JP2023181975A - Control device, program, and control method - Google Patents

Abstract

To obtain a control device capable of suppressing overshooting without deteriorating the performance of a solder processing device.SOLUTION: A control device includes: an acquisition part for acquiring a detection value of temperature detected by a detection part; a specification part for specifying a temperature change trend of a solder processing part, on the basis of history information of the detection value acquired by the acquisition part; a setting part for setting a number of heating pulses to be applied to a heating part, by correcting a reference value using a correction value; a control part for controlling application of the heating pulses to the heating part, on the basis of a setting result of the number of heating pulses according to the setting part; and a storage part for storing the history information. The setting part sets the correction value using correcting information that is different in a situation when the temperature change trend is a temperature rising trend and in a situation when the temperature change trend is a temperature falling trend.SELECTED DRAWING: Figure 3

Description

The present invention relates to a control device, a program, and a control method, and particularly to a control device, program, and control method for controlling a solder processing device.

A temperature control device for a soldering iron according to the background art is disclosed in Patent Document 1. The temperature control device includes a heating pulse generation section that generates heating pulses, a heating section that heats the soldering tip in response to the heating pulse and outputs a sensor signal corresponding to the temperature of the soldering tip, and a heating section that is variable for the heating section. and a controller configured to control the temperature of the solder tip by supplying a number of heating pulses. The control section converts the sensor signal from the heating section into measured temperature data, and determines the variable number of heating pulses in a nonlinear relationship based on the temperature difference between the measured temperature data and the set temperature.

Japanese Patent Application Publication No. 2001-62562

According to the temperature control device disclosed in Patent Document 1, excessive overshoot occurs when the temperature of the solder tip attempts to recover from a temperature lower than the set temperature to the set temperature after the soldering work on the work is finished. there is a possibility.

FIG. 1 is a diagram showing temperature transitions of a solder tip and a workpiece during soldering. In this example, the solder tip temperature setting is 400°C. When the solder tip comes into contact with the workpiece for soldering, the temperature of the tip decreases and the temperature of the workpiece increases. When the solder tip separates from the workpiece in order to move to the next workpiece, the temperature of the tip increases and the temperature of the workpiece decreases. Since the tip temperature is approximately 300°C lower than the set temperature at the time when soldering for the last workpiece is completed, the control unit sets a large value as the variable number of heating pulses based on the temperature difference from the set temperature. Set. Regarding the last work, since there is no next work, the temperature of the solder tip increases rapidly due to the excessive supply of heating pulses. As a result, as shown by the two-dot chain line in FIG. 1, the temperature continues to rise for a while even after the tip temperature exceeds the set temperature of 400° C., resulting in excessive overshoot.

On the other hand, control can be considered to suppress overshoot by setting the overall number of heating pulses to a small number, but such control also reduces the number of heating pulses to raise the tip temperature, which has decreased due to contact with the workpiece. As a result, the performance of the soldering iron deteriorates.

The present invention has been made to solve such problems, and an object thereof is to obtain a control device, a program, and a control method that can suppress overshoot without reducing the performance of a solder processing device. do.

A control device according to one aspect of the present invention includes a solder processing section that processes solder, a heating section that heats the soldering section by applying a heating pulse, and a detection section that detects the temperature of the soldering section. A control device for controlling a solder processing apparatus having: an acquisition unit that acquires a detected value of the temperature detected by the detection unit; and a control device that controls the soldering process based on history information of the detected value acquired by the acquisition unit. a setting section that sets the number of heating pulses to be applied to the heating section by correcting a reference value using a correction value; and a setting section that sets the number of heating pulses applied to the heating section by correcting a reference value using a correction value. a control unit that controls application of the heating pulse to the heating unit based on a setting result, and a storage unit that stores the history information; The correction value is set using different correction information depending on whether the temperature is decreasing or the temperature is decreasing.

According to this aspect, the setting unit sets the correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. Therefore, even if the temperature difference between the set temperature of the soldering section and the detected value is the same, different correction values can be used to set different numbers of heating pulses when the temperature is decreasing and when the temperature is increasing. The number of heating pulses can be set to an optimal value depending on the characteristics during the trend. As a result, it is possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus when the temperature tends to fall.

In the above aspect, the correction information includes an addition table that is stored in the storage unit and indicates an addition value to be added to the reference value, and a subtraction table that indicates a subtraction value to be subtracted from the reference value, and the correction information The value is the addition value indicated by the addition table or the subtraction value indicated by the subtraction table, and the setting unit sets the reference value and the addition value to the reference value according to the temperature change tendency. The number of heating pulses may be set based on the added value or the value obtained by subtracting the subtracted value from the reference value.

According to this aspect, the setting section can set an appropriate number of heating pulses according to the temperature change tendency by referring to the addition table and subtraction table stored in the storage section.

In the above aspect, the addition table and the subtraction table when the set temperature of the soldering section belongs to a first region, and the addition table and the subtraction table when the set temperature of the soldering section belongs to a second region. It would be nice if it was different from the table.

According to this aspect, it is possible to perform appropriate temperature control according to the set temperature of the solder processing section.

In the above aspect, the reference value is a value indicating a reference pulse number that is set based on the difference between the set temperature of the solder processing section and the detected value acquired by the acquisition section; The set temperature of the solder processing section, which is different from the reference value when the set temperature belongs to a first region and the reference value when the set temperature of the solder processing section belongs to a second region, belongs to the first region. The reference value in this case may be different from the reference value in the case where the set temperature of the solder processing section belongs to the second region.

According to this aspect, it is possible to perform appropriate temperature control according to the set temperature of the solder processing section.

In the above aspect, when the temperature change tendency is a temperature increase tendency, the setting unit subtracts the correction value from the reference value, so that the heating pulse number is less than the reference pulse number indicated by the reference value. If the temperature change trend is a temperature decrease trend, it is preferable to set the heating pulse number to be greater than the reference pulse number by adding the correction value to the reference value.

According to this aspect, it is possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus when the temperature tends to fall.

In the above aspect, the reference value is a value indicating a reference pulse number that is set based on the difference between the set temperature of the soldering section and the detected value acquired by the acquisition section, and the setting section a predicted value of the amount of temperature change in the solder processing section predicted when the reference pulse number indicated by the reference value is applied, and an amount of temperature change in the solder processing section calculated from the detected value detected by the detection section; It is preferable to set the correction value according to the difference from the actual measured value.

According to this aspect, it is possible to set an appropriate number of heating pulses with high precision.

In the above aspect, when the temperature change trend is a temperature decrease trend and the difference obtained by subtracting the absolute value of the actual measured value from the absolute value of the predicted value is negative, or when the temperature change trend is a temperature increase trend, If the trend and the difference obtained by subtracting the absolute value of the measured value from the absolute value of the predicted value are positive, the number of heating pulses is greater than the number of reference pulses by adding the correction value to the reference value. is set, and the temperature change trend is a temperature decrease trend and the difference obtained by subtracting the absolute value of the actual measured value from the absolute value of the predicted value is positive, or the temperature change trend is a temperature increase trend and the predicted value If the difference obtained by subtracting the absolute value of the actual measurement value from the absolute value of is negative, the number of heating pulses may be set to be smaller than the reference number of pulses by subtracting the correction value from the reference value.

According to this aspect, it is possible to set an appropriate number of heating pulses with high precision according to the temperature change tendency and the magnitude of the predicted value and the actual measurement value.

In the above aspect, the storage unit stores a reference table indicating the reference value, and the correction information in which the temperature change trend is a temperature decreasing trend and the absolute value of the actual measurement value is determined from the absolute value of the predicted value. a downward addition table indicating the correction value to be set when the difference obtained by subtracting the value is negative, and the temperature change trend is a temperature increase trend and the absolute value of the actual measured value is subtracted from the absolute value of the predicted value an increase addition table indicating the correction value to be set when the difference is positive; and the temperature change trend is a temperature decrease trend, and the difference is obtained by subtracting the absolute value of the actual measured value from the absolute value of the predicted value. is positive, and the temperature change trend is a temperature increase trend, and the difference obtained by subtracting the absolute value of the actual measured value from the absolute value of the predicted value is negative. It is preferable to store an increase subtraction table indicating the correction value set in a certain case.

According to this aspect, by separately providing the descending addition table, the descending subtraction table, the ascending addition table, and the ascending subtraction table, it is possible to perform precise temperature control.

In the above aspect, it is preferable that the correction value of the descending subtraction table is set to zero.

According to this aspect, it is possible to appropriately prevent performance deterioration of the solder processing apparatus when the temperature tends to decrease.

In the above aspect, the setting unit sets the reference value indicating the number of heating pulses in the second control cycle before the first control cycle that is the current control cycle, the detected value, and the history information of the detected value. The number of heating pulses in the first control cycle may be set based on the correction value according to the amount of temperature change of the solder processing section.

According to this aspect, it becomes possible to easily and appropriately set the number of heating pulses.

In the above aspect, when the temperature change tendency is a temperature increase tendency, the setting unit subtracts the correction value from the reference value, so that the heating pulse number is less than the reference pulse number indicated by the reference value. If the temperature change trend is a temperature decrease trend, it is preferable to set the heating pulse number to be greater than the reference pulse number by adding the correction value to the reference value.

According to this aspect, it is possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus when the temperature tends to fall.

In the above aspect, the setting unit is configured to determine the amount of temperature change between the first control cycle and the second control cycle, and the amount of temperature change between the second control cycle and a third control cycle preceding it. It is preferable to set the correction value based on the following.

According to this aspect, since the correction value can be appropriately set, it is possible to improve the accuracy of temperature control.

In the above aspect, the setting unit is configured to determine the temperature change tendency between the first control cycle and the second control cycle, and the temperature change tendency between the second control cycle and the third control cycle. are different from each other, and the amount of temperature change between the first control cycle and the second control cycle is less than the amount of temperature change between the second control cycle and the third control cycle, It is preferable to set the correction value to zero.

According to this aspect, it is possible to suppress the occurrence of erroneous control due to noise or the like.

A program according to one aspect of the present invention includes a solder processing section that processes solder, a heating section that heats the soldering section by applying a heating pulse, and a detection section that detects the temperature of the soldering section. An information processing device installed in a control device that controls a solder processing device is configured to include an acquisition unit that acquires the detected value of the temperature detected by the detection unit, and based on history information of the detected value acquired by the acquisition unit. , a specifying means for specifying a temperature change tendency of the soldering section; a setting section for setting the number of heating pulses to be applied to the heating section by correcting a reference value using a correction value; A program for functioning as a control means for controlling the application of the heating pulses to the heating section based on a setting result of the number of heating pulses, the setting means controlling the temperature change trend to be a temperature increase trend. The correction value is set using different correction information depending on whether the temperature is decreasing or the temperature is decreasing.

According to this aspect, the setting means sets the correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. Therefore, even if the temperature difference between the set temperature of the soldering section and the detected value is the same, different correction values can be used to set different numbers of heating pulses when the temperature is decreasing and when the temperature is increasing. The number of heating pulses can be set to an optimal value depending on the characteristics during the trend. As a result, it is possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus when the temperature tends to fall.

A control method according to one aspect of the present invention includes: a solder processing section that processes solder; a heating section that heats the soldering section by applying a heating pulse; and a detection section that detects the temperature of the soldering section. 2. A control method for controlling a solder processing apparatus comprising: an information processing apparatus that obtains a detected value of the temperature detected by the detection section, and controls the solder processing section based on history information of the obtained detected value. The number of heating pulses to be applied to the heating section is set by identifying the temperature change tendency and correcting the reference value using the correction value, and the number of heating pulses to be applied to the heating section is set based on the result of setting the number of heating pulses. The application of heating pulses is controlled, and in setting the number of heating pulses, the correction value is set using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend.

According to this aspect, in setting the number of heating pulses, a correction value is set using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. Therefore, even if the temperature difference between the set temperature of the soldering section and the detected value is the same, different correction values can be used to set different numbers of heating pulses when the temperature is decreasing and when the temperature is increasing. The number of heating pulses can be set to an optimal value depending on the characteristics during the trend. As a result, it is possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus when the temperature tends to fall.

According to the present invention, it is possible to suppress overshoot without reducing the performance of the solder processing device.

FIG. 3 is a diagram showing the temperature transition of a solder tip and a workpiece during soldering. 1 is a diagram showing a simplified configuration of a solder processing system according to an embodiment of the present invention. FIG. 2 is a diagram showing a simplified configuration of a microcomputer. It is a figure which shows the application control of the heating pulse by a control part. It is a figure which shows an example of a reference table. It is a figure showing an example of an addition table. It is a figure which shows an example of a subtraction table. 5 is a flowchart illustrating processing executed by an information processing unit. FIG. 7 is a diagram illustrating a method of setting the number of heating pulses by a setting unit in the first embodiment. It is a figure which shows an example of the setting result of the number of heating pulses when temperature falls. It is a figure which shows an example of the setting result of the number of heating pulses when temperature rises. FIG. 7 is a diagram illustrating a method of setting the number of heating pulses by a setting unit in the second embodiment. FIG. 7 is a diagram showing a method of setting the number of heating pulses by a setting section in the third embodiment. FIG. 7 is a diagram showing a method of setting the number of heating pulses by a setting section in the third embodiment. It is a figure which shows an example of the setting result of the number of heating pulses when temperature falls. It is a figure which shows an example of the setting result of the number of heating pulses when temperature rises.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that elements given the same reference numerals in different drawings indicate the same or corresponding elements.

FIG. 2 is a diagram showing a simplified configuration of a solder processing system according to an embodiment of the present invention. The solder processing system includes a solder processing device 11 that processes solder, and a control device 12 that controls the solder processing device 11. In the example of this embodiment, the solder processing device 11 is a soldering iron. However, the solder processing device 11 may be a solder remover, a tweezer, or the like.

The soldering device 11 includes an iron tip 21, a soldering tip 22 as a soldering portion that comes into contact with a workpiece for soldering, a temperature sensor 23 that detects the temperature of the soldering tip 22, and a heating pulse HP is applied. and a heater 24 that heats the solder tip 22 by heating the solder tip 22. The temperature sensor 23 is configured using, for example, a thermocouple.

The control device 12 is configured as a station connected to the solder processing device 11 by wire, and amplifies the temperature value of the solder tip 22 detected by a microcomputer (hereinafter abbreviated as "microcomputer") 31 and a temperature sensor 23. and a switching element 33 controlled by the microcomputer 31. The switching element 33 is configured using, for example, an FET. By turning on the switching element 33, a heating pulse HP is applied to the heater 24, thereby heating the solder tip 22. By turning off the switching element 33, the application of the heating pulse HP to the heater 24 is stopped, and thereby heating of the solder tip 22 is stopped. Note that the control device 12 may be mounted within the solder processing device 11 by being miniaturized.

FIG. 3 is a diagram showing a simplified configuration of the microcomputer 31. As shown in FIG. The microcomputer 31 includes an ADC 41 that converts analog signals into digital signals, an information processing section 42, and a storage section 43. The information processing unit 42 is configured using an information processing device such as a CPU. The storage unit 43 is configured using an HDD, SSD, semiconductor memory, or the like.

The information processing unit 42 has an acquisition unit 51, a specification unit 52, a setting unit 53, and a control unit 54 as functions realized by the CPU executing a program read from a computer-readable recording medium such as a ROM. are doing. In other words, the program includes the information processing unit 42 as an information processing device installed in the control device 12, the acquisition unit 51 (acquisition means), the identification unit 52 (identification means), the setting unit 53 (setting means), and a program for functioning as the control unit 54 (control means).

The storage unit 43 stores a lookup table (hereinafter abbreviated as “LUT”) 61 and history information 62.

The acquisition unit 51 acquires the temperature value of the solder tip 22 detected by the temperature sensor 23 via the amplifier 32 and the ADC 41 . Time-series data of detected values acquired by the acquisition unit 51 is stored in the storage unit 43 as history information 62. The identification unit 52 identifies the temperature change tendency of the solder tip 22 based on the history information 62. The temperature change trend includes a temperature decrease trend, a temperature increase trend, and a temperature maintenance trend. The setting unit 53 sets the number of heating pulses to be applied to the heater 24 in each control cycle by correcting the reference value using the correction value. The reference value is a value indicating the number of reference pulses used as a reference for the number of heating pulses to be applied next. The correction value is a value that corrects the reference value based on the temperature change tendency, and includes an addition value that is added to the reference value and a subtraction value that is subtracted from the reference value. The setting unit 53 sets the number of heating pulses based on a reference value, a value obtained by adding an addition value to the reference value, or a value obtained by subtracting a subtraction value from the reference value, according to the temperature change tendency of the solder tip 22. . The setting unit 53 sets a correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. The correction information includes the LUT 61 or an arithmetic expression, and the LUT 61 is used in the following example. The LUT 61 includes an addition table showing a plurality of addition values and a subtraction table showing a plurality of subtraction values. The control unit 54 controls the application of the heating pulse HP to the heater 24 by controlling the switching element 33 in each control cycle based on the setting result of the number of heating pulses by the setting unit 53.

FIG. 4 is a diagram showing application control of the heating pulse HP by the control unit 54. FIG. 4 shows a first control cycle, which is the current control cycle, a second control cycle, which is the previous control cycle, and a third control cycle, which is the previous control cycle. At measurement timing T0 at the beginning of the first control cycle, the switching element 33 is turned off, and the detection value S0 of the temperature sensor 23 is acquired by the acquisition unit 51. At measurement timing T1 at the beginning of the second control cycle, the switching element 33 is turned off, and the detection value S1 of the temperature sensor 23 is acquired by the acquisition unit 51. At measurement timing T2 at the beginning of the third control cycle, the switching element 33 is turned off, and the detection value S2 of the temperature sensor 23 is acquired by the acquisition unit 51.

In the example of this embodiment, the interval between successive measurement timings T is, for example, 0.3 seconds, and a maximum of 37 heating pulses HP can be included in this 0.3 second. That is, the number of heating pulses that can be applied to the heater 24 in each control cycle is an arbitrary set value from a minimum value of 0 to a maximum value of 37, and is calculated by the setting unit 53. If the calculation result of the number of heating pulses exceeds the maximum value, the setting unit 53 sets the number of heating pulses to the maximum value (37 in this example). Similarly, when the calculation result of the number of heating pulses is less than the minimum value, the setting unit 53 sets the number of heating pulses to the minimum value (0 in this example).

Note that the application control of the heating pulse HP by the control unit 54 may be effective after the temperature of the solder tip 22 reaches the set temperature for the first time, except for the start-up immediately after the solder processing apparatus 11 is turned on.

(First embodiment)
In the first embodiment, the reference value is a value indicating the number of reference pulses that is set based on the difference between the set temperature of the solder tip 22 and the detected value (S0) acquired by the acquisition unit 51. Setting the reference value includes reference to the LUT or calculation using an arithmetic expression. In the first embodiment, the setting unit 53 sets the number of heating pulses equal to the reference pulse number when the temperature change tendency is a temperature maintenance tendency, and sets the number of heating pulses equal to the reference pulse number when the temperature change tendency is a temperature increase tendency, from the reference value. Set the number of heating pulses less than the standard number of pulses by subtracting the correction value, and if the temperature change trend is a downward trend, set the number of heating pulses more than the standard number of pulses by adding the additional value to the standard value. Set the number.

In the first embodiment, the setting unit 53 sets the number of heating pulses to be applied next based on the reference value and the correction value according to the temperature change tendency and temperature change amount of the solder tip 22. This makes it possible to easily and appropriately set the number of heating pulses. The setting unit 53 sets a correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. Further, in the first embodiment, the LUT 61 includes a reference table indicating a reference value, an addition table indicating an addition value which is a correction value to be added to the reference value, and a subtraction table indicating a subtraction value which is a correction value to be subtracted from the reference value. It has a table. The setting unit 53 refers to the subtraction table when the temperature change trend is a temperature increase trend, and refers to the addition table when the temperature change trend is a temperature decrease trend.

FIG. 5 is a diagram showing an example of a reference table. FIG. 6 is a diagram showing an example of an addition table. FIG. 7 is a diagram showing an example of a subtraction table.

Referring to FIG. 5, if the temperature difference obtained by subtracting the detected value from the set temperature of the solder tip 22 is, for example, 5°C, 10°C, or 15°C, the number of reference pulses indicated by the reference value is 7 and 20, respectively. , 28 pieces. That is, the smaller the temperature difference between the set temperature and the detected value, the smaller the number of reference pulses is set, and the larger the temperature difference between the set temperature and the detected value, the larger the number of reference pulses is set.

Note that a plurality of reference tables may be provided depending on the temperature range of the set temperature of the solder tip 22. For example, a reference table for a high temperature region and a reference table for a low temperature region may be provided separately. By providing a plurality of reference tables, the reference value when the set temperature belongs to the first region (for example, high temperature region) and the reference value when the set temperature belongs to the second region (for example, low temperature region) are mutually different. different. This makes it possible to perform appropriate temperature control according to the set temperature of the solder tip 22. Note that three (or four or more) reference tables may be provided in accordance with the three temperature regions of high temperature, medium temperature, and low temperature. The same applies to the second embodiment described below.

Referring to FIG. 6, in the case where the temperature change trend of the solder tip 22, that is, the temperature difference obtained by subtracting the detected value S1 of the second control cycle from the detected value S0 of the first control cycle is a negative temperature decreasing trend, When the absolute value of the difference between the value S0 and the detected value S1 is, for example, 5° C., 10° C., and 15° C., the number of added pulses (corrected value) indicated by the added value is 4, 8, and 21, respectively. Referring to FIG. 7, in the case of a temperature increase trend where the temperature difference obtained by subtracting the detected value S1 of the second control cycle from the detected value S0 of the first control cycle is positive, the difference between the detected value S0 and the detected value S1 is For example, when the absolute values are 5° C., 10° C., and 15° C., the number of subtracted pulses (corrected value) indicated by the subtracted value is 3, 5, and 9, respectively.

Note that a plurality of addition tables and subtraction tables may be provided depending on the temperature range of the set temperature of the solder tip 22. For example, an addition table and a subtraction table for a high temperature region and an addition table and a subtraction table for a low temperature region may be provided separately. This makes it possible to perform appropriate temperature control according to the set temperature of the solder tip 22. In this case, only one reference table may be provided, or a plurality of reference tables may be provided depending on the temperature range as described above. The same applies to the second embodiment described below.

FIG. 8 is a flowchart showing the processing executed by the information processing section 42.

First, in step SP01, the acquisition unit 51 acquires the temperature value of the solder tip 22 detected by the temperature sensor 23 via the amplifier 32 and the ADC 41. Time-series data of detected values acquired by the acquisition unit 51 is stored in the storage unit 43 as history information 62.

Next, in step SP02, the identification unit 52 identifies the temperature change tendency of the solder tip 22 based on the history information 62. The specifying unit 52 compares the detected value S0 and the detected value S1, and when the detected value S0 is smaller than the detected value S1, specifies that the temperature change trend is a temperature decreasing trend, and the detected value S0 is smaller than the detected value S1. If the detected value S0 is greater than the detected value S1, the temperature change trend is determined to be a temperature increase trend, and if the detected value S0 is equal to the detected value S1, the temperature change trend is determined to be a temperature maintenance trend. Note that the object to be compared with the detected value S0 is not limited to the detected value S1, but may be the detected value S2, or the average value of the detected value S1 and the detected value S2.

Next, in step SP03, the setting unit 53 sets the number of heating pulses to be applied to the heater 24 in the first control cycle by correcting the reference value using the correction value. The setting unit 53 sets the number of heating pulses based on a reference table indicating the reference pulse number and an addition table or subtraction table according to the amount of temperature change of the solder tip 22.

FIG. 9 is a diagram showing a method for setting the number of heating pulses P by the setting section 53 in the first embodiment.

ΔT is the amount of temperature change obtained by subtracting the detected value S1 from the detected value S0.

P ⁺ is the number of addition pulses set by the addition table.

^P- is the number of subtraction pulses set by the subtraction table.

P is the number of heating pulses set for the first control cycle (number of heating pulses applied next).

P0 is the reference pulse number set by the reference table.

When the temperature tends to be maintained according to condition 1 (ΔT=0), the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference pulse number set by the reference table.

When the temperature tends to rise according to condition 1 (ΔT>0), the setting unit 53 sets the number of heating pulses P by subtracting the number of subtraction pulses set by the subtraction table from the reference number of pulses set by the reference table. (=P0- ^P- ) is set. That is, when the specifying unit 52 specifies that the temperature tends to increase, the setting unit 53 sets the number of heating pulses smaller than the reference pulse number by subtracting the correction value from the reference value. This makes it possible to suppress excess power supply to the heater 24 and appropriately suppress overshoot as shown by the solid line in FIG.

When the temperature tends to fall according to condition 1 (ΔT<0), the setting unit 53 sets the number of heating pulses P by adding the number of addition pulses set by the addition table to the reference number of pulses set by the reference table. (=P0+P ⁺ ) is set. Thereby, additional power is supplied to the heater 24 when a load larger than expected is applied.

Next, in step SP04, the control unit 54 controls the application of the heating pulse HP to the heater 24 by controlling the switching element 33 in each control cycle based on the setting result of the number of heating pulses by the setting unit 53.

According to the first embodiment, the setting unit 53 uses different correction information (for example, an addition table or a subtraction table) depending on whether the temperature change trend of the solder tip 22 is a temperature increase trend or a temperature decrease trend. and set the correction value. Therefore, even if the temperature difference between the set temperature of the solder tip 22 and the detected value is the same, different correction values can be used to set different numbers of heating pulses when the temperature is decreasing and when the temperature is increasing. The number of heating pulses can be set to an optimal value depending on the characteristics during the trend. As a result, it is possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus 11 when the temperature tends to fall.

FIG. 10 is a diagram showing an example of the setting result of the number of heating pulses when the temperature decreases. Compared to the conventional method in which the number of heating pulses is set based on the difference from the set temperature, in the inventive method using a reference value and correction value, when the temperature decreases, the number of heating pulses decreases as the sensor temperature (detected value) decreases. It tends to be set more frequently. As a result, according to the inventive method, deterioration in the performance of the solder processing device 11 is effectively avoided when the temperature decreases.

FIG. 11 is a diagram showing an example of the setting result of the number of heating pulses when the temperature rises. Compared to the conventional method, in the inventive method using a reference value and a correction value, when the temperature rises, the number of heating pulses tends to be set smaller as the sensor temperature rises, compared to the conventional method. As a result, according to the inventive method, overshoot is effectively suppressed when the temperature rises.

(Second embodiment)
In the second embodiment, the reference value is a value indicating the number of reference pulses that is set based on the difference between the set temperature of the solder tip 22 and the detected value (S0) acquired by the acquisition unit 51. Setting the reference value includes reference to the LUT or calculation using an arithmetic expression. In the second embodiment, the setting unit 53 calculates the predicted value of the amount of temperature change of the solder tip 22 predicted when the reference pulse number indicated by the reference value is applied, and the detected value detected by the temperature sensor 23. A correction value is set according to the difference between the amount of temperature change of the solder tip 22 and the actual measurement value.

Specifically, when the temperature change trend is a decreasing trend and the difference obtained by subtracting the absolute value of the actual measured value of the temperature change amount from the absolute value of the predicted value of the temperature change amount is negative ( (if the absolute value of the actual measured value exceeds the absolute value of the predicted value of the amount of temperature change), or the temperature change trend is a rising trend and the absolute value of the actual measured value of the amount of temperature change from the absolute value of the predicted value of the amount of temperature change If the difference obtained by subtracting Set the number of heating pulses higher than . Further, when the temperature change trend is a decreasing trend and the difference obtained by subtracting the absolute value of the actual measured value of the temperature change amount from the absolute value of the predicted value of the temperature change amount is positive (the actual measured value of the temperature change amount is (the absolute value of the predicted value of the temperature change is less than the absolute value of the predicted value of the temperature change), or the temperature change trend is a rising trend and the absolute value of the actual measured value of the temperature change is subtracted from the absolute value of the predicted value of the temperature change. If the difference is negative (if the absolute value of the actual measured value of temperature change exceeds the absolute value of the predicted value of temperature change), by subtracting the correction value from the reference value, the number of pulses will be greater than the reference pulse number. Set a small number of heating pulses. This makes it possible to easily and appropriately set the number of heating pulses. Here, the predicted value is a predicted value of the amount of temperature change, which is how much the detected value of the temperature sensor 23 will change when the reference pulse number is applied. In reality, the detected value after applying the heating pulse is often different from the predicted value due to the heat load applied to the solder tip 22 such as the size of the workpiece or other external factors. A correction value is used depending on the difference from the value. The setting unit 53 sets different correction values depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend, but in reality, a correction value is used depending on the difference between the predicted value and the actual measurement value. Therefore, this also includes cases where the correction value is coincidentally the same in cases where the temperature tends to rise and cases where the temperature tends to fall. In addition, in the second embodiment, the LUT 61 includes a reference table (for example, FIG. 5) indicating a reference value, an addition table (for example, FIG. 6) indicating an addition value that is a correction value to be added to the reference value, and a table (for example, FIG. 6) indicating an addition value that is a correction value to be added to the reference value. and a subtraction table (for example, FIG. 7) showing subtraction values that are correction values.

Referring to FIG. 6, if the absolute value of the temperature difference obtained by subtracting the actual value from the predicted value of the amount of temperature change of the solder tip 22 is, for example, 5°C, 10°C, or 15°C, then the number of additional pulses indicated by the added value (correction values) are 4, 8, and 21, respectively. Referring to FIG. 7, if the absolute value of the temperature difference obtained by subtracting the actual value from the predicted value of the amount of temperature change of the solder tip 22 is, for example, 5°C, 10°C, or 15°C, then the number of subtracted pulses indicated by the subtracted value (correction values) are 3, 5, and 9, respectively.

Note that the addition table may be provided separately as an addition table for a temperature decreasing tendency (a decreasing addition table) and an addition table for a temperature increasing tendency (a rising addition table). The downward addition table is used when the identifying unit 52 identifies a decreasing trend in temperature and the difference obtained by subtracting the absolute value of the actual measured value of the temperature change from the absolute value of the predicted value of the temperature change is negative (temperature change Indicates the correction value set when the absolute value of the actual measured value of the quantity is greater than the absolute value of the predicted value. The increase addition table is used when the identification unit 52 identifies a temperature increase trend and the difference obtained by subtracting the absolute value of the actual measured value of the temperature change amount from the absolute value of the predicted value of the temperature change amount is positive (temperature change Indicates the correction value set when the absolute value of the actual measured value of the quantity is smaller than the absolute value of the predicted value.

Similarly, the subtraction table may be separately provided as a subtraction table for a temperature decreasing trend (a decreasing subtraction table) and a subtraction table for a temperature increasing trend (a rising subtraction table). The descending subtraction table is used when the identification unit 52 identifies a decreasing trend in temperature and the difference obtained by subtracting the absolute value of the actual measured value of the temperature change from the absolute value of the predicted value of the temperature change is positive (temperature change Indicates the correction value set when the absolute value of the actual measured value of the quantity is smaller than the absolute value of the predicted value. The increase subtraction table is used when the identification unit 52 identifies a temperature increase trend and the difference obtained by subtracting the absolute value of the actual measured value of the temperature change from the absolute value of the predicted value of the temperature change is negative (temperature change Indicates the correction value set when the absolute value of the actual measured value of the quantity is greater than the absolute value of the predicted value.

By separately providing a descending addition table, a descending subtraction table, an ascending addition table, and an ascending subtraction table, it becomes possible to perform fine temperature control.

Note that all correction values in the descending subtraction table may be set to zero. In this case, even if the actual value of the amount of temperature change is smaller than the predicted value due to a downward trend in temperature, the number of heating pulses will be equal to the number of reference pulses regardless of the difference between the predicted value and the actual value of the amount of temperature change. When the temperature is on a downward trend, there is no concern about overshoot, and the intention is not to make any correction to lower the output. This makes it possible to appropriately prevent performance deterioration of the solder processing device 11 when the temperature tends to decrease.

The process executed by the information processing unit 42 according to the second embodiment is shown by the flowchart in FIG. The processing in steps SP01, SP02, and SP04 is the same as in the first embodiment.

In step SP03, the setting unit 53 sets the number of heating pulses to be applied to the heater 24 in the first control cycle by correcting the reference value using the correction value. The setting unit 53 determines the number of heating pulses based on a reference table indicating the number of reference pulses and an addition table or a subtraction table indicating a correction value according to the difference between the predicted value and the measured value of the amount of temperature change of the solder tip 22. Set.

FIG. 12 is a diagram showing a method of setting the number of heating pulses P by the setting section 53 in the second embodiment.

ΔT is the amount of temperature change obtained by subtracting the detected value S1 from the detected value S0.

ΔTup is the absolute value of the actual measured value of the amount of temperature change (amount of temperature rise) obtained by subtracting the detected value S1 from the detected value S0 when the temperature tends to increase. The setting unit 53 calculates the measured value of the amount of temperature change based on the detected value history information 62.

ΔTupP is the absolute value of the predicted value of the amount of temperature change (amount of temperature rise) predicted at measurement timing T0 after the detected value S1 when the temperature tends to increase. The setting unit 53 calculates a predicted value of the amount of temperature change based on the history information of the set value of the number of heating pulses in the past control cycle, the set temperature of the solder tip 22, and the history information 62 of the detected value. Note that the predicted value of the amount of temperature change may be obtained based on a predetermined prediction table. The prediction table indicates a predicted value of temperature change when a reference pulse number is applied to a specific type of soldering iron tip, and is created in advance by experiment, simulation, or the like. In this case, different prediction tables may be used for the case where the temperature tends to rise and the case where the temperature tends to fall.

ΔTdown is the absolute value of the actual measured value of the amount of temperature change (amount of temperature decrease) obtained by subtracting the detected value S1 from the detected value S0 when the temperature tends to decrease.

ΔTdownP is the absolute value of the predicted value of the amount of temperature change (amount of temperature decrease) predicted at measurement timing T0 after the detected value S1 when the temperature tends to decrease.

P ⁺ is the number of addition pulses set by the addition table.

^P- is the number of subtraction pulses set by the subtraction table.

P is the number of heating pulses set for the first control cycle (number of pulses applied next).

P0 is the reference pulse number set by the reference table.

When the temperature tends to be maintained according to condition 1 (ΔT=0), the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference pulse number set by the reference table.

If the temperature tends to increase according to condition 1 (ΔT>0), the setting unit 53 calculates ΔTupP−ΔTup. If the calculation result is negative (<0) according to condition 2, the setting unit 53 determines that the temperature rise is larger than predicted, and calculates the subtraction pulse set by the subtraction table from the reference pulse number set by the reference table. By subtracting the number, the number of heating pulses P (=P0−P ⁻ ) is set. In other words, when the identifying unit 52 identifies a temperature increase trend and the absolute value of the actual measured value of the temperature change is larger than the absolute value of the predicted value of the temperature change, the setting unit 53 subtracts the correction value from the reference value. By doing so, the number of heating pulses is set smaller than the reference number of pulses. This makes it possible to suppress excess power supply to the heater 24 and appropriately suppress overshoot as shown by the solid line in FIG. Further, if the calculation result is positive (>0) according to condition 2, the setting unit 53 determines that the temperature rise is smaller than predicted, and sets the number of pulses set by the addition table to the reference pulse number set by the reference table. The number of heating pulses P (=P0+P ⁺ ) is set by adding the number of additional pulses. This ensures that the solder tip 22 returns to the set temperature quickly and reliably. Further, when the calculation result is zero according to condition 2, the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference number of pulses set by the reference table.

The setting unit 53 calculates ΔTdownP−ΔTdown when the temperature tends to decrease according to condition 1 (ΔT<0). If the calculation result is negative (<0) according to condition 2, the setting unit 53 determines that the temperature drop is larger than predicted, and adds the addition pulse set according to the addition table to the reference pulse number set according to the reference table. By adding the numbers, the number of heating pulses P (=P0+P ⁺ ) is set. Thereby, additional power is supplied to the heater 24 when a load larger than expected is applied. Further, if the calculation result is positive (>0) according to condition 2, the setting unit 53 determines that the temperature drop is smaller than predicted, and calculates the number of pulses set by the subtraction table from the reference pulse number set by the reference table. The number of heating pulses P (=P0−P ⁻ ) is set by subtracting the number of subtraction pulses. This suppresses the supply of heat other than the heat required to restore the temperature of the soldering tip 22, and suppresses the accumulation of excess heat in the soldering tip 21. Further, when the calculation result is zero according to condition 2, the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference number of pulses set by the reference table.

According to the second embodiment, in addition to the effects obtained by the first embodiment, the setting unit 53 sets a correction value according to the difference between the predicted value and the measured value of the amount of temperature change of the solder tip 22. , it becomes possible to set an appropriate number of heating pulses with high precision.

(Third embodiment)
In the third embodiment, the reference value is a value indicating the number of heating pulses in the second control cycle, which is the previous control cycle.

In the third embodiment, the setting unit 53 sets the reference value indicating the number of heating pulses in the second control cycle and the correction value according to the amount of temperature change of the solder tip 22 based on the detected value and the history information of the detected value. Based on this, the number of heating pulses in the first control cycle is set. This makes it possible to easily and appropriately set the number of heating pulses.

Specifically, when the temperature change tendency of the solder tip 22 is a temperature increase tendency, the setting unit 53 sets the number of heating pulses smaller than the reference pulse number by subtracting the correction value from the reference value. Further, when the temperature change tendency of the solder tip 22 is a temperature decreasing tendency, the setting unit 53 sets the number of heating pulses larger than the reference pulse number by adding a correction value to the reference value. Further, in the third embodiment, the LUT 61 includes an addition table (for example, FIG. 6) indicating an addition value and a subtraction table (for example, FIG. 7) indicating a subtraction value.

The process executed by the information processing unit 42 according to the third embodiment is shown by the flowchart in FIG. The processing in steps SP01, SP02, and SP04 is the same as in the first embodiment.

In step SP03, the setting unit 53 sets the number of heating pulses to be applied to the heater 24 in the first control cycle by correcting the reference value using the correction value. The setting unit 53 performs the first control based on the reference value indicating the number of heating pulses in the second control cycle and the correction value according to the amount of temperature change of the solder tip 22 based on the detected value and the history information of the detected value. Set the number of heating pulses in the cycle.

FIGS. 13 and 14 are diagrams showing a method for setting the number of heating pulses P by the setting section 53 in the third embodiment.

Ta is the amount of temperature change obtained by subtracting the detected value S1 of the second control cycle from the detected value S0 of the first control cycle.

Tb is the amount of temperature change obtained by subtracting the detected value S2 of the third control cycle from the detected value S1 of the second control cycle.

Tc is the amount of temperature change obtained by subtracting the detected value S2 of the third control cycle from the detected value S0 of the first control cycle.

Pa ⁺ is the number of addition pulses set by the addition table based on the amount of temperature change Ta.

Pa ^- is the number of subtraction pulses set by the subtraction table based on the temperature change amount Ta.

Pb ⁺ is the number of addition pulses set by the addition table based on the amount of temperature change Tb.

Pb ^- is the number of subtraction pulses set by the subtraction table based on the temperature change amount Tb.

P is the number of heating pulses set for the first control cycle (number of pulses applied next).

P0 is the number of heating pulses (reference pulse number) set in the second control cycle.

When the temperature tends to be maintained according to condition 1 (Ta=0), the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference number of pulses.

When the temperature tends to increase according to condition 1 (Ta>0), the setting unit 53 determines whether Tb is positive (>0), negative, or 0 (≦0) according to condition 2. When Tb is positive, Tc is positive or 0 (≧0) according to condition 3. When Tc is positive or 0 (that is, when it is the topmost characteristic in FIG. 14), the setting unit 53 subtracts the total value of Pa ⁻ and Pb ⁻ from P0 to calculate the number of heating pulses P( =P0-( ^Pa- + ^Pb- )). That is, when the specifying unit 52 specifies that the temperature tends to increase, the setting unit 53 sets the number of heating pulses smaller than the reference pulse number by subtracting the correction value from the reference value. This makes it possible to suppress excess power supply to the heater 24 and appropriately suppress overshoot. When Tb is negative or 0, the setting unit 53 determines whether Tc is positive, 0 (≧0), or negative (<0) according to condition 3. When Tc is positive or 0 (that is, when it is the second characteristic from the top in FIG. 14), the setting unit 53 subtracts Pa ⁻ from P0 to set the number of heating pulses P (=P0 − Pa ⁻ ). Set. This makes it possible to suppress excess power supply to the heater 24 and appropriately suppress overshoot. If Tc is negative (that is, the third characteristic from the top in FIG. 14), the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference number of pulses. In other words, the setting unit 53 determines that the temperature change tendency between the first control cycle and the second control cycle and the temperature change tendency between the second control cycle and the third control cycle are different from each other, and If the amount of temperature change between the first control cycle and the second control cycle is less than the amount of temperature change between the second control cycle and the third control cycle, the correction value is set to zero. As a result, it becomes possible to suppress the occurrence of erroneous control caused by noise or the like. Thereby, the correction value can be appropriately set based on the degree of the tendency of temperature rise or temperature fall compared to a plurality of cycles ago from the previous history, rather than depending on the immediately preceding detected value.

When the temperature tends to decrease according to condition 1 (Ta<0), the setting unit 53 determines whether Tb is negative (<0), positive, or 0 (≧0) according to condition 2. When Tb is negative, Tc is negative or 0 (≦0) according to condition 3. When Tc is negative or 0 (that is, the fourth characteristic from the top in FIG. 14), the setting unit 53 sets the number of heating pulses P by adding the total value of Pa ⁺ and Pb ⁺ to P0. (=P0+(Pa ⁺ +Pb ⁺ )) is set. Thereby, additional power is supplied to the heater 24 when a large load is applied. When Tb is positive or 0, the setting unit 53 determines whether Tc is negative, 0 (≦0), or positive (>0) according to condition 3. If Tc is negative or 0 (that is, the fifth characteristic from the top in FIG. 14), the setting unit 53 sets the number of heating pulses P (=P0+Pa ⁺ ) by adding Pa ⁺ to P0. do. Thereby, additional power is supplied to the heater 24 when a load larger than expected is applied. If Tc is positive (that is, the sixth characteristic from the top in FIG. 14), the setting unit 53 sets the number of heating pulses P (=P0) equal to the reference number of pulses. As a result, it becomes possible to suppress the occurrence of erroneous control caused by noise or the like. Thereby, the correction value can be appropriately set based on the degree of the tendency of temperature rise or temperature fall compared to a plurality of cycles ago from the previous history, rather than depending on the immediately preceding detected value.

Similarly to the first embodiment, the third embodiment also makes it possible to suppress overshoot when the temperature tends to rise without reducing the performance of the solder processing apparatus 11 when the temperature tends to fall.

FIG. 15 is a diagram showing an example of the setting result of the number of heating pulses when the temperature decreases. Compared to the conventional method in which the number of heating pulses is set based on the difference from the set temperature, in the inventive method using a reference value and correction value, when the temperature decreases, the number of heating pulses decreases as the sensor temperature (detected value) decreases. It tends to be set more frequently. As a result, according to the inventive method, deterioration in the performance of the solder processing device 11 is effectively avoided when the temperature decreases.

FIG. 16 is a diagram showing an example of the setting result of the number of heating pulses when the temperature rises. Compared to the conventional method, in the inventive method using a reference value and a correction value, when the temperature rises, the number of heating pulses tends to be set smaller as the sensor temperature rises, compared to the conventional method. As a result, according to the inventive method, overshoot is effectively suppressed when the temperature rises.

Note that if the temperature of the solder tip 22 returns to the set temperature during control, the number of heating pulses (reference value) related to the previous control cycle may be reset to zero.

Furthermore, a plurality of addition tables and subtraction tables may be provided depending on the temperature range of the set temperature of the solder tip 22.

In addition, the setting unit 53 used the current detection value S0, the previous (one previous) detection value S1, and the previous (two previous) detection value S2 to set the number of heating pulses P; Previous (or earlier) detected values may also be used. Instead of the first and second previous detected values, the second and fourth previous detected values may be used. An average value of a plurality of detected values may be used.

11 Solder processing device 12 Control device 22 Solder tip 23 Temperature sensor 24 Heater 42 Information processing section 43 Storage section 51 Acquisition section 52 Specification section 53 Setting section 54 Control section 61 LUT
62 History information

Claims (15)

A control device for controlling a solder processing apparatus having a solder processing section that processes solder, a heating section that heats the solder processing section by applying a heating pulse, and a detection section that detects the temperature of the solder processing section. hand,
an acquisition unit that acquires a detected value of the temperature detected by the detection unit;
an identifying unit that identifies a temperature change tendency of the soldering unit based on history information of the detected value acquired by the acquiring unit;
a setting unit that sets the number of heating pulses to be applied to the heating section by correcting a reference value using a correction value;
a control unit that controls application of the heating pulse to the heating unit based on the setting result of the number of heating pulses by the setting unit;
a storage unit that stores the history information;
Equipped with
The setting unit is a control device that sets the correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. The correction information includes an addition table indicating an addition value to be added to the reference value and a subtraction table indicating a subtraction value to be subtracted from the reference value, which is stored in the storage unit,
The correction value is the addition value indicated by the addition table or the subtraction value indicated by the subtraction table,
The setting unit sets the number of heating pulses based on the reference value, a value obtained by adding the added value to the reference value, or a value obtained by subtracting the subtracted value from the reference value, according to the temperature change tendency. The control device according to claim 1, wherein the control device sets: The addition table and the subtraction table when the temperature setting of the solder processing section belongs to a first region are different from the addition table and the subtraction table when the temperature setting of the soldering processing section belongs to a second region. , The control device according to claim 2. The reference value is a value indicating a reference pulse number that is set based on the difference between the set temperature of the solder processing section and the detected value acquired by the acquisition section,
The reference value when the set temperature of the solder processing section belongs to a first region is different from the reference value when the set temperature of the solder processing section belongs to a second region. Control device. The setting section includes:
If the temperature change trend is a temperature increase trend, subtracting the correction value from the reference value to set the number of heating pulses smaller than the reference pulse number indicated by the reference value;
The control device according to claim 1, wherein when the temperature change trend is a temperature decrease trend, the number of heating pulses is set to be greater than the number of reference pulses by adding the correction value to the reference value. The reference value is a value indicating a reference pulse number that is set based on the difference between the set temperature of the solder processing section and the detected value acquired by the acquisition section,
The setting unit is configured to calculate the solder temperature from a predicted value of a temperature change amount of the solder processing unit predicted when the reference pulse number indicated by the reference value is applied, and the detected value detected by the detection unit. The control device according to claim 1, wherein the correction value is set according to a difference between the temperature change amount of the processing section and an actual measurement value. The setting section includes:
If the temperature change trend is a temperature decrease trend and the difference obtained by subtracting the absolute value of the actual measured value from the absolute value of the predicted value is negative, or if the temperature change trend is a temperature increase trend and the absolute value of the predicted value is negative. If the difference obtained by subtracting the absolute value of the actual measurement value is positive, the number of heating pulses is set to be greater than the number of reference pulses by adding the correction value to the reference value;
If the temperature change trend is a temperature decrease trend and the difference obtained by subtracting the absolute value of the actual measured value from the absolute value of the predicted value is positive, or if the temperature change trend is a temperature increase trend and the absolute value of the predicted value is positive. According to claim 6, when the difference obtained by subtracting the absolute value of the actual measurement value is negative, the number of heating pulses is set to be smaller than the number of reference pulses by subtracting the correction value from the reference value. control device. The storage unit includes:
a reference table indicating the reference value;
As the correction information,
a downward addition table indicating the correction value to be set when the temperature change trend is a temperature decrease trend and the difference obtained by subtracting the absolute value of the actual measurement value from the absolute value of the predicted value is negative;
an increase addition table indicating the correction value to be set when the temperature change trend is a temperature increase trend and the difference obtained by subtracting the absolute value of the actual measurement value from the absolute value of the predicted value is positive;
a downward subtraction table indicating the correction value to be set when the temperature change trend is a temperature decrease trend and the difference obtained by subtracting the absolute value of the actual measurement value from the absolute value of the predicted value is positive;
an increase subtraction table that indicates the correction value that is set when the temperature change trend is a temperature increase trend and the difference obtained by subtracting the absolute value of the actual measurement value from the absolute value of the predicted value is negative;
The control device according to claim 7, wherein the control device stores:. The control device according to claim 8, wherein the correction value of the descending subtraction table is set to zero. The setting unit is configured to control the soldering process based on the reference value indicating the number of heating pulses in a second control cycle prior to the first control cycle that is the current control cycle, the detected value, and the history information of the detected value. The control device according to claim 1, wherein the number of heating pulses in the first control cycle is set based on the correction value according to the amount of temperature change of the part. The setting section includes:
If the temperature change trend is a temperature increase trend, subtracting the correction value from the reference value to set the number of heating pulses smaller than the reference pulse number indicated by the reference value;
11. The control device according to claim 10, wherein when the temperature change trend is a temperature decrease trend, the number of heating pulses is set to be greater than the number of reference pulses by adding the correction value to the reference value. The setting unit is based on the amount of temperature change between the first control cycle and the second control cycle, and the amount of temperature change between the second control cycle and a third control cycle preceding it. 11. The control device according to claim 10, wherein the control device sets the correction value. The setting unit is configured such that the temperature change tendency between the first control cycle and the second control cycle is different from the temperature change tendency between the second control cycle and the third control cycle. , and when the amount of temperature change between the first control cycle and the second control cycle is less than the amount of temperature change between the second control cycle and the third control cycle, the correction value is 13. The control device according to claim 12, wherein the control device is set to zero. Equipped in a control device that controls a solder processing apparatus that has a solder processing section that processes solder, a heating section that heats the solder processing section by applying a heating pulse, and a detection section that detects the temperature of the solder processing section. information processing equipment,
acquisition means for acquiring the detected value of the temperature detected by the detection unit;
identification means for identifying a temperature change tendency of the soldering section based on history information of the detected values acquired by the acquisition means;
Setting means for setting the number of heating pulses to be applied to the heating section by correcting the reference value using the correction value;
A control means for controlling application of the heating pulse to the heating section based on a result of setting the number of heating pulses by the setting means;
It is a program to function as
The setting means sets the correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend. A control method for controlling a solder processing apparatus having a solder processing section that processes solder, a heating section that heats the solder processing section by applying a heating pulse, and a detection section that detects the temperature of the solder processing section. hand,
The information processing device
obtaining a detection value of the temperature detected by the detection unit;
Identifying a temperature change trend of the soldering part based on the acquired history information of the detected values,
setting the number of heating pulses to be applied to the heating section by correcting the reference value using the correction value;
Controlling the application of the heating pulse to the heating section based on the setting result of the number of heating pulses,
In setting the number of heating pulses, the control method sets the correction value using different correction information depending on whether the temperature change trend is a temperature increase trend or a temperature decrease trend.

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