JP2024004752A - Substrate processing method and substrate processing device - Google Patents

Abstract

To provide a substrate processing method and a substrate processing device, capable of accurately processing a substrate.SOLUTION: A substrate processing method includes: a setting step of setting the aperture of a flow rate adjustment section 215 to an initial aperture, based on aperture information showing the relationship between the initial aperture of the flow rate adjustment section 215 and the target flow rate of a processing liquid LQ; a changing step of changing the aperture from the initial aperture to the target aperture such that detection results of a flow meter 212 become the target flow rate; a first determination step of determining whether the change from the initial aperture to the target aperture is either a change in a positive direction showing that the target aperture is greater than the initial aperture or a change in a negative direction showing that the target aperture is less than the initial aperture; and a second determination step of determining whether an abnormality occurs in a substrate processing device 100A, based on a plurality of determination results obtained by performing each of the setting step, the changing step and the first determination step multiple times.SELECTED DRAWING: Figure 2

Description

The present invention relates to a substrate processing method and a substrate processing apparatus.

In the process of manufacturing semiconductor devices, various processes are performed on semiconductor wafers using a substrate processing apparatus. For example, as a substrate processing apparatus, an etching apparatus is known that sets the thickness of a target film included in a semiconductor wafer to a target thickness (for example, see Patent Document 1). For example, an etching apparatus supplies an etching liquid from a supply pipe toward a semiconductor wafer to etch the semiconductor wafer.

Furthermore, it is necessary to change the discharge amount of a processing liquid such as an etching liquid depending on various processes. Therefore, the supply pipe is provided with an adjustment valve that adjusts the flow rate of the processing liquid.

Japanese Patent Application Publication No. 2017-85174

In the substrate processing apparatus, a flow meter is arranged in the supply pipe. The flow meter detects the flow rate of the processing liquid within the supply pipe. When a substrate processing apparatus is used for a long period of time, the flow rate of the processing liquid in the supply pipe and the detection result of the flowmeter may differ. As a result, the substrate may be processed in a state where the flow rate of the processing liquid in the supply pipe and the detection result of the flowmeter are different. Therefore, the substrate may not be processed with high precision.

The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing method and a substrate processing apparatus that can process a substrate with high precision.

The substrate processing method according to the present invention is executed by a substrate processing apparatus. The substrate processing apparatus includes a processing tank, a flow rate adjustment section, and a flow meter. The processing tank stores a processing liquid and processes a substrate with the processing liquid. The flow rate adjustment section adjusts the flow rate of the processing liquid in a pipe connected to the processing tank by adjusting the opening degree. The flow meter detects the flow rate of the processing liquid within the piping. The substrate processing method includes setting the opening degree of the flow rate adjusting section to the initial opening degree based on opening degree information indicating a relationship between the initial opening degree of the flow rate adjusting section and a target flow rate of the processing liquid. a changing step of changing the initial opening degree to the target opening degree so that the detection result of the flowmeter becomes the target flow rate; and a changing step of changing the initial opening degree to the target opening degree so that the detection result of the flowmeter becomes the target flow rate. a first determination step of determining whether the change is in a positive direction indicating that the degree of opening is larger than the initial opening degree, or a change in a negative direction indicating that the target opening degree is smaller than the initial opening degree; A step of determining whether or not an abnormality has occurred in the substrate processing apparatus based on a plurality of determination results obtained by performing each of the setting step, the changing step, and the first determining step multiple times. 2 determination steps.

In one embodiment, in the second determination step, it is determined whether an abnormality has occurred in the substrate processing apparatus by determining whether an abnormality condition is satisfied based on the plurality of determination results. , the abnormal condition indicates that the change in the positive direction has continued for a first predetermined number of times or more, or that the change in the negative direction has continued for a first predetermined number of times or more.

In one embodiment, in the second determination step, it is determined whether an abnormality has occurred in the substrate processing apparatus by determining whether an abnormality condition is satisfied based on the plurality of determination results. , the abnormal condition indicates that there has been a change in the positive direction more than a second predetermined number of times in a predetermined period, or that there has been a change in the negative direction more than a second predetermined number of times in the predetermined period.

In an embodiment, the substrate is processed based on each of a plurality of recipes, and in the second determination step, based on the plurality of determination results executed with the same recipe among the plurality of recipes, It is determined whether an abnormality has occurred in the substrate processing apparatus.

The substrate processing apparatus according to the present invention includes a processing tank that stores a processing liquid and processes a substrate with the processing liquid, and a processing tank that stores a processing liquid and processes a substrate with the processing liquid. A flow rate adjustment unit that adjusts the flow rate, a flow meter that detects the flow rate of the processing liquid in the piping, and opening degree information that indicates the relationship between the initial opening degree of the flow rate adjustment unit and the target flow rate of the processing liquid. a setting section that sets the opening degree of the flow rate adjustment section to the initial opening degree; and a changing section that changes the opening degree from the initial opening degree to the target opening degree so that the detection result of the flow meter becomes the target flow rate. and the change from the initial opening degree to the target opening degree is a positive change indicating that the target opening degree is larger than the initial opening degree, and that the target opening degree is smaller than the initial opening degree. a first determination unit that determines which of the negative changes shown in FIG. and a second determination unit.

In an embodiment, a plurality of the piping, a plurality of the flow rate adjustment sections, and a plurality of the flowmeters are provided, the same type or different types of processing liquid flows through the plurality of piping, and the second The determination unit determines whether an abnormality has occurred in each of the plurality of flowmeters.

According to the substrate processing method and substrate processing apparatus according to the present invention, a substrate can be processed with high precision.

1 is a schematic perspective view showing a substrate processing apparatus according to Embodiment 1 of the present invention. 1 is a schematic cross-sectional view showing a substrate processing apparatus according to Embodiment 1. FIG. 1 is a block diagram showing a control device according to a first embodiment. FIG. FIG. 2 is a diagram for explaining substrate processing performed by the substrate processing apparatus according to the first embodiment. 5 is a flowchart showing processing by a control device included in the substrate processing apparatus of Embodiment 1. FIG. FIG. 7 is a diagram for explaining substrate processing performed by a substrate processing apparatus according to Embodiment 2 of the present invention. FIG. 7 is a diagram for explaining substrate processing performed by a substrate processing apparatus according to Embodiment 3 of the present invention. FIG. 3 is a schematic cross-sectional view showing a substrate processing apparatus according to Embodiment 4 of the present invention.

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the drawings, the same reference numerals are given to the same or corresponding parts, and the description will not be repeated. Further, in an embodiment of the present invention, the X-axis, Y-axis, and Z-axis are perpendicular to each other, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

<Embodiment 1>
Referring to FIG. 1, a substrate processing apparatus 100A and a substrate processing method according to Embodiment 1 of the present invention will be described. First, the substrate processing apparatus 100A will be explained with reference to FIG. FIG. 1 is a schematic perspective view showing a substrate processing apparatus 100A. Specifically, FIGS. 1A and 1B are schematic perspective views of the substrate processing apparatus 100A before and after loading the substrate W into the processing tank 110.

As shown in FIGS. 1A and 1B, the substrate processing apparatus 100A processes a plurality of substrates W at once using a processing liquid LQ. Note that the substrate processing apparatus 100A may process a predetermined number of a large number of substrates W using the processing liquid LQ. The predetermined number is an integer of 1 or more.

The substrate W has a thin plate shape. Typically, the substrate W is thin and approximately disk-shaped. The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, or a photomask. including solar cell substrates, ceramic substrates, and solar cell substrates.

Using the treatment liquid LQ, at least one of etching treatment, surface treatment, property imparting, treatment film formation, removal of at least a portion of the film, and cleaning is performed on the plurality of substrates W. For example, the substrate processing apparatus 100A performs an etching process on a silicon oxide film (SiO ₂ film) and a silicon nitride film (SiN film) on the pattern formation side surface of the substrate W made of a silicon substrate. In such an etching process, either the silicon oxide film or the silicon nitride film is removed from the surface of the substrate W.

The treatment liquid LQ is, for example, a chemical liquid. The processing liquid includes an etching liquid, a rinsing liquid, SC1, and SC2. The etching solution etches the substrate W. Examples of the etching solution include hydrofluoric nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO ₃ )), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, and HFEG (a mixture of hydrofluoric acid and ethylene glycol). ) or phosphoric acid (H ₃ PO ₄ ). The rinsing liquid rinses the substrate W. Specifically, the rinsing liquid is used to wash away the etching liquid remaining on the substrate W. The rinsing liquid is, for example, deionized water, carbonated water, electrolyzed ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm). Each of SC1 and SC2 cleans the substrate W. SC1 is, for example, a mixed liquid containing NH ₄ OH and H ₂ O ₂ . Although the treatment liquid is not particularly limited, in the first embodiment, a case where the treatment liquid LQ is an etching liquid will be described below.

Specifically, the substrate processing apparatus 100A includes a processing tank 110 and a substrate holding section 120.

The processing tank 110 stores the processing liquid LQ. Specifically, the processing tank 110 stores the processing liquid LQ. Specifically, the processing tank 110 has a double tank structure including an inner tank 112 and an outer tank 114. The inner tank 112 and the outer tank 114 each have an upper opening that opens upward. The inner tank 112 stores the processing liquid LQ and is configured to be able to accommodate a plurality of substrates W. The outer tank 114 is provided on the outer peripheral surface of the upper opening of the inner tank 112.

The substrate holding unit 120 holds a plurality of substrates W. The plurality of substrates W are arranged in a line along the first direction D10 (Y direction). In other words, the first direction D10 indicates the direction in which the plurality of substrates W are arranged. The first direction D10 is approximately parallel to the horizontal direction. Further, each of the plurality of substrates W is approximately parallel to the second direction D20. The second direction D20 is substantially perpendicular to the first direction D10 and substantially parallel to the horizontal direction.

Specifically, the substrate holding section 120 includes a lifter. The substrate holding unit 120 moves vertically upward or vertically downward while holding a plurality of substrates W. By moving the substrate holder 120 vertically downward, the plurality of substrates W held by the substrate holder 120 are immersed in the processing liquid LQ stored in the inner tank 112.

In FIG. 1A, the substrate holder 120 is located above the inner tank 112 of the processing tank 110. The substrate holding unit 120 descends vertically downward (in the Z direction) while holding the plurality of substrates W. As a result, a plurality of substrates W are loaded into the processing tank 110.

As shown in FIG. 1B, when the substrate holder 120 descends to the processing tank 110, the plurality of substrates W are immersed in the processing liquid LQ in the processing tank 110. In the first embodiment, the substrate holding unit 120 immerses a plurality of substrates W arranged at predetermined intervals in the processing liquid LQ stored in the processing tank 110.

Specifically, the substrate holding section 120 further includes a main body plate 122 and a holding rod 124. The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rod 124 extends from one main surface of the main body plate 122 in the horizontal direction (Y direction). In the example of FIGS. 1(a) and 1(b), three holding rods 124 extend horizontally from one main surface of the main body plate 122. In the example shown in FIGS. The plurality of substrates W are aligned at predetermined intervals and held in an upright position (vertical position) with the lower edges of each substrate W in contact with the plurality of holding rods 124 .

The substrate holder 120 may further include a lifting unit 126. The lifting unit 126 has a processing position (the position shown in FIG. 1B) where a plurality of substrates W held by the substrate holder 120 are located in the inner tank 112, and a processing position where the plurality of substrates W held by the substrate holder 120 are located in the inner tank 112. The main body plate 122 is moved up and down between a retracted position (the position shown in FIG. 1A) where the substrates W are located above the inner tank 112. Therefore, by moving the main body plate 122 to the processing position by the lifting unit 126, the plurality of substrates W held by the holding rod 124 are immersed in the processing liquid LQ.

Continuing with reference to FIG. 2, the substrate processing apparatus 100A will be described in detail. FIG. 2 is a schematic cross-sectional view showing the substrate processing apparatus 100A according to the first embodiment. Note that open valves are shown in white, and closed valves are shown in black. As shown in FIG. 2, the substrate processing apparatus 100A further includes a first supply section 210, a plurality of circulating processing liquid supply members 130, a diluent supply section 700, and a control device 200.

The plurality of circulating processing liquid supply members 130 supply the processing liquid LQ to the inner tank 112 of the processing tank 110. The plurality of circulating processing liquid supply members 130 are arranged at the bottom of the inner tank 112 inside the inner tank 112 of the processing tank 110 . Each of the plurality of circulating processing liquid supply members 130 has a substantially cylindrical shape. Each of the plurality of circulating processing liquid supply members 130 is, for example, a pipe.

Specifically, each of the plurality of circulating processing liquid supply members 130 has a plurality of processing liquid discharge holes P. In FIG. 2, only one processing liquid discharge hole P is shown for one circulating processing liquid supply member 130. Each of the plurality of circulating processing liquid supply members 130 supplies the processing liquid LQ to the inner tank 112 from the plurality of processing liquid discharge holes P.

The diluent supply unit 700 supplies the diluent to the processing tank 110 via the plurality of circulating processing liquid supply members 130 . The diluent is, for example, DIW (Deionized Water).

The first supply unit 210 includes a first pipe 211 , a first flow meter 212 , a first adjustment valve 215 , a first on-off valve 216 , and an on-off valve 217 . The first flow meter 212, the first adjustment valve 215, the first opening/closing valve 216, and the opening/closing valve 217 are arranged in the first piping 211 in this order toward the upstream or downstream of the first piping 211. . The first adjustment valve 215 is an example of a "flow rate adjustment section."

The first pipe 211 supplies the processing liquid LQ to the processing tank 110 via the plurality of circulating processing liquid supply members 130 . Specifically, the processing liquid LQ is supplied from the tank 218 to the processing tank 110 via the first pipe 211. The treatment liquid LQ is, for example, hydrofluoric acid (HF). The first pipe 211 is a tubular member through which the processing liquid LQ flows.

The first on-off valve 216 opens and closes the first pipe 211. That is, the first on-off valve 216 switches between supplying and stopping the supply of the processing liquid LQ from the first pipe 211 to the processing tank 110.

The on-off valve 217 opens and closes the first pipe 211. That is, the on-off valve 217 switches between supplying and stopping the supply of the processing liquid LQ from the first pipe 211 to the processing tank 110.

The first adjustment valve 215 adjusts the flow rate of the processing liquid LQ flowing through the first pipe 211. The "flow rate" indicates, for example, the flow rate of the processing liquid LQ that passes through a unit area per unit time. The first adjustment valve 215 adjusts the flow rate of the processing liquid LQ in the first pipe 211 by adjusting the opening degree.

The first regulating valve 215 is, for example, a motor needle valve. Specifically, the first regulating valve 215 includes a valve body (not shown) in which a valve seat is provided, a needle that opens and closes the valve seat, and a motor that moves the needle between the open position and the closed position. (not shown). The opening degree of the first adjustment valve 215 is adjusted by the control device 200. Specifically, the opening degree of the first adjustment valve 215 is adjusted by the number of drive pulses from the needle origin position that are input to the motor.

The first flow meter 212 detects the flow rate of the processing liquid LQ flowing through the first pipe 211. The first flowmeter 212 is, for example, a positive displacement flowmeter, a differential pressure flowmeter, a vortex flowmeter, a hot wire mass flowmeter, a steam flowmeter, a mass flowmeter, an ultrasonic flowmeter, or an electromagnetic flowmeter. The first flow meter 212 outputs a signal indicating the flow rate to the control device 200. The signal indicating the flow rate is an example of a “detection result” and indicates the flow rate of the processing liquid LQ flowing through the first pipe 211. Hereinafter, the signal indicating the flow rate will be referred to as a "first flow rate signal FA."

Continuing with reference to FIGS. 3 and 4, the control device 200 will be described. FIG. 3 is a block diagram showing the control device 200 according to the first embodiment. FIG. 4 is a diagram for explaining substrate processing performed by the substrate processing apparatus 100A according to the first embodiment. "Substrate processing" refers to sequentially processing a predetermined number of substrates W using the processing liquid LQ.

As shown in FIG. 3, the control device 200 controls the operation of each part of the substrate processing apparatus 100A. Specifically, control device 200 includes a control section 201 and a storage section 202.

Storage unit 202 has a main storage device. The main storage device is, for example, a semiconductor memory. The storage unit 202 may further include an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. Storage unit 202 may include removable media.

Storage unit 202 stores data and computer programs. The data includes data DA indicating substrate processing performed by the substrate processing apparatus 100A. As shown in FIG. 4, the substrate W is processed based on each of a plurality of recipes. Data DA indicating substrate processing includes information indicating a plurality of recipes RAA. Specifically, the data DA indicating substrate processing includes information indicating the first recipe RAA1, information indicating the second recipe RAA2, and information indicating the third recipe RAA3. The first recipe RAA1, the second recipe RAA2, and the third recipe RAA3 are the same recipe. The first recipe RAA1, the second recipe RAA2, and the third recipe RAA3 are executed in this order.

Each of the information indicating the first recipe RAA1, the information indicating the second recipe RAA2, and the information indicating the third recipe RAA3 includes information indicating a plurality of recipe steps. In other words, each of the plurality of recipes RAA defines the processing content and processing procedure for the substrate W.

Specifically, each of the plurality of recipes RAA includes a recipe step 1st, a recipe step N, and a recipe step N+1. Recipe step 1st, recipe step N, and recipe step N+1 are executed in this order. Recipe step 1st, recipe step N, and recipe step N+1 each indicate different processing contents. Recipe step N includes information indicating the target flow rate SAA of the processing liquid LQ.

In FIG. 4, the detection results of the first flowmeter 212, the opening/closing states of the first on-off valve 216 and the on-off valve 217, the processing contents of the recipe step, and the opening state of the first adjustment valve 215 are shown. ing. In the detection results of the first flowmeter 212, the horizontal axis indicates time, and the vertical axis indicates the flow rate of the processing liquid LQ. In the open/close states of the first on-off valve 216 and the on-off valve 217, the horizontal axis represents time, and the vertical axis represents either the open state or the closed state. In the processing content of the recipe step, the horizontal axis indicates time, and the vertical axis indicates the processing content of the recipe step. In the state of the opening degree of the first regulating valve 215, the horizontal axis indicates time, and the vertical axis indicates the opening degree of the first regulating valve 215.

The storage unit 202 also stores a first table TA. The first table TA is an example of "opening information". The first table TA shows the relationship between the initial opening degree XAA of the first regulating valve 215 and the target flow rate SAA of the processing liquid LQ. The initial opening degree XAA indicates the magnitude of the opening degree of the first adjustment valve 215. Specifically, the initial opening degree XAA includes information indicating the number of driving pulses from the origin position of the needle so that the flow rate of the processing liquid LQ flowing through the first pipe 211 becomes the target flow rate SAA. Specifically, the number of driving pulses from the needle origin position is taught in the storage unit 202.

Control unit 201 has a processor. The control unit 201 includes, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 201 may include a general-purpose computing machine.

The control unit 201 processes the substrate W with the processing liquid LQ based on the computer program, data, and first table TA stored in the storage unit 202. Specifically, the control unit 201 includes a setting unit 2011, a changing unit 2012, a first determining unit 2013, and a second determining unit 2014.

The setting unit 2011 sets the opening degree of the first adjustment valve 215 to the initial opening degree XAA based on the first table TA. Specifically, the setting unit 2011 outputs an opening signal to the first adjustment valve 215. The opening signal indicates the number of driving pulses from the needle's origin position. Specifically, when supplying the processing liquid LQ at the target flow rate SAA to the processing tank 110, the setting unit 2011 outputs the number of drive pulses based on the first table TA to the first adjustment valve 215.

Further, the setting unit 2011 outputs opening/closing signals to the first opening/closing valve 216 and the opening/closing valve 217. The open/close signal indicates either an open state or a closed state of the first pipe 121. Specifically, the setting unit 2011 outputs an opening/closing signal indicating the open state to the first opening/closing valve 216 and the opening/closing valve 217, so that the first opening/closing valve 216 and the opening/closing valve 217 open the first pipe 211. On the other hand, the setting unit 2011 outputs an opening/closing signal indicating the closed state to the first opening/closing valve 216 and the opening/closing valve 217, so that the first opening/closing valve 216 and the opening/closing valve 217 close the first pipe 211. Specifically, the setting unit 2011 outputs open/close signals indicating the open state to the first open/close valve 216 and the open/close valve 217 at time T1, time T3, and time T5. Further, at time T2, time T4, and time T6, the setting unit 2011 outputs an open/close signal indicating the closed state to the first open/close valve 216 and the open/close valve 217.

The changing unit 2012 changes the opening degree of the first adjustment valve 215 from the initial opening degree XAA to the target opening degree YAA so that the detection result of the first flowmeter 212 becomes the target flow rate SAA. Specifically, the changing unit 2012 receives the first flow rate signal FA from the first flow meter 212. When the flow rate indicated by the first flow rate signal FA is less than the target flow rate SAA, the changing unit 2012 outputs an opening degree signal indicating an opening degree larger than the initial opening degree XAA to the first adjustment valve 215. As a result, the flow rate of the processing liquid LQ flowing through the first pipe 211 becomes the target flow rate SAA. On the other hand, when the flow rate indicated by the first flow rate signal FA is higher than the target flow rate SAA, the changing unit 2012 outputs an opening signal indicating an opening smaller than the initial opening XAA to the first adjustment valve 215. As a result, the flow rate of the processing liquid LQ flowing through the first pipe 211 becomes the target flow rate SAA.

Further, the changing unit 2012 is capable of feedback controlling the opening degree of the first adjustment valve 215. More specifically, the feedback control includes proportional control, integral control, and differential control based on the first flow rate signal FA. The changing unit 2012 executes proportional control, integral control, and differential control based on the flow rate indicated by the first flow rate signal FA, and changes the opening degree indicating the opening degree at which the proportional control, integral control, and differential control are executed. A signal is output to the first regulating valve 215. Feedback control is, for example, PID control.

The first determination unit 2013 determines whether the change from the initial opening degree XAA to the target opening degree YAA is a change in the positive direction or a change in the negative direction. A change in the positive direction indicates that the target opening degree YAA is larger than the initial opening degree XAA. A change in the negative direction indicates that the target opening degree YAA is smaller than the initial opening degree XAA.

The second determination unit 2014 determines whether or not an abnormality has occurred in the substrate processing apparatus 100A based on the plurality of determination results determined by the first determination unit 2013. In other words, the second determination unit 2014 determines whether there is an abnormality in the substrate processing apparatus 100A based on a plurality of determination results obtained by respectively performing a setting step, a change step, and a first determination step, which will be described later, multiple times. Determine whether it has occurred. In detail, the second determination unit 2014 determines whether an abnormality has occurred in the substrate processing apparatus 100A by determining whether an abnormality condition is satisfied based on a plurality of determination results. The abnormal condition indicates that changes in the positive direction have continued for a first predetermined number of times or more, or that changes in the negative direction have continued for a first predetermined number of times or more. The first predetermined number of times is two or more times, for example, three times.

For example, when executing the first recipe RAA1, changing from the initial opening XAA to the target opening YAA is a change in the positive direction, and when executing the second recipe RAA2, changing from the initial opening XAA to the target opening YAA is a positive change. If the change to degree YAA is a change in the positive direction, and when the third recipe RAA3 is executed, if the change from the initial opening degree 2 determination unit 2014 determines that the abnormal condition is satisfied. As a result, it can be recognized that because the substrate processing apparatus 100A has been used for a long period of time, the origin of the first flowmeter 212 has shifted or the state of the first supply section 210 has become biased. Therefore, the origin of the first flow meter 212 can be adjusted or the state of the first supply section 210 can be checked at appropriate timing.

On the other hand, when the first recipe RAA1 is executed, the change from the initial opening XAA to the target opening YAA is a change in the positive direction, and when the second recipe RAA2 is executed, the initial opening XAA is changed to the target opening YAA. If the change to degree YAA is a change in the positive direction, and when the third recipe RAA3 is executed, and the change from the initial opening degree 2 determination unit 2014 determines that the abnormal condition is not satisfied. As a result, it can be recognized that the origin of the first flowmeter 212 is not shifted or that the state of the first supply section 210 is not biased.

Embodiment 1 of the present invention has been described above. According to the first embodiment, it is determined whether an abnormality has occurred in the substrate processing apparatus 100A based on a plurality of determination results. As a result, the displacement of the detection result of the first flowmeter 212 can be recognized. Therefore, it can be recognized that because the substrate processing apparatus 100A has been used for a long period of time, the origin of the first flowmeter 212 has shifted or the state of the first supply section 210 has become biased. As a result, it is possible to prevent the substrate W from being processed in a state where the flow rate of the processing liquid LQ in the first pipe 211 and the detection result of the first flow meter 212 are different.

Further, the abnormal condition indicates that the change in the positive direction has continued for a first predetermined number of times or more, or that the change in the negative direction has continued for a first predetermined number or more. As a result, it can be easily recognized that the displacement detected by the first flowmeter 212 is uneven.

Next, with reference to FIG. 5, the substrate processing method of the first embodiment will be described. The substrate processing method of the first embodiment is executed by the substrate processing apparatus 100A described with reference to FIGS. 1 to 4. FIG. 5 is a flowchart showing processing by the control device 200 included in the substrate processing apparatus 100A of the first embodiment.

First, in step S101, the setting unit 2011 closes the first pipe 211 by outputting an open/close signal indicating a closed state to the first open/close valve 216 and the open/close valve 217.

Next, in step S102, the setting unit 2011 sets the opening degree of the first adjustment valve 215 to the closing angle.

Next, in step S103, the setting unit 2011 sets the opening degree of the first adjustment valve 215 to the initial opening degree XAA based on the first table TA. Step S103 corresponds to an example of the "setting step" of the present invention.

Next, in step S104, the setting unit 2011 opens the first pipe 211 by outputting an open/close signal indicating the open state to the first open/close valve 216 and the open/close valve 217.

Next, in step S105, the changing unit 2012 receives the first flow rate signal FA from the first flow meter 212.

Next, in step S106, the changing unit 2012 changes the opening degree of the first adjustment valve 215 from the initial opening degree XAA to the target opening degree YAA so that the detection result of the first flow meter 212 becomes the target flow rate SAA. . Step S106 corresponds to an example of the "changing step" of the present invention.

Next, in step S107, the first determination unit 2013 determines whether the change from the initial opening degree XAA to the target opening degree YAA is a change in the positive direction or a change in the negative direction. Step S107 corresponds to an example of the "first determination step" of the present invention.

Next, in step S<b>108 , the second determination unit 2014 determines whether the abnormality condition is satisfied based on the plurality of determination results determined by the first determination unit 2013 . Step S108 corresponds to an example of the "second determination step" of the present invention. If the second determination unit 2014 determines in step S108 that the abnormal condition is not satisfied, the process returns to step S101.

On the other hand, if the second determination unit 2014 determines in step S108 that the abnormal condition is satisfied, the process advances to step S109.

Next, in step S109, the second determination unit 2014 issues an alert indicating that an abnormality has occurred in the substrate processing apparatus 100A, and the process ends.

Embodiment 1 of the present invention has been described above. According to the first embodiment, it is determined whether the abnormal condition is satisfied based on a plurality of determination results. As a result, the displacement of the detection result of the first flowmeter 212 can be recognized. Therefore, it can be recognized that because the substrate processing apparatus 100A has been used for a long period of time, the origin of the first flowmeter 212 has shifted or the state of the first supply section 210 has become biased. As a result, it is possible to prevent the substrate W from being processed in a state where the flow rate of the processing liquid LQ in the first pipe 211 and the detection result of the first flow meter 212 are different.

Continuing with reference to FIG. 2, the substrate processing apparatus 100A according to the first embodiment will be described in more detail. The substrate processing apparatus 100A further includes a drainage section 170 and a circulation section 140.

The liquid drain section 170 discharges the processing liquid LQ from the processing tank 110. Specifically, the drain section 170 includes a drain pipe 170a and a valve 170b. A drain pipe 170a is connected to the bottom wall of the inner tank 112 of the processing tank 110. A valve 170b is arranged in the drain pipe 170a. By opening the valve 170b, the processing liquid LQ stored in the inner tank 112 is discharged to the outside through the drain pipe 170a. The discharged treatment liquid LQ is sent to a drainage treatment device (not shown) and treated.

Circulation section 140 includes piping 141, pump 142, heater 143, filter 144, regulating valve 145, and valve 146. Pump 142, heater 143, filter 144, regulating valve 145, and valve 146 are arranged in this order from upstream to downstream of piping 141.

Piping 141 guides processing liquid LQ sent out from processing tank 110 to processing tank 110 again. Specifically, the upstream end of the pipe 141 is connected to the outer tank 114. Therefore, the piping 141 guides the processing liquid LQ from the outer tank 114 to the circulating processing liquid supply member 130. A circulating processing liquid supply member 130 is connected to the downstream end of the pipe 141 . Specifically, the discharge part 131 is connected to the downstream end of the pipe 141.

Pump 142 sends processing liquid LQ from piping 141 to discharge section 131 . Therefore, the discharge unit 131 discharges the processing liquid LQ supplied from the pipe 141. The filter 144 filters the processing liquid LQ flowing through the pipe 141.

The heater 143 heats the processing liquid LQ flowing through the pipe 141 . That is, the heater 143 adjusts the temperature of the processing liquid LQ. The adjustment valve 145 adjusts the opening degree of the pipe 141 to adjust the flow rate of the processing liquid LQ supplied to the discharge section 131. Valve 146 opens and closes piping 141.

[Embodiment 2]
Embodiment 2 of the present invention will be described with reference to FIG. However, matters that are different from Embodiment 1 will be explained, and explanations of matters that are the same as Embodiment 1 will be omitted. In the second embodiment, the abnormal condition indicates that there has been a positive change more than a second predetermined number of times in a predetermined period, or that there has been a negative change more than a second predetermined number of times in a predetermined period. This is different from the first embodiment.

FIG. 6 is a diagram for explaining substrate processing performed by the substrate processing apparatus 100A according to the second embodiment. As shown in FIG. 6, the substrate W is processed based on each of the plurality of recipes. The data DB indicating substrate processing includes information indicating a plurality of recipes RBB. Specifically, the data DB indicating substrate processing includes information indicating the first recipe RBB1, information indicating the second recipe RBB2, information indicating the third recipe RBB3, and information indicating the fourth recipe RBB4. . The first recipe RBB1, the second recipe RBB2, the third recipe RBB3, and the fourth recipe RBB4 are the same recipe. The first recipe RBB1, the second recipe RBB2, the third recipe RBB3, and the fourth recipe RBB4 are executed in this order.

Each of the information indicating the first recipe RBB1, the information indicating the second recipe RBB2, the information indicating the third recipe RBB3, and the information indicating the fourth recipe RBB4 includes information indicating a plurality of recipe steps. Note that at time T1, time T3, time T5, and time T7, the setting unit 2011 outputs open/close signals indicating the open state to the first open/close valve 216 and the open/close valve 217. Further, at time T2, time T4, time T6, and time T8, the setting unit 2011 outputs an open/close signal indicating the closed state to the first open/close valve 216 and the open/close valve 217.

The second determination unit 2014 determines whether or not the abnormal condition is satisfied based on the plurality of determination results determined by the first determination unit 2013. In other words, the second determination unit 2014 determines whether an abnormality has occurred in the substrate processing apparatus 100A based on a plurality of determination results obtained by executing the setting process, the change process, and the first determination process multiple times. Determine whether or not the

Specifically, the abnormal condition indicates that there has been a change in the positive direction more than a second predetermined number of times in a predetermined period, or that there has been a change in a negative direction more than a second predetermined number of times in a predetermined period. The predetermined period is, for example, a period during which the recipe is executed four times. The second predetermined number of times is, for example, three times.

For example, when executing the first recipe RBB1, changing from the initial opening XAA to the target opening YAA is a change in the positive direction, and when executing the second recipe RBB2, changing from the initial opening XAA to the target opening YAA is a positive change. The change to degree YAA is a positive change, and when the third recipe RBB3 is executed, the change from the initial opening degree XAA to the target opening YAA is a negative change, and the fourth recipe RBB4 When executed, if the change from the initial opening degree XAA to the target opening degree YAA is a change in the positive direction, the second determination unit 2014 determines that the abnormal condition is satisfied. As a result, it can be recognized that because the substrate processing apparatus 100A has been used for a long period of time, the origin of the first flowmeter 212 has shifted or the state of the first supply section 210 has become biased. Therefore, the origin of the first flow meter 212 can be adjusted or the state of the first supply section 210 can be checked at appropriate timing.

On the other hand, when executing the first recipe RBB1, the change from the initial opening XAA to the target opening YAA is a change in the positive direction, and when executing the second recipe RBB2, the change from the initial opening XAA to the target opening YAA is a change in the positive direction. The change to degree YAA is a positive change, and when the third recipe RBB3 is executed, the change from the initial opening degree XAA to the target opening YAA is a negative change, and the fourth recipe RBB4 When executed, if the change from the initial opening degree XAA to the target opening degree YAA is a change in the negative direction, the second determination unit 2014 determines that the abnormal condition is not satisfied. As a result, it can be recognized that the origin of the first flowmeter 212 is not shifted or that the state of the first supply section 210 is not biased.

The second embodiment of the present invention has been described above. According to the second embodiment, it is determined whether the abnormal condition is satisfied based on a plurality of determination results. As a result, the displacement of the detection result of the first flowmeter 212 can be recognized. Therefore, it can be recognized that because the substrate processing apparatus 100A has been used for a long period of time, the origin of the first flowmeter 212 has shifted or the state of the first supply section 210 has become biased. As a result, it is possible to prevent the substrate W from being processed in a state where the flow rate of the processing liquid LQ in the first pipe 211 and the detection result of the first flow meter 212 are different.

Further, the abnormal condition indicates that there has been a change in the positive direction more than a second predetermined number of times in a predetermined period, or that there has been a change in a negative direction more than a second predetermined number of times in a predetermined period. As a result, it can be easily recognized that the displacement detected by the first flowmeter 212 is uneven.

[Embodiment 3]
Embodiment 3 of the present invention will be described with reference to FIG. However, matters that are different from Embodiment 1 will be explained, and explanations of matters that are the same as Embodiment 1 will be omitted. Embodiment 3 differs from Embodiment 1 in that the first recipe RCC1 and the third recipe RCC3 are different recipes.

FIG. 7 is a diagram for explaining substrate processing performed by the substrate processing apparatus 100A according to the third embodiment. As shown in FIG. 7, the substrate W is processed based on each of a plurality of recipes. Data DC indicating substrate processing includes information indicating a plurality of recipe RCCs. Specifically, the data DC indicating the substrate processing includes information indicating the first recipe RCC1, information indicating the second recipe RCC2, information indicating the third recipe RCC3, and information indicating the fourth recipe RCC4. . The first recipe RCC1, the second recipe RCC2, the third recipe RCC3, and the fourth recipe RCC4 are executed in this order.

Each of the information indicating the first recipe RCC1, the information indicating the second recipe RCC2, the information indicating the third recipe RCC3, and the information indicating the fourth recipe RCC4 includes information indicating a plurality of recipe steps. Each recipe step N of the information indicating the first recipe RCC1, the information indicating the second recipe RCC2, and the information indicating the fourth recipe RCC4 includes information indicating the target flow rate SAA of the processing liquid LQ. Recipe step N of the information indicating the third recipe RCC3 includes information indicating the target flow rate SCC of the processing liquid LQ.

The second determination unit 2014 determines whether the abnormal condition is satisfied based on the plurality of determination results determined by the first determination unit 2013. In other words, the second determination unit 2014 determines whether the abnormality condition is satisfied based on a plurality of determination results obtained by performing each of the setting step, the change step, and the first determination step multiple times. do. Specifically, the abnormal condition indicates that changes in the positive direction have continued for a first predetermined number of times or more, or that changes in the negative direction have continued for a first predetermined number of times or more. In the third embodiment, the second determination unit 2014 determines whether an abnormality condition is satisfied based on a plurality of determination results executed using the same recipe among the plurality of recipes. Specifically, since recipes other than the third recipe RCC3 and the third recipe RCC3 are different recipes, the determination result for the third recipe RCC3 is excluded.

For example, when executing the first recipe RCC1, changing from the initial opening XAA to the target opening YAA is a change in the positive direction, and when executing the second recipe RCC2, changing from the initial opening XAA to the target opening YAA is a positive change. If the change to degree YAA is a change in the positive direction, and when the fourth recipe RCC4 is executed, if the change from the initial opening degree 2 determination unit 2014 determines that the abnormal condition is satisfied. As a result, even if a different recipe is executed, it can be recognized that the origin of the first flowmeter 212 has shifted or that the state of the first supply section 210 is biased. Therefore, the origin of the first flow meter 212 can be adjusted or the state of the first supply section 210 can be checked at appropriate timing.

[Embodiment 4]
Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view showing the substrate processing apparatus 100A according to the first embodiment. However, matters that are different from Embodiment 1 will be explained, and explanations of matters that are the same as Embodiment 1 will be omitted. Embodiment 4 differs from Embodiment 1 in that it further includes a plurality of supply units.

As shown in FIG. 8, the substrate processing apparatus 100A further includes a second supply section 310, a third supply section 410, a fourth supply section 510, and a fifth supply section 610. Note that the configurations of the second supply section 310, the third supply section 410, the fourth supply section 510, and the fifth supply section 610 are similar to the configuration of the first supply section 210.

The second supply unit 310 includes a second pipe 311 , a second flow meter 312 , a second adjustment valve 315 , a second on-off valve 316 , and an on-off valve 317 . The third supply unit 410 includes a third pipe 411 , a third flow meter 412 , a third adjustment valve 415 , a third on-off valve 416 , and an on-off valve 417 . The fourth supply unit 510 includes a fourth pipe 511 , a fourth flow meter 512 , a fourth adjustment valve 515 , a fourth on-off valve 516 , and an on-off valve 517 . The fifth supply unit 610 includes a fifth pipe 611 , a fifth flowmeter 612 , a fifth adjustment valve 615 , a fifth on-off valve 616 , and an on-off valve 617 . Each of the second adjustment valve 315, the third adjustment valve 415, the fourth adjustment valve 515, and the fifth adjustment valve 615 is an example of a "flow rate adjustment section."

The same or different types of processing liquids LQ flow through the first pipe 211, the second pipe 311, the third pipe 411, the fourth pipe 511, and the fifth pipe 611. For example, hydrofluoric acid (HF) flows through the first pipe 211 as the processing liquid LQ. Hydrochloric acid (HCL) flows through the second pipe 311 as the processing liquid LQ. Hydrogen peroxide (H ₂ O ₂ ) flows through the third pipe 411 as the processing liquid LQ. H ₂ O ₂ flows through the fourth pipe 511 as the processing liquid LQ. Trimethyl-2-hydroxyethylammonium hydroxide (TMY) flows through the fifth pipe 611 as the processing liquid LQ.

The storage unit 202 further stores a second table, a third table, a fourth table, and a fifth table. Each of the second table, the third table, the fourth table, and the fifth table is an example of "opening degree information". The second table shows the relationship between the initial opening degree XAA of the second regulating valve 315 and the target flow rate SAA of the processing liquid LQ. The third table shows the relationship between the initial opening degree XAA of the third regulating valve 415 and the target flow rate SAA of the processing liquid LQ. The fourth table shows the relationship between the initial opening degree XAA of the fourth adjustment valve 515 and the target flow rate SAA of the processing liquid LQ. The fifth table shows the relationship between the initial opening degree XAA of the fifth adjustment valve 615 and the target flow rate SAA of the processing liquid LQ.

The second determination unit 2014 determines whether abnormal conditions are satisfied for each of the first flowmeter 212, the second flowmeter 312, the third flowmeter 412, the fourth flowmeter 512, and the fifth flowmeter 612. . Specifically, the second determination unit 2014 determines whether the first It is determined whether the abnormal condition of the flow meter 212 is satisfied. Further, the second determination unit 2014 determines whether the second flowmeter 312 It is determined whether or not the abnormal condition is satisfied. Further, the second determination unit 2014 determines whether the third flowmeter 412 It is determined whether or not the abnormal condition is satisfied. Further, the second determination unit 2014 determines whether the fourth flowmeter 512 is abnormal based on a plurality of determination results obtained by performing the setting process, the change process, and the determination process multiple times in the fourth supply unit 510. Determine whether the conditions are met. Further, the second determination unit 2014 determines whether the fifth flowmeter 612 It is determined whether or not the abnormal condition is satisfied.

Embodiment 4 of the present invention has been described above. According to the fourth embodiment, the abnormal conditions of each of the first flow meter 212, the second flow meter 312, the third flow meter 412, the fourth flow meter 512, and the fifth flow meter 612 are determined. Determine whether or not it is satisfied. As a result, it can be recognized that the respective origins of the first flow meter 212, the second flow meter 312, the third flow meter 412, the fourth flow meter 512, and the fifth flow meter 612 are shifted. . Therefore, inspection can be carried out appropriately.

The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 8). However, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the spirit thereof. Further, the plurality of components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be configured. Elements may be deleted from the embodiment.

The drawings mainly schematically show each component in order to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each illustrated component may vary depending on the convenience of drawing. The above image may differ from the actual one. Further, the configuration of each component shown in the above embodiment is an example, and is not particularly limited, and it goes without saying that various changes can be made without substantially departing from the effects of the present invention. .

(1) In the third embodiment, since the first recipe RCC1 and the third recipe RCC3 are different recipes, the determination result for the third recipe RCC3 is excluded, but this is not particularly limited. The determination result in the third recipe RCC3 may be added. For example, when executing the first recipe RCC1, changing from the initial opening XAA to the target opening YAA is a change in the positive direction, and when executing the second recipe RCC2, changing from the initial opening XAA to the target opening YAA is a positive change. If the change to degree YAA is a change in the positive direction, and when the third recipe RCC3 is executed, the change from the initial opening degree 2 determination unit 2014 determines that the abnormal condition is satisfied.

(2) In the first determination step, the change from the initial opening degree XAA to the target opening degree YAA is a positive change indicating that the target opening degree YAA is larger than the initial opening degree XAA, and Although it has been determined whether the change is in the negative direction indicating that the opening degree is smaller than the opening degree XAA, this is not particularly limited. A change in the positive direction indicates that the target opening YAA is larger than the initial opening XAA by a predetermined value or more, and a change in the negative direction indicates that the target opening YAA is smaller than the initial opening XAA by a predetermined value or more. Good too.

The present invention is useful in the field of processing substrates.

100A: Substrate processing apparatus 110: Processing tank 211: First piping 212: First flow meter 215: First adjustment valve (flow rate adjustment section)
LQ: Processing liquid

Claims (6)

a processing tank that stores a processing liquid and processes a substrate with the processing liquid;
a flow rate adjustment unit that adjusts the flow rate of the processing liquid in the piping connected to the processing tank by adjusting the opening degree;
A substrate processing method carried out in a substrate processing apparatus including a flow meter that detects the flow rate of the processing liquid in the piping,
a setting step of setting the opening degree of the flow rate adjustment section to the initial opening degree based on opening degree information indicating a relationship between the initial opening degree of the flow rate adjustment section and the target flow rate of the processing liquid;
a changing step of changing the initial opening degree to the target opening degree so that the detection result of the flowmeter becomes the target flow rate;
The change from the initial opening degree to the target opening degree is a positive change indicating that the target opening degree is greater than the initial opening degree, and a negative change indicating that the target opening degree is smaller than the initial opening degree. a first determination step of determining whether it is a change in direction;
A step of determining whether or not an abnormality has occurred in the substrate processing apparatus based on a plurality of determination results obtained by performing each of the setting step, the changing step, and the first determining step multiple times. 2. A substrate processing method, comprising: 2 determination steps. In the second determination step, determine whether an abnormality condition has occurred in the substrate processing apparatus by determining whether an abnormality condition is satisfied based on the plurality of determination results;
2. The substrate processing method according to claim 1, wherein the abnormal condition indicates that the change in the positive direction has continued for a first predetermined number of times or more, or that the change in the negative direction has continued for a first predetermined number or more. In the second determination step, determine whether an abnormality condition has occurred in the substrate processing apparatus by determining whether an abnormality condition is satisfied based on the plurality of determination results;
The abnormal condition indicates that there has been a change in the positive direction more than a second predetermined number of times in a predetermined period, or that there has been a change in the negative direction more than a second predetermined number of times in the predetermined period. Item 1. The substrate processing method according to item 1. processing the substrate based on each of a plurality of recipes;
2. In the second determination step, it is determined whether or not an abnormality has occurred in the substrate processing apparatus based on the plurality of determination results executed with the same recipe among the plurality of recipes. 4. The substrate processing method according to claim 3. a processing tank that stores a processing liquid and processes a substrate with the processing liquid;
a flow rate adjustment unit that adjusts the flow rate of the processing liquid in the piping connected to the processing tank by adjusting the opening degree;
a flow meter that detects the flow rate of the processing liquid in the piping;
a setting section that sets the opening degree of the flow rate adjustment section to the initial opening degree based on opening degree information indicating a relationship between the initial opening degree of the flow rate adjustment section and the target flow rate of the processing liquid;
a changing unit that changes the initial opening degree to the target opening degree so that the detection result of the flowmeter becomes the target flow rate;
The change from the initial opening degree to the target opening degree is a positive change indicating that the target opening degree is greater than the initial opening degree, and a negative change indicating that the target opening degree is smaller than the initial opening degree. a first determination unit that determines whether the direction is changed;
and a second determination section that determines whether or not an abnormality has occurred in the substrate processing apparatus based on a plurality of determination results determined by the first determination section. a plurality of the piping;
a plurality of the flow rate adjustment units;
and a plurality of the flowmeters,
Processing liquids of the same type or different types flow through the plurality of pipes,
The substrate processing apparatus according to claim 5, wherein the second determination unit determines whether or not an abnormality has occurred in each of the plurality of flowmeters.

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