JP2024007418A - Photosensitive resin composition, resin film, cured product, partition wall, organic electroluminescent element, wavelength conversion layer, display, method for producing cured product, and method for manufacturing partition wall - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for manufacturing a partition wall which has good compatibility and has high uniformity of liquid repellency and/or a partition wall having high uniformity of optical density.

SOLUTION: A photosensitive resin composition contains an ethylenically unsaturated compound (A), a photopolymerization initiator (B), an alkali-soluble resin (C), and a fluorine-containing resin (D) composed of a fluorine-containing resin (D₁) having a fluorine atom percentage content of 20-60 mass% and/or a fluorine-containing resin (D₂) having a fluorine atom percentage content of more than 0 mass% and less than 20 mass%, wherein the alkali-soluble resin (C) is a bisphenol type epoxy resin having a structure represented by the following general formula (1) (in formula (1), R each independently represents a 1-3C linear or 3C branched alkyl group, a 1-3C linear perfluoroalkyl group or a hydrogen atom, and Z represents a monovalent organic group or a hydrogen atom.

SELECTED DRAWING: None

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present disclosure relates to a photosensitive resin composition, a resin film, a cured product, a partition wall, an organic electroluminescent element, a wavelength conversion layer, a display, a method for producing a cured product, and a method for producing a partition wall.

When manufacturing display elements such as organic EL displays, micro LED displays, and quantum dot displays, an inkjet method is known as a method for forming an organic layer having functions such as light emission. There are several methods for the inkjet method.Specifically, there is a method in which ink is dropped from a nozzle into the recesses of a patterned film formed on a substrate and is solidified, or a method in which ink is solidified between a lyophilic area that is a part that gets wet with ink and ink. As the liquid-repellent part, which is the part that repels liquid, a method may be used in which droplets of ink are dropped onto a patterned film formed in advance on the substrate, and the ink is applied only to the lyophilic part.

In particular, in the former method of solidifying ink dropped from a nozzle into the concave portions of a patterned film, two main methods can be employed to produce a patterned film having such unevenness. One is a photolithography method in which the surface of a photosensitive resist film coated on a substrate is exposed in a pattern to form exposed and unexposed areas, and either area is dissolved and removed using a developer. , the other is an imprint method that uses printing technology.

The convex portions of the patterned film having the formed irregularities are called banks (partition walls), and the banks act as a barrier to prevent the inks from mixing with each other when ink is dropped into the concave portions of the patterned film. In order to enhance this barrier effect, the substrate surface of the patterned film recesses is exposed, and the substrate surface is required to be lyophilic to ink, and the bank top surface is required to be lyophobic to ink. .

As a resin for forming such banks, a fluororesin is used as an ink repellent. Liquid repellency is improved by using a fluororesin.

Patent Document 1 describes a resist composition containing a fluororesin that has a monomer unit formed from a monomer represented by the following formula and has a fluorine atom content of 7 to 35% by mass. A resist composition comprising a fluororesin (A) and a photosensitive component that reacts with light with a wavelength of 100 to 600 nm, wherein the ratio of the fluororesin (A) to the total solid content of the resist composition is 0.1 to 600 nm. 30% by mass, and the photosensitive component reacts with the photoacid generator (B), the alkali-soluble resin (C) having a carboxyl group and/or a phenolic hydroxyl group, and the carboxyl group or the phenolic hydroxyl group by the action of an acid. Disclosed is a resist composition characterized by containing an acid crosslinking agent (D), which is a compound having two or more groups capable of crosslinking.
_CH2 =C(R)COOXR ^f1
(In the formula, ^R is a hydrogen atom, a methyl group, or a trifluoromethyl group, (Indicates a fluoroalkyl group.)

Patent Document 2 describes an alkyl group having 20 or less carbon atoms in which at least one of the hydrogen atoms is substituted with a fluorine atom (however, the above alkyl group is an ink repellent agent containing a polymerized unit containing a fluorine atom). ), and a polymer having a polymer unit (b2) having an ethylenic double bond, with a fluorine content of 5 to 25% by mass and a number average molecular weight of 500. Disclosed is an ink repellent having a molecular weight of at least 10,000.

Patent Document 3 describes a resist composition containing a fluororesin, which has a monomer unit formed from a monomer represented by the following formula, has an ethylenic double bond, and has a fluorine atom content. A resist composition comprising a fluorine-containing resin (A) having a content of 7 to 35% by mass and a photosensitive component that reacts with light having a wavelength of 100 to 600 nm, wherein the fluorine-containing resin (A) is 7 to 35% by mass based on the total solid content of the resist composition. The proportion of A) is 0.1 to 30% by mass, and the photosensitive components are a photoradical initiator (E) and an alkali-soluble resin having an acidic group and two or more ethylenic double bonds in one molecule. A resist composition characterized by containing (F) is disclosed.
_CH2 =C(R)COOXR ^f1
(In the formula, ^R is a hydrogen atom, a methyl group, or a trifluoromethyl group, (Indicates a fluoroalkyl group.)

Patent Document 4 discloses that a negative photosensitive resin composition containing an ink repellent having a fluorine atom contains a photocurable alkali-soluble resin or an alkali-soluble monomer (A) and a photoradical polymerization initiator (B). ), a photoacid generator (C), an acid curing agent (D), and an ink repellent agent (E) having a fluorine atom, the negative photosensitive resin composition comprising: A negative photosensitive resin composition is disclosed, wherein the content of the fluorine atoms in E) is 1 to 40% by mass, and the ink repellent (E) has an ethylenic double bond. There is.

Patent No. 4474991 Patent No. 4488098 Patent No. 4905563 Patent No. 6536578

As a result of intensive studies by the present inventors, when preparing a photosensitive resin composition by mixing a component containing an ethylenically unsaturated compound, a photopolymerization initiator, and an alkali-soluble resin with a fluororesin, each component is It has been found that there are cases where they are not sufficiently compatible, and that banks obtained from such photosensitive resin compositions with poor compatibility do not have uniform liquid repellency and/or optical density.

The present disclosure has been made in view of such circumstances. One of the objects of the present disclosure is to provide a photosensitive resin composition for producing partition walls with good compatibility and high uniformity of liquid repellency and/or partition walls with high uniformity of optical density. It is.

The present inventors conducted extensive studies in view of the above problems. As a result, the inventors discovered that the compatibility of photosensitive resin compositions can be improved by using an alkali-available resin having a predetermined structure, leading to the present disclosure.

That is, the present disclosure is as follows.

The photosensitive resin composition of the present disclosure (1) comprises an ethylenically unsaturated compound (A), a photopolymerization initiator (B), an alkali-soluble resin (C), and a fluorine atom content of 20 to 60% by mass. A photosensitive material containing a fluororesin (D ₁ ) and/or a fluororesin (D) having a fluorine atom content of more than 0% by mass and less than 20% by mass (D ₂ ). The above-mentioned alkali-soluble resin composition is characterized in that the alkali-soluble resin (C) is a bisphenol-type epoxy resin having a structure represented by the following general formula (1).

［式（１）中、Ｒは、それぞれ独立に、炭素数１～３の直鎖状若しくは炭素数３の分岐状のアルキル基、炭素数１～３の直鎖状のパーフルオロアルキル基又は水素原子を表し、Ｚは１価の有機基又は水素原子を表す。］

[In formula (1), R is each independently a linear or branched alkyl group having 1 to 3 carbon atoms, a linear perfluoroalkyl group having 1 to 3 carbon atoms, or hydrogen; represents an atom, and Z represents a monovalent organic group or a hydrogen atom. ]

In the photosensitive resin composition of the present disclosure, since the alkali-soluble resin (C) is a bisphenol-type epoxy resin having the structure represented by the above general formula (1), the photosensitive resin composition has good compatibility.

The present disclosure (2) is the photosensitive resin composition according to the present disclosure (1), which further contains a colored pigment (E).

The present disclosure (3) is the photosensitive resin composition according to the present disclosure (1) or (2), wherein the alkali-soluble resin (C) has a fluorine atom content of 10% by mass or less.

The present disclosure (4) is characterized in that the difference between the fluorine atom content of the fluororesin (D) and the fluorine atom content of the alkali-soluble resin (C) is 15 to 60% by mass. The photosensitive resin composition according to any one of (3).

The present disclosure (5) is any one of the present disclosure (1) to (4), wherein the content of the fluororesin (D) based on the total solid content of the photosensitive resin composition is 0.01 to 40% by mass. The photosensitive resin composition described in .

The present disclosure (6) provides that the content of the alkali-soluble resin (C) in the photosensitive resin composition is 1,000 parts by mass or more and 10,000 parts by mass or less based on 100 parts by mass of the fluororesin (D). A photosensitive resin composition according to any one of the present disclosure (1) to (5).

The present disclosure (7) further includes at least one selected from the group consisting of a photoradical sensitizer, a chain transfer agent, an ultraviolet absorber, and a polymerization inhibitor. The photosensitive resin composition described above.

The present disclosure (8) is a photosensitive resin composition according to any one of the present disclosure (1) to (7), which is used for forming a partition wall.

The present disclosure (9) is a resin film obtained from the photosensitive resin composition according to any one of the present disclosure (1) to (8).

The present disclosure (10) is a cured product obtained by curing the resin film described in the present disclosure (9).

The present disclosure (11) is a partition wall made of the cured product described in the present disclosure (10).

The present disclosure (12) is an organic electroluminescent device comprising the partition wall described in the present disclosure (11).

The present disclosure (13) is a wavelength conversion layer including the partition wall described in the present disclosure (11).

The present disclosure (14) is a display including the partition wall described in the present disclosure (11).

The present disclosure (15) is a method for producing a cured product, in which the photosensitive resin composition according to any one of the present disclosures (1) to (8) is coated on a substrate and then heated to form a resin film. This method of producing a cured product is characterized by comprising a film forming step of exposing the resin film to high-energy rays.

The present disclosure (16) is a method for manufacturing a partition wall, in which the photosensitive resin composition according to any one of the present disclosures (1) to (8) is coated on a substrate and then heated to form a resin film. This method of manufacturing a partition wall includes a film forming step and an exposure step of exposing the resin film to high energy rays.

By using the photosensitive resin composition of the present disclosure, it is possible to produce a cured product with high liquid repellency and/or high uniformity of optical density.

According to the present disclosure, it is possible to provide a photosensitive resin composition for producing partition walls with good compatibility and high uniformity of liquid repellency and/or partition walls with high uniformity of optical density.

The present disclosure will be described in detail below. The present disclosure is not limited to the following embodiments, and can be implemented as appropriate based on the common knowledge of those skilled in the art without departing from the spirit of the present disclosure.
Note that in this specification, "bank" and "partition wall" are synonymous, and unless otherwise noted, mean a convex portion of a patterned film having concavities and convexities in an inkjet method.

The photosensitive resin composition of the present disclosure comprises an ethylenically unsaturated compound (A), a photopolymerization initiator (B), an alkali-soluble resin (C), and a fluorine atom content of 20 to 60% by mass. A photosensitive resin composition containing a fluororesin (D ₁ ) and/or a fluororesin (D) consisting of a fluororesin (D ₂ ) having a fluorine atom content of more than 0% by mass and less than 20% by mass The alkali-soluble resin (C) is a bisphenol-type epoxy resin having a structure represented by the following general formula (1).

［式（１）中、Ｒは、それぞれ独立に、炭素数１～３の直鎖状若しくは炭素数３の分岐状のアルキル基、炭素数１～３の直鎖状のパーフルオロアルキル基又は水素原子を表し、Ｚは１価の有機基又は水素原子を表す。］

[In formula (1), R is each independently a linear or branched alkyl group having 1 to 3 carbon atoms, a linear perfluoroalkyl group having 1 to 3 carbon atoms, or hydrogen; represents an atom, and Z represents a monovalent organic group or a hydrogen atom. ]

When R is a linear alkyl group having 1 to 3 carbon atoms or a branched alkyl group having 3 carbon atoms, specific examples of R include a methyl group, an ethyl group, a propyl group, and an isopropyl group. Among them, methyl group is preferred from the viewpoint of easy availability.
Specific examples of the linear perfluoroalkyl group having 1 to 3 carbon atoms include trifluoromethyl group, pentafluoroethyl group, and heptafluoropropyl group. Among these, trifluoromethyl group is preferred from the viewpoint of easy availability.
Note that each R may have the same structure or may have a different structure.

When Z is a monovalent organic group, Z is preferably an alkyl group having 1 to 10 carbon atoms. The alkyl group having 1 to 10 carbon atoms may be linear, branched, or cyclic. At least one hydrogen atom of the alkyl group having 1 to 10 carbon atoms may be substituted with a carboxyl group or a hydroxyl group.
The carboxyl group or hydroxyl group possessed by the alkyl group having 1 to 10 carbon atoms may be reacted with an esterifying agent. Examples of the esterifying agent include acid halides, acid anhydrides, and condensing agents with acids.
When Z is a hydrogen atom, -O-Z may be reacted with an esterifying agent. As the esterifying agent, the same esterifying agents as mentioned above can be mentioned.
Examples of the acid anhydride include acrylic anhydride, methacrylic anhydride, succinic anhydride, phthalic anhydride, and 1,2,3,4-tetrahydrophthalic anhydride. By reacting with these acid anhydrides, ethylenically unsaturated bonds and carboxyl groups can be introduced into the alkali-soluble resin.
The amount of carboxyl groups or hydroxyl groups in the alkali-soluble resin to be reacted with the acid anhydride may be appropriately adjusted in consideration of the solubility in alkali necessary for the alkali-soluble resin.

In the photosensitive resin composition of the present disclosure, since the alkali-soluble resin (C) is a bisphenol-type epoxy resin having the structure represented by the above general formula (1), the photosensitive resin composition has good compatibility.

Further, when partition walls and the like are manufactured using such a photosensitive resin composition of the present disclosure, partition walls with high liquid repellency and/or high uniformity of optical density can be manufactured.
The reason why such an effect is obtained is that the photosensitive resin composition of the present disclosure has good compatibility and the fluororesin (D) is evenly mixed therein.

Each component of the photosensitive resin composition of the present disclosure will be described in detail below.

<Ethylenically unsaturated compound (A)>
Since the photosensitive resin composition of the present disclosure contains the ethylenically unsaturated compound (A), curing of the photosensitive resin composition by light irradiation is promoted, and curing can be performed in a shorter time.
Specific examples of the ethylenically unsaturated compound (A) include polyfunctional acrylates (for example, product names manufactured by Shin Nakamura Chemical Co., Ltd.: A-TMM-3, A-TMM-3L, A-TMM-3LM-N). , A-TMPT, AD-TMP), polyethylene glycol diacrylate (for example, Shin Nakamura Chemical Co., Ltd. product name: A-200, A-400, A-600), urethane acrylate (for example, Shin Nakamura Chemical Co., Ltd. product name: A-200, A-400, A-600), Product names manufactured by Co., Ltd.: UA-122P, UA-4HA, UA-6HA, UA-6LPA, UA-11003H, UA-53H, UA-4200, UA-200PA, UA-33H, UA-7100, UA-7200 ), pentaerythritol hexaacrylate (for example, product name: DPHA manufactured by Nippon Kayaku Co., Ltd.), and the like.

Preferred examples of the polyfunctional acrylate compound are listed below.

The content of the ethylenically unsaturated compound (A) may be 10 parts by mass or more and 300 parts by mass or less, when the total mass of the alkali-soluble resin (C) and fluororesin (D) is 100 parts by mass. It is preferably 50 parts by mass or more and 200 parts by mass or less.
If the content of the ethylenically unsaturated compound (A) is less than 10 parts by mass, a sufficient crosslinking effect will not be obtained, and if it exceeds 300 parts by mass, resolution and sensitivity will tend to decrease.

<Photopolymerization initiator (B)>
In the photosensitive resin composition of the present disclosure, the photopolymerization initiator (B) is not particularly limited as long as it polymerizes a monomer having a polymerizable double bond with high energy rays such as electromagnetic waves or electron beams. A known photopolymerization initiator can be used instead of a photopolymerization initiator.
As the photopolymerization initiator (B), a photoradical initiator or a photoacid initiator can be used, and these may be used alone, or a photoradical initiator and a photoacid initiator may be used in combination. , two or more types of photoradical initiators or photoacid initiators may be used in combination. Moreover, by using an additive together with a photopolymerization initiator, living polymerization can be carried out depending on the case, and known additives can be used as the additive.

As a photo radical initiator, specifically, an intramolecular cleavage type in which the bonds within the molecule are cleaved by absorption of electromagnetic waves or electron beams to generate radicals, and a hydrogen donor such as a tertiary amine or ether are used in combination. It can be classified as a hydrogen abstraction type that generates radicals by doing so, and either type may be used. Photoradical initiators other than the types listed above can also be used.

Specific examples of the photoradical initiator include benzophenone, acetophenone, diketone, acylphosphine oxide, quinone, and acyloin.

Specific examples of benzophenone include benzophenone, 4-hydroxybenzophenone, 2-benzoylbenzoic acid, 4-benzoylbenzoic acid, 4,4'-bis(dimethylamino)benzophenone, and 4,4'-bis(diethylamino)benzophenone. Examples include. Among these, 2-benzoylbenzoic acid, 4-benzoylbenzoic acid, and 4,4'-bis(diethylamino)benzophenone are preferred.

Specific examples of acetophenone include acetophenone, 2-(4-toluenesulfonyloxy)-2-phenylacetophenone, p-dimethylaminoacetophenone, 2,2'-dimethoxy-2-phenylacetophenone, p-methoxyacetophenone, -Methyl-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like. Among these, p-dimethylaminoacetophenone and p-methoxyacetophenone are preferred.

Specific examples of diketones include 4,4'-dimethoxybenzyl, methyl benzoylformate, and 9,10-phenanthrenequinone. Among these, 4,4'-dimethoxybenzyl and methyl benzoylformate are preferred.

Specific examples of the acylphosphine oxide include bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide.

Specific examples of quinones include anthraquinone, 2-ethylanthraquinone, camphorquinone, and 1,4-naphthoquinone. Among them, camphorquinone and 1,4-naphthoquinone are preferred.

Specific examples of the acyloin type include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether. Among these, benzoin and benzoin methyl ether are preferred.

As the photoradical initiator, benzophenone type, acetophenone type, and diketone type are preferable, and benzophenone type is more preferable.

Among commercially available photoradical initiators, preferred are BASF product names: Irgacure 127, Irgacure 184, Irgacure 369, Irgacure 651, Irgacure 819, Irgacure 907, Irgacure 2959, Irgacure OXE-01, Darocure 1173, Examples include Lucirin TPO. Among them, Irgacure 651 and Irgacure 369 are more preferred.

Photoacid initiators include aromatic sulfonic acid, aromatic iodonium, aromatic diazonium, aromatic ammonium, thianthrenium, thioxanthonium, (2,4-cyclopentadien-1-yl)(1- Onium consisting of a pair of at least one cation selected from the group consisting of iron (methylethylbenzene) and at least one anion selected from the group consisting of tetrafluoroborate, hexafluorophosphate, hexafluoroantimonate, and pentafluorophenylborate. It's salt.
Among these, bis[4-(diphenylsulfonio)phenyl]sulfide bishexafluorophosphate, bis[4-(diphenylsulfonio)phenyl]sulfide tetrakis(pentafluorophenyl)borate, and diphenyliodonium hexafluorophosphate are particularly preferred.

Commercially available photoacid initiators include, for example, product names manufactured by Sun-Apro Co., Ltd.: CPI-100P, CPI-110P, CPI-101A, CPI-200K, CPI-210S, and product names manufactured by Dow Chemical Japan Co., Ltd.: Cylacure Photocuring Initiator UVI-6990, Cylacure Photocuring Initiator UVI-6992, Cylacure Photocuring Initiator UVI-6976, Product name manufactured by ADEKA Co., Ltd.: ADEKA Optomer SP-150, ADEKA Optomer SP-152, ADEKA Optomer SP-170, ADEKA OPTOMER SP-172, ADEKA OPTOMER SP-300, Nippon Soda Co., Ltd. product name: CI-5102, CI-2855, Sanshin Chemical Industry Co., Ltd. product name: SUN-AID SI -60L, SunAid SI-80L, SunAid SI-100L, SunAid SI-110L, SunAid SI-180L, SunAid SI-110, SunAid SI-180, Lamberti product names: Esacure 1064, Esacure 1187, Ciba Specialty -Product name manufactured by Chemicals Co., Ltd.: Irgacure 250, etc.

The content of the photopolymerization initiator (B) in the photosensitive resin composition of the present disclosure is 0.1 parts by mass when the total mass of the alkali-soluble resin (C) and fluororesin (D) is 100 parts by mass. It is preferably 1 part or more and 30 parts by mass or less, and more preferably 1 part or more and 20 parts by mass or less. When the content of the photopolymerization initiator is less than 0.1 parts by mass, a sufficient crosslinking effect tends to be insufficient, and when it exceeds 30 parts by mass, resolution and sensitivity tend to decrease.

<Alkali-soluble resin (C)>
Since the photosensitive resin composition of the present disclosure contains the alkali-soluble resin (C) represented by the above formula (1), the photosensitive resin composition has good compatibility. Moreover, the shape of the partition wall (bank) manufactured using the photosensitive resin composition of the present disclosure can be improved.

In the photosensitive resin composition of the present disclosure, the alkali-soluble resin (C) may or may not contain fluorine atoms, but the fluorine atom content of the alkali-soluble resin (C) is 10% by mass. % or less. Furthermore, it is more preferable that the alkali-soluble resin (C) does not contain fluorine atoms or has a fluorine atom content of more than 0% by mass and 5% by mass or less.
When the alkali-soluble resin (C) contains a fluorine atom and the fluorine atom content is within the above range, the liquid repellency of the partition wall manufactured using the photosensitive resin composition of the present disclosure is improved.
Further, it is preferable that the fluorine atom content is less than 10% by mass because each component becomes sufficiently compatible with the others.
The fluorine atom content of the alkali-soluble resin (C) can be measured by the same method as the method for measuring the fluorine atom content of the fluororesin (D), which will be described later.

Examples of the alkali-soluble resin (C) include bisphenol-type epoxy resins and acid-modified epoxy acrylate resins derived from the above-mentioned epoxy resins.
Examples of bisphenol epoxy resins include bisphenol A epoxy resins having a structural unit represented by the above formula (1). The above epoxy resin may have a hydroxyl group or a polymerizable substituent such as a methacryloyl group or an acryloyl group in the side chain.
The alkali-soluble resin (C) having such structural units is characterized by containing structural units represented by the following formulas (1-1), (1-2) and (1-3). Examples include polymer compounds.
The structural units represented by formulas (1-1), (1-2), and (1-3) may be randomly copolymerized, or each structural unit may be block copolymerized.

（上記一般式（１－１）、（１－２）及び（１－３）中、ａ、ｂ及びｃはそれぞれ１以上の整数である。）

(In the above general formulas (1-1), (1-2) and (1-3), a, b and c are each an integer of 1 or more.)

In the above general formulas (1-1), (1-2) and (1-3), a+b+c is preferably from 3 to 100, and from the viewpoint of solubility in the developer, from 10 to 50. is more preferable.

The following structure can be mentioned as the terminal structure of the above-mentioned polymer compound. In addition, in the following structural formula, the wavy line represents a bond with another atomic group.

When the structural unit of any of the above formulas (1-1), (1-2), and (1-3) has a structure adjacent to the terminal of the polymer compound, the terminal bonded to the oxygen atom of the structural unit The structure of the above formula (1a) is preferable, and the structure of the terminal bonded to the carbon atom of the structural unit is preferably the above formula (1c).
Note that the structural units adjacent to the terminals of the polymer compound may be the same structural unit or may be different structural units.

From the viewpoint of ease of synthesis, the alkali-soluble resin is preferably a polymer compound in which the structure other than the terminal ends consists only of the structural unit represented by the above formula (1).
In addition, the alkali-soluble resin is a polymer whose structure other than the terminal consists of at least one type of structural unit selected from the structural units represented by the above formulas (1-1), (1-2), and (1-3). It may also be a compound.

As commercially available acid-modified epoxy acrylate resins, for example, Nippon Kayaku Co., Ltd. product names: ZAR-1035, ZAR-1494H, ZAR-2001H, ZAR-2023H, ZAR-2050H, ZAR-2051H, etc. are used. I can do it.
Among these, product names ZAR-2023H and ZAR-2050H manufactured by Nippon Kayaku Co., Ltd. are preferred.

The weight average molecular weight of the alkali-soluble resin (C) component is preferably 1,000 to 50,000 from the viewpoint of developability and resolution of the photosensitive resin composition.

The content of the alkali-soluble resin (C) in the photosensitive resin composition of the present disclosure is preferably 1,000 parts by mass or more and 10,000 parts by mass or less based on 100 parts by mass of the fluororesin (D). , more preferably 2,000 parts by mass or more and 5,000 parts by mass or less.
When the content of the alkali-soluble resin (C) is within the above range, unevenness in contact angle when forming partition walls using the photosensitive resin composition of the present disclosure is reduced.

Note that the photosensitive resin composition of the present disclosure may contain other alkali-soluble resins in addition to the alkali-soluble resin (C).
In the photosensitive resin composition of the present disclosure, the ratio of the alkali-soluble resin (C) to the total alkali-soluble resin is preferably 10.0 to 100.0 wt%, and preferably 30.0 to 100.0 wt%. is more preferably 50.0 to 100.0 wt% even more preferably.
When the content of the alkali-soluble resin (C) is within the above range, unevenness in liquid repellency of the partition walls formed using the photosensitive resin composition of the present disclosure is reduced.

<Fluororesin (D)>
In the photosensitive resin composition of the present disclosure, the fluororesin (D) is a fluororesin (D 1 ) having a fluorine atom content of 20 to 60% by mass, and/or a fluorine-containing resin (D ₁ ) having a fluorine atom content of 0% by mass. and less than 20% by mass of fluororesin (D ₂ ).
Among these, from the viewpoint of improving the liquid repellency of partition walls produced using the photosensitive resin composition of the present invention, the fluororesin (D) is a fluorine-containing resin having a fluorine atom content of 20 to 60% by mass. It is preferably made of fluororesin (D ₁ ).

In the photosensitive resin composition of the present disclosure, the fluororesin (D) may contain multiple types of fluororesins, for example, a fluororesin having a fluorine atom content of 20 to 60% by mass. (D ₁ ) and a fluororesin (D ₂ ) having a fluorine atom content of more than 0% by mass and less than 20% by mass may be included.

In this specification, the "fluorine atom content of the fluororesin (D)" refers to the molar ratio of monomers constituting the fluororesin (D) measured by NMR (nuclear magnetic resonance spectroscopy), It can be calculated from the molecular weight of the monomer constituting D), the fluorine content contained in the monomer, etc.
Here, as an example, a method for measuring the fluorine content when the fluorine-containing resin (D) is a resin consisting of 1,1-bistrifluoromethylbutadiene, 4-hydroxystyrene, and 2-(perfluorohexyl)ethyl methacrylate. Explain.
(i) First, the fluororesin (D) is subjected to NMR measurement to calculate the proportion of each composition (molar proportion).
(ii) Multiply the molecular weight (Mw) of the monomer of each composition of the fluororesin (D) by the molar ratio, and add the obtained values to determine the total value. The mass proportion (wt%) of each composition is calculated from the total value.
The molecular weight of 1,1-bistrifluoromethylbutadiene is 190, the molecular weight of 4-hydroxystyrene is 120, and the molecular weight of 2-(perfluorohexyl)ethyl methacrylate is 432.
(iii) Next, in a composition containing fluorine, the fluorine atom content in the monomer is calculated.
(iv) Calculate the value of "fluorine atom content in monomer ÷ monomer molecular weight (Mw) x mass ratio (wt%)" for each component, and add up the obtained values.
(v) Calculate "the numerical value obtained in the above (iv)"/"the total value obtained in the above (ii)" to calculate the fluorine atom content of the fluororesin (D).
Thereby, the fluorine-containing resin (D) is a fluorine-containing resin (D 1 ) with a fluorine atom content of 20 to 60% by mass, or a fluorine-containing resin (D ₁ ) with a fluorine atom content of more than 0% by mass and less than 20% by mass. It is determined whether it is a fluororesin (D ₂ ).

A preferred structure of the fluororesin (D) will be described below.
The difference between a fluororesin (D ₁ ) with a fluorine atom content of 20 to 60% by mass and a fluororesin (D ₂ ) with a fluorine atom content of more than 0% by mass and less than 20% by mass is The difference is in the fluorine atom content, and unless otherwise specified, the preferred structures are common.

In the photosensitive resin composition of the present disclosure, the fluororesin (D) may have a structure represented by the following chemical formula (2), or may have a structure represented by the following formula (3). Good too.

（式（２）中、Ｒｂは、それぞれ独立に、炭素数１～６の直鎖状、炭素数３～６の分岐鎖状若しくは炭素数３～６の環状のアルキル基又はフッ素原子を表し、該アルキル基中の任意の数の水素原子がフッ素原子で置換されている。Ｒ^２は水素原子、炭素数１～６の直鎖状、炭素数３～６の分岐鎖状又は炭素数３～６の環状のアルキル基を表す。）

(In formula (2), Rb each independently represents a linear alkyl group having 1 to 6 carbon atoms, a branched chain having 3 to 6 carbon atoms, or a cyclic alkyl group having 3 to 6 carbon atoms, or a fluorine atom, Any number of hydrogen atoms in the alkyl group are substituted with fluorine atoms. ^{R 2} is a hydrogen atom, a linear chain having 1 to 6 carbon atoms, a branched chain having 3 to 6 carbon atoms, or a branched chain having 3 to 6 carbon atoms. 6 represents a cyclic alkyl group.)

（式（３）中、Ｒｂは、それぞれ独立に、炭素数１～６の直鎖状、炭素数３～６の分岐鎖状若しくは炭素数３～６の環状のアルキル基又はフッ素原子を表し、該アルキル基中の任意の数の水素原子がフッ素原子で置換されている。Ｒ^１は、水素原子、フッ素原子又はメチル基を表す。Ｒ^２は水素原子、炭素数１～６の直鎖状、炭素数３～６の分岐鎖状又は炭素数３～６の環状のアルキル基を表す。）

(In formula (3), Rb each independently represents a linear alkyl group having 1 to 6 carbon atoms, a branched chain having 3 to 6 carbon atoms, or a cyclic alkyl group having 3 to 6 carbon atoms, or a fluorine atom, An arbitrary number of hydrogen atoms in the alkyl group are substituted with fluorine atoms.R ¹ represents a hydrogen atom, a fluorine atom, or a methyl group.R ² represents a hydrogen atom, a straight chain having 1 to 6 carbon atoms , represents a branched chain alkyl group having 3 to 6 carbon atoms or a cyclic alkyl group having 3 to 6 carbon atoms.)

In formula (3), R ¹ is preferably a hydrogen atom or a methyl group. Further, R ² is, for example, a hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, 1-methylpropyl group, 2-methylpropyl group, tert-butyl group, n- Examples include pentyl group, isopentyl group, 1,1-dimethylpropyl group, 1-methylbutyl group, 1,1-dimethylbutyl group, n-hexyl group, cyclopentyl group, cyclohexyl group, etc. Hydrogen atom, methyl group, Ethyl group, n-propyl group, and isopropyl group are preferred, and hydrogen atom and methyl group are more preferred.
Furthermore, Rb in formula (2) or formula (3) is a fluorine atom, trifluoromethyl group, difluoromethyl group, pentafluoroethyl group, 2,2,2-trifluoroethyl group, n-heptafluoropropyl group. , 2,2,3,3,3-pentafluoropropyl group, 3,3,3-trifluoropropyl group, hexafluoroisopropyl group, heptafluoroisopropyl group, n-nonafluorobutyl group, isononafluorobutyl group, A tert-nonafluorobutyl group is preferred, and a fluorine atom, trifluoromethyl group, difluoromethyl group, pentafluoroethyl group, 2,2,2-trifluoroethyl group, n-heptafluoropropyl group, 2,2,3, A 3,3-pentafluoropropyl group, a 3,3,3-trifluoropropyl group, and a hexafluoroisopropyl group are more preferred, and a fluorine atom, a difluoromethyl group, and a trifluoromethyl group are particularly preferred.

The following structures can be exemplified as preferred repeating units represented by formula (3) contained in the fluororesin (D) in the photosensitive resin composition of the present disclosure.

The content of the repeating unit represented by formula (3) in the fluororesin (D) is 5 mol% or more and 70 mol% or less, based on 100 mol% of all repeating units constituting the fluororesin (D). is preferred, more preferably 10 mol% or more and 50 mol% or less, particularly preferably 10 mol% or more and 30 mol% or less.

When the content of the repeating unit of formula (3) is more than 70 mol%, the fluororesin (D) tends to be difficult to dissolve in a solvent.

Further, in the photosensitive resin composition of the present disclosure, the fluororesin (D) may include a structure represented by the following formula (4).

In formula (4), R ³ and R ⁴ each independently represent a hydrogen atom or a methyl group.

In formula (4), W ¹ represents a divalent linking group, -O-, -OC(=O)-, -C(=O)-O-, -O-C(=O)- Represents NH-, -C(=O)-OC(=O)-NH- or -C(=O)-NH-. Among these, -OC(=O)-NH-, -C(=O)-OC(=O)-NH- or -C(=O)-NH- is preferred.

In formula (4), A ¹ represents a divalent to tetravalent linking group, which is a linear hydrocarbon group having 1 to 10 carbon atoms, a branched chain having 3 to 10 carbon atoms, or a cyclic hydrocarbon group having 3 to 10 carbon atoms. represents, and any number of hydrogen atoms in the hydrocarbon group may be substituted with a hydroxyl group or -OC(=O)-CH ₃ .

When the divalent linking group A ¹ is a linear alkylene group having 1 to 10 carbon atoms, for example, a methylene group, ethylene group, propylene group, n-butylene group, n-pentylene group, n-hexalene group. , n-heptalene group, n-octalene group, n-nonalene group, and n-decene group.

When the divalent linking group A ¹ is a branched alkylene group having 3 to 10 carbon atoms, for example, isopropylene group, isobutylene group, sec-butylene group, tert-butylene group, isopentalene group, isohexalene group, etc. can be mentioned.

When the divalent linking group A ¹ is a cyclic alkylene group having 3 to 10 carbon atoms, for example, 2-substituted cyclopropane, 2-substituted cyclobutane, 2-substituted cyclopentane, 2-substituted cyclohexane, 2-substituted Examples include cycloheptane, 2-substituted cyclooctane, 2-substituted cyclodecane, and 2-substituted 4-tert-butylcyclohexane.

When any number of hydrogen atoms in these alkylene groups are substituted with hydroxyl groups, examples of the hydroxyl-substituted alkylene groups include hydroxyethylene group, 1-hydroxy-n-propylene group, 2-hydroxy-n-propylene group. group, hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ -), 1-hydroxy-n-butylene group, 2-hydroxy-n-butylene group, hydroxy-sec-butylene group (-CH(CH ₂ OH)CH ₂ CH ₂ -), hydroxy-isobutylene group (-CH ₂ CH(CH ₂ OH)CH ₂ -), hydroxy-tert-butylene group (-C(CH ₂ OH) (CH ₃ ) CH ₂ -) etc. can be mentioned.

In addition, when an arbitrary number of hydrogen atoms in these alkylene groups are substituted with -OC(=O) _-CH3 , the hydroxyl group of the hydroxyl group-substituted alkylene group exemplified above is used as the substituted alkylene group. Those substituted with -OC(=O)-CH ₃ can be mentioned.

Among them, the divalent linking group ^A1 is a methylene group, ethylene group, propylene group, n-butylene group, isobutylene group, sec-butylene group, cyclohexyl group, 2-hydroxy-n-propylene group, hydroxy-isopropylene group. (-CH(CH ₂ OH)CH ₂ -), 2-hydroxy-n-butylene group, hydroxy-sec-butylene group (-CH(CH ₂ OH)CH2CH ₂ -) are preferred, and ethylene group, propylene group, 2 -Hydroxy-n-propylene group and hydroxy-isopropylene group (-CH(CH ₂ OH) CH ₂ -) are more preferred, and ethylene group and 2-hydroxy-n-propylene group are particularly preferred.
Examples of the trivalent linking group A ¹ include -C(CH ₂ -) ₂ CH ₃ and examples of the tetravalent linking group A ¹ include C(CH ₂ -) ₄ . .

In formula (4), Y ¹ represents a divalent linking group, and represents -O- or -NH-, and -O- is more preferable.

In general formula (4), u represents an integer of 1 to 3, and it is particularly preferable that u is 1.

In formula (4), n represents an integer of 1 to 3, and n is particularly preferably 1.
The substitution positions on the aromatic ring each independently represent the ortho position, the meta position, and the para position, with the para position being preferred.

As for the repeating unit represented by formula (4), the following structures can be exemplified as preferable ones. In addition, although the substitution position of the aromatic ring is exemplified as the para position, the substitution position may be independently the ortho position or the meta position.

The content of the repeating unit represented by formula (4) in the fluororesin (D) is 5 mol% or more and 70 mol% or less, based on 100 mol% of all repeating units constituting the fluororesin (D). is preferred, more preferably 10 mol% or more and 50 mol% or less, particularly preferably 10 mol% or more and 30 mol% or less.

When the content of the repeating unit of formula (4) is more than 70 mol%, the fluororesin (D) tends to be difficult to dissolve in a solvent.

As mentioned above, the fluororesin (D) is a copolymer containing a repeating unit represented by the above formula (3) and a repeating unit represented by the above formula (4), and a copolymer containing a repeating unit represented by the above formula (3). It may be a mixture (blend) of a repeating unit represented by the above formula (4) and another type of copolymer containing the repeating unit represented by the above formula (4). In particular, the fluororesin (D) is a fluororesin containing a repeating unit in which W ¹ in formula (4) is -OC(=O)-NH-, and a fluororesin in which W ¹ in formula (4) is -C One of the preferred embodiments of the present disclosure is that it is a mixture with a fluororesin containing a repeating unit of (=O)-NH-.

Furthermore, in the photosensitive resin composition of the present disclosure, the fluororesin (D) may include a structure represented by the following formula (5).

In formula (5), R ⁵ and R ⁶ each independently represent a hydrogen atom or a methyl group.

In formula (5), W ² represents a divalent linking group, -O-, -OC(=O)-, -C(=O)-O-, -O-C(=O)- Represents NH-, -C(=O)-OC(=O)-NH- or -C(=O)-NH-. Among these, -OC(=O)-NH-, -C(=O)-OC(=O)-NH- or -C(=O)-NH- is preferred.

In formula (5), A ² represents a divalent linking group, and represents a linear alkylene group having 1 to 10 carbon atoms, a branched chain having 3 to 10 carbon atoms, or a cyclic alkylene group having 3 to 10 carbon atoms. , any number of hydrogen atoms in the alkylene group may be substituted with a hydroxyl group or -OC(=O)-CH ₃ .

In the general formula (5), A ³ represents a divalent to tetravalent linking group, which is a straight chain having 1 to 10 carbon atoms, a branched chain having 3 to 10 carbon atoms, or a cyclic carbonized group having 3 to 10 carbon atoms. It represents a hydrogen group, and any number of hydrogen atoms in the hydrocarbon group may be substituted with a hydroxyl group or -OC(=O)-CH ₃ .

When the divalent linking groups A ² and A ³ are each independently a linear alkylene group having 1 to 10 carbon atoms, for example, a methylene group, an ethylene group, a propylene group, an n-butylene group, an n- Examples include pentylene group, n-hexalene group, n-heptalene group, n-octalene group, n-nonalene group, and n-decene group.

When the divalent linking groups A ² and A ³ are each independently a branched alkylene group having 3 to 10 carbon atoms, for example, an isopropylene group, an isobutylene group, a sec-butylene group, a tert-butylene group. , isopentalene group, isohexalene group, and the like.

When the divalent linking groups A ² and A ³ are each independently a cyclic alkylene group having 3 to 10 carbon atoms, for example, 2-substituted cyclopropane, 2-substituted cyclobutane, 2-substituted cyclopentane, 2 Examples include substituted cyclohexane, disubstituted cycloheptane, disubstituted cyclooctane, disubstituted cyclodecane, and disubstituted 4-tert-butylcyclohexane.

When an arbitrary number of hydrogen atoms in these alkylene groups are substituted with hydroxyl groups, examples of the hydroxyl-substituted alkylene groups include 1-hydroxyethylene group (-CH(OH)CH ₂ -), 2-hydroxyethylene Group (-CH ₂ CH(OH)-), 1-hydroxy-n-propylene group, 2-hydroxy-n-propylene group, hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ -), 1- Hydroxy-n-butylene group, 2-hydroxy-n-butylene group, hydroxy-sec-butylene group (-CH(CH ₂ OH)CH ₂ CH ₂ -), hydroxy-isobutylene group (-CH ₂ CH(CH ₂ OH) )CH ₂ -), hydroxy-tert-butylene group (-C(CH ₂ OH)(CH ₃ )CH ₂ -), and the like.

In addition, when an arbitrary number of hydrogen atoms in these alkylene groups are substituted with -OC(=O) _-CH3 , the hydroxyl group of the hydroxyl group-substituted alkylene group exemplified above is used as the substituted alkylene group. Those substituted with -OC(=O)-CH ₃ can be mentioned.

Among them, the divalent linking groups A ² and A ³ each independently include a methylene group, an ethylene group, a propylene group, an n-butylene group, an isobutylene group, a sec-butylene group, a cyclohexyl group, and a 1-hydroxyethylene group (- CH(OH)CH ₂ -), 2-hydroxyethylene group (-CH ₂ CH(OH)-), 2-hydroxy-n-propylene group, hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ - ), 2-hydroxy-n-butylene group, hydroxy-sec-butylene group (-CH(CH ₂ OH)CH ₂ CH ₂ -) are preferable, and ethylene group, propylene group, 1-hydroxyethylene group (-CH(OH) )CH ₂ -), 2-hydroxyethylene group (-CH ₂ CH(OH)-), 2-hydroxy-n-propylene group, hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ -) are more Ethylene group, 1-hydroxyethylene group (-CH(OH)CH ₂ -), and 2-hydroxyethylene group (-CH ₂ CH(OH)-) are particularly preferred.
Examples of the trivalent linking group A ³ include -C(CH ₂ -) ₂ CH ₃ and examples of the tetravalent linking group A ³ include C(CH ₂ -) ₄ . .

In formula (5), Y ² and Y ³ represent a divalent linking group, each independently representing -O- or -NH-, and -O- is more preferable.

In formula (5), n represents an integer of 1 to 3, and n is particularly preferably 1.

In formula (5), r represents 0 or 1. When r is 0, the part "(-C(=O)-) _r " represents a single bond.

As for the repeating unit represented by formula (5), the following structures can be exemplified as preferable ones.

The content of the repeating unit represented by formula (5) in the fluororesin (D) is 5 mol% or more and 70 mol% or less, based on 100 mol% of all repeating units constituting the fluororesin (D). is preferred, more preferably 10 mol% or more and 50 mol% or less, particularly preferably 10 mol% or more and 30 mol% or less.

When the content of the repeating unit of formula (5) is more than 70 mol%, the fluororesin (D) tends to be difficult to dissolve in a solvent. On the other hand, if the content of the repeating unit of formula (5) is less than 5 mol %, the adhesion of the fluororesin film or bank obtained from the fluororesin (D) to the substrate tends to decrease.

Although the effect of the repeating unit represented by formula (5) is not clear, the fluororesin film or bank obtained by containing the repeating unit represented by formula (5) in the fluororesin (D) It is inferred that this improves the adhesion to the substrate. However, the effects of the present disclosure are not limited to the effects described here.

The fluororesin (D) is a copolymer containing a repeating unit represented by the above formula (3) and a repeating unit represented by the above formula (5), and a repeating unit represented by the above formula (3). It may also be a mixture (blend) with another type of copolymer containing the repeating unit represented by the above formula (5). In particular, the fluororesin (D) contains a repeating unit in which W ² in formula (5) is -OC(=O)-NH-, and the fluororesin (D) contains a repeating unit in which W ² in formula (5) is -C One of the preferred embodiments of the present disclosure is that it is a mixture with a fluororesin containing a repeating unit of (=O)-NH-.

Further, in the photosensitive resin composition of the present disclosure, the fluororesin (D) may include a structure represented by the following formula (6).

In formula (6), R ⁷ represents a hydrogen atom or a methyl group.

In formula (6), R ⁸ represents a linear alkyl group having 1 to 15 carbon atoms, a branched chain having 3 to 15 carbon atoms, or a cyclic alkyl group having 3 to 15 carbon atoms, and any number in the alkyl group hydrogen atoms are substituted with fluorine atoms, and the fluorine atom content in the repeating unit is 30% by mass or more.

When R ⁸ is a linear alkyl group, specifically, a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, or a group having 10 to 14 carbon atoms. Examples include straight-chain alkyl groups in which any number of hydrogen atoms are substituted with fluorine atoms.

When R ⁸ is a linear alkyl group, the repeating unit represented by the above formula (6) is preferably a repeating unit represented by the following formula (6-1).

In formula (6-1), R ⁹ has the same meaning as R ⁷ in formula (6).

In formula (6-1), X is a hydrogen atom or a fluorine atom.

In formula (6-1), p is an integer from 1 to 4. q is an integer from 1 to 14. It is particularly preferred that p is an integer of 1 to 2, q is an integer of 2 to 8, and X is a fluorine atom.

As for the repeating unit represented by formula (6), the following structures can be exemplified as preferable ones.

The content of the repeating unit represented by formula (6) is preferably 5 mol% or more and 70 mol% or less, and 10 mol% or more and 50 mol% or less, based on 100 mol% of all repeating units constituting the fluororesin (D). It is more preferably mol% or less, and particularly preferably 10 mol% or more and 30 mol% or less.

When the content of the repeating unit of formula (6) is more than 70 mol%, the fluororesin (D) tends to be difficult to dissolve in a solvent.

Further, in the photosensitive resin composition of the present disclosure, the fluororesin (D) may include a structure represented by the following formula (7).

In formula (7), R ¹⁰ represents a hydrogen atom or a methyl group.

In formula (7), B each independently represents a hydroxyl group, a carboxyl group, -C(=O)-O-R ¹¹ (R ¹¹ is a linear chain having 1 to 15 carbon atoms, a branched chain having 3 to 15 carbon atoms) represents a cyclic alkyl group having 3 to 15 carbon atoms, an arbitrary number of hydrogen atoms in the alkyl group are substituted with fluorine atoms, and the fluorine atom content in R ¹¹ is 30% by mass or more ) or -OC(=O)-R ¹² (R ¹² represents a linear alkyl group having 1 to 6 carbon atoms, a branched chain having 3 to 6 carbon atoms, or a cyclic alkyl group having 3 to 6 carbon atoms. ) represents. Further, m represents an integer from 0 to 3.

As for the repeating unit represented by formula (7), the following structures can be exemplified as preferable ones.

The content of the repeating unit represented by formula (7) is preferably 5 mol% or more and 70 mol% or less, and 10 mol% or more and 50 mol% or less, based on 100 mol% of all repeating units constituting the fluororesin (D). It is more preferably mol% or less, and particularly preferably 20 mol% or more and 40 mol% or less.

When the content of the repeating unit of formula (7) is more than 70 mol%, the fluororesin (D) tends to be difficult to dissolve in a solvent.

In formula (7), when B is a hydroxyl group or a carboxyl group, the repeating unit represented by formula (7) has solubility in an alkaline developer. Therefore, when it is desired to impart alkaline developability to a film obtained from the fluororesin (D), the fluororesin (D) is expressed by the formula (7) where B is a hydroxyl group or a carboxyl group. Preferably, it contains a repeating unit.

Further, in the photosensitive resin composition of the present disclosure, the fluororesin (D) may include a structure represented by the following formula (8).

In formula (8), R ¹³ represents a hydrogen atom or a methyl group.

In formula (8), A ⁴ represents a divalent linking group, and represents a linear alkylene group having 1 to 10 carbon atoms, a branched chain having 3 to 10 carbon atoms, or a cyclic alkylene group having 3 to 10 carbon atoms. , any number of hydrogen atoms in the alkylene group may be substituted with a hydroxyl group or -OC(=O)-CH ₃ .

When the divalent linking group A ⁴ is a linear alkylene group having 1 to 10 carbon atoms, for example, a methylene group, ethylene group, propylene group, n-butylene group, n-pentylene group, n-hexalene group. , n-heptalene group, n-octalene group, n-nonalene group, and n-decene group.

When the divalent linking group A ⁴ is a branched alkylene group having 3 to 10 carbon atoms, for example, isopropylene group, isobutylene group, sec-butylene group, tert-butylene group, isopentalene group, isohexalene group, etc. can be mentioned.

When the divalent linking group A ⁴ is a cyclic alkylene group having 3 to 10 carbon atoms, for example, 2-substituted cyclopropane, 2-substituted cyclobutane, 2-substituted cyclopentane, 2-substituted cyclohexane, 2-substituted Examples include cycloheptane, 2-substituted cyclooctane, 2-substituted cyclodecane, and 2-substituted 4-tert-butylcyclohexane.

When an arbitrary number of hydrogen atoms in these alkylene groups are substituted with hydroxyl groups, examples of the hydroxyl-substituted alkylene groups include 1-hydroxyethylene group (-CH(OH)CH ₂ -), 2-hydroxyethylene Group (-CH ₂ CH(OH)-), 1-hydroxy-n-propylene group, 2-hydroxy-n-propylene group, hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ -), 1- Hydroxy-n-butylene group, 2-hydroxy-n-butylene group, hydroxy-sec-butylene group (-CH(CH ₂ OH)CH ₂ CH ₂ -), hydroxy-isobutylene group (-CH ₂ CH(CH ₂ OH) )CH ₂ -), hydroxy-tert-butylene group (-C(CH ₂ OH)(CH ₃ )CH ₂ -), and the like.

In addition, when an arbitrary number of hydrogen atoms in these alkylene groups are substituted with -OC(=O) _-CH3 , the hydroxyl group of the hydroxyl group-substituted alkylene group exemplified above is used as the substituted alkylene group. Those substituted with -OC(=O)-CH ₃ can be mentioned.

Among them, the divalent linking group A ⁴ is a methylene group, ethylene group, propylene group, n-butylene group, isobutylene group, sec-butylene group, cyclohexyl group, 1-hydroxyethylene group (-CH(OH)CH ₂ - ), 2-hydroxyethylene group (-CH ₂ CH(OH)-), 2-hydroxy-n-propylene group, hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ -), 2-hydroxy-n -butylene group, hydroxy-sec-butylene group (-CH(CH ₂ OH) CH ₂ CH ₂ -) is preferable, and ethylene group, propylene group, 1-hydroxyethylene group (-CH(OH)CH ₂ -), 2 -Hydroxyethylene group (-CH ₂ CH(OH)-), 2-hydroxy-n-propylene group, and hydroxy-isopropylene group (-CH(CH ₂ OH)CH ₂ -) are more preferred, and ethylene group, 1- Hydroxyethylene group (-CH(OH)CH ₂ -) and 2-hydroxyethylene group (-CH ₂ CH(OH)-) are particularly preferred.

In formula (8), Y ⁴ represents a divalent linking group, and represents -O- or -NH-, and -O- is more preferable.

In formula (8), r represents 0 or 1. When r is 0, the part "(-C(=O)-) _r " represents a single bond.

In formula (8), E ¹ represents a hydroxyl group, a carboxyl group, or an oxirane group.
When E ¹ is an oxirane group, examples thereof include ethylene oxide group, 1,2-propylene oxide group, and 1,3-propylene oxide group. Among these, an ethylene oxide group is preferred.

In formula (8), s represents 0 or 1. When s is 0, the portion "(-Y ⁴ -A ⁴ -) _s " represents a single bond. When r is 0 and s is 0, the structure is such that E ¹ is bonded to the main chain of the repeating unit.

As for the repeating unit represented by formula (8), the following structures can be exemplified as preferable ones.

In formula (8), when E ¹ is a hydroxyl group or a carboxyl group, the repeating unit represented by formula (8) provides solubility of the fluororesin (D) in an alkaline developer. Therefore, when it is desired to impart alkaline developability to a film obtained from the fluororesin (D), the fluororesin (D) is expressed by formula (8) where E ¹ is a hydroxyl group or a carboxyl group. It is preferable that the repeating unit contains repeating units.

The fluororesin (D) having a crosslinking site can be obtained by, for example, polymerizing monomers to obtain a fluororesin precursor having repeating units having the structures shown in formulas (3), (6) to (8) above, and then By reacting a fluororesin precursor with a photopolymerizable group derivative, a photopolymerizable group is introduced into the side chain of the polymer, and a repeating unit consisting of the structure shown in formulas (4) and (5) above is produced. It is possible to synthesize a fluororesin (D) having the following.
The photopolymerizable group introduced into the fluororesin precursor is preferably an acrylic group, a methacryl group, a vinyl group, or an allyl group, and more preferably an acrylic group.
When introducing an acrylic group as a photopolymerizable group, examples of the photopolymerizable group derivative include acrylic acid derivatives such as isocyanate monomers having an acrylic group and epoxy monomers having an acrylic group.
Examples of isocyanate monomers having an acrylic group include 2-isocyanatoethyl methacrylate, 2-isocyanatoethyl acrylate, 2-(2-methacryloyloxyethyloxy)ethyl isocyanate, and 1,1-(bisacryloyloxymethyl). Examples include ethyl isocyanate. Preferably it is 2-isocyanatoethyl acrylate.
Examples of the epoxy monomer having an acrylic group include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether (4HBAGE, manufactured by Mitsubishi Chemical Corporation), and the like.

A photopolymerizable group is introduced into the fluororesin precursor through an addition reaction between the hydroxyl group of the fluororesin precursor and the photopolymerizable group derivative.
The proportion of photopolymerizable groups in the fluororesin (D) is preferably 10 mol% or more and 70 mol% or less in the fluororesin (D). If the proportion of photopolymerizable groups is less than 10 mol %, the strength of the resin film and partition walls tends to decrease. If the proportion of photopolymerizable groups exceeds 70 mol%, it may become difficult to form a resin film by coating. More preferably, it is 15 mol% to 60 mol%.

In the photosensitive resin composition of the present disclosure, the molecular weight of the fluororesin (D) is a weight average molecular weight measured by gel permeation chromatography (GPC) using polystyrene as a standard material, and is preferably 1,000 or more, 1, 000,000 or less, more preferably 2,000 or more and 500,000 or less, particularly preferably 3,000 or more and 100,000 or less. If the molecular weight is less than 1,000, the strength of the fluororesin film or bank to be formed tends to decrease, and if the molecular weight is greater than 1,000,000, the solubility in solvents is insufficient, making it difficult to form a fluororesin film by coating. May be difficult to form.

The degree of dispersion (Mw/Mn) of the fluororesin (D) is preferably from 1.01 to 5.00, more preferably from 1.01 to 4.00, particularly preferably from 1.01 to 3.00.

The fluororesin (D) may be a random copolymer, an alternating copolymer, a block copolymer, or a graft copolymer. . A random copolymer is preferable from the viewpoint of dispersing each characteristic appropriately rather than locally.

Preferred embodiments of the fluororesin (D) in the photosensitive resin composition of the present disclosure are as follows.
<Aspect 1>
Contains a repeating unit represented by the following formula (3), a repeating unit represented by formula (5), a repeating unit represented by formula (6-1), and a repeating unit represented by formula (7). Fluororesin (D) Formula (3): R ¹ and R ² are hydrogen atoms, Rb are each independently a fluorine atom, difluoromethyl group or trifluoromethyl group Formula (5): R ⁵ and R ⁶ are each independently , a hydrogen atom or a methyl group, W ² is -OC(=O)-NH-, -C(=O)-OC(=O)-NH- or -C(=O)-NH-, A ² and A ³ are each independently an ethylene group, Y ² and Y ³ are -O-, n is 1, and r is 1 Formula (6-1): R ⁹ is a methyl group, p is an integer of 2, q is an integer from 4 to 8, X is a fluorine atom formula (7): R ¹⁰ is a hydrogen atom, B is a hydroxyl group or a carboxyl group, and m is 1.

<Aspect 2>
Contains a repeating unit represented by the following formula (5), a repeating unit represented by formula (6), a repeating unit represented by formula (6-1), and a repeating unit represented by formula (8). Fluororesin (D) Formula (5): R ⁵ and R ⁶ are each independently a hydrogen atom or a methyl group, W ² is -O-C(=O)-NH-, -C(=O)-O- C(=O)-NH- or -C(=O)-NH-, A ² and A ³ are each independently an ethylene group, Y ² and Y ³ are -O-, n is 1, and r is 1 formula (6): R ⁷ is a methyl group, R ⁸ is a branched perfluoroalkyl group having 3 to 15 carbon atoms Formula (6-1): R ⁹ is a methyl group, p is an integer of 2, q is 4 to 8 integer, X is a fluorine atom formula (8): R ¹³ is a methyl group, A ⁴ is an ethylene group, Y ⁴ is -O-, r is 1, s is 0 or 1, E ¹ is a hydroxyl group or a carboxyl group be.

The content of the fluororesin (D) based on the total solid content of the photosensitive resin composition of the present disclosure is preferably 0.01 to 40% by mass, more preferably 20 to 40% by mass. Within this range, the water and oil repellency and adhesion of the resin film to the substrate will be good.

In the photosensitive resin composition of the present disclosure, the difference between the fluorine atom content of the fluororesin (D) and the fluorine atom content of the alkali-soluble resin (C) ([Fluorine atom content of the fluororesin (D)] ]-[Fluorine atom content of alkali-soluble resin (C)]) is preferably 15 to 60% by mass, preferably 20 to 50% by mass, more preferably 25 to 40% by mass. preferable.
Within the above range, the compatibility of the photosensitive resin composition of the present disclosure will be better.

<Other ingredients>
The photosensitive resin composition of the present disclosure may contain a solvent, a colored pigment (E), a photoradical sensitizer, a chain transfer agent, an ultraviolet absorber, a polymerization inhibitor, etc. as other components.
Preferred embodiments of these other components are as follows.

<Solvent>
In the photosensitive resin composition of the present disclosure, the solvent is particularly limited as long as the ethylenically unsaturated compound (A), the photopolymerization initiator (B), the alkali-soluble resin (C), and the fluororesin (D) are soluble therein. Examples include methyl ethyl ketone, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone, ethyl lactate, butyl acetate, and γ-butyrolactone.

The amount of the solvent in the photosensitive resin composition of the present disclosure is 50 parts by mass or more and 2,000 parts by mass or less, when the total mass of the alkali-soluble resin (C) and fluororesin (D) is 100 parts by mass. It is preferable that the range is as follows. More preferably, it is 100 parts by mass or more and 1,000 parts by mass or less. By adjusting the amount of solvent, the thickness of the resin film to be formed can be adjusted, and within the above range, the thickness of the resin film particularly suitable for obtaining banks can be obtained.

<Colored pigment (E)>
The colored pigment (E) causes a decrease in the compatibility of the photosensitive resin composition containing the fluororesin. However, since the photosensitive resin composition of the present disclosure contains the alkali-soluble resin (C), the compatibility is sufficiently high even if the colored pigment (E) is contained.

The colored pigment (E) may be an organic pigment or an inorganic pigment, and black pigments, white pigments, and other colored pigments are preferred.

From the viewpoint of compatibility, the black pigment is preferably an organic pigment, and more preferably a benzodifuranone black pigment, a perylene black pigment, an azo black pigment, or an isomer thereof. Isomers also include tautomers. The isomer may be included as a mixture of a plurality of pigment powders, or may be included as a mixed crystal in constituting one primary particle.

Examples of benzodifuranone black pigments include pigments represented by the following general formula (9) or the following general formula (10), and the pigment represented by the following general formula (9) is classified as so-called lactam black. Corresponds to pigment.

In general formulas (9) and (10), R ¹⁴ and R ¹⁹ each independently represent a hydrogen atom, CH3, _CF3 , a fluorine atom, or a chlorine atom. R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ²⁰ , R ²¹ , R ²² and R ²³ are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 12 carbon atoms, or a C 1 to 12 Cycloalkyl group having 1 to 12 carbon atoms, alkenyl group having 1 to 12 carbon atoms, cycloalkenyl group having 1 to 12 carbon atoms, alkynyl group having 1 to 12 carbon atoms, COOH, COOR ²⁴ , COO ^- , CONH ₂ , CONHR ²⁴ , CONR ²⁴ R ²⁵ , CN, OH, ^OR24 , ^OCOR24 , _OCONH2 , ^OCONHR24 , ^OCONR24R25 , _NO2 , _NH2 , ^{NHR24 , NR24R25 , NHCOR24 , NR24COR25} , N= _CH2 , N=CHR ²⁴ , N=CR ²⁴ R ²⁵ , SH, SR ²⁴ , SOR ²⁴ , SO ₂ R ²⁴ , SO ₃ R ²⁴ , SO ₃ H, SO ₃ -, SO ₂ NH ₂ , SO ₂ NHR ¹⁹ or SO ₂ Represents NR ²⁴ R ²⁵ . R ¹⁵ and R ¹⁶ , R ¹⁶ and R ¹⁷ , R ¹⁷ and R ¹⁸ , R 20 and R ²¹ , R ²¹ and R ²² , and R ^{22 and} R ²³ are directly bonded or bonded by O, S, NH or NR ²⁴ May be combined. R ²⁴ and R ²⁵ are each independently an alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 1 to 12 carbon atoms, an alkenyl group having 1 to 12 carbon atoms, a cycloalkenyl group having 1 to 12 carbon atoms, or Represents an alkynyl group having 1 to 12 carbon atoms.

Among these, from the viewpoint of compatibility and uniformity of optical density, those in which R ¹⁴ to R ²³ are hydrogen atoms are more preferable, that is, benzodifuranone black pigments represented by the following structural formula (11) are preferably used. can.
By using the black pigment of the following structural formula (11), the concentration of the colored pigment in the photosensitive resin composition becomes uniform, and a photosensitive resin composition for producing partition walls with higher uniformity of optical density is obtained. I can do it. As the benzodifuranone black pigment represented by the following structural formula (11), commercially available products may be used, such as "Irgaphor" (registered trademark) Black S0100 manufactured by BASF.

The perylene black pigment refers to a pigment represented by the following general formula (12) or (13) and a C.I. I. Pigment Black 31, 32. It corresponds to a pigment classified as so-called perylene black. Among them, from the viewpoint of uniformity of optical density, pigments represented by the following general formula (12) or (13) are preferred.

In the general formulas (12) and (13), R ²⁶ to R ³³ each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group. Among these, from the viewpoint of uniformity of optical density, those in which R ²⁶ to R ³³ are hydrogen atoms are preferred, that is, perylene black pigments represented by the following structural formulas (14) and/or (15) are preferably used. be able to. Commercially available products may be used as the perylene black pigments (cis-trans isomer mixture) represented by the following structural formulas (14) and (15), such as FK428 manufactured by BASF.
0 is mentioned.

The azo black pigment means a pigment represented by the following general formula (16). It corresponds to a pigment classified as so-called azomethine black.

In the general formula (16), R ³⁴ represents an organic group having an isoindolinone structure or an organic group having an isoindoline structure, and R ³⁵ represents an alkyl group having 1 to 3 carbon atoms and an alkoxy group having 1 to 3 carbon atoms. represents at least one organic group selected from the group consisting of groups, and n represents an integer of 1 to 5.

The white pigment must be at least one inorganic substance selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, zirconium oxide, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate, and barium carbonate. is preferred. Since these inorganic substances have a high refractive index, it is possible to improve light reflectivity in the partition walls manufactured using the photosensitive resin composition of the present invention. Titanium oxide is more preferable from the viewpoint of particularly high refractive index and dispersibility in the photosensitive resin composition.

As other colored pigments, various organic pigments such as yellow, orange, blue, red, green, purple, and brown may be used, and a pigment dispersion containing two or more types of organic pigments may be used. Optical properties such as solubility and light-shielding properties can be controlled by adjusting the type and amount ratio of the pigments contained. In particular, from the viewpoint of compatibility and uniformity of optical density, a combination of blue, purple, and orange is preferred. Further, the pigment dispersion may contain an alkali-soluble resin, and the alkali-soluble resin may contain a bisphenol-type epoxy resin having a structure represented by the above general formula (1).

Examples of organic orange pigments include C.I. I. Pigment Orange 1, 2, 5, 13, 16, 17, 19, 20, 21, 22, 23, 24, 34, 36, 38, 39, 43, 46, 48, 49, 61, 62, 64, 65, 67, 68, 69, 70, 71, 72, 73, 74, 75, 77, 78, 79. Among these, C. I. Pigment Orange 43 is preferred.

Examples of organic blue pigments include C.I. I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 60, 64, 65, 75, 79, and 80. Among them, C. I. Pigment Blue 60 is preferred.

Examples of organic purple pigments include C.I. I. Pigment Violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, and 50. Among them, from the viewpoint of dispersibility and light blocking property, C. I. Pigment Violet 23 is preferred.

In the photosensitive resin composition of the present disclosure, the color pigment (E) is preferably 3% by mass or more and less than 70% by mass, more preferably 5% by mass or more and less than 70% by mass based on the total solid content. preferable.
By setting it as the said range, the compatibility of the photosensitive resin composition of this indication will become favorable, and the coloring of the hardened|cured material manufactured using the photosensitive resin composition of this indication will become favorable.

In the photosensitive resin composition of the present disclosure, the particle diameter D ₅₀ of the colored pigment (E) is preferably 50 to 700 nm, more preferably 200 to 500 nm, even more preferably 200 to 400 nm. .
When the particle diameter D ₅₀ of the colored pigment (E) is within the above range, variations in optical density values in the partition wall portions can be reduced in the partition walls manufactured using the photosensitive resin composition of the present invention.

Note that the photosensitive resin composition of the present disclosure does not need to contain the coloring pigment (E).

<Photoradical sensitizer>
When the photosensitive resin composition of the present disclosure contains a photoradical sensitizer, the exposure sensitivity of the photosensitive resin composition of the present disclosure can be further improved. The photoradical sensitizer is preferably a compound that absorbs light or radiation and becomes excited. When the photoradical sensitizer becomes excited, it causes electron transfer, energy transfer, heat generation, etc. when it comes into contact with the photopolymerization initiator, and as a result, the photopolymerization initiator easily decomposes and generates acid. The photoradical sensitizer may have an absorption wavelength in the range of 350 nm to 450 nm, and may include polynuclear aromatics, xanthenes, xanthones, cyanines, merocyanines, thiazines, acridines, acridones, anthraquinones, Mention may be made of squaliums, styryls, base styryls or coumarins.

Examples of polynuclear aromatics include pyrene, perylene, triphenylene, anthracene, 9,10-dibutoxyanthracene, 9,10-diethoxyanthracene, 3,7-dimethoxyanthracene, or 9,10-dipropyloxyanthracene. be able to.

Examples of xanthenes include fluorescein, eosin, erythrosin, rhodamine B, and rose bengal.
Examples of xanthones include xanthone, thioxanthone, dimethylthioxanthone, diethylthioxanthone, and isopropylthioxanthone.

Examples of cyanines include thiacarbocyanine and oxacarbocyanine.
Examples of merocyanines include merocyanine and carbomerocyanine. Examples of thiazines include thionine, methylene blue, and toluidine blue.

Examples of acridines include acridine orange, chloroflavin, and acriflavin.
Examples of acridones include acridone and 10-butyl-2-chloroacridone.

As the anthraquinones, anthraquinone can be exemplified.
Examples of squaliums include squalium. Examples of base styryls include 2-[2-[4-(dimethylamino)phenyl]ethenyl]benzoxazole.

Coumarins include 7-diethylamino 4-methylcoumarin, 7-hydroxy 4-methylcoumarin, or 2,3,6,7-tetrahydro-9-methyl-1H,5H,11H[l]benzopyrano[6,7, 8-ij] quinolidine-11-non.
These photoradical sensitizers may be used alone or in combination of two or more.

The photoradical sensitizer used in the photosensitive resin composition of the present disclosure is preferably polynuclear aromatics, acridones, styryls, base styryls, coumarins, etc., since they have a large effect of improving exposure sensitivity. or xanthone, particularly preferably xanthone. Among the xanthones, diethylthioxanthone and isopropylthioxanthone are preferred.

In the photosensitive resin composition of the present disclosure, the content of the photoradical sensitizer is preferably 0.1 parts by mass to 8 parts by mass based on 100 parts by mass of the alkali-soluble resin (C) and the fluororesin (D). and more preferably 1 part to 4 parts by weight. By setting the content of the photoradical sensitizer within the above-mentioned range, the exposure sensitivity of the photosensitive resin composition is improved, and the pattern forming film after exposure of the photosensitive resin composition of the present disclosure has a liquid-repellent portion. The boundaries of lyophilic sites become clearer, the contrast of the ink pattern after ink application improves, and a precise pattern can be obtained.

<Chain transfer agent>
The photosensitive resin composition of the present disclosure may contain a chain transfer agent as necessary.
Examples of the chain transfer agent include the same compounds that can be used in the synthesis of the above-mentioned fluororesin (D).

<Ultraviolet absorber>
The photosensitive resin composition of the present disclosure may contain an ultraviolet absorber as necessary. Examples of ultraviolet absorbers include salicylic acid-based, benzophenone-based, triazole-based, and the like.
The content of the ultraviolet absorber in the photosensitive resin composition is preferably 0.5 to 5% by mass, more preferably 1 to 3% by mass.

<Polymerization inhibitor>
The photosensitive resin composition of the present disclosure may contain a polymerization inhibitor.
Examples of polymerization inhibitors include o-cresol, m-cresol, p-cresol, 6-t-butyl-2,4-xylenol, 2,6-di-t-butyl-p-cresol, hydroquinone, catechol, and 4-cresol. t-Butylpyrocatechol, 2,5-bistetramethylbutylhydroquinone, 2,5-di-t-butylhydroquinone, p-methoxyphenol, 1,2,4-trihydroxybenzene, 1,2-benzoquinone, 1, Examples include 3-benzoquinone, 1,4-benzoquinone, leucoquinizarin, phenothiazine, 2-methoxyphenothiazine, tetraethylthiuram disulfide, 1,1-diphenyl-2-picrylhydrazyl or 1,1-diphenyl-2-picrylhydrazine. be able to.

Commercially available polymerization inhibitors include N,N'-di-2-naphthyl-p-phenylenediamine (trade name, Nonflex F) and N,N-diphenyl-p-phenylenediamine (manufactured by Seiko Kagaku Co., Ltd.). (Product name, Nonflex H), 4,4'-bis(a,a-dimethylbenzyl)diphenylamine (Product name, Nonflex DCD), 2,2'-methylene-bis(4-methyl-6-tert-butylphenol) ) (trade name, Nonflex MBP), N-(1-methylheptyl)-N'-phenyl-p-phenylenediamine (trade name, Ozonone 35), or ammonium N-nitrosophenyl hydroxy manufactured by Wako Pure Chemical Industries, Ltd. Examples include amine (trade name, Q-1300) or N-nitrosophenylhydroxyamine aluminum salt (trade name, Q-1301).

The content of the polymerization inhibitor in the total solid content of the photosensitive resin composition of the present disclosure is preferably 0.001 to 20% by mass, more preferably 0.005 to 10% by mass, and 0.01 to 5% by mass. Particularly preferred. When the content ratio is within the above range, development residues of the photosensitive resin composition are reduced and pattern linearity is good.

The photosensitive resin composition of the present disclosure may further contain various additives such as a dissolution inhibitor, a plasticizer, a stabilizer, a thickener, an adhesive, and an antioxidant, if necessary. These other additives may be known ones.

The photosensitive resin composition of the present disclosure can be used to produce the cured product of the present disclosure.
The method for producing a cured product of the present disclosure includes the steps of: (1) forming a resin film by applying the photosensitive resin composition of the present disclosure to a substrate and then heating it to form a resin film; and applying high-energy rays to the resin film. (2) exposure step of exposing.

A method for producing a cured product using the photosensitive resin composition of the present disclosure will be explained by taking as an example a method for producing partition walls made of the cured product.
The method for forming the partition wall may include (1) a film forming step, (2) an exposure step, and (3) a developing step.
Each step will be explained below.

(1) Film Forming Step First, the photosensitive resin composition of the present disclosure is applied to a substrate, and then heated to form a fluororesin film from the photosensitive resin composition.
Heating conditions are not particularly limited, but are preferably 80 to 100°C and 60 to 200 seconds.
Thereby, the solvent and the like contained in the photosensitive resin composition can be removed.
Note that the fluorine-containing resin film is also the resin film of the present disclosure.

As the substrate, a silicon wafer, metal, glass, ITO substrate, etc. can be used.
Further, an organic or inorganic film may be provided on the substrate in advance. For example, there may be an anti-reflection coating, an underlayer of multilayer resist, and a pattern may be formed thereon. Alternatively, the substrate may be cleaned in advance. For example, cleaning can be performed using ultrapure water, acetone, alcohol (methanol, ethanol, isopropyl alcohol), or the like.

As a method for applying the photosensitive resin composition of the present disclosure to a substrate, a known method such as spin coating can be used.

(2) Exposure step Next, a desired photomask is set in an exposure device, and the fluorine-containing resin film is exposed to high-energy radiation through the photomask.
The high-energy rays are preferably at least one selected from the group consisting of ultraviolet rays, gamma rays, X-rays, and alpha rays.

The exposure amount of the high energy rays is preferably 1 mJ/cm ² or more and 200 mJ/cm ² or less, more preferably 10 mJ/cm ² or more and 100 mJ/cm ² or less.

Through this step, the exposed portion of the fluororesin film is cured to become a cured product. The cured product is also the cured product of the present disclosure.

(3) Development process Next, the fluororesin film after the exposure process is developed with an alkaline aqueous solution to form a fluororesin pattern film.
That is, a fluororesin pattern film is obtained by dissolving either the exposed portion of the fluororesin film or the unexposed portion of the film in an alkaline aqueous solution.

As the alkaline aqueous solution, a tetramethylammonium hydroxide (TMAH) aqueous solution, a tetrabutylammonium hydroxide (TBAH) aqueous solution, etc. can be used. When the alkaline aqueous solution is a tetramethylammonium hydroxide (TMAH) aqueous solution, its concentration is preferably 0.1% by mass or more and 5% by mass or less, more preferably 2% by mass or more and 3% by mass or less. .

As the developing method, a known method can be used, and examples thereof include a dip method, a paddle method, a spray method, and the like.

The development time (time during which the developer contacts the fluororesin film) is preferably 10 seconds or more and 3 minutes or less, more preferably 30 seconds or more and 2 minutes or less.

After development, a step of cleaning the fluororesin pattern film using deionized water or the like may be provided, if necessary. Regarding the cleaning method and cleaning time, it is preferably 10 seconds or more and 3 minutes or less, and more preferably 30 seconds or more and 2 minutes or less.

The partition wall can be manufactured through the above steps. The partition wall is also the partition wall of the present disclosure.

A cured product (including the partition walls) produced using the photosensitive resin composition of the present disclosure has high uniformity in liquid repellency.
For example, after forming a cured product on a substrate using the <cured product formation method> described below, and heating the substrate on which the cured product has been formed at 230°C for 60 minutes, place the cured product at any 20 locations. When the contact angle of propylene glycol monomethyl ether acetate (PGMEA) is measured, the difference between the maximum value and the minimum value of the contact angle is preferably 0 to 2°, more preferably 0°.
<Method for forming cured product>
After cleaning the ITO substrate with ultrapure water and then with acetone, the substrate is subjected to UV ozone treatment for 5 minutes using a UV ozone treatment device. Next, using a spin coater, the photosensitive composition of the present disclosure was coated on the resulting UV ozone-treated substrate at a rotation speed of 400 rpm, and heated on a hot plate at 100° C. for 150 seconds to form a film with a thickness of 3 μm. Forms a cured product. Thereafter, the obtained cured product is exposed to i-rays (wavelength: 365 nm).

Moreover, the cured product (partition wall) manufactured in this way has high uniformity of optical density (OD value).
For example, after forming a cured product on a substrate using the above <method for forming a cured product> and heating the substrate on which the cured product has been formed at 230°C for 60 minutes, When the optical density of the cured product was measured with a black and white transmission densitometer (light source: halogen lamp, measurement wavelength: full wavelength range from 400 to 700 nm), the difference between the maximum and minimum OD values was 0.00. It is preferably 0.01 μm ⁻¹ , more preferably 0.00 μm ⁻¹ .

The barrier ribs produced in this way can be used as banks for organic electroluminescent devices, wavelength conversion layers or displays.
The organic electroluminescent device, wavelength conversion layer, or display provided with the partition wall of the present disclosure is also the organic electroluminescent device, wavelength conversion layer, or display of the present disclosure.
Examples of the display include an organic EL display and a quantum dot display.

Hereinafter, the present disclosure will be described in detail with reference to Examples, but the present disclosure is not limited to these Examples.

1. Method for measuring parameters of fluororesin (D) [Measurement of molar ratio of each repeating unit] The molar ratio of each repeating unit in the polymer is determined from the measured values of ¹ H-NMR, ¹⁹ F-NMR or ¹³ C-NMR. Decided.

[Measurement of molecular weight of polymer] The weight average molecular weight Mw and molecular weight dispersity (ratio of number average molecular weight Mn to weight average molecular weight Mw; Mw/Mn) of the polymer are determined by high speed gel permeation chromatography (hereinafter referred to as GPC). An ALPHA-M column and an ALPHA-2500 column (both manufactured by Tosoh Corporation) were connected in series, and tetrahydrofuran (THF) was used as the developing solvent. It was measured. A refractive index difference measurement detector was used as a detector.

2. Synthesis of fluororesin for liquid repellent [Synthesis of liquid repellent precursor 1] 1,1-bis(trifluoromethyl)-1,3-butadiene ( 2.9 g (0.015 mol) of 4-acetoxystyrene (manufactured by Central Glass Co., Ltd., hereinafter referred to as BTFBE), 3.2 g of 4-acetoxystyrene (produced by Tokyo Chemical Industry Co., Ltd., hereinafter referred to as p-AcO-St). (0.02 mol), 13.0 g (0.03 mol) of 2-(perfluorohexyl)ethyl methacrylate (produced by Tokyo Kasei Kogyo Co., Ltd., hereinafter referred to as MA-C6F), 13.0 g (0.03 mol) of hydroxyethyl methacrylate (Tokyo Kasei Kogyo Co., Ltd.) 4.6 g (0.035 mol) of company product (hereinafter referred to as HEMA) and 47.2 g of methyl ethyl ketone (hereinafter referred to as MEK) were collected, and azobis(2-methylbutyronitrile) (Tokyo Kasei Kogyo Co., Ltd.) was collected. After adding 0.84 g (0.005 mol) of product (hereinafter referred to as AIBN) and degassing while stirring, the inside of the flask was replaced with nitrogen gas, the internal temperature was raised to 79°C, and the reaction was carried out overnight. . When 200 g of n-heptane was added dropwise to the reaction system, a white precipitate was obtained. This precipitate was filtered and dried under reduced pressure at a temperature of 45° C. to obtain 20.7 g of liquid repellent precursor 1 as a white solid in a yield of 88%.

<NMR measurement results> The composition ratio of each repeating unit of liquid repellent precursor 1 is expressed as a molar ratio: repeating unit by BTFBE: repeating unit by p-AcO-St: repeating unit by MA-C6F: repeating unit by HEMA. =15:20:30:35.

<GPC measurement results>
Mw=8,900, Mw/Mn=1.5

[Synthesis of liquid repellent 1] In a 500 ml glass flask equipped with a stirrer, 20 g of liquid repellent precursor 1 (hydroxyl equivalent: 0.035 mol), 0.20 g of triethylamine (hydroxyl equivalent: 0.0021 mol), propylene glycol monomethyl ether acetate ( 60 g of 2-isocyanatoethyl acrylate (hereinafter referred to as PGMEA) and 4.9 g (hydroxyl group equivalent: 0.035 mol) of 2-isocyanatoethyl acrylate (manufactured by Showa Denko K.K., product name: Karenz AOI) were added, and the mixture was reacted at 45°C for 4 hours. Ta. After the reaction was completed, the reaction solution was concentrated, and 200 g of n-heptane was added to precipitate. This precipitate was filtered and dried under reduced pressure at 40°C to obtain 19.9 g of liquid repellent 1 as a white solid in a yield of 80%.

< ¹³ C-NMR measurement results> In liquid repellent agent 1, the amount of AOI-derived acrylic acid derivative introduced (reaction rate) and the amount of residual hydroxyl groups (unreacted rate) were 99:1 in terms of molar ratio. In addition, the composition ratio of each repeating unit that does not react with the crosslinking group site (repeat unit by BTFBE, repeat unit by p-AcO-St, repeat unit by MA-C6F) is unchanged from the liquid repellent precursor 1 used ( The same as before the introduction of the crosslinking group) was confirmed. The content of fluorine-containing atoms in the liquid repellent agent 1 was 27.6% by mass based on the repeating units. Therefore, the liquid repellent 1 is a fluororesin (D).

<GPC measurement results>
Mw=12,800, Mw/Mn=1.5

[Synthesis of liquid repellent precursor 2] 2.7 g (0.014 mol) of BTFBE and 2.3 g (0.042 mol) of p-AcO-St were placed in a 500 ml glass flask equipped with a stirrer at room temperature (approximately 20°C). , 18.2 g (0.042 mol) of MA-C6F, 3.9 g (0.03 mol) of HEMA (produced by Tokyo Chemical Industry Co., Ltd.), 54.0 g of MEK, and 0.84 g (0.005 mol) of AIBN were collected. ), and after degassing with stirring, the inside of the flask was purged with nitrogen gas, the internal temperature was raised to 79°C, and the reaction was carried out overnight. When 300 g of n-heptane was added dropwise to the reaction system, a white precipitate was obtained. This precipitate was filtered and dried under reduced pressure at a temperature of 45° C. to obtain 24.0 g of liquid repellent precursor 2 as a white solid in a yield of 89%.

<NMR measurement results> The composition ratio of each repeating unit of liquid repellent precursor 2 is expressed in molar ratio: repeating unit by BTFBE: repeating unit by p-AcO-St: repeating unit by MA-C6F: repeating unit by HEMA. =14:14:42:30.

<GPC measurement results>
Mw=9,200, Mw/Mn=1.5

[Synthesis of liquid repellent 2] In a 500 ml glass flask equipped with a stirrer, collect 20 g of liquid repellent precursor 2 (hydroxyl equivalent: 0.03 mol), 0.21 g of triethylamine (hydroxyl equivalent: 0.0021 mol), and 60 g of PGMEA. 4.26 g (hydroxyl equivalent: 0.03 mol) of AOI was added, and the mixture was reacted at 45° C. for 4 hours. After the reaction was completed, the reaction solution was concentrated, and 200 g of n-heptane was added to precipitate. This precipitate was filtered and dried under reduced pressure at 40° C. to obtain 21.6 g of liquid repellent 2 as a white solid in a yield of 90%.

< ¹³ C-NMR measurement results> In liquid repellent agent 2, the amount of AOI-derived acrylic acid derivative introduced (reaction rate) and the amount of residual hydroxyl groups (unreacted rate) were 99:1 in terms of molar ratio. In addition, the composition ratio of each repeating unit that does not react with the crosslinking group site (repeat unit by BTFBE, repeat unit by p-AcO-St, repeat unit by MA-C6F) does not change from the liquid repellent precursor 2 used ( The same as before the introduction of the crosslinking group) was confirmed. The content of fluorine-containing atoms in the liquid repellent agent 2 was 38.6% by mass based on the repeating units. Therefore, the liquid repellent 2 is a fluororesin (D).

<GPC measurement results>
Mw=13,100, Mw/Mn=1.7

[Synthesis of liquid repellent precursor 3] 2.3 g (0.012 mol) of BTFBE and 4.9 g (0.03 mol) of p-AcO-St were placed in a 500 ml glass flask equipped with a stirrer at room temperature (approximately 20°C). , 5.6 g (0.013 mol) of MA-C6F, 5.9 g (0.045 mol) of HEMA (produced by Tokyo Chemical Industry Co., Ltd.), 37.2 g of MEK, and 0.84 g (0.005 mol) of AIBN. ), and after degassing with stirring, the inside of the flask was purged with nitrogen gas, the internal temperature was raised to 79° C., and the reaction was carried out overnight. When 250 g of n-heptane was added dropwise to the reaction system, a white precipitate was obtained. This precipitate was filtered and dried under reduced pressure at a temperature of 45° C. to obtain 16.7 g of liquid repellent precursor 3 as a white solid in a yield of 90%.

<NMR measurement results> The composition ratio of each repeating unit of the liquid repellent precursor 3 is expressed as a molar ratio: repeating unit by BTFBE: repeating unit by p-AcO-St: repeating unit by MA-C6F: repeating unit by HEMA. =12:30:13:45.

<GPC measurement results>
Mw=9,800, Mw/Mn=1.5

[Synthesis of liquid repellent 3] In a 500 ml glass flask equipped with a stirrer, 16.5 g of liquid repellent precursor 3 (hydroxyl equivalent: 0.045 mol), 0.45 g of triethylamine (hydroxyl equivalent: 0.0045 mol), and 60 g of PGMEA were collected. , 6.4 g (hydroxyl equivalent: 0.045 mol) of Karenz AOI were added, and the mixture was reacted at 45° C. for 4 hours. After the reaction was completed, the reaction solution was concentrated, and 200 g of n-heptane was added to precipitate. This precipitate was filtered and dried under reduced pressure at 40°C to obtain 19.4 g of liquid repellent 3 as a white solid in a yield of 85%.

< ¹³ C-NMR measurement results> In liquid repellent agent 3, the amount of AOI-derived acrylic acid derivative introduced (reaction rate) and the amount of residual hydroxyl groups (unreacted rate) were 99:1 expressed in molar ratio. In addition, the composition ratio of each repeating unit that does not react with the crosslinking group site (repeat unit by BTFBE, repeat unit by p-AcO-St, repeat unit by MA-C6F) does not change from the liquid repellent precursor 3 used ( The same as before the introduction of the crosslinking group) was confirmed. The fluorine-containing atom content in the liquid repellent agent 3 was 18.5% by mass based on the repeating units. Therefore, the liquid repellent 3 is a fluororesin (D).

<GPC measurement results>
Mw=14,300, Mw/Mn=1.7

3. Preparation of Colored Pigment Dispersion 1 The pigment, dispersant, alkali-soluble resin, and solvent listed in Table 1 were mixed at the mass ratio listed in Table 1. This solution was subjected to a dispersion treatment at 25° C. for 12 hours in a bead mill using zirconia beads of 0.5 mmφ. After the dispersion treatment was completed, the beads were removed by filtration to prepare colored pigment dispersion 1.

4. Preparation of photosensitive resin composition The components used in each example and each comparative example are shown below.
<Alkali-soluble resin>
Alkali-soluble resin 1: "ZAR-2050H" manufactured by Nippon Kayaku Co., Ltd. (special BIS-A type epoxy resin, contains the structural unit represented by the above general formula (1). Does not contain fluorine atoms)
Alkali-soluble resin 2: "ZCR-1569H" manufactured by Nippon Kayaku Co., Ltd. (biphenyl type epoxy resin, does not contain the structural unit represented by the above general formula (1))
Alkali-soluble resin 3: "CCR-1171H" manufactured by Nippon Kayaku Co., Ltd. (cresol novolac type epoxy resin, does not contain the structural unit represented by the above general formula (1))
Alkali-soluble resin 4: Bisphenol B derivative, containing a structural unit represented by the above-mentioned general formula (1). R is a methyl group or an ethyl group. (Does not contain fluorine atoms)
Alkali-soluble resin 5: Bisphenol E derivative, containing a structural unit represented by the above-mentioned general formula (1). R is a methyl group and hydrogen. (Does not contain fluorine atoms)

Synthesis of alkali-soluble resin 4:
Add 92.52 g (10 mol) of epichlorohydrin (Tokyo Kasei Kogyo Reagent) to 24.3 g (0.1 mol) of bisphenol B (Tokyo Kasei Kogyo Reagent) in a four-necked flask equipped with a thermometer and a decanter equipped with a condenser. Dissolved. 16.7 g (0.2 mol) of a 48% by mass aqueous NaOH solution was added dropwise at 80° C. over 1 hour. Heating continued to distill the epichlorohydrin and water, separating the epichlorohydrin and water, and returning the epichlorohydrin to the flask. Stirring was continued for an additional 2 hours. Thereafter, 50 g of water was added to the flask and allowed to stand still. The lower layer (aqueous layer) was discarded, and epichlorohydrin remaining in the organic layer was recovered to obtain a crude resin. 50 g of methyl isobutyl ketone (hereinafter referred to as MIBK) was added to the crude resin, and further 30 g of a 3% by mass NaOH aqueous solution was added, followed by stirring at 70° C. for 30 minutes. The lower aqueous layer was then discarded. Thereafter, the MIBK layer was washed with 30 g of water, and the aqueous layer was discarded. After concentrating the MIBK layer, 35 g of the desired epoxy resin was obtained. This resin was liquid and had an epoxy equivalent of 180 g/eq.
The obtained epoxy resin was a bisphenol B type epoxy compound represented by the following general formulas (11-1) and (11-2).

（一般式（１１－１）及び（１１－２）中、ｎは、それぞれ独立に１～２０である。）

(In general formulas (11-1) and (11-2), n is each independently 1 to 20.)

30 g of bisphenol B type epoxy compound (epoxy equivalent: 180 g/eq) obtained above, 10 g of acrylic acid (Tokyo Kasei Kogyo Reagent), 0 6-t-butyl-2,4-xylenol (Tokyo Kasei Kogyo Reagent) as a polymerization inhibitor. .1 g, triphenylphosphine (Tokyo Kasei Kogyo Reagent), 1.0 g, and 40 g of propylene glycol monomethyl ether acetate were placed in a reaction vessel and stirred at 90°C until the acid value became 3 mgKOH/g or less. Next, 1.0 g of cis-4-cyclohexene-1,2-dicarboxylic anhydride was added to the reaction solution obtained by the above reaction, and the mixture was reacted at 90° C. for 3 hours.
Then, a 50% by mass PGMEA solution of the alkali-soluble resin 4 with a solid content acid value of 50 mgKOH/g and a polystyrene-equivalent weight average molecular weight (Mw) measured by GPC of 7,200 was obtained.
Alkali-soluble resin 4 was a polymer compound characterized by containing structural units represented by the following general formulas (1-4), (1-5), and (1-6).

（上記一般式（１－４）、（１－５）及び（１－６）中、ａ、ｂ及びｃはそれぞれ１以上の整数である。）

(In the above general formulas (1-4), (1-5) and (1-6), a, b and c are each an integer of 1 or more.)

Synthesis of alkali-soluble resin 5:
In a four-necked flask equipped with a thermometer and a decanter equipped with a condenser, 92.52 g (10 mol) of epichlorohydrin was dissolved in 21.4 g (0.1 mol) of bisphenol E (Tokyo Kasei Kogyo Reagent). 16.7 g (0.2 mol) of a 48% by mass aqueous NaOH solution was added dropwise at 80° C. over 1 hour. Heating continued to distill the epichlorohydrin and water, separating the epichlorohydrin and water, and returning the epichlorohydrin to the flask. Stirring was continued for another 2 hours, and then 50 g of water was added to the flask and allowed to stand still. The lower layer (aqueous layer) was discarded, and epichlorohydrin remaining in the organic layer was recovered to obtain a crude resin. 50 g of MIBK was added to the crude resin, and further 30 g of a 3% by mass NaOH aqueous solution was added, followed by stirring at 70° C. for 30 minutes. The lower aqueous layer was then discarded. Thereafter, the MIBK layer was washed with 30 g of water, and the aqueous layer was discarded. After concentrating the MIBK layer, 30 g of the desired epoxy resin was obtained. This resin was liquid and had an epoxy equivalent of 185 g/eq.
The obtained epoxy resin was a bisphenol E type epoxy compound represented by the following general formulas (12-1) and (12-2).

（一般式（１２－１）及び（１２－２）中、ｎは、それぞれ独立に１～２０である。）

(In general formulas (12-1) and (12-2), n is each independently 1 to 20.)

25 g of the bisphenol E type epoxy compound (epoxy equivalent: 185 g/eq) expressed by the following formula obtained above, 8 g of acrylic acid (Tokyo Kasei Kogyo Reagent), 6-t-butyl-2,4-xylenol ( 0.1 g of Tokyo Kasei Kogyo Reagent), 0.8 g of triphenylphosphine (Tokyo Kasei Kogyo Reagent), and 33 g of propylene glycol monomethyl ether acetate were charged into a reaction vessel and stirred at 90°C until the acid value became 3 mgKOH/g or less. Next, 0.8 g of cis-4-cyclohexene-1,2-dicarboxylic anhydride was added to the reaction solution obtained by the above reaction, and the mixture was reacted at 90° C. for 3 hours.
Then, a 50% by mass PGMEA solution of alkali-soluble resin 5 was obtained, which had a solid content acid value of 50 mgKOH/g and a polystyrene-equivalent weight average molecular weight (Mw) measured by GPC of 7,500.
Alkali-soluble resin 5 was a polymer compound characterized by containing structural units represented by the following general formulas (1-7), (1-8), and (1-9).

（上記一般式（１－７）、（１－８）及び（１－９）中、ａ、ｂ及びｃはそれぞれ１以上の整数である。）
＜着色顔料分散体＞
着色顔料分散体１：上述の着色顔料分散体１の調製の手順で調製した着色顔料分散体。（顔料混合、全固形分に対する顔料含有量：６６質量％、粒子径：Ｄ_５０は、３２０ｎｍ）
着色顔料分散体２：ラクタムブラックとして、以下化合物からなる顔料（全固形分に対する顔料含有量：７５質量％、粒子径：Ｄ_５０は、３００ｎｍ）

(In the above general formulas (1-7), (1-8) and (1-9), a, b and c are each an integer of 1 or more.)
<Colored pigment dispersion>
Colored Pigment Dispersion 1: Colored Pigment Dispersion prepared by the procedure for preparing Colored Pigment Dispersion 1 described above. (Pigment mixture, pigment content based on total solids: 66% by mass, particle size: _D50 , 320 nm)
Colored pigment dispersion 2: Lactam black, a pigment consisting of the following compound (pigment content based on total solid content: 75% by mass, particle size: _D50 , 300 nm)

Colored pigment dispersion 3: "NX-501" manufactured by Dainichiseika Kagyo Co., Ltd. (titanium oxide pigment, pigment content:
73% by mass, particle size: _D50 is 270 nm)
<Ethylenically unsaturated compound>
Ethylenically unsaturated compound 1: "DPHA" (dipentaerythritol hexaacrylate) manufactured by Nippon Kayaku Co., Ltd.
<Photopolymerization initiator>
Photopolymerization initiator: “Irgacure OXE-01” manufactured by BASF
<Additives>
Additive 1: "KAYAMER PM-21" manufactured by Nippon Kayaku Co., Ltd. (mixture of caprolactone-modified phosphoric acid monomethacrylate and caprolactone-modified phosphoric acid dimethacrylate)

5. Evaluation <Preparation of photosensitive resin composition>
Add each component so that the solid content of each component in the total solid content is as shown in Tables 2 and 3 (in Table 2, the numerical value of the blending ratio means the mass blending ratio), and , PGMEA was added so that the total solid content was 30% by mass, and the mixture was stirred and dissolved to prepare photosensitive resin compositions of Examples 1 to 21 and Comparative Examples 1 to 11. Using the obtained photosensitive resin composition, evaluation was performed by the method described below.

[Formation of evaluation measurement substrate]
After cleaning a 10 cm square ITO substrate with ultrapure water and then acetone, the substrate was subjected to UV ozone treatment for 5 minutes using a UV ozone treatment device (manufactured by Sen Special Light Source Co., Ltd., model number PL17-110). Next, the photosensitive compositions according to each Example and each Comparative Example were coated on the resulting UV ozone-treated substrate using a spin coater at a rotation speed of 400 rpm, and heated on a hot plate at 100° C. for 150 seconds. Then, a fluorine-containing coating film and a comparative fluorine-containing coating film with a film thickness of 3 μm were formed. The resin film obtained from the mask aligner (product of SUSS Microtech Co., Ltd.) was exposed to i-rays (wavelength: 365 nm). The contact angle and optical density of the resulting cured coating film after exposure were measured.

[Contact angle]
After heating the substrate having the cured product obtained in the above process at 230°C for 60 minutes, the contact angle of the surface of the cured product to propylene glycol monomethyl ether acetate (PGMEA) was measured using a contact angle meter (Kyowa Interface Science Co., Ltd.) The PGMEA contact angle was measured at 20 locations on the coating film using GMs-601) manufactured by Co., Ltd.
Tables 2 and 3 show the average value, maximum value, minimum value, and difference between the maximum value and the minimum value of the measured numerical values.

[Optical density]
After heating the substrates having the cured products of Examples 4 to 21 and Comparative Examples 5 to 11 obtained through the above steps at 230°C for 60 minutes, the optical density of the cured products was measured using a black and white transmission densitometer (Ihara The OD value was measured at 20 locations on the coating film using a T5plus (manufactured by Denshi Co., Ltd.).
Tables 2 and 3 show the average value, maximum value, minimum value, and difference between the maximum value and the minimum value of the measured numerical values.

In the example, it was confirmed that the variation in the PGMEA contact angle and OD value within the film surface was small.
Furthermore, in the comparative example, it was confirmed that the PGMEA contact angle or OD value varied widely within the cured product, probably because the compatibility with other components was lower than that of the alkali-soluble resin used in the example.

Claims (16)

an ethylenically unsaturated compound (A);
A photopolymerization initiator (B),
an alkali-soluble resin (C);
A fluororesin (D ₁ ) having a fluorine atom content of 20 to 60% by mass, and/or a fluororesin (D ₂ ) having a fluorine atom content of more than 0% by mass and less than 20% by mass. A photosensitive resin composition containing a fluororesin (D),
A photosensitive resin composition, wherein the alkali-soluble resin (C) is a bisphenol-type epoxy resin having a structure represented by the following general formula (1).

[In formula (1), R is each independently a linear or branched alkyl group having 1 to 3 carbon atoms, a linear perfluoroalkyl group having 1 to 3 carbon atoms, or hydrogen; represents an atom, and Z represents a monovalent organic group or a hydrogen atom. ] The photosensitive resin composition according to claim 1, further comprising a colored pigment (E). The photosensitive resin composition according to claim 1 or 2, wherein the alkali-soluble resin (C) has a fluorine atom content of 10% by mass or less. The photosensitive resin composition according to claim 1 or 2, wherein the difference between the fluorine atom content of the fluororesin (D) and the fluorine atom content of the alkali-soluble resin (C) is 15 to 60% by mass. thing. The photosensitive resin composition according to claim 1 or 2, wherein the content of the fluororesin (D) based on the total solid content of the photosensitive resin composition is 0.01 to 40% by mass. 2. The content of the alkali-soluble resin (C) in the photosensitive resin composition is 1,000 parts by mass or more and 10,000 parts by mass or less based on 100 parts by mass of the fluororesin (D). The photosensitive resin composition described in . The photosensitive resin composition according to claim 1 or 2, further comprising at least one selected from the group consisting of a photoradical sensitizer, a chain transfer agent, an ultraviolet absorber, and a polymerization inhibitor. The photosensitive resin composition according to claim 1 or 2, which is used for forming partition walls. A resin film obtained from the photosensitive resin composition according to claim 1 or 2. A cured product obtained by curing the resin film according to claim 9. A partition wall comprising the cured product according to claim 10. An organic electroluminescent device comprising the partition wall according to claim 11. A wavelength conversion layer comprising the partition wall according to claim 11. A display comprising the partition wall according to claim 11. A method for producing a cured product, comprising:
A film forming step of forming a resin film by applying the photosensitive resin composition according to claim 1 or 2 onto a substrate and then heating it;
A method for producing a cured product, comprising an exposure step of exposing the resin film to high-energy rays. A method for manufacturing a partition wall, the method comprising:
A film forming step of forming a resin film by applying the photosensitive resin composition according to claim 1 or 2 onto a substrate and then heating it;
A method for manufacturing a partition wall, comprising: an exposure step of exposing the resin film to high-energy rays.