JP2023540624A5 - - Google Patents

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Publication number
JP2023540624A5
JP2023540624A5 JP2023516133A JP2023516133A JP2023540624A5 JP 2023540624 A5 JP2023540624 A5 JP 2023540624A5 JP 2023516133 A JP2023516133 A JP 2023516133A JP 2023516133 A JP2023516133 A JP 2023516133A JP 2023540624 A5 JP2023540624 A5 JP 2023540624A5
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JP
Japan
Prior art keywords
cathode
subpulse
subpulses
coating method
bias
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JP2023516133A
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English (en)
Japanese (ja)
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JP2023540624A (ja
JP7901583B2 (ja
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Priority claimed from DE102020124032.5A external-priority patent/DE102020124032A1/de
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Publication of JP2023540624A publication Critical patent/JP2023540624A/ja
Publication of JP2023540624A5 publication Critical patent/JP2023540624A5/ja
Application granted granted Critical
Publication of JP7901583B2 publication Critical patent/JP7901583B2/ja
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JP2023516133A 2020-09-15 2021-09-06 分割パルスを有するコーティング装置及びコーティング方法 Active JP7901583B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020124032.5A DE102020124032A1 (de) 2020-09-15 2020-09-15 Beschichtungsvorrichtung und Beschichtungsverfahren mit unterteilten Pulsen
DE102020124032.5 2020-09-15
PCT/EP2021/074470 WO2022058193A1 (de) 2020-09-15 2021-09-06 Beschichtungsvorrichtung und beschichtungsverfahren mit unterteilten pulsen

Publications (3)

Publication Number Publication Date
JP2023540624A JP2023540624A (ja) 2023-09-25
JP2023540624A5 true JP2023540624A5 (enExample) 2024-07-04
JP7901583B2 JP7901583B2 (ja) 2026-08-06

Family

ID=77913070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516133A Active JP7901583B2 (ja) 2020-09-15 2021-09-06 分割パルスを有するコーティング装置及びコーティング方法

Country Status (6)

Country Link
US (1) US12286705B2 (enExample)
EP (1) EP4193378A1 (enExample)
JP (1) JP7901583B2 (enExample)
CN (1) CN116438623A (enExample)
DE (1) DE102020124032A1 (enExample)
WO (1) WO2022058193A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4442853A1 (en) * 2023-04-03 2024-10-09 TRUMPF Huettinger Sp. Z o. o. Method of operating a plasma process system and a plasma process system
DE102024100342A1 (de) * 2024-01-08 2025-07-10 Kennametal Inc. Verfahren zum Herstellen eines beschichteten Gegenstands und beschichteter Gegenstand

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1434336A4 (en) 2001-09-28 2008-10-08 Shibaura Mechatronics Corp POWER SUPPLY FOR SPUTTER
US9771648B2 (en) * 2004-08-13 2017-09-26 Zond, Inc. Method of ionized physical vapor deposition sputter coating high aspect-ratio structures
SE0402644D0 (sv) 2004-11-02 2004-11-02 Biocell Ab Method and apparatus for producing electric discharges
EP2102888B1 (en) * 2006-12-12 2015-07-29 Oerlikon Advanced Technologies AG Arc suppression and pulsing in high power impulse magnetron sputtering (hipims)
DE102011016681A1 (de) 2011-04-11 2012-10-11 Oerlikon Trading Ag, Trübbach Kohlenstofffunkenverdampfung
WO2013045454A2 (en) 2011-09-30 2013-04-04 Cemecon Ag Coating of substrates using hipims
EP2587518B1 (en) 2011-10-31 2018-12-19 IHI Hauzer Techno Coating B.V. Apparatus and Method for depositing Hydrogen-free ta C Layers on Workpieces and Workpiece
DE102012110041A1 (de) 2012-06-22 2013-12-24 Von Ardenne Anlagentechnik Gmbh Verfahren zur Einstellung des Arbeitspunktes beim Hochenergiesputtern
EP2784799B1 (en) 2013-03-28 2022-12-21 CemeCon AG Dense, hard coatings on substrates using HIPIMS
CA2916640A1 (en) 2013-06-26 2014-12-31 Siegfried Krassnitzer Decorative hipims - hard-material layer
US10000843B2 (en) 2013-09-13 2018-06-19 DePuy Synthes Products, Inc. Coating process for non-conductive substrates and devices made from the coating process
KR101828508B1 (ko) * 2016-07-13 2018-03-29 제이와이테크놀로지(주) Dlc 박막 제조 장치
US20190088457A1 (en) 2017-09-19 2019-03-21 Applied Materials, Inc. Sync controller for high impulse magnetron sputtering

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