JP2024001800A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2024001800A
JP2024001800A JP2022100686A JP2022100686A JP2024001800A JP 2024001800 A JP2024001800 A JP 2024001800A JP 2022100686 A JP2022100686 A JP 2022100686A JP 2022100686 A JP2022100686 A JP 2022100686A JP 2024001800 A JP2024001800 A JP 2024001800A
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
lead
frame
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022100686A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024001800A5 (https=
Inventor
陽一 下田
Yoichi Shimoda
大蔵 神原
Daizo Kanbara
裕司 重枝
Yuji Shigee
幸治 市川
Koji Ichikawa
裕之 石河
Hiroyuki Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2022100686A priority Critical patent/JP2024001800A/ja
Priority to CN202380047842.XA priority patent/CN119404618A/zh
Priority to PCT/JP2023/020776 priority patent/WO2023248770A1/ja
Priority to KR1020247041195A priority patent/KR20250026176A/ko
Priority to EP23826957.5A priority patent/EP4517848A4/en
Priority to US18/869,060 priority patent/US20250324830A1/en
Priority to TW112122142A priority patent/TW202404919A/zh
Publication of JP2024001800A publication Critical patent/JP2024001800A/ja
Publication of JP2024001800A5 publication Critical patent/JP2024001800A5/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape

Landscapes

  • Led Device Packages (AREA)
JP2022100686A 2022-06-22 2022-06-22 発光装置 Pending JP2024001800A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2022100686A JP2024001800A (ja) 2022-06-22 2022-06-22 発光装置
CN202380047842.XA CN119404618A (zh) 2022-06-22 2023-06-05 发光装置
PCT/JP2023/020776 WO2023248770A1 (ja) 2022-06-22 2023-06-05 発光装置
KR1020247041195A KR20250026176A (ko) 2022-06-22 2023-06-05 발광장치
EP23826957.5A EP4517848A4 (en) 2022-06-22 2023-06-05 Light-emitting device
US18/869,060 US20250324830A1 (en) 2022-06-22 2023-06-05 Light-emitting device
TW112122142A TW202404919A (zh) 2022-06-22 2023-06-14 發光裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022100686A JP2024001800A (ja) 2022-06-22 2022-06-22 発光装置

Publications (2)

Publication Number Publication Date
JP2024001800A true JP2024001800A (ja) 2024-01-10
JP2024001800A5 JP2024001800A5 (https=) 2025-06-11

Family

ID=89379631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022100686A Pending JP2024001800A (ja) 2022-06-22 2022-06-22 発光装置

Country Status (7)

Country Link
US (1) US20250324830A1 (https=)
EP (1) EP4517848A4 (https=)
JP (1) JP2024001800A (https=)
KR (1) KR20250026176A (https=)
CN (1) CN119404618A (https=)
TW (1) TW202404919A (https=)
WO (1) WO2023248770A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240379926A1 (en) * 2021-09-24 2024-11-14 Stanley Electric Co., Ltd. Light-emitting device, and method for producing light-emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150116127A (ko) * 2014-04-04 2015-10-15 엘지디스플레이 주식회사 발광다이오드 장치와 이를 이용한 액정표시장치
JP3219881U (ja) * 2017-12-11 2019-01-31 長華科技股▲ふん▼有限公司 発光素子パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4608294B2 (ja) 2004-11-30 2011-01-12 日亜化学工業株式会社 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
JP2013051296A (ja) * 2011-08-31 2013-03-14 Panasonic Corp 半導体装置用パッケージとその製造方法、および半導体装置
JP6260593B2 (ja) * 2015-08-07 2018-01-17 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法
JP6888709B2 (ja) * 2020-04-09 2021-06-16 日亜化学工業株式会社 発光装置の製造方法及び発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150116127A (ko) * 2014-04-04 2015-10-15 엘지디스플레이 주식회사 발광다이오드 장치와 이를 이용한 액정표시장치
JP3219881U (ja) * 2017-12-11 2019-01-31 長華科技股▲ふん▼有限公司 発光素子パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240379926A1 (en) * 2021-09-24 2024-11-14 Stanley Electric Co., Ltd. Light-emitting device, and method for producing light-emitting device

Also Published As

Publication number Publication date
CN119404618A (zh) 2025-02-07
TW202404919A (zh) 2024-02-01
US20250324830A1 (en) 2025-10-16
EP4517848A1 (en) 2025-03-05
EP4517848A4 (en) 2025-10-01
WO2023248770A1 (ja) 2023-12-28
KR20250026176A (ko) 2025-02-25

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