JP2024009341A - Semiconductor component and manufacturing method thereof - Google Patents

Abstract

To provide a manufacturing method of a semiconductor component capable of suppressing a phenomenon in which an adhesive extends to the upper surface side of a semiconductor element on a side surface of the semiconductor element when the semiconductor element is arranged on a support member via an adhesive layer.SOLUTION: A manufacturing method of a semiconductor component 10 including a support member 11, a semiconductor element 13 arranged on the support member 11, and an adhesive layer 15 disposed between the support member 11 and the semiconductor element 13 includes a step of forming an adhesive layer 15 while suppressing the phenomenon in which an adhesive extends to the upper surface side of the semiconductor element 13 on the side surface of the semiconductor element 13.SELECTED DRAWING: Figure 1

Description

The present invention relates to a semiconductor component and a method for manufacturing the same.

Semiconductor components used in semiconductor devices are manufactured, for example, by placing semiconductor elements on a support member via an adhesive layer (die bonding). Known adhesives for forming the adhesive layer include gold-silicon eutectic, solder, and paste-like resin compositions. Among these, paste-like resin compositions are sometimes used from the viewpoint of workability and cost. Regarding the manufacturing method of semiconductor parts using a paste-like resin composition, it is required to suppress the generation of voids in the resin composition, and various manufacturing methods are being considered (for example, , see Patent Document 1 below).

Japanese Patent Application Publication No. 2011-114301

By the way, there is a need for paste-like resin compositions to suppress the problems that tend to occur due to the paste-like composition.

The present invention provides a method for manufacturing a semiconductor component that is capable of suppressing the phenomenon in which the adhesive extends to the top surface of the semiconductor element on the side surface of the semiconductor element when the semiconductor element is placed on a support member via an adhesive layer; The present invention also aims to provide a semiconductor component obtained by the manufacturing method.

A method for manufacturing a semiconductor component according to a first embodiment of the present invention includes: a support member, a semiconductor element disposed on the support member, an adhesive layer disposed between the support member and the semiconductor element; A method for manufacturing a semiconductor component, comprising the step of forming the adhesive layer on the side surface of the semiconductor element while suppressing a phenomenon in which the adhesive extends toward the upper surface of the semiconductor element. A semiconductor component according to a second embodiment of the present invention includes a support member, a semiconductor element disposed on the support member, and an adhesive layer disposed between the support member and the semiconductor element, A phenomenon in which the adhesive extends toward the upper surface of the semiconductor element on the side surface of the semiconductor element is suppressed.

According to the present invention, when a semiconductor element is placed on a support member via an adhesive layer, it is possible to suppress the phenomenon in which the adhesive extends toward the upper surface of the semiconductor element on the side surface of the semiconductor element.

FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor component. FIG. 2 is a schematic cross-sectional view showing another example of the semiconductor component. FIG. 3 is a drawing showing the observation results of the creeping phenomenon. FIG. 4 is a drawing showing the observation results of the creeping phenomenon.

In this specification, a numerical range indicated using "~" indicates a range that includes the numerical values written before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described stepwise in this specification, the upper limit or lower limit of the numerical range of one step can be arbitrarily combined with the upper limit or lower limit of the numerical range of another step. In the numerical ranges described in this specification, the upper limit or lower limit of the numerical range may be replaced with the values shown in the examples. "A or B" may include either A or B, or may include both. The materials exemplified herein can be used alone or in combination of two or more, unless otherwise specified. In the present specification, if there are multiple substances corresponding to each component in the composition, unless otherwise specified, the usage amount of each component in the composition refers to the total amount of the multiple substances present in the composition. means. In this specification, the term "layer" includes not only a structure formed on the entire surface but also a structure formed on a part of the layer when observed in a plan view. In this specification, the term "process" is used not only to refer to an independent process, but also to include a process in which the intended effect of the process is achieved even if the process cannot be clearly distinguished from other processes. . "(Meth)acrylic" means at least one of acrylic and methacrylic corresponding thereto. The same applies to other similar expressions such as "(meth)acryloyl".

Embodiments of the present invention will be described in detail below. However, the present invention is not limited to the following embodiments, and can be implemented with various modifications within the scope of the gist.

<Semiconductor parts>
The semiconductor component according to this embodiment includes a support member, a semiconductor element disposed on the support member, and an adhesive layer disposed between the support member and the semiconductor element. In the semiconductor component according to the present embodiment, the adhesive (adhesive for forming an adhesive layer) on the side surface of the semiconductor element extends to the upper surface of the semiconductor element (in some cases, the resin composition is spread on the upper surface of the semiconductor element). This phenomenon (hereinafter referred to as "creeping") is suppressed. The method for manufacturing a semiconductor component according to the present embodiment includes a step of forming an adhesive layer while suppressing the creep-up phenomenon. The adhesive layer contains a curable adhesive (such as a resin composition) or a cured product thereof. The semiconductor element is mounted on the support member via an adhesive layer. The adhesive layer is in contact with the support member and the semiconductor element. A semiconductor device according to this embodiment includes a semiconductor component according to this embodiment.

Support members (support members for mounting semiconductor elements) include lead frames such as 42 alloy lead frames, copper lead frames, palladium PPF lead frames; glass epoxy substrates (substrates made of glass fiber reinforced epoxy resin), BT substrates (cyanate monomer and a substrate using BT resin made of its oligomer and bismaleimide). Examples of semiconductor elements include ICs, LSIs, LED chips, and the like. The thickness of the semiconductor element may be 600 μm or less, 500 μm or less, or 400 μm or less.

The semiconductor component according to this embodiment may include a sealing portion that seals part or all of the semiconductor element. Translucent resin can be used as a constituent material of the sealing part. The sealing portion may seal part or all of the support member.

The method for manufacturing a semiconductor component according to this embodiment includes an adhesive layer forming step of disposing an adhesive between a support member and a semiconductor element to form an adhesive layer. The method for manufacturing a semiconductor component according to this embodiment may include, after the adhesive layer forming step, a step of curing the adhesive layer (thermally curing or the like) to obtain a cured product. The method for manufacturing a semiconductor component according to this embodiment may include a wire bonding step of wire bonding the semiconductor element after the adhesive layer forming step. The method for manufacturing a semiconductor component according to this embodiment may include a step of sealing the semiconductor element after the adhesive layer forming step.

To adhere a semiconductor element to a support member using an adhesive, for example, first, the adhesive is applied onto the support member by a dispensing method, a screen printing method, a stamping method, etc., and then the semiconductor element is pressure-bonded, and then, This can be done by heating and curing the adhesive using a heating device (oven, heat block, etc.). Further, after the wire bonding process, the semiconductor element can be sealed by a conventional method.

The heat curing conditions for the adhesive differ depending on whether the adhesive is cured quickly at a high temperature or cured for a long time at a low temperature. For example, in the case of rapid curing at high temperatures, heat curing of the adhesive can be carried out at 150 to 220°C (preferably 180 to 200°C) for 30 seconds to 2 hours (preferably 1 hour to 1 hour and 30 minutes). can.

FIG. 1 is a schematic cross-sectional view showing an example of a semiconductor component according to this embodiment. As shown in FIG. 1, the semiconductor component 10 includes a support member 11, a semiconductor element 13, an adhesive layer 15, and a sealing part 17. The adhesive layer 15 is disposed between the support member 11 and the semiconductor element 13, and includes the adhesive according to this embodiment or a cured product thereof. The sealing portion 17 seals the support member 11, the semiconductor element 13, and the adhesive layer 15. Semiconductor element 13 is connected to lead frame 19b via wire 19a.

FIG. 2 is a schematic cross-sectional view showing another example of the semiconductor component according to this embodiment. As shown in FIG. 2, the semiconductor component 20 includes a support member 21, a semiconductor element (LED chip) 23, an adhesive layer 25, and a sealing part 27. The support member 21 includes a substrate 21a and a lead frame 21b formed to surround the substrate 21a. The adhesive layer 25 is disposed between the support member 21 and the semiconductor element 23, and includes the adhesive according to the present embodiment or a cured product thereof. The sealing portion 27 seals the semiconductor element 23 and the adhesive layer 25. The semiconductor element 23 is connected to the lead frame 21b via wires 29.

Hereinafter, an example of a resin composition that is an adhesive that can be used to form an adhesive layer will be described.

<Resin composition and cured product>
The resin composition according to this embodiment can be used as a resin composition for bonding a semiconductor element to a support member. The resin composition according to the present embodiment is, for example, a curable (eg, thermosetting) composition. The resin composition according to this embodiment can be used as a paste-like resin composition. The cured product according to this embodiment is a cured product of the resin composition according to this embodiment.

The resin composition according to the present embodiment is selected from the group consisting of a fatty acid and a polymer compound having a polyoxyalkylene group (hereinafter referred to as a "polyoxyalkylene compound" in some cases, excluding compounds corresponding to fatty acids). It can contain at least one type. Fatty acids and polyoxyalkylene compounds can be used as dispersants.

According to this embodiment, the adhesive layer includes a support member, a semiconductor element disposed on the support member, and an adhesive layer disposed between the support member and the semiconductor element, and the adhesive layer includes a fatty acid and a polyester. It is possible to provide a semiconductor component containing a resin composition or a cured product thereof containing at least one selected from the group consisting of oxyalkylene compounds. Further, according to the present embodiment, the step of forming an adhesive layer by disposing a resin composition containing at least one selected from the group consisting of fatty acids and polyoxyalkylene compounds between the support member and the semiconductor element is performed. A method for manufacturing a semiconductor component can be provided.

By the way, as semiconductor components become more sophisticated, smaller, lighter, and thinner, semiconductor elements are becoming thinner. ) A problem occurs when the pad portion of the semiconductor element is electrically connected to the outside by wire bonding after forming an adhesive layer between the semiconductor element and the semiconductor element. According to the findings of the present inventors, it is presumed that the creeping phenomenon caused by capillarity or the like is the cause of the above-mentioned problem. On the other hand, when the resin composition contains at least one selected from the group consisting of fatty acids and polyoxyalkylene compounds, the creeping-up phenomenon can be easily suppressed. Since fatty acids and polyoxyalkylene compounds have a high affinity for metal particles and resin components, the use of fatty acids or polyoxyalkylene compounds improves the dispersibility of metal particles into resin components, thereby suppressing the creeping phenomenon. It is presumed that it can be done.

As the fatty acid, at least one of saturated fatty acids and unsaturated fatty acids can be used. The number of carbon atoms in the fatty acid is preferably 6 or more, more preferably 9 or more, and even more preferably 12 or more, from the viewpoint of easily suppressing the creeping phenomenon. The number of carbon atoms in the fatty acid may be 15 or more, or 18 or more. The number of carbon atoms in the fatty acid is preferably 24 or less, more preferably 21 or less, and even more preferably 18 or less, from the viewpoint of easily suppressing the creeping phenomenon. The number of carbon atoms in the fatty acid may be 15 or less, or 12 or less. The fatty acid preferably contains at least one selected from the group consisting of oleic acid, stearic acid, and lauric acid from the viewpoint of easily suppressing the creeping phenomenon.

The polyoxyalkylene compound may be a polymeric amine compound. As the polyoxyalkylene compound, the product name "Esleem AD-374M" manufactured by NOF Corporation can be used.

The content of the fatty acid and/or polyoxyalkylene compound is preferably in the following range based on the total amount of the resin composition (total amount of solid content; the same applies hereinafter). The content of the fatty acid and/or polyoxyalkylene compound is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more, from the viewpoint of easily suppressing the creeping phenomenon. It is preferably 0.7% by mass or more, particularly preferably 0.9% by mass or more, and extremely preferably 0.9% by mass or more. The content of the fatty acid and/or polyoxyalkylene compound is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 2% by mass or less, from the viewpoint of easily ensuring sufficient curability of the resin composition. , 1.5% by mass or less is particularly preferred, 1.1% by mass or less is extremely preferred, and 1% by mass or less is extremely preferred. From these viewpoints, the content of the fatty acid and/or polyoxyalkylene compound is preferably 0.1 to 5% by mass.

The resin composition according to the present embodiment can contain metal particles (particles containing metal, for example, metal powder) and/or a thermosetting component.

The metal particles may include first particles containing aluminum (hereinafter sometimes referred to as "aluminum particles"; for example, aluminum powder). Aluminum particles are inexpensive and have excellent electrical conductivity, thermal conductivity, and the like. By using aluminum particles, the electrical conductivity and thermal conductivity of the resin composition can be increased without using silver particles or while reducing the amount of silver particles used. Examples of the shape of the aluminum particles include scale-like, spherical, lump-like, dendritic, plate-like, and the like.

The content of aluminum in at least one aluminum particle is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, particularly preferably 98% by mass or more, and extremely preferably 99% by mass or more. . The at least one aluminum particle may be in an embodiment consisting essentially of aluminum (substantially 100% by weight of the particle is aluminum).

The metal particles may include second particles containing a metal other than aluminum (excluding particles containing aluminum). The shapes of the second particles include scaly, spherical, lumpy, dendritic, plate-like, etc., but since the second particles easily come into contact with each other, it is easy to obtain excellent electrical conductivity and thermal conductivity. From this point of view, scaly shapes are preferred.

Examples of metals other than aluminum in the second particles include silver, gold, copper, nickel, iron, stainless steel, and the like. The second particles may include particles containing silver (hereinafter referred to as "silver particles" in some cases, for example, silver powder) from the viewpoint of easily obtaining excellent electrical conductivity, thermal conductivity, oxidation resistance, and dispersibility. preferable.

The content of silver in at least one silver particle is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, particularly preferably 98% by mass or more, and extremely preferably 99% by mass or more. . At least one silver particle may be in an embodiment consisting essentially of silver (substantially 100% by weight of the particle is silver).

The average particle diameter of the aluminum particles is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more, from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. The average particle size of the aluminum particles is determined from the viewpoint of obtaining excellent wetting and spreading properties of the resin composition and suppressing tilting of the semiconductor element when mounting the semiconductor element on a support member using the resin composition. From the viewpoint of ease of formation, the thickness is preferably 6 μm or less, more preferably 5 μm or less, and even more preferably 4 μm or less. From these viewpoints, the average particle size of the aluminum particles is preferably 1 to 6 μm.

The average particle size of the silver particles is preferably in the following range from the viewpoint of making it difficult for the silver particles in the resin composition to settle. The average particle diameter of the silver particles is preferably 1 μm or more, more preferably 1.5 μm or more, and even more preferably 2 μm or more. The average particle diameter of the silver particles is preferably 15 μm or less, more preferably 10 μm or less, even more preferably 6 μm or less, particularly preferably 5 μm or less, extremely preferably 4 μm or less, and very preferably 3 μm or less. From these viewpoints, the average particle size of the silver particles is preferably 1 to 15 μm.

The average particle size of the metal particles can be determined as a median diameter using a particle size distribution measuring device (for example, Microtrac X100, manufactured by Microtrac Bell Co., Ltd.) using a laser light diffraction method. The "median diameter" indicates the value of the particle diameter (D50) at which the cumulative rate in the number-based particle size distribution is 50%.

The content of aluminum particles is preferably in the following range based on the total amount of metal particles. The content of aluminum particles is preferably 10% by mass or more, more preferably 20% by mass or more, even more preferably 25% by mass or more, and 30% by mass or more, from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. Particularly preferred is 35% by mass or more, extremely preferably 40% by mass or more. The content of aluminum particles is 100% by mass or less, preferably less than 100% by mass, more preferably 90% by mass or less, even more preferably 80% by mass or less, and 70% by mass from the viewpoint of easily obtaining excellent adhesive strength. The following is particularly preferred, 60% by mass or less is extremely preferred, and 50% by mass or less is extremely preferred. From these viewpoints, the content of aluminum particles is preferably 10 to 100% by mass.

The content of the second particles is preferably in the following range based on the total amount of metal particles. The content of the second particles is preferably more than 0% by mass, more preferably 10% by mass or more, even more preferably 20% by mass or more, and even more preferably 30% by mass or more, from the viewpoint of easily obtaining excellent electrical conductivity. Particularly preferred is 40% by mass or more, extremely preferably 50% by mass or more. The content of the second particles is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength and easily reducing viscosity. , is particularly preferably 70% by weight or less, very preferably 65% by weight or less, and very preferably 60% by weight or less. From these viewpoints, the content of the second particles is preferably more than 0% by mass and 90% by mass or less.

The content of silver particles is preferably in the following range based on the total amount of metal particles. From the viewpoint of easily obtaining excellent electrical conductivity, the content of silver particles is preferably more than 0% by mass, more preferably 10% by mass or more, even more preferably 20% by mass or more, and particularly preferably 30% by mass or more. , 40% by mass or more is extremely preferred, and 50% by mass or more is very preferred. The content of silver particles is preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength and easily reducing viscosity. It is particularly preferably up to 65% by weight, very preferably up to 60% by weight. From these viewpoints, the content of silver particles is preferably more than 0% by mass and 90% by mass or less.

The content of aluminum particles is preferably in the following range based on the total amount of the resin composition. The content of aluminum particles is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, and even more preferably 15% by mass or more, from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. Particularly preferred is 20% by mass or more, extremely preferably 25% by mass or more. The content of aluminum particles is preferably 70% by mass or less, more preferably 60% by mass or less, even more preferably 50% by mass or less, particularly preferably 42% by mass or less, and 40% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength. % or less, very preferably 35% by weight or less, and even more preferably 30% by weight or less. From these viewpoints, the content of aluminum particles is preferably 1 to 70% by mass.

The content of the second particles is preferably in the following range based on the total amount of the resin composition. The content of the second particles is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, and 20% by mass from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. Particularly preferred is above, extremely preferably 30% by mass or more, and very preferably 35% by mass or more. The content of the second particles is preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 55% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength and easily reducing viscosity. , 50% by mass or less is particularly preferred, 45% by mass or less is extremely preferred, and 40% by mass or less is extremely preferred. From these viewpoints, the content of the second particles is preferably 1 to 70% by mass.

The content of silver particles is preferably in the following range based on the total amount of the resin composition. The content of silver particles is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, and even more preferably 20% by mass or more, from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. Particularly preferred is 30% by mass or more, extremely preferably 35% by mass or more. The content of silver particles is preferably 70% by mass or less, more preferably 60% by mass or less, even more preferably 55% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength and easily reducing viscosity. It is particularly preferably up to 45% by weight, very preferably up to 40% by weight. From these viewpoints, the content of silver particles is preferably 1 to 70% by mass.

The mass ratio of the content of aluminum particles to the content of second particles (content of aluminum particles/content of second particles) is preferably in the following range. From the viewpoint of easily obtaining excellent workability, the mass ratio is preferably 0.3 or more, more preferably 0.5 or more, even more preferably more than 0.5, particularly preferably 0.6 or more, and 0.5 or more. 7 or more is extremely preferred, and 0.75 or more is very preferred. From the viewpoint of easily obtaining excellent workability, the mass ratio is preferably 2.5 or less, more preferably 2.3 or less, even more preferably 2 or less, particularly preferably 1.5 or less, extremely preferably 1 or less, It is very preferably less than 1, even more preferably 0.95 or less, even more preferably 0.9 or less, particularly preferably 0.85 or less, and extremely preferably 0.8 or less. From these viewpoints, the mass ratio is preferably 0.3 to 2.5, more preferably 0.3 to 2.3.

The mass ratio of the aluminum particle content to the silver particle content (aluminum particle content/silver particle content) is preferably in the following range. From the viewpoint of easily obtaining excellent workability, the mass ratio is preferably 0.3 or more, more preferably 0.5 or more, even more preferably more than 0.5, particularly preferably 0.6 or more, and 0.5 or more. 7 or more is extremely preferred, and 0.75 or more is very preferred. From the viewpoint of easily obtaining excellent workability, the mass ratio is preferably 2.5 or less, more preferably 2.3 or less, even more preferably 2 or less, particularly preferably 1.5 or less, extremely preferably 1 or less, It is very preferably less than 1, even more preferably 0.95 or less, even more preferably 0.9 or less, particularly preferably 0.85 or less, and extremely preferably 0.8 or less. From these viewpoints, the mass ratio is preferably 0.3 to 2.5, more preferably 0.3 to 2.3.

The content of metal particles (total amount of aluminum particles and second particles) is preferably in the following range based on the total amount of the resin composition. The content of metal particles is preferably 2% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and 40% by mass or more, from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. Particularly preferred is 50% by mass or more, extremely preferably 60% by mass or more, even more preferably 65% by mass or more. The content of metal particles is preferably less than 100% by mass, more preferably 90% by mass or less, even more preferably 85% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength and easily reducing viscosity. It is particularly preferably up to 75% by weight, very preferably up to 70% by weight. From these viewpoints, the content of metal particles is preferably 2% by mass or more and less than 100% by mass.

Thermosetting components include compounds with (meth)acryloyl groups (hereinafter referred to as "(meth)acrylic compounds" in some cases), thermosetting resins (excluding compounds that fall under (meth)acrylic compounds), and polymerization initiators. and hardening accelerators.

The thermosetting component preferably contains a (meth)acrylic compound from the viewpoint of easily suppressing separation of metal particles and other components (resin components, etc.) during flow of the resin composition. The (meth)acrylic compound is a (meth)acrylic ester having one or more (meth)acryloyloxy groups from the viewpoint of further suppressing separation of metal particles and other components (resin components, etc.). It is preferable to include. The (meth)acrylic acid ester is a compound represented by the following general formula (C1), a compound represented by the following general formula (C2), from the viewpoint of further suppressing separation of metal particles and other components (resin components, etc.). A compound represented by the following general formula (C3), a compound represented by the following general formula (C4), a compound represented by the following general formula (C5), a compound represented by the following general formula (C6) , a compound represented by the following general formula (C7), a compound represented by the following general formula (C8), a compound represented by the following general formula (C9), and a compound represented by the following general formula (C10). It is preferable that at least one kind selected from the group consisting of the following compounds is included.

［式中、Ｒ^１ａは水素原子又はメチル基を表し、Ｒ^１ｂは炭素数１～１００（好ましくは、炭素数１～３６の２価の脂肪族基、又は、環状構造を有する炭化水素基）を表す。］

[In the formula, R ^1a represents a hydrogen atom or a methyl group, and R ^1b is a divalent aliphatic group having 1 to 100 carbon atoms (preferably a divalent aliphatic group having 1 to 36 carbon atoms, or a hydrocarbon group having a cyclic structure) represents. ]

［式中、Ｒ^２ａは水素原子又はメチル基を表し、Ｒ^２ｂは炭素数１～１００（好ましくは、炭素数１～３６の２価の脂肪族基、又は、環状構造を有する炭化水素基）を表す。］

[In the formula, R ^2a represents a hydrogen atom or a methyl group, and R ^2b is a divalent aliphatic group having 1 to 100 carbon atoms (preferably a divalent aliphatic group having 1 to 36 carbon atoms or a hydrocarbon group having a cyclic structure) represents. ]

［式中、Ｒ^３ａは水素原子又はメチル基を表し、Ｒ^３ｂは水素原子、メチル基又はフェノキシメチル基を表し、Ｒ^３ｃは水素原子、炭素数１～６のアルキル基、フェニル基又はベンゾイル基を表し、ｎ３は１～５０の整数を表す。］

[In the formula, R ^3a represents a hydrogen atom or a methyl group, R ^3b represents a hydrogen atom, a methyl group, or a phenoxymethyl group, and R ^3c represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a phenyl group, or a benzoyl group. , and n3 represents an integer from 1 to 50. ]

［式中、Ｒ^４ａは、水素原子又はメチル基を表し、Ｒ^４ｂは、フェニル基、シアノ基、－Ｓｉ（ＯＲ^４ｃ）_３（Ｒ^４ｃは炭素数１～６のアルキル基を表す）、又は、下記式で表される１価の基を表し、ｎ４は０～３の整数を表す。］

[In the formula, R ^4a represents a hydrogen atom or a methyl group, and R ^4b represents a phenyl group, a cyano group, -Si(OR ^4c ) ₃ (R ^4c represents an alkyl group having 1 to 6 carbon atoms), or , represents a monovalent group represented by the following formula, and n4 represents an integer of 0 to 3. ]

［式中、Ｒ^４ｄ、Ｒ^４ｅ及びＲ^４ｆは、それぞれ独立に水素原子又は炭素数１～６のアルキル基を表し、Ｒ^４ｇは、水素原子、炭素数１～６のアルキル基、又は、フェニル基を表す。］

[In the formula, R ^4d , R ^4e and R ^4f each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ^4g is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or phenyl represents a group. ]

［式中、Ｒ^５ａ及びＲ^５ｂは、それぞれ独立に水素原子又はメチル基を表し、Ｒ^５ｃは、炭素数１～１００（好ましくは、炭素数１～３６の２価の脂肪族基、又は、環状構造を有する炭化水素基）を表す。］

[In the formula, R ^5a and R ^5b each independently represent a hydrogen atom or a methyl group, and R ^5c is a divalent aliphatic group having 1 to 100 carbon atoms (preferably 1 to 36 carbon atoms, or represents a hydrocarbon group (having a cyclic structure). ]

［式中、Ｒ^６ａ及びＲ^６ｂは、それぞれ独立に水素原子又はメチル基を表し、Ｒ^６ｃは、水素原子、メチル基又はフェノキシメチル基を表し、ｎ６は１～５０の整数を表す。但し、Ｒ^６ｃが水素原子又はメチル基であるとき、ｎ６は１ではない。］

[In the formula, R ^6a and R ^6b each independently represent a hydrogen atom or a methyl group, R ^6c represents a hydrogen atom, a methyl group, or a phenoxymethyl group, and n6 represents an integer of 1 to 50. However, when R ^6c is a hydrogen atom or a methyl group, n6 is not 1. ]

［式中、Ｒ^７ａ、Ｒ^７ｂ、Ｒ^７ｃ及びＲ^７ｄは、それぞれ独立に水素原子又はメチル基を表す。］

[In the formula, R ^7a , R ^7b , R ^7c and R ^7d each independently represent a hydrogen atom or a methyl group. ]

［式中、Ｒ^８ａ、Ｒ^８ｂ、Ｒ^８ｃ、Ｒ^８ｄ、Ｒ^８ｅ及びＲ^８ｆは、それぞれ独立に水素原子又はメチル基を表し、ｎ８１及びｎ８２は、それぞれ独立に１～２０の整数を表す。］

[In the formula, R ^8a , R ^8b , R ^8c , R ^8d , R ^8e and R ^8f each independently represent a hydrogen atom or a methyl group, and n81 and n82 each independently represent an integer from 1 to 20. ]

［式中、Ｒ^９ａ、Ｒ^９ｂ、Ｒ^９ｃ、Ｒ^９ｄ、Ｒ^９ｅ及びＲ^９ｆは、それぞれ独立に水素原子又はメチル基を表し、ｎ９は１～２０の整数を表す。］

[In the formula, R ^9a , R ^9b , R ^9c , R ^9d , R ^9e and R ^9f each independently represent a hydrogen atom or a methyl group, and n9 represents an integer of 1 to 20. ]

［式中、Ｒ^１０ａ及びＲ^１０ｂは、それぞれ独立に水素原子又はメチル基を表し、ｒ、ｓ、ｔ及びｕは、それぞれ独立に、繰り返し数の平均値を示す０以上の数であり、ｒ＋ｔは０．１以上（好ましくは０．３～５）であり、ｓ＋ｕは１以上（好ましくは１～１００）である。］

[In the formula, R ^10a and R ^10b each independently represent a hydrogen atom or a methyl group, r, s, t and u each independently represent a number of 0 or more indicating the average number of repeats, r + t is 0.1 or more (preferably 0.3 to 5), and s+u is 1 or more (preferably 1 to 100). ]

Examples of the compound represented by formula (C1) include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate. Acrylate, t-butyl (meth)acrylate, amyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl ( meth)acrylate, decyl(meth)acrylate, isodecyl(meth)acrylate, lauryl(meth)acrylate, tridecyl(meth)acrylate, hexadecyl(meth)acrylate, stearyl(meth)acrylate, isostearyl(meth)acrylate, cyclohexyl(meth)acrylate ) acrylate, isobornyl (meth)acrylate, tricyclo[5.2.1.0 ^2,6 ]decyl (meth)acrylate, 2-(tricyclo)[5.2.1.0 ^2,6 ]dec-3-ene -8 or 9-yloxyethyl (meth)acrylate and the like. As the compound represented by formula (C1), ethyl (meth)acrylate is preferable.

Examples of the compound represented by formula (C2) include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, dimer diol mono(meth)acrylate, and the like.

Examples of the compound represented by formula (C3) include diethylene glycol mono(meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, 2-methoxyethyl(meth)acrylate, and 2-ethoxyethyl(meth)acrylate. ) acrylate, 2-butoxyethyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, 2-phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate , 2-benzoyloxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, and the like. As the compound represented by formula (C3), 2-phenoxyethyl (meth)acrylate is preferred.

Examples of the compound represented by formula (C4) include benzyl (meth)acrylate, 2-cyanoethyl (meth)acrylate, glycidyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, tetrahydropyranyl (meth)acrylate, dimethylamino Ethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 1,2,2,6,6-pentamethylpiperidinyl (meth)acrylate, 2,2,6,6-tetramethylpiperidinyl (meth)acrylate , (meth)acryloyloxyethyl phosphate, (meth)acryloxyethyl phenyl acid phosphate, β-(meth)acryloyloxyethyl hydrogen phthalate, β-(meth)acryloyloxyethyl hydrogen succinate, dicyclopentenyloxyethyl ( Examples include meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and the like. As the compound represented by formula (C4), dicyclopentenyloxyethyl (meth)acrylate is preferred from the viewpoint of further suppressing separation of metal particles and other components (resin components, etc.).

Examples of the compound represented by formula (C5) include ethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and 1,9-nonanediol. Examples include di(meth)acrylate, 1,3-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dimer diol di(meth)acrylate, dimethyloltricyclodecane di(meth)acrylate, and the like. As the compound represented by formula (C5), neopentyl glycol di(meth)acrylate is preferable.

Examples of the compound represented by formula (C6) include diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and tripropylene glycol di(meth)acrylate. Examples include meth)acrylate, polypropylene glycol di(meth)acrylate, and the like. As the compound represented by formula (C6), polyethylene glycol di(meth)acrylate is preferable.

Examples of the compound represented by formula (C7) include di(meth)acrylate compounds obtained by reacting 1 mole of bisphenol A, bisphenol F, or bisphenol AD with 2 moles of glycidyl (meth)acrylate.

Examples of the compound represented by formula (C8) include di(meth)acrylate compounds of polyethylene oxide adducts of bisphenol A, bisphenol F, or bisphenol AD. Examples of bisphenol A include ethoxylated bisphenol A (for example, EO-modified bisphenol A diacrylate), hydrogenated bisphenol A, and halogenated bisphenol A.

Examples of the compound represented by formula (C9) include bis((meth)acryloxypropyl)polydimethylsiloxane, bis((meth)acryloxypropyl)methylsiloxane-dimethylsiloxane copolymer, and the like.

Examples of the compound represented by formula (C10) include reaction products obtained by reacting polybutadiene to which maleic anhydride has been added and 2-hydroxyethyl (meth)acrylate, and hydrogenated products thereof. Examples of the compound represented by formula (C10) include MM-1000-80 and MAC-1000-80 (both trade names of JX Nippon Oil & Energy Corporation).

The content of the (meth)acrylic compound is preferably in the following range based on the total amount of the resin composition. The content of the (meth)acrylic compound is preferably 1% by mass or more, more preferably 3% by mass or more, even more preferably 5% by mass or more, particularly preferably 10% by mass or more, from the viewpoint of easily obtaining excellent adhesive strength. , 15% by mass or more is extremely preferred, and 20% by mass or more is very preferred. The content of the (meth)acrylic compound is preferably 50% by mass or less, more preferably 45% by mass or less, still more preferably 40% by mass or less, and 35% by mass or less, from the viewpoint of easily obtaining excellent electrical conductivity and thermal conductivity. % or less, particularly preferably 30% by weight or less, and very preferably 25% by weight or less. From these viewpoints, the content of the (meth)acrylic compound is preferably 1 to 50% by mass.

Thermosetting resins can be used as binder resins. Examples of the thermosetting resin include epoxy resin, silicone resin, and urethane resin. The thermosetting component preferably contains an epoxy resin from the viewpoint of easily obtaining excellent adhesive strength and from the viewpoint of further suppressing separation of the metal particles and other components (resin components, etc.).

The epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. Such epoxy resins include bisphenol A epoxy resins (for example, AER-X8501 (Asahi Kasei Corporation, trade name), R-301 (Mitsubishi Chemical Corporation, trade name), YL-980 (Mitsubishi Chemical Corporation, trade name), (trade name)), bisphenol F-type epoxy resin (e.g. YDF-170 (Toto Kasei Co., Ltd., trade name)), bisphenol AD-type epoxy resin (for example, R-1710 (Mitsui Chemicals Co., Ltd., trade name)), phenol Novolak-type epoxy resins (e.g., N-730S (DIC Corporation, trade name), Quatrex-2010 (Dow Chemical Company, trade name)), cresol novolac-type epoxy resins (for example, N-665-EXP (DIC Corporation, trade name)) , trade name), YDCN-702S (Toto Kasei Co., Ltd., trade name), EOCN-100 (Nippon Kayaku Co., Ltd., trade name)), polyfunctional epoxy resins (e.g., EPPN-501 (Nippon Kayaku Co., Ltd., trade name) (trade name), TACTIX-742 (Dow Chemical Co., trade name), VG-3010 (Mitsui Chemicals Co., Ltd., trade name), 1032S (Mitsubishi Chemical Co., Ltd., trade name)), epoxy resins with a naphthalene skeleton (e.g. , HP-4032 (DIC Corporation, trade name)), alicyclic epoxy resins (for example, CEL-3000 (Daicel Corporation, trade name)), epoxidized polybutadiene (for example, PB-3600 (Daicel Corporation, trade name)) name), E-1000-6.5 (JX Nippon Oil & Energy Corporation, trade name)), amine-type epoxy resins (e.g., ELM-100 (Sumitomo Chemical Co., Ltd., trade name), YH-434L (Toto Kasei Co., Ltd., trade name)), Co., Ltd. (trade name)), resorcin type epoxy resins (e.g. Denacol EX-201 (Nagase ChemteX Co., Ltd., trade name)), neopentyl glycol type epoxy resins (e.g. Denacol EX-211 (Nagase ChemteX Co., Ltd., trade name)) , trade name)), 1,6-hexanediol diglycidyl ether type epoxy resin (e.g. Denacol EX-212 (Nagase ChemteX Co., Ltd., trade name)), ethylene/propylene glycol type epoxy resin (e.g. Denacol EX- 810, 811, 850, 851, 821, 830, 832, 841, 861 (Nagase ChemteX Corporation, trade name)), epoxy resins represented by the following general formula (C11) (for example, E-XL-24, E-XL-3L (Mitsui Chemicals, Inc., trade name)) and the like.

［式中、ｎ１１は０～５の整数を表す。］

[In the formula, n11 represents an integer from 0 to 5. ]

The epoxy resin preferably contains at least one selected from the group consisting of bisphenol F-type epoxy resin, epoxidized polybutadiene, phenol novolac-type epoxy resin, and cresol novolac-type epoxy resin. In this case, it is easy to obtain excellent electrical conductivity, adhesive strength, thermal conductivity, coating workability, and mechanical properties.

The epoxy resin may contain a monofunctional epoxy compound (reactive diluent), which is a compound having one epoxy group in one molecule. Such monofunctional epoxy compounds include phenylglycidyl ether (for example, PGE (trade name, Nippon Kayaku Co., Ltd.)), alkylphenol monoglycidyl ether (for example, PP-101 (trade name, Toto Kasei Co., Ltd.)), Aliphatic monoglycidyl ethers (e.g. ED-502 (ADEKA Co., Ltd., trade name)), alkylphenol monoglycidyl ethers (e.g. ED-509 (ADEKA Co., Ltd., trade name)), alkylphenol monoglycidyl ethers (e.g. YED- 122 (Mitsubishi Chemical Corporation, trade name)).

The number average molecular weight of the thermosetting resin is preferably 160 to 3,000. When the number average molecular weight of the thermosetting resin is 160 or more, excellent adhesive strength is likely to be obtained. When the number average molecular weight of the thermosetting resin is 3000 or less, good workability can be easily obtained without the viscosity of the resin composition increasing too much. The number average molecular weight can be obtained by measuring by gel permeation chromatography (GPC) under the following conditions and converting it from a calibration curve using standard polystyrene.
[GPC conditions]
Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd.)
Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd.)
Column: Gelpack GL-R420 + Gelpack GL-R430 + Gelpack GL-R430 (3 columns in total) (manufactured by Hitachi Chemical Co., Ltd., product name)
Eluent: THF
Sample concentration: 250mg/5mL
Injection volume: 50μL
Pressure: 441Pa (45kgf/cm ² )
Flow rate: 1.75mL/min

The epoxy equivalent of the epoxy resin is preferably 80 to 1000, more preferably 100 to 500. When the epoxy equivalent of the epoxy resin is 80 or more, excellent adhesive strength is likely to be obtained. When the epoxy equivalent of the epoxy resin is 1000 or less, it is easy to suppress the unreacted cured product from remaining when the resin composition is cured, so that outgassing of the cured product of the resin composition occurs due to the thermal history after curing. easy to suppress.

The content of the thermosetting resin is preferably in the following range based on the total amount of the resin composition. The content of the thermosetting resin is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 0.8% by mass or more, from the viewpoint of easily obtaining excellent adhesive strength, and 1% by mass or more. Particularly preferably % by mass or more. The content of the thermosetting resin is preferably 5% by mass or less, more preferably 3% by mass or less, from the viewpoint of suppressing the viscosity of the resin composition from increasing too much and easily obtaining good workability. It is more preferably at most 1.5% by mass, particularly preferably at most 1.5% by mass. From these viewpoints, the content of the thermosetting resin is preferably 0.1 to 5% by mass.

A polymerization initiator can be used to accelerate curing of the resin composition. The polymerization initiator preferably includes a radical polymerization initiator.

The radical polymerization initiator preferably contains a peroxide-based radical polymerization initiator from the viewpoint of easily suppressing the generation of voids during curing of the resin composition. Examples of peroxide-based radical polymerization initiators include 1,1,3,3-tetramethylperoxy 2-ethylhexanoate, 1,1-bis(t-butylperoxy)cyclohexane, and 1,1-bis( t-butylperoxy) cyclododecane, di-t-butylperoxyisophthalate, t-butyl perbenzoate, dicumyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di(t -butylperoxy)hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, cumene hydroperoxide, and the like.

The content of the polymerization initiator is preferably in the following range based on the total amount of the resin composition. The content of the polymerization initiator is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more, from the viewpoint of easily ensuring sufficient curability of the resin composition. It is preferably 0.7% by mass or more, particularly preferably 0.9% by mass or more, and extremely preferably 0.9% by mass or more. The content of the polymerization initiator is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 2% by mass or less, particularly preferably 1.5% by mass or less, from the viewpoint of easily obtaining excellent adhesive strength. , 1% by mass or less is extremely preferred. From these viewpoints, the content of the polymerization initiator is preferably 0.1 to 5% by mass.

Examples of the curing accelerator include amine compounds (excluding polyoxyalkylene compounds) and the like. The thermosetting component preferably contains an amine compound from the viewpoint of easily ensuring sufficient curability of the resin composition. Examples of the amine compound include dicyandiamide, dibasic acid dihydrazide represented by the following general formula (C12) (for example, ADH, PDH, and SDH (all trade names of Nippon Finechem Co., Ltd.)), polyamines, imidazole compounds, epoxy Microcapsule type curing agent consisting of a reaction product of a resin and an amine compound (e.g. Novacure (trade name, Asahi Kasei Corporation)), diaminodiphenylmethane, m-phenylenediamine, m-xylenediamine, diaminodiphenylsulfone, urea, urea derivatives , melamine, etc. Examples of imidazole compounds include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, etc. .

［式中、Ｒ^１２ａは、ｍ－フェニレン基、ｐ－フェニレン基等の２価の芳香族基、炭素数２～１２の直鎖又は分岐鎖のアルキレン基を表す。］

[In the formula, R ^12a represents a divalent aromatic group such as m-phenylene group or p-phenylene group, or a linear or branched alkylene group having 2 to 12 carbon atoms. ]

The content of the curing accelerator is preferably in the following range based on the total amount of the resin composition. The content of the curing accelerator is preferably 0.1% by mass or more, more preferably 0.15% by mass or more, and still more preferably 0.2% by mass or more, from the viewpoint of easily ensuring sufficient curability of the resin composition. It is preferably 0.25% by mass or more, particularly preferably 0.25% by mass or more. The content of the curing accelerator is preferably 1% by mass or less, more preferably 0.5% by mass or less, even more preferably 0.4% by mass or less, from the viewpoint of easily ensuring sufficient stability of the resin composition. Particularly preferred is 0.3% by mass or less. From these viewpoints, the content of the curing accelerator is preferably 0.1 to 1% by mass.

The resin composition according to the present embodiment can contain a plasticizing agent (excluding compounds corresponding to thermosetting components). In this case, flexibility can be imparted to the cured product of the resin composition. Examples of the softening agent include rubber compounds, thermoplastic resins (excluding rubber compounds), and the like.

The rubber compound preferably contains a butadiene rubber having a butadiene skeleton. Examples of the butadiene rubber include liquid rubbers such as epoxidized polybutadiene rubber, maleated polybutadiene, acrylonitrile butadiene rubber, carboxy-terminated acrylonitrile-butadiene rubber, amino-terminated acrylonitrile-butadiene rubber, vinyl-terminated acrylonitrile-butadiene rubber, and styrene-butadiene rubber.

The number average molecular weight of the rubber compound is preferably 500 to 10,000, more preferably 1,000 to 5,000. When the number average molecular weight of the rubber compound is 500 or more, it is easy to impart good flexibility to the cured product of the resin composition. When the number average molecular weight of the rubber compound is 10,000 or less, the viscosity of the resin composition is difficult to increase, and good workability of the resin composition is easily obtained. The number average molecular weight of the rubber compound can be measured by the same method as the number average molecular weight of the thermosetting resin.

The content of the softening agent is preferably in the following range based on the total amount of the resin composition. The content of the softening agent is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 2.5% by mass or more, and even more preferably 3% by mass or more, from the viewpoint of easily reducing warpage of the cured product. Particularly preferred. The content of the softening agent is preferably 10% by mass or less, more preferably 9% by mass or less, from the viewpoint of suppressing the viscosity of the resin composition from increasing too much and easily obtaining good workability. It is more preferably at most 4% by mass, particularly preferably at most 4% by mass. From these viewpoints, the content of the plasticizing agent is preferably 1 to 10% by mass.

The resin composition according to the present embodiment can contain other additives different from the above-mentioned components. As additives, alkoxysilanes (silane coupling agents, etc.), coupling agents (titanate coupling agents, aluminum coupling agents, zirconate coupling agents, zircoaluminate coupling agents, etc.) fall under alkoxysilanes. moisture absorbers (calcium oxide, magnesium oxide, etc.), wettability improvers (fluorosurfactants, nonionic surfactants, higher fatty acids, etc.), antifoaming agents (silicone oil, etc.), Examples include ion trapping agents (inorganic ion exchangers, etc.).

EXAMPLES Hereinafter, the present invention will be explained in more detail using Examples and Comparative Examples, but the present invention is not limited to the following Examples.

<Components of resin composition>
(fatty acid)
Oleic acid, stearic acid and lauric acid were used.

(Polyoxyalkylene compound)
Esleem AD-374M (polyalkylene glycol derivative, dispersant, manufactured by NOF Corporation, trade name)

(aluminum particles)
12-0086 (manufactured by Toyo Aluminum Co., Ltd., trade name, average particle size: 3.5 to 4.2 μm)

(Silver particles)
TC-204B (manufactured by Tokuriki Kagaku Kenkyusho Co., Ltd., trade name, average particle size: 2.0 to 4.0 μm)

((meth)acrylic compound)
FA-512AS (dicyclopentenyloxyethyl acrylate, manufactured by Hitachi Chemical Co., Ltd., trade name, compound represented by the following formula (C4-1))
SR-349 (EO modified bisphenol A diacrylate, manufactured by Sartomer, trade name, compound represented by the following formula (C8-1))

(thermosetting resin)
N-665-EXP (cresol novolac type epoxy resin, manufactured by DIC Corporation, trade name, epoxy equivalent: 198-208)

(Polymerization initiator)
Trigonox 22-70E (1,1-bis(tert-butylperoxy)cyclohexane, manufactured by Kayaku Akzo Co., Ltd., trade name)

(hardening accelerator)
Dicy (dicyandiamide, manufactured by Mitsubishi Chemical Corporation, trade name)

(flexibilizing agent)
Epolead PB-4700 (epoxidized polybutadiene, manufactured by Daicel Corporation, trade name, epoxy equivalent: 152.4-177.8, number average molecular weight: 3500)

(coupling agent)
KBM-403 (γ-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name)

<Preparation of resin composition>
After mixing each component in Table 1 (unit of blending amount: parts by mass), the mixture was kneaded using a planetary mixer (manufactured by Primix Co., Ltd., model number: T.K. HIVIS MIX 2P-06). Next, a resin composition was obtained by performing defoaming treatment for 10 minutes at 666.61 Pa (5 Torr) or less.

<Evaluation>
Approximately 6 mg of the resin composition was applied onto a copper lead frame with silver spot plating to form an adhesive layer, and then a 7 mm x 7 mm silicon chip (thickness: 400 μm) was press-bonded (die bonding) onto the adhesive layer. . Next, the temperature was raised to 180°C in an oven for 30 minutes, and then the resin composition was cured by heating at 180°C for 1 hour to obtain a cured product. Then, the presence or absence of a phenomenon in which the resin composition extended toward the upper surface of the silicon chip (creeping phenomenon) on the side surface of the silicon chip was visually confirmed. The results are shown in Table 1. 3 and 4 are photographs showing the side surfaces of silicon chips (FIG. 3(a): Example 1, FIG. 3(b): Example 2, FIG. 4(a): Example 3, FIG. b): Example 4, FIG. 4(c): Comparative Example 1. Photographs of Example 5 are omitted).

DESCRIPTION OF SYMBOLS 10, 20... Semiconductor component, 11, 21... Supporting member, 13, 23... Semiconductor element, 15, 25... Adhesive layer, 17, 27... Sealing part, 19a, 29... Wire, 19b, 21b... Lead frame, 21a...Substrate.

Claims (2)

A method for manufacturing a semiconductor component, comprising a support member, a semiconductor element disposed on the support member, and an adhesive layer disposed between the support member and the semiconductor element,
A method for manufacturing a semiconductor component, comprising the step of forming the adhesive layer on the side surface of the semiconductor element while suppressing a phenomenon in which the adhesive extends toward the upper surface of the semiconductor element. comprising a support member, a semiconductor element disposed on the support member, and an adhesive layer disposed between the support member and the semiconductor element,
A semiconductor component, wherein a phenomenon in which an adhesive extends toward an upper surface of the semiconductor element on a side surface of the semiconductor element is suppressed.

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