CN216645612U - Imaging system for thermal infrared imager and thermal infrared imager - Google Patents
Imaging system for thermal infrared imager and thermal infrared imager Download PDFInfo
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- CN216645612U CN216645612U CN202220067515.3U CN202220067515U CN216645612U CN 216645612 U CN216645612 U CN 216645612U CN 202220067515 U CN202220067515 U CN 202220067515U CN 216645612 U CN216645612 U CN 216645612U
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Abstract
The application relates to the technical field of thermal infrared imagers, and particularly discloses an imaging system for a thermal infrared imager and the thermal infrared imager. The imaging system for the thermal infrared imager comprises a super-surface lens array and an infrared detector, wherein the super-surface lens array comprises a substrate and a plurality of nano-columns vertically arranged on the substrate, the super-surface lens array is used for converging infrared wave signals of an object to be detected, and the infrared wave signals radiated by the object to be detected are converged to the infrared detector through the super-surface lens array. The imaging system is small in size, does not need various optical devices, and is beneficial to miniaturization and portability.
Description
Technical Field
The application relates to the technical field of thermal infrared imagers, in particular to an imaging system for a thermal infrared imager and the thermal infrared imager.
Background
The infrared thermal imager can image the whole target in real time in a 'surface' form, so that an operator can preliminarily judge the heating condition and the fault part by the aid of image colors displayed on a screen and a hotspot tracking and displaying function, and then follow-up analysis is performed, so that the problem is determined efficiently and accurately.
Almost all devices that utilize or emit energy generate heat before they fail. The key to ensuring the operational reliability of electrical and mechanical systems is the efficient management of energy. Now, infrared imaging technology has undoubtedly become the most effective detection tool in the field of preventive maintenance, and it can quickly, accurately and safely find out the fault before the equipment is in fault. The method can be used for timely finding and maintaining one electric contact before the electric contact fails, so that the high cost caused by production shutdown, yield reduction, energy loss, fire and even catastrophic failure can be saved or avoided.
The thermal infrared imager utilizes an infrared detector and an optical imaging objective lens to receive an infrared radiation energy distribution pattern of a detected target and reflect the infrared radiation energy distribution pattern on a photosensitive element of the infrared detector, so that an infrared thermal image is obtained, and the thermal image corresponds to a thermal distribution field on the surface of an object. Conventionally, thermal infrared imagers convert the invisible infrared energy radiated by an object into a visible thermal image and a temperature value that is displayed on a display. The thermal infrared imager can accurately quantify the detected heat and can accurately identify and strictly analyze the heating fault area.
However, thermal infrared imagers in the prior art mainly include two focusing methods, one is reflective focusing composed of multiple normal mirrors, and the reflected light is focused on a sensor, which is called a reflective optical system. The other is a transmission type optical system, which is a lens (fresnel lens) with a plurality of combined surfaces, and the lens is focused on the infrared sensor through the fresnel lens. The two focusing modes have the problems of complicated light path, need of various optical devices, large volume, inconvenience for miniaturization and portability and high requirements on devices and alignment precision.
SUMMERY OF THE UTILITY MODEL
The application provides an imaging system for a thermal infrared imager and the thermal infrared imager, which at least solve the technical problems in the prior art.
In a first aspect, the present application provides an imaging system for a thermal infrared imager.
An imaging system for a thermal infrared imager comprises a super-surface lens array and an infrared detector, wherein the super-surface lens array comprises a substrate and a plurality of nano-columns vertically arranged on the substrate, the super-surface lens array is used for converging infrared wave signals of an object to be detected, and the infrared wave signals radiated by the object to be detected are converged to the infrared detector through the super-surface lens array.
Preferably, when the infrared wave signal is normally incident, the super surface lens array needs to satisfy the following conditions:
wherein, λ is the working wavelength, r is the position coordinate, and f is the focal length of the super-surface lens array;
when the infrared wave signal is inclined, the super-surface lens array needs to meet the following conditions:
wherein, λ is the working wavelength, (x, y) is the position coordinate, and f is the focal length of the super-surface lens.
Preferably, the infrared detector is spaced from the super-surface lens array, and the infrared detector can move towards the super-surface lens array or move away from the super-surface lens array.
Preferably, the shape of the nano-pillar is any one or more of a polygon, a cylinder and a cone.
Preferably, the thermal infrared imager is used in a middle infrared band, any wavelength in the middle infrared band is selected as a design wavelength according to a design target, when the shape of the nano-pillar is a cylinder, the diameter range of the nano-pillar is from half of the design wavelength to 1/20 of the design wavelength, and the height range of the nano-pillar is within two times of the design wavelength.
Preferably, the diameter is selected in the range of 50nm to 700 nm.
In a second aspect, the present application provides a thermal infrared imager.
An infrared thermal imager comprises a display, a signal processing device and any one of the imaging systems mentioned in the first aspect, wherein the signal processing device processes an infrared wave signal received by the infrared detector and then transmits the processed infrared wave signal to the display for image display.
Preferably, the signal processing device is connected with the infrared detector through a wire or a wireless connection.
Compared with the prior art, the application has the advantages that:
(1) the imaging system of the application uses the super-surface objective to replace the traditional objective, so that the volume of the imaging system is greatly reduced;
(2) compared with the traditional thermal infrared imager, the focusing mode of the thermal infrared imager has no problem of complex light path, does not need various optical devices, and is favorable for miniaturization and portability.
Drawings
Fig. 1 is a schematic structural diagram of an imaging system in an embodiment of the present application.
FIG. 2 is a top view of a super surface lens array in an embodiment of the present application.
Description of reference numerals:
1. a super-surface lens array; 11. a substrate; 12. a nanopillar; 2. an object to be measured; 3. an infrared detector.
Detailed Description
The present invention is described in further detail below with reference to the attached drawings.
The embodiment of the application discloses an imaging system for a thermal infrared imager. Referring to fig. 1 and 2, the imaging system includes a super-surface lens array 1 and an infrared detector 3, the super-surface lens array 1 includes a substrate 11 and a plurality of nano-pillars 12 vertically disposed on the substrate 11, the super-surface lens array 1 is configured to converge an infrared wave signal of an object 2 to be detected, and the infrared wave signal emitted by the object 2 to be detected is converged to the infrared detector 3 through the super-surface lens array 1. Wherein, the infrared detector 3 is arranged at a distance from the super surface lens array 1, and the infrared detector 3 can move towards the super surface lens array 1 or move away from the super surface lens array 1.
When an infrared wave signal is normally incident, the super-surface lens array needs to meet the following conditions:
wherein, λ is the working wavelength, (x, y) are the position coordinates, and f is the focal length of the super-surface lens array;
when the infrared wave signal is inclined, the super-surface lens array needs to meet the following conditions:
wherein, λ is the working wavelength, (x, y) is the position coordinate, and f is the focal length of the super-surface lens.
The substrate 11 may be made of an inorganic type or an organic type material. The inorganic material used to form the substrate 11 is any one of silica, chalcogenide glass, and calcium fluoride glass, and the organic material used to form the substrate 11 is any one or more of Polyethylene (PE), polypropylene (PP), and poly (4-methyl-1-pentene) (PMP).
The nano-pillars 12 are made of any one of silicon, germanium, gold, silver and aluminum. The shape of the nano-pillar 12 is any one or more of a polygon, a cylinder and a cone.
In order to improve the light transmittance, at least one layer of antireflection film may be added on the side of the substrate 11 close to the infrared detector 3.
The embodiment of the application further discloses a thermal infrared imager. The thermal infrared imager comprises a display, a signal processing device, any one of the imaging systems, a housing, a light source, and a camera. The signal processing device processes the infrared wave signal received by the infrared detector 3 and then transmits the processed infrared wave signal to the display for image display. One side of the shell is provided with three mounting ports, and the light source, the camera and the super-surface lens array 1 are positioned in the shell and are respectively arranged in one-to-one correspondence with the three mounting ports. The signal processing device is connected with the infrared detector 3 through wires or wirelessly.
The thermal infrared imager is used for the intermediate infrared band, and a user can select any wavelength in the intermediate infrared band as a design wavelength according to a design target. When the shape of the nanopillar 12 is a cylinder, the diameter of the nanopillar 12 ranges from half the design wavelength to 1/20 the design wavelength, and the height of the nanopillar 12 ranges within two times the design wavelength. The diameter of the nano-pillars 12 may be any value from 50nm to 700 nm.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. An imaging system for a thermal infrared imager, comprising: including super surface lens array and infrared detector, super surface lens array includes the basement and a plurality of nanometer post that set up perpendicularly on the basement, super surface lens array is used for assembling the infrared wave signal of the object that awaits measuring, and the infrared wave signal of the object radiation that awaits measuring assembles infrared detector through super surface lens array.
2. The imaging system for thermal infrared imager of claim 1, wherein: when an infrared wave signal is normally incident, the phase of the super-surface lens array needs to meet the following conditions:
wherein, λ is the working wavelength, (x, y) are the position coordinates, and f is the focal length of the super-surface lens array;
when the infrared wave signal is inclined, the super-surface lens array needs to meet the following conditions:
wherein, λ is the working wavelength, r is the position coordinate, and f is the focal length of the super-surface lens.
3. The imaging system for thermal infrared imager of claim 1, wherein: the infrared detector is arranged at a distance from the super surface lens array and can move towards the super surface lens array or move away from the super surface lens array.
4. The imaging system for thermal infrared imager of claim 1, wherein: the shape of the nano-column is any one or more of a polygon, a cylinder and a cone.
5. The imaging system for thermal infrared imager of claim 4, wherein: the thermal infrared imager is used in a medium infrared band, any wavelength in the medium infrared band is selected as a design wavelength according to a design target, when the shape of the nano-column is a cylinder, the diameter range of the nano-column is from half of the design wavelength to 1/20 of the design wavelength, and the height range of the nano-column is within two times of the design wavelength.
6. The imaging system for thermal infrared imager of claim 5, wherein: the diameter is selected within the range of 50nm-700 nm.
7. A thermal infrared imager, characterized in that: the imaging system comprises a display, a signal processing device and the imaging system as claimed in any one of claims 1 to 6, wherein the signal processing device processes infrared wave signals received by the infrared detector and transmits the processed infrared wave signals to the display for image display.
8. The thermal infrared imager of claim 7, wherein: the signal processing device is connected with the infrared detector in a wired or wireless mode.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220067515.3U CN216645612U (en) | 2022-01-04 | 2022-01-04 | Imaging system for thermal infrared imager and thermal infrared imager |
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| CN202220067515.3U CN216645612U (en) | 2022-01-04 | 2022-01-04 | Imaging system for thermal infrared imager and thermal infrared imager |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115046479A (en) * | 2022-08-12 | 2022-09-13 | 杭州纳境科技有限公司 | Superlens detection device and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115046479A (en) * | 2022-08-12 | 2022-09-13 | 杭州纳境科技有限公司 | Superlens detection device and system |
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