on the helix 23 so that the movement of the helix 23 is restrained and can be removed from the helix 23. Further, wax may be formed instead of solder.

Note that the shape of the conductive member 11 has been described using a bus bar shape as an example. The shape of the conductive member 11 is not limited to a bus bar shape, and for example, a conductive member having a pin shape with an elastic portion may be applied. Further, a connector-type conductive member 11 including an elastic portion may be applied.

Further, as the fixing member 25 formed on the elastic portion 17 of the conductive member 11, solder 27 or wax 29 is used as an example. The fixing member 25 is not limited to the solder 27 or the wax 29, as long as it can be melted by the heat when joining the terminal to the connection location, and for example, it can be melted by the heat of about 350° C. to 400° C., for example. , a fixing member such as resin may be applied.

Furthermore, as the fixing member 25, before the terminal 15 is connected, the movement of the elastic part 17 is restrained, and after the terminal 15 is connected, if it can be removed from the elastic part 17, it can be used for other members regardless of the melting point. can also be applied.

Furthermore, the opening 7b formed in the substrate 5 (5b) is taken as an example of a connection location to which the terminal 15 of the conductive member 11 is connected. The connection location is not limited to the opening 7b, but may be, for example, an electrode pad or the like.

Further, as the electronic device member 3 to which the conductive member 11 is electrically connected, for example, a motor or an electric actuator using a motor can be applied. The elastic portion 17 in the conductive member 11 can absorb vibrations caused by driving the motor or electric actuator.

Note that the electronic devices including the conductive members described in each embodiment can be combined in various ways as necessary.

The embodiment disclosed this time is an example and is not limited thereto. The present invention is defined not by the scope described above, but by the scope of the claims, and is intended to include all changes within the meaning and range equivalent to the scope of the claims.

INDUSTRIAL APPLICATION This invention is effectively utilized for the electronic device provided with electrically conductive members, such as a bus bar.

1 electronic device, 3 electronic device member, 3a first electronic device member, 3b second electronic device member, 5, 5a, 5b substrate, 7 connection point, 7a, 7b opening, 11 conductive member, 13 bus bar, 15 terminal , 17 elastic part, 19 curved part, 21 zigzag part, 23 spiral part, 25 fixing member, 27, 27a, 31 solder, 29 wax.

Claims (11)

A method for manufacturing an electronic device in which a conductive member attached to a first electronic device member is electrically connected to a second electronic device member,
preparing the conductive member including a terminal, an elastic part connected to the terminal, and a fixing member formed on the elastic part to restrain movement of the elastic part;
With one or more conductive members attached to the first electronic device member and the fixing member formed on the elastic part, the terminals of the one or more conductive members are connected to the second electronic device member. a step of aligning the connection points in the equipment components;
connecting the terminal to the connection point;
A method of manufacturing an electronic device, comprising: removing the fixing member formed on the elastic section from the elastic section. Using solder as the fixing member in the conductive member,
In the step of aligning the terminal to the connection point on the second electronic device member, the terminal is positioned at the connection point in the second electronic device member in such a manner that the terminal is located below the elastic portion. aligned,
In the step of connecting the terminal to the connection point, the solder serving as the fixing member is melted, and the melted solder is guided by gravity from the elastic part to the terminal, so that the terminal is fixed by the solder. connected to the connection point,
2. The electronic device according to claim 1, wherein in the step of removing the fixing member from the elastic part, the molten solder is guided by gravity from the elastic part to the terminal and is removed from the elastic part. Production method. Using wax as the fixing member in the conductive member,
In the step of aligning the terminal to the connection point on the second electronic device member, the terminal is positioned at the connection point in the second electronic device member in such a manner that the terminal is located below the elastic portion. aligned,
In the step of connecting the terminal to the connection location, molten solder is supplied to the connection location in a state where the terminal is aligned with the connection location in the second electronic device member, so that the terminal connects to the connection location. connected to the connection point by solder;
In the step of removing the fixing member from the elastic part, the heat of the molten solder supplied to the connection point is conducted to the elastic part to melt the wax, and the molten wax is transferred to the elastic part by gravity. 2. The method of manufacturing an electronic device according to claim 1, wherein the elastic portion is guided from the elastic portion to the terminal and is removed from the elastic portion. Any one of claims 1 to 3, wherein in the step of aligning the terminal to the connection location in the second electronic device member, the terminal is inserted into an opening formed at the connection location. A method for manufacturing an electronic device according to. An electrically conductive member that electrically connects a first electronic device member and a second electronic device member,
a terminal; and a terminal formed to be connected to the terminal, and connected between the first electronic device member and the second electronic device member, and between the first electronic device member and the second electronic device member. an elastic part that absorbs the stress generated in the
A conductive member, comprising: a fixing member formed on the elastic portion and restraining movement of the elastic portion. The conductive member according to claim 5, wherein the fixing member has a melting point of 350°C to 400°C. The conductive member according to claim 6, wherein the fixing member includes solder. 7. The conductive member according to claim 6, wherein the fixing member includes wax. The conductive member according to claim 5, wherein the elastic portion has at least one of a curved shape, a bent shape, a zigzag shape, and a spiral shape. An electronic device in which a conductive member attached to a first electronic device member is electrically connected to a second electronic device member,
The conductive member is
a terminal connected to a connection point in the second electronic device member;
an elastic part connected to the terminal,
An electronic device, wherein a portion of the elastic portion located on the terminal side is covered with solder. An electronic device in which a conductive member attached to a first electronic device member is electrically connected to a second electronic device member,
The conductive member is
a terminal connected to a connection point in the second electronic device member;
an elastic part connected to the terminal,
The terminal is connected to the connection point by solder,
The electronic device, wherein the solder is covered with wax.

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