JP2023553066A5 - - Google Patents

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Publication number
JP2023553066A5
JP2023553066A5 JP2023534597A JP2023534597A JP2023553066A5 JP 2023553066 A5 JP2023553066 A5 JP 2023553066A5 JP 2023534597 A JP2023534597 A JP 2023534597A JP 2023534597 A JP2023534597 A JP 2023534597A JP 2023553066 A5 JP2023553066 A5 JP 2023553066A5
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JP
Japan
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JP2023534597A
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Japanese (ja)
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JP2023553066A (ja
JPWO2022125231A5 (https=
JP7842759B2 (ja
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Priority claimed from PCT/US2021/058357 external-priority patent/WO2022125231A1/en
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Publication of JPWO2022125231A5 publication Critical patent/JPWO2022125231A5/ja
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JP2023534597A 2020-12-08 2021-11-05 低周波rf発生器および関連する静電チャック Active JP7842759B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063122659P 2020-12-08 2020-12-08
US63/122,659 2020-12-08
US202163164450P 2021-03-22 2021-03-22
US63/164,450 2021-03-22
PCT/US2021/058357 WO2022125231A1 (en) 2020-12-08 2021-11-05 Low frequency rf generator and associated electrostatic chuck

Publications (4)

Publication Number Publication Date
JP2023553066A JP2023553066A (ja) 2023-12-20
JP2023553066A5 true JP2023553066A5 (https=) 2024-11-01
JPWO2022125231A5 JPWO2022125231A5 (https=) 2024-11-01
JP7842759B2 JP7842759B2 (ja) 2026-04-08

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ID=81974772

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Application Number Title Priority Date Filing Date
JP2023534597A Active JP7842759B2 (ja) 2020-12-08 2021-11-05 低周波rf発生器および関連する静電チャック

Country Status (4)

Country Link
US (1) US12387909B2 (https=)
JP (1) JP7842759B2 (https=)
KR (1) KR20230114184A (https=)
WO (1) WO2022125231A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12609283B2 (en) * 2020-06-15 2026-04-21 Lam Research Corporation Control of pulsing frequencies and duty cycles of parameters of RF signals
WO2022103765A1 (en) * 2020-11-13 2022-05-19 Lam Research Corporation Systems and methods for radiofrequency signal generator-based control of impedance matching system
KR20230107477A (ko) * 2020-11-18 2023-07-17 램 리써치 코포레이션 임피던스 매칭을 위한 균일도 제어 회로
JP7560214B2 (ja) * 2021-03-11 2024-10-02 東京エレクトロン株式会社 着火方法及びプラズマ処理装置
JP7374961B2 (ja) * 2021-07-27 2023-11-07 株式会社Kokusai Electric 半導体装置の製造方法、基板処理方法、基板処理装置、およびプログラム
JP2025508379A (ja) * 2022-02-18 2025-03-26 ラム リサーチ コーポレーション 中心周波数同調のためのシステムおよび方法
JP7577093B2 (ja) * 2022-06-29 2024-11-01 東京エレクトロン株式会社 プラズマ処理システムおよびプラズマ処理方法
CN119998917A (zh) * 2022-09-28 2025-05-13 应用材料公司 用于等离子体处理系统的宽带供应电路系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011525682A (ja) * 2008-05-14 2011-09-22 アプライド マテリアルズ インコーポレイテッド Rf電力供給のための時間分解チューニングスキームを利用したパルス化プラズマ処理の方法及び装置
US8040068B2 (en) * 2009-02-05 2011-10-18 Mks Instruments, Inc. Radio frequency power control system
US10283330B2 (en) * 2016-07-25 2019-05-07 Lam Research Corporation Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators
US11367597B2 (en) 2018-07-05 2022-06-21 Samsung Electronics Co., Ltd. Electrostatic chuck and plasma processing apparatus including the same
KR102650167B1 (ko) * 2018-07-05 2024-03-22 삼성전자주식회사 정전 척 및 그를 포함하는 플라즈마 처리 장치
US10854427B2 (en) * 2018-08-30 2020-12-01 Applied Materials, Inc. Radio frequency (RF) pulsing impedance tuning with multiplier mode
US12300473B2 (en) * 2019-03-08 2025-05-13 Applied Materials, Inc. Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber

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