JP2023521364A - Infrared temperature measuring device - Google Patents

Abstract

The present invention is an infrared temperature measuring device comprising a camera lens (11) including a lens (111), an infrared camera (10) having an imaging control system, a reflecting mirror (21) and the reflecting mirror (21). a galvanomirror (20) comprising a drive unit for driving it into angular deflection with respect to the infrared camera (10). The reflecting mirror (21) intersects the main optical axis of the lens (111), and the infrared rays from the object are reflected through the reflecting mirror (21), and the imaging control is performed by the camera lens (11). reach the system. In the infrared temperature measurement device, a galvanomirror (20) is placed near the infrared camera (10), and by widening the field angle of the infrared camera (10) through the galvanomirror (20), the infrared camera (10) It helps to obtain a wider range of infrared radiant heat information, and the infrared temperature measurement device is no longer limited to portable type. [Selection drawing] Fig. 1

Description

The present invention relates to the technical field of temperature measurement, and more particularly to an infrared temperature measurement device.

Infrared rays are a type of electromagnetic waves that have the same properties as radio waves and visible light. Infrared has a wavelength of 0.76 to 100 μm, and is between radio waves and visible light. Any object with a temperature above -273°C always emits infrared radiation. In nature, all objects with a temperature above absolute zero constantly emit infrared radiant energy into the surrounding space. The intensity and wavelength distribution of the infrared radiant energy of an object have a very close relationship with its surface temperature. Therefore, by measuring the infrared energy radiated by the object itself, the surface temperature can be measured accurately. Infrared temperature measurement technology plays an important role in the production process, product quality control and monitoring, equipment online fault diagnosis and safety protection, and energy conservation.

The infrared image maker is the most widely known current infrared temperature measurement product, and is mainly used for research and development, industrial inspection, equipment maintenance, fire prevention, night vision, security, etc. there is A general infrared image maker is a device that converts invisible infrared energy emitted from an object into a visible thermal image. Different colors on the thermal image represent different temperatures of the object to be measured. The infrared image maker is a facility that uses infrared imaging technology to detect the infrared radiant heat of an object measured by an infrared sensor, and converts the image of the temperature distribution of the object into a visible image by means of signal processing, photoelectric conversion, etc. . Image Maker accurately quantifies the amount of heat that is actually detected and photographs the entire subject in real time, making it possible to accurately identify hot spots suspected of failure. The color of the image displayed on the screen and the function of hot spot tracking display allow the operator to make an initial judgment of the heat generation status and failure location, and then perform a rigorous analysis, thereby demonstrating high efficiency and accuracy in problem identification. do. Generally speaking, an infrared image maker converts invisible infrared energy emitted by an object into a visible thermal image. Different colors on the thermal image represent different temperatures of the object to be measured. By looking at the thermal image, the overall temperature distribution of the measurement object can be observed, and the next step judgment can be made to study the heat generation situation of the measurement object.

Portable infrared imagers are the most widely used because the field angle of the lenses of prior art infrared imagers is too small, making it difficult to automatically monitor a wider area of the object being inspected. should be aimed at the object to be inspected. Currently, the need for automatic temperature monitoring equipment is increasing, and how to obtain automatic infrared temperature measurement equipment for wide-range monitoring has become a new challenge for the industry.

In order to solve the problem that the conventional infrared temperature measurement device has a small field angle and can only measure the temperature of the object to be measured at a short distance by hand, and cannot monitor the temperature at a long distance and in a wide range, the present invention: The object is to provide an infrared temperature measuring device having the following configuration.

An infrared temperature measurement device, comprising: an infrared camera comprising a camera lens including a lens and an imaging control system; a reflector; and a drive unit for driving the reflector to be angularly deflected with respect to the infrared camera. A galvanometric mirror and the reflector intersect the principal optical axis of the lens, and infrared light from an object is reflected through the reflector and reaches the imaging control system by the lens.

Furthermore, the galvanomirror is a MEMS galvanomirror.

Furthermore, the central axis of the reflector intersects the principal optical axis of the lens.

Further, the field angle of the infrared camera is a, the deflection angle of the galvanomirror is b, the field angle of the infrared temperature measurement device is a+2b, the range of a is 30° to 60°, and the range of b is 20. ° to 40°.

Furthermore, the reflecting mirror is plated with gold on the reflecting surface.

Furthermore, the MEMS galvanomirror is a uniaxial microgalvanomirror or a biaxial microgalvanomirror.

Furthermore, the MEMS galvanomirror is driven by one or more of electrostatic drive, electromagnetic drive, and piezoelectric drive.

Further, the driving unit comprises an electrode and a driving circuit, the driving circuit applies a voltage to the electrode so as to generate an electrostatic force between the electrodes, and the reflector deflects an angle by the electrostatic force. .

Further, the imaging control system comprises an infrared sensor, a signal amplifier circuit, and a data processing unit, wherein the infrared sensor converts infrared radiant heat received from an object into an electric signal, and converts the electric signal into an electric signal. The temperature data is obtained by sequentially passing through the signal amplifying circuit and the data processing unit.

Further, the infrared camera further comprises a communication module, a storage unit, and a display, wherein the temperature data is stored in the storage unit, displayed on the display, sent to a server and/or intelligently via the communication module. The temperature data sent to the terminal are temperature values and/or thermal infrared images.

The advantages of the present invention compared to the prior art are as follows.

In the infrared temperature measuring device of the present invention, a galvano-mirror is placed near the infrared camera, and the field angle of the infrared camera is widened through the galvano-mirror, so that the infrared camera can acquire infrared radiant heat information over a wider range. As a result, the infrared temperature measurement device is no longer limited to portable type, it enables long-distance and wide-range temperature monitoring, and can be applied in different situations.

1 is a schematic diagram showing the configuration of an infrared temperature measuring device according to the present invention; FIG. FIG. 2 is an enlarged schematic view of part A of the infrared temperature measurement device of FIG. 1; 1 is a front view of an infrared camera according to the present invention; FIG. 1 is a cross-sectional view showing a MEMS galvanomirror according to the present invention; FIG. 1 is a schematic diagram showing the internal structure of a MEMS galvanomirror according to the present invention; FIG.

Preferred Embodiments of the Invention Next, the advantages of the invention will be explained in conjunction with the drawings and specific examples.

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the drawings. Where the following description refers to the drawings, the same numbers in different drawings identify the same or similar elements unless otherwise indicated. The embodiments described in the exemplary embodiments below do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present invention as recited in the appended claims.

The terminology used in the invention is for the purpose of describing particular embodiments and is not intended to be limiting of the invention. As used in the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include plural forms unless the context clearly dictates otherwise. Also, as used herein, the term "and/or" is understood to refer to any and all possible combinations of one or more of the associated listed items.

Although the present invention may use terms such as first, second, third, etc. to describe various pieces of information, it is understood that they should not be limited to these terms. These terms are only used to distinguish the same type of information. For example, first information may be referred to as second information, and, similarly, second information may be referred to as first information, without departing from the scope of the present disclosure. Depending on the context, for example, the word "if" as used here could be interpreted as "when...", or "with..." or "depending on the determination". Sometimes it is done.

In describing the present invention, the terms "longitudinal", "lateral", "upward", "downward", "front", "back", "left", "right", "vertical", "horizontal" , "top", "bottom", "inner", "outer", etc. refer to orientations or relationships based on those shown in the drawings to facilitate the description of the invention, For purposes of simplification only, there is no indication or implied that the referenced device or element must have, or be configured and operated in, any particular orientation; cannot be understood as limiting the

In the description of the present invention, unless otherwise specified and limited, the terms "attachment", "communication" and "connection" should be understood broadly and may be, for example, mechanical or electrical connections, A connection within two components, a direct connection, or an indirect connection via an intermediate medium, and the specific meaning of the above terms can be understood by those skilled in the art according to the circumstances.

In the following description, suffixes such as "module", "component", and "unit" are used to designate components for the sole purpose of facilitating the description of the invention and have no specific meaning per se. . As such, the terms "module" and "component" can be used interchangeably.

1-5 illustrate one embodiment of the present invention. As shown in FIG. 1, the infrared temperature measurement device of the present invention includes an infrared camera 10 and a MEMS galvanomirror 20. As shown in FIG.

As shown in FIG. 3, the infrared camera 10 includes a camera lens 11 including a lens 111 and an imaging control system. Preferably, the lens 111 has a filter to allow only infrared rays to enter the camera lens 11 . The imaging control system comprises an infrared sensor, a signal amplifier circuit, and a data processing unit, wherein the infrared sensor converts infrared radiant heat received from an object into an electrical signal, and converts the electrical signal into a signal amplifier circuit. and a data processor to obtain temperature data. Said infrared sensor comprises a heat sensing element, eg a thermistor, capable of converting received infrared radiant heat into a corresponding electrical signal. Preferably, the infrared camera 10 further comprises a communication module, a storage unit, and a display, and the temperature data is stored in the storage unit, displayed on the display, and sent to a server and/or via the communication module. or sent to an intelligent terminal, the temperature data being temperature values and/or thermal infrared images. Preferably, said communication module is a wireless communication module. Said intelligent terminals include mobile terminals such as smart phones, tablets, laptops, palmtop computers, personal digital assistants (PDAs), portable media players, navigation devices, wearable devices, smart bracelets, pedometers, etc., as well as digital televisions, desktop computers, etc. fixed terminals. Preferably, the infrared camera 10 is an infrared imaging camera, and the infrared camera 10 of the present invention can be various infrared thermography cameras already available in the art.

As shown in FIGS. 4 and 5, the MEMS galvanometer mirror 20 includes a PCB board 23, a substrate 24 installed on the PCB board 23, a driving unit installed on the substrate 24, and a driving unit installed on the driving unit. and a protective cover 25 installed outside the reflecting mirror 21 . Preferably, transparent glass is used for the protective cover 25 to protect the reflector 21, the electrodes 221 on the substrate 24, and the drive circuit. The reflective surface of the reflector 21 is coated with gold (Au) or other possible metals to enhance infrared reflectance. The drive unit comprises an electrode 221 and a drive circuit. The reflecting mirror 21 is installed above the electrode 221 . The drive unit is used to drive the reflector 21 to deflect the angle with respect to the infrared camera 10 . The driving circuit applies a voltage to the electrodes 221 to generate an electrostatic field between the electrodes 221, and the reflector 21 is angularly deflected by the electrostatic force. The deflection angle of the reflecting mirror 21 is related to the strength of the electrostatic field, and the greater the strength, the greater the angular response of the deflection. The drive circuit generates different magnitudes of the electrostatic field by adjusting the magnitude of the voltage applied to the electrodes, thereby controlling the reflector to produce a predetermined angular deflection, which is controllable. Realize the angular deflection of the reflector and achieve a wide range of scanning. The MEMS galvanomirror 20 is driven by electrostatic driving. The MEMS galvanometer mirror 20 may be any of various MEMS galvanometer mirrors already available in the art.

It should be noted that in other embodiments, the MEMS galvo mirrors can also be driven by one or more of electrostatic, electromagnetic, or piezoelectric drives. It should be noted that in other embodiments, the MEMS galvanometer mirror 20 can also be replaced by a galvanometer mirror, the driving unit of the galvanometer mirror is a motor, and the reflector of the galvanometer mirror is angularly deflected by the electrode driving. It is to be done.

As shown in FIGS. 1 and 2, the reflector 21 intersects the main optical axis of the lens 111. Preferably, the central axis of the reflector 21 intersects the main optical axis of the lens 111, and the object to be measured Infrared rays from are reflected through the reflector 21 of the MEMS galvanomirror 20 and reach the image control system by the camera lens 11 of the infrared camera 10, and the imaging control system receives radiation from the object. The generated infrared radiant heat is converted into a temperature value and/or an infrared thermal image and displayed on the display of the infrared camera 10 . The field angle of the infrared camera 10 is the angle formed by both edges of the maximum range of the object image of the measurement object that can pass through the camera lens with the camera lens 11 of the infrared camera 10 as the vertex. It is divided into field angle and vertical field angle. The deflection angle of the MEMS galvanomirror 20 is the angle between the non-deflection position of the reflecting mirror 21 and the position when deflection in a certain direction reaches the maximum deflection amount. As shown in FIG. 1, the vertical field angle of the infrared camera is a, where a is between 30° and 60°. The deflection angle of the MEMS galvanomirror 20 is b, and b is 20° to 40°. The MEMS galvano-mirror 20 is a uniaxial MEMS galvano-mirror that rotates along the X-axis. Rotating clockwise and counterclockwise along an axis. Since the reflecting mirror 21 can be deflected in two completely opposite directions from a non-deflecting position, specifically, the enlarged view of the optical path shown in FIG. 1 is a schematic diagram showing the optical path principle in three positional states of the optical path when the three positional states are the positional state when the counterclockwise deflection reaches the maximum amount of deflection, and the position when there is no deflection. , and the position state when the clockwise deflection reaches the maximum amount of deflection. Therefore, as can be seen from FIGS. 1 and 2, with the vertical field angle a of the infrared camera 10 as a reference, the angular deflection of the reflector 21 of the MEMS galvanomirror 20 causes the vertical field angle of the infrared temperature measurement device to be a+2b. Widening, ie, the range of field angles of the infrared thermometer according to the present invention is 70° to 140°.

It should be noted that in another embodiment, if the MEMS galvanometer mirror 20 is a single-axis MEMS galvanometer mirror rotating in the Y-axis direction, the Y-axis is the central axis of the reflecting mirror 21 perpendicularly crossing the X-axis. point to Assuming that the horizontal field angle of the infrared camera 10 is a, the rotation of the reflecting mirror 21 along the Y-axis widens the horizontal field angle a of the infrared temperature measuring device to a+2b.

Note that in another embodiment, if the MEMS galvanomirror 20 is a two-axis galvanomirror, both the vertical and horizontal field angles of the infrared temperature measuring device are spread to a+2b.

As described above, in the infrared temperature measurement apparatus of the present invention, the MEMS galvanomirror 20 is arranged near the infrared camera 10, and by widening the field angle of the infrared camera 10 with the MEMS galvanomirror 20, the infrared temperature measurement apparatus It is not limited to hand-held temperature measurement at a distance, but it can be used for wide-range and long-distance temperature monitoring, which is useful for obtaining information on a wider range of infrared radiant heat, and can be applied to various situations.

Exemplarily, when the reflector 21 in FIG. 1 is in the undeflected position, the angle between the reflector 21 and the main optical axis of the infrared camera 10 is 45°, but it should be noted that In another embodiment, when the reflector 21 of the MEMS galvanomirror 20 is in an undeflected position, the angle between the reflector 21 and the main optical axis of the infrared camera 10 is as shown in FIG. However, by changing the angle between the reflecting mirror 21 and the main optical axis of the infrared camera 10 according to the needs of the measurement scene, the scanning direction of the infrared temperature measuring device according to the present invention can be changed. be able to. Therefore, according to another embodiment of the present invention, there is provided an infrared temperature measurement device, said infrared temperature measurement device comprising a housing, a communication module, an infrared camera provided on the housing, and a housing rotatably connected to the housing. and an angle adjustment module provided on the housing for controlling the overall angle of the galvanometer mirror. Exemplarily, the angle adjustment module includes a control module electrically connected to the communication module, a drive unit electrically connected to the control module, an angle adjustment mechanism connected to the drive unit, Prepare. The control module controls the driving unit to drive the angle adjustment mechanism after receiving an angle adjustment command from the intelligent terminal through the communication module, so that the angle adjustment mechanism moves the entire galvanometer mirror to the infrared camera. to further adjust the angle between the galvanometric mirror reflector and the principal optical axis of the infrared camera when it is in the undeflected position. Exemplarily, the drive unit is a motor, the angle adjustment mechanism is an extension mechanism, and the extension and retraction mechanism pushes and pulls the entire galvanometer mirror by extending and retracting, thereby deflecting the reflecting mirror of the galvanometer mirror. Adjust the angle between the reflecting mirror of the galvanomirror and the main optical axis of the infrared camera when it is in the non-removed position. Alternatively, exemplarily, the drive unit is one or more of electrostatic drive, electromagnetic drive, and piezoelectric drive, and the angle adjustment mechanism is an expansion/contraction mechanism, and the expansion/contraction of the expansion/contraction mechanism causes the The entire galvanomirror can be pushed and pulled to adjust the angle with the main optical axis of the infrared camera when the reflector of the galvanomirror is in an undeflected state. In this embodiment, the angle formed by the reflecting mirror and the main optical axis of the infrared camera is within the range of 0° to 180°. In this embodiment, the infrared temperature measuring device has the following functions: 1. Remotely control the angle between the reflecting mirror and the main optical axis of the infrared camera in an undeflected state by an angle adjustment module, and the scanning direction of the galvanomirror. is roughly adjusted macroscopically. 2. When the angle between the reflecting mirror and the main optical axis of the infrared camera in the undeflected state is a certain value, the infrared temperature measurement device of the present invention can detect the following by the angular deflection of the galvanomirror itself: To further widen the field angle of the infrared temperature measuring device. As described above, the infrared temperature measurement device of this embodiment adjusts the macroscopic angle of the entire galvanomirror by the angle adjustment mechanism, and the angle deflection of the galvanomirror itself widens the field angle of the infrared temperature measurement device, and the temperature The monitoring range can be expanded.

As described above, the infrared temperature measurement device of the present invention has a galvanometer mirror placed near the infrared camera, and by greatly widening the field angle of the infrared camera via the galvanometer mirror, the infrared camera can detect a wider range of infrared radiant heat. The infrared temperature measurement device is no longer limited to portable type, but can be used for wide-range and long-distance temperature monitoring, which can be applied in different situations.

Although specific embodiments of the present invention have been described in detail above, these are merely examples, and the present invention is not limited to the specific embodiments described above. For those skilled in the art, modifications and replacements equivalent to the present invention are also within the scope of the present invention. Therefore, equivalent variations and modifications that do not depart from the spirit and scope of the present invention shall be included in the scope of the present invention.

10 infrared camera 11 camera lens 111 lens 20 MEMS galvanomirror 21 reflector 221 electrode 23 PCB board 24 substrate 25 protective cover

Claims (10)

An infrared temperature measuring device,
an infrared camera comprising a camera lens including a lens and an imaging control system;
a galvo mirror comprising a reflector and a drive unit for driving the reflector to be angularly deflected with respect to the infrared camera;
Infrared temperature measurement, wherein the reflecting mirror intersects the main optical axis of the lens, and infrared rays from an object are reflected through the reflecting mirror and reach the imaging control system through the camera lens. Device.
2. The infrared temperature measuring device according to claim 1, wherein the galvanomirror is a MEMS galvanomirror.
2. The infrared temperature measuring device according to claim 1, wherein the center axis of the reflecting mirror intersects the main optical axis of the lens.
The field angle of the infrared camera is a, the deflection angle of the galvanomirror is b, the field angle of the infrared temperature measurement device is a+2b, the range of a is 30° to 60°, and the range of b is 20° to 40°.
2. The infrared temperature measuring device according to claim 1, wherein the reflecting mirror has a gold-plated reflecting surface.
3. The infrared temperature measuring device according to claim 2, wherein the MEMS galvanomirror is a one-axis microgalvanomirror or a two-axis microgalvanomirror.
3. The infrared temperature measurement device according to claim 2, wherein the MEMS galvanomirror is driven by one or more of electrostatic drive, electromagnetic drive, and piezoelectric drive.
The driving unit comprises an electrode and a driving circuit, the driving circuit applying a voltage to the electrode to generate an electrostatic force between the electrodes, and the reflecting mirror deflecting the angle by the electrostatic force. An infrared temperature measuring device according to claim 7.
The imaging control system includes an infrared sensor, a signal amplifier circuit, and a data processing unit. The infrared sensor converts infrared radiant heat received from an object into an electrical signal, converts the electrical signal into the signal 2. The infrared temperature measuring device according to claim 1, wherein the temperature data is obtained by sequentially passing through the amplifying circuit and the data processing unit.
The infrared camera further comprises a communication module, a storage unit and a display, wherein the temperature data is stored in the storage unit and displayed on the display to a server and/or intelligent terminal via the communication module. 10. An infrared temperature measuring device according to claim 9, characterized in that the transmitted temperature data are temperature values and/or thermal infrared images.

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