JP2023174734A - vapor deposition mask - Google Patents

Abstract

To provide a vapor deposition mask that makes a mask body and a frame body to less likely to deform using a frame, inhibits the mask body from deviating from a correct position, and improves accuracy relating to vapor deposition.SOLUTION: A vapor deposition mask includes: a mask body with which a number of independent vapor deposition through-holes can be provided at a predetermined pattern; and a frame body disposed integrally with the mask body. An isolating processing part is provided in the frame body. The isolating processing part includes a plurality of through-holes arrayed in a plurality of lines. The through-holes are provided with cut-out parts in ends in a direction in which the through-holes are arrayed in the plurality of lines. The isolating processing part has a shape in which removal parts are adjusted while being increased and decreased in accordance with deformable property of each part of the frame body.SELECTED DRAWING: Figure 1

Description

The present invention relates to a vapor deposition mask, and can be applied, for example, to a vapor deposition mask for an organic EL device used when forming a light emitting layer of an organic EL device by a vapor deposition mask method.

A vapor deposition mask method is often used as a method for forming a light emitting layer of an organic EL (Electroluminescence) element. In this vapor deposition mask method, in order to vapor-deposit an organic light-emitting substance at a desired position on a substrate made of a transparent material such as glass, a vapor deposition mask is used in which a portion of the substrate corresponding to the vapor deposition site is removed and perforated.

In a vapor deposition apparatus that performs vapor deposition, a vapor deposition mask is installed in a state where it is correctly aligned with a substrate to be vapor deposited, and vapor deposition is performed. However, during vapor deposition, heating is generally performed to create an environment in the vapor deposition apparatus that allows vapor deposition, so if the thermal deformation states of the vapor deposition mask and the glass substrate differ, the relative positional relationship between the vapor deposition mask and the substrate will change. However, there is a problem in that the required precision of the light emitting layer to be formed cannot be satisfied.

In recent years, by adopting a mask structure in which a reinforcing frame made of a material with a thermal expansion coefficient equivalent to that of the substrate to be evaporated, such as glass, or a material with a low thermal expansion coefficient is attached to the outer periphery of a thin mask body, Even if you use a mask body made of a material with a thermal expansion coefficient different from that of the deposition substrate, the shape of the mask body will change following the expansion of the frame that has the same thermal expansion coefficient as the deposition substrate, or the mask body will change shape due to the expansion of the frame body, which has a thermal expansion coefficient similar to that of the deposition substrate, or the mask body will change shape due to the expansion of the frame body, which has a thermal expansion coefficient similar to that of the deposition substrate. This vapor deposition method ensures that the mask body does not change shape as it is suppressed by the frame body, which ensures alignment accuracy of the mask body with respect to the substrate to be evaporated when the temperature rises in the evaporation equipment, and allows formation of a light-emitting layer on the substrate to be evaporated with high precision. Masks are suggested.

An example of such a conventional vapor deposition mask is one disclosed in Japanese Patent Laid-Open No. 2005-15908.

Japanese Patent Application Publication No. 2005-15908

The conventional vapor deposition mask has the configuration shown in the above-mentioned patent document, and can suppress relative deformation between the mask and the substrate due to the difference in coefficient of thermal expansion, and can prevent significant deterioration in the positional accuracy of the vapor deposited product.

However, there is a demand for higher precision in the market, and there is a need to further suppress the occurrence of misalignment due to mask displacement. However, in the case of the conventional combination structure of the mask body and frame, it is necessary to make the reinforcing frame thin, so there is a limit to how high the strength can be achieved with such a thin frame, and the mask body side It was not possible to ensure the rigidity of the frame alone to avoid even the slightest deformation due to the effects of stress. For this reason, with conventional mask structures, it is difficult to keep the displacement of the mask body within the tolerance range that is becoming stricter as precision increases, and the problem is that yields inevitably deteriorate due to misalignment of the deposited product. .

The present invention has been made to solve the above-mentioned problems, and is a vapor deposition method that makes it difficult for the mask body and frame to deform with the frame, suppresses deviation of the mask body from the correct position, and improves the accuracy of vapor deposition. The purpose is to provide masks.

A vapor deposition mask according to the disclosure of the present invention includes a mask body provided with a large number of independent vapor deposition holes in a predetermined pattern, and a frame body disposed integrally with the mask body, wherein the frame body includes: It has a holding frame portion that is connected and integrated with the mask main body, and a reinforcing frame portion that is disposed integrally with the holding frame portion.

As described above, according to the disclosure of the present invention, a reinforcing frame portion for reinforcing the holding frame portion of the frame body that holds the mask body is provided, and the rigidity of the frame body against the stress of the mask body is increased. , the mask body can be fixedly installed in the evaporation equipment with the deviation of each part from its original position suppressed, and the alignment between the mask and the substrate to be evaporated can be ensured, allowing precise evaporation at the appropriate position on the evaporation target substrate. can be done.

Further, in the vapor deposition mask according to the disclosure of the present invention, at least one of through holes or recesses may be formed regularly or irregularly in the boundary portion between the holding frame portion and the reinforcing frame portion in the frame body, as necessary. A cutting section is provided in which a plurality of grooves are arranged in a line or grooves are arranged in a continuous line.

As described above, according to the disclosure of the present invention, the separation processing part is provided at the boundary between the holding frame part and the reinforcing frame part of the frame body, and is used as a processing target position when separating the reinforcing frame part from the holding frame part. As a result, when it is no longer necessary to ensure the rigidity of the frame by the reinforcing frame, such as after positioning and fixing the frame holding frame and the mask body to the vapor deposition equipment side, the reinforcing frame can be removed from the holding frame. The separation process can be easily and effortlessly performed, allowing a smooth transition to the vapor deposition process using the vapor deposition equipment, and the reinforcing frame can be removed without affecting the shape of the holding frame that remains as a frame or the reinforcement state of the mask body by the holding frame. It can be separated and the subsequent vapor deposition process can proceed without any problems.

Further, in the vapor deposition mask according to the disclosure of the present invention, if necessary, the mask main body is integrated with the holding frame portion of the frame body in a state where stress that tends to contract inward with respect to the frame body remains. Then,
The frame body has an expected deformation amount of each part of the frame body calculated in advance assuming a state in which a force based on the stress is applied to the frame body, and the separation processing section is a separation processing section of the frame body. The larger the expected amount of deformation at the location, the smaller the ratio of the size of the portion removed as the through hole, recess, or groove at that location to the remaining portion that is not removed. .

As described above, according to the disclosure of the present invention, the amount of expected deformation of each part of the frame body due to the force based on the stress of the mask body is estimated in advance, and the portion to be removed in the cutting part of the frame body is In places where the expected amount of deformation of the frame due to the stress of the mask body is large, the ratio of the removed portion to the remaining part that will not be removed is reduced, while at places where the expected amount of deformation of the frame due to the stress of the mask body is small, the removal is By setting the ratio of the removed part to the remaining part that will not be removed to be large, and making the cutting part have a shape that increases or decreases the removed part depending on the deformability of each part of the frame, the stress of the mask body can be used to In areas where the body is expected to undergo significant deformation, the ratio of removed parts such as recesses in the cutting section is reduced to ensure sufficient strength of the frame, while in areas where the stress of the mask body is less likely to be applied to the frame, separation is done. By increasing the proportion of the removed part of the processed part, it is possible to increase the processing efficiency when cutting off the reinforcing frame part while ensuring appropriate strength, making it possible to quickly separate the reinforcing frame part and proceeding smoothly to the vapor deposition process. Can be migrated.

Further, in the vapor deposition mask according to the disclosure of the present invention, the cutting-off processed portion may be formed in a groove continuously arranged in a linear manner at the boundary between the holding frame portion and the reinforcing frame portion, and in the groove. The shape is a combination of a plurality of through holes drilled at predetermined intervals in the direction of continuous grooves, and each through hole has an acute notch at the end in the direction in which the grooves continue. It is.

As described above, according to the disclosure of the present invention, the cutting part of the frame body has a combination structure of a groove and a through hole, and the through hole is partially extended in the continuous direction of the groove to form an acute-angled notch. By causing this, when the reinforcing frame portion of the frame body is separated by cutting the separation processing portion, a cut surface is easily generated along the separation processing portion starting from the notch portion, and It is difficult for burrs to remain on the holding frame side, and does not adversely affect various operations associated with the vapor deposition process.

Further, a method for installing a vapor deposition mask according to the disclosure of the present invention is a method for installing a vapor deposition mask in which a vapor deposition mask is installed at a preset position in a vapor deposition apparatus, in which the vapor deposition mask is
A plurality of mask bodies in which a large number of independent vapor deposition holes are provided in a predetermined pattern are held by a holding frame that can be integrally connected to the outer periphery of the mask body, and an arrangement that continuously surrounds the outside of the holding frame. It is manufactured by arranging a frame body each having a reinforcing frame part integrally arranged with the frame part so as to surround the outside of the mask main body, and a frame for supporting the vapor deposition mask in the vapor deposition apparatus is used for vapor deposition. The holding frame part of the frame of the mask is fixed integrally, and the reinforcing frame part is separated and removed from the holding frame part of the frame in a state fixed to the frame.

As described above, according to the disclosure of the present invention, a vapor deposition mask in which a plurality of mask bodies are connected to a frame body whose strength is increased by a reinforcing frame portion disposed outside a holding frame portion to make it difficult to deform, is attached to a frame of a vapor deposition apparatus. By fixing the holding frame part of the frame body, it is possible to obtain a state in which it is supported by the vapor deposition apparatus.
The vapor deposition mask can be installed in the vapor deposition equipment while the frame body suppresses deformation of the mask body.
It prevents displacement of the mask body, ensures alignment between the mask and the substrate to be deposited, improves deposition accuracy, and improves the yield of deposited products. Furthermore, by separating the reinforcing frame part from the holding frame part after fixing the frame body to the vapor deposition apparatus, the reinforcing frame part does not become an obstacle to the process after fixing and supporting the vapor deposition mask.
Vapor deposition using a vapor deposition device can proceed without any problems.

Further, in the method for installing a vapor deposition mask according to the disclosure of the present invention, the frame body has a rectangular outer shape, and when the vapor deposition mask is in a completed state, outside the rectangular frame body at each position of the frame body and the mask body. The first step is to measure the displacement in two directions parallel to each side of the periphery, and if the inward displacement at a predetermined location does not fall within the preset tolerance range, a frame outside the location where the maximum displacement occurred is measured. a second step of applying a predetermined outward pulling force parallel to the direction of maximum displacement to the outer circumferential part of the body as a force of a magnitude such that the displacement of the part falls within the permissible range; and a second step of applying the pulling force. a third step of measuring the displacement of the frame body and the mask body in each position in the two directions again in the state;
After the measurement, if there is a new point where the inward displacement does not fall within the above tolerance range, while maintaining the state where the tensile force is applied, move the frame outside the point where the new maximum displacement has occurred. a fourth step of further applying a predetermined outward tensile force parallel to the direction of the new maximum displacement to the outer circumference of the body as a force of such a magnitude that the displacement of the said part falls within the permissible range; If you measure a situation where the outward displacement does not fall within the preset tolerance range due to the application of other tensile forces later on at any point inside the outer periphery of the frame where force is being applied, , a fifth step of adjusting to reduce the tensile force applied to the outer periphery of the frame outside the said location so that the displacement of the location falls within an allowable range, and each of the third to fifth steps are performed. The measurement is repeated until the measured displacement at each position of the frame and the mask body falls within the allowable range, and the holding frame of the vapor deposition mask frame whose displacement falls within the allowable range is attached to the frame while applying a tensile force to the frame. The frame body is fixed, and after the frame body is fixed, the application of tensile force to the frame body is released.

As described above, according to the disclosure of the present invention, the process of applying a tensile force from the outside to a predetermined location of the frame that can be significantly deformed due to the stress of the mask body to keep the displacement within an allowable range is performed on the frame and the mask. Repeat this until the displacement falls within the allowable range at any position on the main body, then fix the holding frame of the frame to the frame while leaving the frame and mask main body in the same state where the displacement falls within the allowable range, and remove the evaporation mask. By releasing the tensile force applied to the frame after installing the mask in the evaporator, we can correct the displacement of the mask body from its correct position due to the deformation of the frame by applying an external force to the frame. By fixing the frame body to the frame while reliably preventing deformation using a method of suppressing deformation, it is possible to ensure an appropriate installation state of the vapor deposition mask in the vapor deposition apparatus, and further improve the precision related to vapor deposition.

Further, the method for manufacturing a vapor deposition mask according to the disclosure of the present invention includes a plurality of metal mask bodies provided with a large number of vapor deposition holes, and a metal frame body disposed surrounding the outside of the mask body. , a method for manufacturing a vapor deposition mask, including a first electroforming step of forming a primary electrodeposition layer corresponding to the mask body by metal electroforming at a plurality of predetermined positions on a matrix; a frame arrangement step of arranging the frame on the matrix while aligning the primary electrodeposition layer so that it is located within the plurality of openings; and performing a predetermined removal process on the frame; A cutting section is provided in the frame, in which at least one of the through holes or recesses is arranged in a plurality of lines in a regular or irregular manner, or the groove is arranged in a continuous linear manner. Frame processing process,
in a predetermined range spanning from a part or all of the surface of the frame to the outer peripheral surface of the primary electrodeposition layer,
a second electroforming step in which a metal layer is formed by electroforming and the frame body and the primary electrodeposition layer are integrally connected through the metal layer so as not to be separated; and the primary electrodeposition layer is integrated from the matrix; The method includes a peeling step of peeling off the frame and the metal layer.

As described above, according to the disclosure of the present invention, a primary electrodeposition layer serving as a mask body is formed on a matrix, a frame is arranged to be located around this primary electrodeposition layer, and the frame is further coated from the surface of the frame. In the process of forming a metal layer for connecting the frame and the primary electrodeposited layer in a predetermined range extending over the outer peripheral surface of the primary electrodeposition layer, the frame is subjected to a predetermined removal process to remove the separation processing part. By providing
In a state where a vapor deposition mask is obtained by peeling the primary electrodeposited layer, the frame body, and the metal layer together from the matrix, a region for holding the inner mask body together with the frame body separated by the processing part for separation; If you make the area outside the cutting part of the frame sufficiently large, the frame will be able to resist the force applied from the mask body to the frame based on the stress of the mask body. This increases the rigidity, and allows the deposition mask to be fixedly installed in the deposition equipment while suppressing the deviation of each part of the mask body from its original position, ensuring alignment between the mask and the substrate to be deposited, and improving the deposition process. Vapor deposition can be performed accurately at appropriate positions on the substrate. In addition, after the evaporation mask is fixedly installed on the evaporation equipment side, if it is no longer necessary to ensure the rigidity of the frame by the area outside the separation processing section of the frame, it is possible to perform the separation processing at the separation processing section. The outer region of the frame can be easily and effortlessly separated, allowing a smooth transition to the vapor deposition process using the vapor deposition device, and the outer region can be separated without affecting the shape of the inner region that remains as the frame or the holding state of the mask body. The parts can be separated and the subsequent deposition process can proceed without any problems.

FIG. 1 is a schematic plan view of a vapor deposition mask according to a first embodiment of the present invention. FIG. 1 is an explanatory diagram of a main part configuration of a vapor deposition mask according to a first embodiment of the present invention. 1 is a schematic cross-sectional view of a main part of a vapor deposition mask according to a first embodiment of the present invention. It is a top view of the frame in the vapor deposition mask based on the 1st Embodiment of this invention. FIG. 3 is a partially enlarged view of a separation processing portion of the frame in the vapor deposition mask according to the first embodiment of the present invention. FIG. 3 is an explanatory diagram of a primary pattern resist forming process in manufacturing a vapor deposition mask according to the first embodiment of the present invention. FIG. 3 is an explanatory diagram of a primary electrodeposition layer forming process in manufacturing a vapor deposition mask according to a first embodiment of the present invention. FIG. 3 is an explanatory diagram of a secondary pattern resist forming process in manufacturing a vapor deposition mask according to the first embodiment of the present invention. FIG. 3 is an explanatory diagram of a metal layer forming step and a separated state of a vapor deposition mask and a matrix in manufacturing a vapor deposition mask according to a first embodiment of the present invention. FIG. 2 is an explanatory diagram of a process of mounting a vapor deposition mask on a manufacturing apparatus frame according to a first embodiment of the present invention. FIG. 3 is an explanatory diagram of a state in which the vapor deposition mask according to the first embodiment of the present invention is fixed to the manufacturing apparatus frame. FIG. 2 is an explanatory diagram of a reinforcing frame portion separated from a frame body in a vapor deposition mask according to a first embodiment of the present invention. It is a schematic structure explanatory drawing of another manufacturing apparatus frame in which the vapor deposition mask based on the 1st Embodiment of this invention is installed. FIG. 7 is an explanatory diagram of a state in which the vapor deposition mask according to the first embodiment of the present invention is fixed to another manufacturing apparatus frame. FIG. 7 is an explanatory diagram of a schematic arrangement of another separation processing portion of the frame in the vapor deposition mask according to the first embodiment of the present invention. FIG. 6 is an explanatory diagram of a process of removing a frame body in a method of manufacturing a vapor deposition mask according to a second embodiment of the present invention. FIG. 7 is an explanatory diagram of a deformed state of a frame body in a state in which production of a vapor deposition mask according to a third embodiment of the present invention is completed; FIG. 7 is an explanatory diagram of a state in which a tensile force is applied in a first stage to a frame when a vapor deposition mask according to a third embodiment of the present invention is installed in a manufacturing apparatus. FIG. 7 is an explanatory diagram of a state in which a second stage of tensile force is applied to the frame when the vapor deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 7 is an explanatory diagram of a state in which a third stage of tensile force is applied to the frame when the vapor deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 7 is an explanatory diagram of a state in which a fourth stage of tensile force is applied to the frame when the vapor deposition mask according to the third embodiment of the present invention is installed in the manufacturing apparatus. FIG. 7 is an explanatory diagram of a fifth stage of applying a tensile force to the frame when installing the vapor deposition mask in the manufacturing apparatus according to the third embodiment of the present invention. FIG. 7 is an explanatory diagram of a state in which a tensile force is applied in a sixth stage to a frame when a vapor deposition mask according to a third embodiment of the present invention is installed in a manufacturing apparatus. FIG. 7 is an explanatory diagram of a state in which a tensile force is applied in a seventh stage to a frame when a vapor deposition mask according to a third embodiment of the present invention is installed in a manufacturing apparatus.

(First embodiment of the present invention)
EMBODIMENT OF THE INVENTION Hereinafter, the vapor deposition mask based on the 1st Embodiment of this invention is demonstrated based on FIG. 1 thru|or 12. In this embodiment, an example in which the present invention is applied to a vapor deposition mask for an organic EL element will be described.

In each of the above figures, the vapor deposition mask 1 according to the present embodiment includes a plurality of mask bodies 2 provided with a large number of vapor deposition holes 8 in a predetermined pattern, and a frame 3 disposed surrounding the outside of the mask body 2.
The configuration includes the following.

The mask body 2 is formed into a sheet shape by electroforming using nickel, a nickel alloy such as nickel-cobalt, or other electrodeposited metal as a material, and is provided with a large number of independent evaporation holes 8 in a predetermined pattern through which the evaporation material passes. It is a configuration that can be used.

The mask body 2 includes an internal pattern forming area 2a provided with a large number of vapor deposition holes 8, and an outer peripheral edge 2b integrally joined to the frame 3 via a metal layer 7 formed by electroforming. . In the pattern forming region 2a, a large number of vapor deposition holes 8 form a vapor deposition pattern 9 for forming a light emitting layer.

The thickness of the mask body 2 is preferably in the range of 10 to 100 μm, and in this embodiment, the thickness is 20 μm.
It was set to μm. Each vapor deposition through hole 8 has a rectangular shape with, for example, a front-to-back length dimension of 70 μm and a left-right width dimension of 170 to 200 μm in plan view. A matrix-like vapor deposition pattern 9 is formed by forming a row of through-hole groups, and a plurality of rows are arranged in parallel in the left-right direction.

The frame 3 is a frame-shaped rectangular thin plate that is thicker than the mask body 2, and is arranged on the outer periphery of the mask body 2 for reinforcement of the mask body 2, and is attached to the mask body through the metal layer 7. It is configured to be connected and integrated with 2. Specifically, the frame 3 includes a holding frame 4 that is connected and integrated with the outer peripheral edge of the mask body 2, and is integrally arranged with the holding frame 4 so as to continuously surround the outside of the holding frame 4. It has a reinforcing frame part 5.

The frame 3 is made of a material with a low coefficient of thermal expansion, such as Invar material, which is a nickel-iron alloy, or Super Invar material, which is a nickel-iron-cobalt alloy. The frame body 3 is connected and integrated with the outer peripheral edge 2b of the pattern forming area 2a of the mask body 2 so as not to be separated from each other by a metal layer 7 formed by electroforming.

When an Invar material or a Super Invar material is used as the material of the frame 3, the coefficient of thermal expansion is extremely small, so that dimensional changes in the mask body 2 due to thermal effects in the vapor deposition process can be suppressed well. That is, when the mask body 2 is made of a material such as nickel, which has a coefficient of thermal expansion larger than that of general glass that is the substrate to be deposited (not shown), Due to the difference in expansion coefficient, when the vapor deposition mask 1 is aligned with the substrate to be vapor-deposited at room temperature, there will be no deviation between the hole position relative to the substrate and the vapor-deposition position of the vapor-deposited substance during actual vapor deposition. Due to the small coefficient of thermal expansion of the frame 3 that holds the mask body 2, dimensional and shape changes caused by the expansion of the mask body 2 when the temperature rises are well suppressed, and alignment accuracy at room temperature is improved from that during vapor deposition. It can be maintained well even when the temperature rises.

Note that, as the material of the frame 3, a material having a low coefficient of thermal expansion close to that of glass, which is the substrate to be deposited, such as glass or ceramic, can also be used. In this case, conductivity is imparted to at least the surface of these materials.

As shown in FIG. 4, the frame 3 is formed into a rectangular frame shape made of a thin plate and has six openings 3a corresponding to the mask bodies 2, and holds six mask bodies 2 with one frame 3. ing. That is, the frame body 3 has six openings 3a arranged in alignment on its plate surface, and one mask body 2 is attached to each opening 3a. The width of the frame 3 at the wide outer peripheral part where the reinforcing frame part 5 is located is, for example, about 60 mm, of which the width of the holding frame part 4 is set to about 10 mm, and the width of the reinforcing frame part 5 is set to about 50 mm. . Further, the thickness of the frame 3 is, for example, about 0.1 to 5.0 mm, and in this embodiment, it is set to 1.0 mm.

A linearly continuous groove 3c is provided at the boundary between the holding frame portion 4 and the reinforcing frame portion 5 in the frame body 3.
A cutting portion 3b having a shape that combines a plurality of through holes 3d is provided. The width of the cutting section 3b is set to, for example, about 2 mm.

This separation processing part 3b includes a groove 3c that is continuously arranged in a linear manner at the boundary between the holding frame part 4 and the reinforcing frame part 5, and a plurality of holes formed in this groove 3c at predetermined intervals in the groove continuous direction. The shape is combined with the provided through hole 3d. Among these, the through hole 3d is provided with an acute-angled notch 3e at the end in the direction in which the groove 3c continues in the through hole.

Note that the position of the tip (acute corner) of the notch portion 3e is preferably set to be shifted toward the holding frame portion 4 or the reinforcing frame portion 5 from the center position in the width direction of the cutting portion 3b. It is more preferable to shift it toward the holding frame portion 4 on the mask main body 2 side.

The cutting portion 3b may be provided by etching the frame 3, or may be provided by removing unnecessary portions by machining or laser processing.
Note that the cutting portion 3b is not limited to a through hole 3d having a cross-sectional shape with a cutout portion 3e, but may be a through hole having a simple rectangular or circular cross section. In addition to the shape of a combination of grooves 3c and through holes 3d, the separation processing portion 3b may have a configuration in which grooves without through holes are provided at predetermined intervals in a continuous linear arrangement. In addition,
The cutting portion 3b may also be configured such that at least one of through holes and recesses is arranged in a plurality of lines regularly or irregularly.

The frame 3 with the separation processing part 3b provided in advance is subjected to the manufacturing process of the vapor deposition mask 1, and after the primary electrodeposition layer 15 which becomes the mask body is formed, the frame 3 is coated around the primary electrodeposition layer 15. In addition, an unprocessed frame 3 is placed on the mother mold 10 so that the frame 3 is placed on the mother mold 10, and a cutting part is formed on the frame 3 in the middle of the manufacturing process. 3b may also be provided.

In the vapor deposition mask 1, a primary pattern resist 14 is provided on the surface of a matrix 10 in correspondence with a portion where the primary electrodeposition layer 15 is not placed, and then a primary pattern resist 14 is formed on the matrix 10 by electroforming of an electrodeposited metal. After forming the deposited layer 15, placing the frame 3 so as to surround the primary electrodeposition layer 15, and further forming the secondary pattern resist 18 covering the portion of the primary electrodeposition layer 15 corresponding to the pattern forming area 2a. A metal layer 7 is formed by electroforming so as to cover the surface of the frame 3 and the surface of the outer peripheral edge 2b of the primary electrodeposition layer 15, and the primary electrodeposition layer 15 and the frame 3 are bonded through this metal layer 7. It is manufactured by separating the primary electrodeposited layer 15, the frame 3, and the metal layer 7 from the matrix 10, which are integrally connected to each other so as not to separate from each other.

The master mold 10 used in the manufacturing process of the vapor deposition mask 1 according to the present embodiment is made of a conductive material such as stainless steel, brass, or steel, and is attached to the mask body until it is separated in the manufacturing process of the vapor deposition mask. The primary pattern resist 14, the primary electrodeposition layer 15, the secondary pattern resist 18, and the metal layer 7 are formed on the surface side at each stage of the vapor deposition mask manufacturing process. It is formed. When forming the primary electrodeposited layer 15 and the metal layer 7, electricity is applied through the matrix 10, so that the primary electrode is electroformed to the part of the surface of the matrix 10 that is not covered with the resist and can be energized. A deposited layer 15 or metal layer 7 will be formed.

The mother mold 10 can also be made of a material with a low coefficient of thermal expansion, such as 42 alloy (42% nickel-iron alloy), Invar (36% nickel-iron alloy), SUS430, or the like. In addition, the matrix may be one in which a metal film made of a conductive metal such as chromium or titanium is formed on the surface of an insulating substrate such as a glass plate or a resin plate.

In the manufacturing process of the vapor deposition mask 1, once the metal layer 7 is formed on the master mold 10 by electroforming (Fig.
(B)), and the matrix 10 is separated and removed from these (see FIG. 9(C)). When the matrix 10 is made of stainless steel, it is preferable to use a method of physically peeling it off from the vapor deposition mask side by applying force, and when the matrix 10 is made of another metal material, it is preferably removed using a chemical solution. It is preferable to use an etching method that dissolves and removes the film. In the case of etching, an etching solution having a selective etching property that dissolves the matrix 10 but does not damage the materials forming the primary electrodeposited layer 15, the frame 3, and the metal layer 7 is used.

The primary electrodeposited layer 15 is made of nickel or a nickel alloy such as nickel-cobalt that is suitable for electroforming, and is formed by electroforming on a portion of the mother die 10 where the primary pattern resist 14 is not present. In the vapor deposition mask 1, the primary electrodeposited layer 15 is formed as a mask body 2 that covers the surface of the substrate to be vapor deposited, except for the vapor deposition holes 8 corresponding to the vapor deposition target locations such as light emitting layers on the substrate to be vapor deposited. The Rukoto.

The primary pattern resist 14 is made of an insulating material that is resistant to dissolution in the electrolyte used in electroforming the primary electrodeposited layer 15, and is formed of an insulating material that is resistant to dissolution in the electrolytic solution used in electroforming the primary electrodeposited layer 15.
It is disposed corresponding to the non-disposed portion, and is removed after the primary electrodeposited layer 15 is formed (see FIGS. 6 and 7).

This primary pattern resist 14 is disposed on the matrix 10 prior to the formation of the primary electrodeposited layer 15, and a photosensitive resist, for example, a negative type photosensitive dry film resist, is placed on the matrix 10.
0 to a predetermined thickness, for example, about 20 μm, and a mask film 12 of a predetermined pattern corresponding to the position of the mask body 2 of the vapor deposition mask 1, that is, the position of the primary electrodeposited layer 15. In the placed state, the resist is cured by exposure to ultraviolet rays, developed to remove the resist in non-irradiated areas, and is formed into a shape corresponding to the non-arranged areas of the primary electrodeposited layer 15.

The secondary pattern resist 18 is made of an insulating material that is resistant to dissolution in the electrolytic solution used in electroforming the metal layer 7, and is arranged in correspondence with a predetermined portion where the metal layer 7 is not placed. The metal layer 7 is removed after the metal layer 7 is formed (see FIGS. 8 and 9).

This secondary pattern resist 18 is provided prior to the formation of the metal layer 7, and is a photosensitive resist, for example, a negative type photosensitive dry film resist, placed on the matrix 10 and the primary electrodeposited layer 15 that has already been placed. For example, with a mask film 17 of a predetermined pattern corresponding to the metal layer 7 of the vapor deposition mask 1 and the position of the frame 3 placed thereon, the mask film 17 is exposed to ultraviolet rays. After curing and development to remove the photosensitive material in non-irradiated areas, it is formed in a shape corresponding to the non-arranged area of the metal layer 7 (pattern formation area 2a of the mask body 2).

The metal layer 7 is formed by electroforming and is made of nickel, nickel-cobalt alloy, etc., and is formed by forming a secondary pattern resist on the matrix 10, the primary electrodeposited layer 15 already placed, and the frame 3. 18 is formed by electroforming on the exposed portion.

This metal layer 7 connects the mask body 2 and the frame 3. The metal layer 7 is laminated by electroforming on the upper surface of the mask body 2 on the outer peripheral edge 2b of the pattern forming area. For more information,
The metal layer 7 covers the upper surface of the outer peripheral edge 2b of the pattern forming area 2a in the mask body 2 and the frame 3.
It is formed on the upper surface, the side surface on the pattern forming area 2a side, and in the gap between the mask body 2 and the frame 3, so that it does not leave the outer periphery 2b of the pattern forming area 2a and the opening periphery of the frame 3. Connect them as one.

Note that the metal layer 7 can be formed on the entire surface (upper surface) of the frame body 3 including both the holding frame part 4 and the reinforcing frame part 5, but the metal layer 7 can be formed on the entire surface (upper surface) of the frame body 3 including both the holding frame part 4 and the reinforcing frame part 5. Reinforcement frame portion 5 of body 3
Since the metal layer 7 is separated and removed, the metal layer 7 may be formed only on the surface of the holding frame portion 4.

Next, a process for manufacturing a vapor deposition mask and a process for installing it in a vapor deposition apparatus according to this embodiment will be explained.
Regarding the manufacturing process of the vapor deposition mask, first, a resist is placed on the mother mold 10 in correspondence with the vapor deposition holes 8 of the mask body 2, that is, the areas where the primary electrodeposited layer 15 is not placed, which are set in advance on the mother mold 10. A layer 11 is provided (see FIG. 6). Specifically, for example, a negative type photosensitive dry film resist is coated on the surface side of the matrix 10 to a predetermined thickness (for example, about 20 μm) corresponding to the height of the primary electrodeposited layer 15 to be formed. A resist layer 11 is formed by laminating several layers and thermocompression bonding (see FIG. 6(A)).

Then, on the surface of the resist layer 11, a mask film (glass mask) 12 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15, such as having transparent holes 12a corresponding to the vapor deposition through holes 8, was closely attached. Thereafter, various treatments such as curing by exposure to ultraviolet rays (see FIGS. 6B and 6C), development to remove the masked non-irradiated portions of the resist, and drying are performed. In this way, the primary pattern resist 14 corresponding to the non-placed portion of the primary electrodeposition layer 15 is applied to the matrix 10.
(See FIG. 7(A)).

Note that such primary pattern resist 14 can be formed by a lithography method using a photoresist or any other arbitrary method, and the forming method is not limited to the above.

The mother mold 10 having the primary pattern resist 14 is placed in an electroforming bath prepared under predetermined conditions, and the primary pattern resist 10 of the mother mold 10 is placed within the thickness range of the primary pattern resist 14.
On the surface (exposed region) not covered with the mask, a primary electrodeposited layer 15 having a thickness of, for example, 20 μm and which will become the mask body 2 is formed by electroforming an electrodeposited metal such as a nickel alloy (see FIG. 7(B)). .

Thereafter, by dissolving and removing the primary pattern resist 14, a predetermined vapor deposition pattern 9 is formed.
A primary electrodeposited layer 15, which will become the mask body 2, is obtained which is provided with a large number of independent vapor deposition holes 8 forming a shape (see FIG. 7(C)).

After the primary electrodeposited layer 15 is obtained, a resist layer 16 is provided over the entire surface of the matrix 10 including the portion where the primary electrodeposited layer 15 is formed. Specifically, for example, a negative type photosensitive dry film resist is applied to the surface side of the matrix 10 to a predetermined thickness (for example, about 15 μm).
8 (A
)reference).

Then, as shown in FIG. 8B, a mask film 17 having transparent holes 17a corresponding to the pattern forming areas 2a of the mask body 2 is brought into close contact with the surface of the resist layer 16, and then exposed to ultraviolet rays. A hardening process is performed (see FIGS. 8(B) and (C)). As a result, a portion of the resist layer 16a corresponding to the pattern forming region 2a is exposed, and the other portion is an unexposed resist layer 16b.

Here, the frame 3, on which the cutting portion 3b is provided in advance, is aligned and placed on the matrix 10 so as to surround the primary electrodeposited layer 15 (see FIG. 8(C)).
The frame 3 here can be temporarily fixed onto the matrix 10 so as not to easily move due to the adhesiveness of the unexposed resist layer 16b.

After placing the frame 3, a process is performed to dissolve and remove the unexposed resist layer 16b exposed on the surface to form a secondary pattern resist 18 that covers the pattern formation area (see FIG. 9(A)).
. Note that the unexposed resist layer 16b existing under the frame 3 is not removed because it does not appear on the surface, and remains on the matrix 10 and continues to play the role of fixing the frame 3. Become.

Thereafter, the upper surface of the primary electrodeposition layer 15 that is not covered with the secondary pattern resist 18 and is exposed on the surface of the outer peripheral edge 2b of the pattern forming area 2a, and the surface between the frame 3 and the primary electrodeposition layer 15 is A metal layer 7 is formed on the exposed surface of the matrix 10 and the surface of the frame 3 by electroforming of electrodeposited metal (see FIG. 9(B)). This metal layer 7 allows the primary electrodeposited layer 15 and the frame 3 to be integrally connected so that they do not separate.

In this case, the metal layer 7 is formed on the upper surface of the primary electrodeposition layer 15 exposed on the surface of the outer peripheral edge 2b of the pattern forming area 2a, or on the matrix exposed on the surface between the primary electrodeposition layer 15 and the frame 3. 10 so that the thickness at the surface is 30 μm. On the other hand, the thickness of the metal layer 7 on the surface of the frame 3 is 15 μm. This difference in thickness is determined only when the metal layer 7 is sequentially laminated from the surface of the matrix 10 and reaches the frame 3 beyond the height dimension of the unexposed resist layer 16b.
This is because the metal layer 7 becomes electrically conductive and the formation of the metal layer 7 on the surface of the frame 3 starts.

When the formation of the metal layer 7 is completed, as a final step, the primary electrodeposition layer 15, which is integral with the matrix 10, is
The frame 3 and metal layer 7 are peeled off (see FIG. 9(C)). Furthermore, the secondary pattern resist 18
By removing the unexposed resist layer 16b existing under the frame body 3, the vapor deposition mask 1
The production of is completed.

The vapor deposition mask 1 obtained through the above-mentioned manufacturing steps is configured such that the mask body 2 generates a stress F in the direction of inward contraction with respect to the outer frame 3.
Specifically, by forming the primary electrodeposited layer 15 on the matrix 10 by electroforming with a material having a large coefficient of thermal expansion, the primary electrodeposition layer 15 can be formed on the matrix in an environment where the temperature is higher than the room temperature in which electroforming is performed. It is formed on the surface of the matrix in a state of linear expansion exceeding that of the matrix 15, and its deformation is regulated on the matrix 10, so that although it tries to shrink more than the matrix 10 in an environment at room temperature, the primary electrodeposited layer 15 does not shrink. A stress is generated in the direction of inward contraction.

On the other hand, since the frame 3 is placed on the matrix 10 at room temperature and the frame itself is made of a material with a low coefficient of thermal expansion, the formation of the metal layer 7 allows the primary electrodeposited layer 15 to be removed from the frame 3. Even in the state in which they are connected, the primary electrodeposition layer 15 still contains stress in the direction of shrinking inward. For this reason, when the integral primary electrodeposition layer 15 and frame 3 are separated from the matrix 10, the primary electrodeposition layer 15, that is, the mask body 2 tends to contract inward with respect to the frame 3, and the frame 3 An inward pulling force will be applied.

Next, a process of installing the vapor deposition mask in the vapor deposition apparatus according to this embodiment will be explained.
As mentioned above, the mask body 2 is formed in a state that generates stress in the direction of inward contraction with respect to the frame body 3, so that the mask body 2 exerts a force that tries to deform the frame body 3. join. Here, the frame body 3 has a structure in which a reinforcing frame part 5 is integrally arranged on the outside of the holding frame part 4, and the frame body 3
A reinforcing frame portion 5 is configured to reinforce the holding frame portion 4 that holds the inner mask body 2 from the outside. As a result, the rigidity of the frame 3 against the force that tends to deform the frame 3 due to the stress of the mask body 2 is increased, and the frame 3 that receives the force does not deform significantly. Since the frame body 3 is difficult to deform, the mask main body 2 is also difficult to deform.

A vapor deposition mask 1 consisting of a combination of the mask body 2 and the frame 3 is installed in a vapor deposition apparatus such as a vapor deposition pot for vapor deposition so as to be capable of vapor deposition. When installing, first, the vapor deposition mask 1 is properly positioned with respect to a frame 50 provided in the vapor deposition apparatus for supporting the vapor deposition mask, and then fixed (see FIGS. 10 and 11). The frame 50 is a frame-shaped member made of a material with a low coefficient of thermal expansion, such as Invar material, and is formed with a thickness of 10 to 25 mm.
This fixation is achieved by integrating the holding frame portion 4 of the frame body 3 of the vapor deposition mask 1 with the frame 50 by welding such as spot welding in a state that is strong and can withstand heat during vapor deposition.

Note that the holding frame portion 4 is fixed to the frame 50 by welding to the frame 50 provided inside the evaporation device, and if the frame 50 is removable from the evaporation device, it can be taken out of the evaporation device for easy handling. It is also possible to perform the process for the frame 50 that has been updated.

The frame 50 has significantly higher rigidity than the frame 3 of the vapor deposition mask 1, and when the holding frame 4 is fixed to the frame 50, the holding frame 4 is completely integrated with the frame 50 without shifting or deforming. The mask body 2, which is connected and held inside the holding frame 4, is not deformed by stress and can maintain its positional relationship with the frame 50. Note that the frame 50 is
A bar 51 may be provided that crosses the middle part of the frame shape (see FIGS. 13 and 14).
. In this case, with the vapor deposition mask 1 fixed to the frame 50, deflection of the central portion of the vapor deposition mask 1 due to its own weight can be suppressed. The bars 51 may be oriented vertically, horizontally, or diagonally with respect to the frame 50, and may be provided in any manner such as being combined in a grid pattern. Provided so as to overlap body 3. This bar 5
1 may be formed at the same time as the frame 50 so that it is integrated with the frame 50 from the beginning, but it is also possible to form one formed independently of the frame 50 and later attach it to the frame 50 and combine them into one. can. Further, the bar 51 is made of a material with a low coefficient of thermal expansion, such as Invar material or ceramic, and has a thickness of 5 to 8 mm, but the material of the bar 51 is the same as that of the frame 50. or a frame different from the frame 50.

After the holding frame portion is fixed to the frame 50, the rigidity of the holding frame portion 4 of the frame body 3 is ensured by the structure of the frame body 3 itself, that is, the holding frame portion 4 is reinforced by the reinforcing frame portion 5 on the outside thereof. There is no need to maintain it as it is. In the vapor deposition process, it is convenient for the vapor deposition mask 1 to be smaller, so there is no need to leave it for reinforcement purposes. It is cut at the processing section 3b and separated and removed from the holding frame section 4 (Fig. 12
reference).

In removing the holding frame part 4, by providing a cutting part 3b on the frame body 3 in advance and using it as a processing target position when separating the reinforcing frame part 5 from the holding frame part 4, the cutting process can be performed easily and easily. In addition, the reinforcing frame portion 5 can be separated without affecting the shape of the holding frame portion 4 that remains as a frame or the state in which the mask body 2 is held by the holding frame portion 4, and the vapor deposition process using the vapor deposition apparatus can be performed smoothly. Can be migrated.

In addition, the separation processing portion 3b to be processed includes a groove 3c continuously arranged in a linear manner, and a groove 3c that is continuously arranged in a linear manner.
It has a structure in which a plurality of through holes 3d are drilled at predetermined intervals in the continuous direction of c, and an acute-angled notch 3e is provided in the through hole 3d. Therefore, when the reinforcing frame portion 5 is separated by cutting the separation processing portion 3b, a cut surface is easily generated along the separation processing portion 3b starting from the notch portion 3e, and the holding frame portion 4 It is possible to prevent burrs etc. from remaining on the sides, and to avoid adversely affecting various operations associated with the vapor deposition process.

As described above, in the vapor deposition mask according to the present embodiment, the reinforcing frame part 5 for reinforcing the holding frame part 4 that holds the mask main body 2 on the inside of the frame body 3 from the outside is disposed, and the mask main body 2 Since the rigidity of the frame body 3 is increased against the force applied from the mask body 2 to the frame body 3 based on the stress of As a result, alignment between the mask and the substrate to be evaporated can be ensured, and evaporation can be performed accurately at appropriate positions on the substrate to be evaporated.

In addition, when installing the vapor deposition mask 1, the holding frame portion 4 of the frame body 3 in the vapor deposition mask 1 is
The vapor deposition mask 1 can be installed in the vapor deposition apparatus by fixing it to the frame 50 of the vapor deposition apparatus by welding or the like, and thus the vapor deposition mask 1 can be installed in the vapor deposition apparatus while maintaining the state in which the deformation of the mask body 2 is suppressed by the frame 3. This can prevent displacement of the mask body 2 and ensure alignment between the mask and the substrate to be deposited, thereby increasing the precision of deposition and improving the yield of deposited products. Furthermore, by separating the reinforcing frame part 5 from the holding frame part 4 after fixing the frame body 3 to the vapor deposition apparatus, the reinforcing frame part 5 can be attached to the vapor deposition mask 1.
It does not interfere with the process after fixation, and the vapor deposition using the vapor deposition equipment can proceed without any problem.

In addition, in the vapor deposition mask according to the embodiment, the separation processing part 3b of the frame body 3 is formed by combining a linearly continuous groove 3c and a plurality of through holes 3d drilled at predetermined intervals in the groove continuous direction. Although the configuration is such that the shape is uniform at any location on the boundary between the holding frame portion 4 and the reinforcing frame portion 5, the shape is not limited to this, and the cutting portion 3b is provided at each position on the frame body 3. The shape of the frame 3 can be changed, for example, the frame 3 can be shaped to correspond to the mask body 2 that is integrated with the frame 3 while retaining stress that tends to contract inward. Assume that the amount of expected deformation of each part of the frame body is calculated in advance assuming a state in which a force based on the stress is applied to the frame body, and that the cutting-off processed portion 3b is attached to the frame body in which the separating processed portion 3b is provided. The larger the expected amount of deformation at the predetermined location in No. 3, the smaller the ratio of the size of the portion removed as the through hole, recess, or groove that forms the cutting section 3b at this location to the remaining portion that is not removed. It is also possible to have a configuration in which it is set to .

In this case, the cutting section 3b of the frame 3 has a shape in which the removed portion is adjusted to increase or decrease depending on the deformability of each part of the frame, that is, the removed section of the cutting section 3b is At locations where the amount of deformation of the frame 3 due to the force applied to the frame 3 based on stress increases, the ratio of the removed portion to the remaining portion that is not removed is reduced, while at locations where the amount of deformation of the frame is small, the amount of the remaining portion that is not removed is reduced. By setting the proportion of the removed part to be large,
In areas where the frame 3 is expected to undergo significant deformation, the ratio of removed portions such as recesses in the cutting section 3b is reduced to ensure sufficient strength of the frame 3, while in areas where it is difficult to predict deformation of the frame 3. In this case, by increasing the proportion of the removed portion of the cutting-off processing section 3b, it is possible to increase the processing efficiency during cutting-off processing while ensuring appropriate strength, and to enable prompt separation of the reinforcing frame section 5, which allows the process to proceed to the vapor deposition process. This will allow for a smooth transition.

As a specific example, as shown in FIG. 15, in the frame 3, the rectangular mask body 2 has relatively low rigidity and is easily affected by the force based on the stress of the mask body 2. In the cutting section 3b near the intermediate position of the edge along each side, the portion that is removed as a through hole, recess, or groove is minimized, and the proportion of the portion that is not removed is increased to reduce the decrease in rigidity due to the removed portion. It is possible to minimize the occurrence of actual deformation. On the other hand, in the cutting part 3b near the corner where each frame side of the frame body 3 intersects, which has high rigidity and is not easily affected by the force due to the stress of the mask body 2, the cutting part 3b is removed as a through hole, recess, or groove. By increasing the ratio of the size of the portion to the remaining portion that is not removed, it is possible to reduce the effort required during the cutting process.

Further, in manufacturing the vapor deposition mask according to the embodiment, the metal layer 7 is formed so as to be in contact with the primary electrodeposition layer 15 and the frame 3, and the metal layer 7 is used to connect the primary electrodeposition layer 15 and the frame 3. Although the structure is intended to be integrated, the present invention is not limited to this. Before arranging the frame body, the primary electrodeposition layer 15 is formed so as to cover the frame body arrangement position, and the frame body 3 is coated with the lower primary electrodeposition layer 15. It is also possible to have a structure in which the primary electrodeposited layer 15 and the frame 3 are integrated by adhesive by placing an adhesive on the layer 15, and the primary electrodeposited layer, that is, the mask body 2 and the frame Integration with the body 3 can be easily performed, and the manufacturing efficiency of the mask can be improved. Note that by forming the metal layer 7 to cover the surface of the mask body 2 and the surface of the frame 3, the bonding state between the mask body 2 and the frame 3 can be made more preferable. In particular, by covering the surface (side part) of the adhesive with the metal layer 7, deterioration of the adhesive due to cleaning treatment or temperature rise can be effectively prevented, and the bond between the mask body 2 and the frame 3 can be effectively prevented. The condition can be maintained for a long period of time.

Further, in manufacturing the vapor deposition mask according to the embodiment, after placing the frame 3 on the mother mold 10, the metal layer 7 is formed on the surface of the frame 3. However, the present invention is not limited to this. Before forming the metal layer 7 by casting, a resist is provided on a part or all of the upper surface of the frame, so that the metal layer 7 is not formed on the entire upper surface of the frame, but only in areas where it is not necessary. It is also possible to provide a stress relaxation portion on the surface of the frame 3 by providing it only on a part of the upper surface of the frame or omitting it.

In this case, the metal layer 7 is not uniformly continuous on the upper surface of the frame 3 and becomes partial or fragmented, so that even if internal stress occurs in the metal layer, it will not be applied to the entire frame 3 but only partially. , the frame body 3 is less susceptible to adverse effects such as deformation, and can maintain its planar shape.

Furthermore, in manufacturing the vapor deposition mask according to the embodiment, after the primary electrodeposition layer 15 is formed, the metal layer 7 is formed without performing any particular surface treatment on the primary electrodeposition layer. , but not limited to this, after the primary electrodeposited layer 15 is formed and before the resist layer 16 is formed, the metal layer 7 of the primary electrodeposited layer 15 is applied to a predetermined area where the metal layer 7 is to be overlaid. Activation treatment such as acid immersion or electrolytic treatment can also be performed.

In this case, the bonding strength between the activation-treated portion of the primary electrodeposited layer 15 and the metal layer 7 thereon can be significantly improved compared to the case of no treatment. Furthermore, instead of the activation treatment, a thin layer of strike nickel, matte nickel, or the like may be formed on a predetermined area of the primary electrodeposited layer 15. This also makes it possible to improve the bonding strength between the thin layer forming portion of the primary electrodeposited layer 15 and the metal layer 7 thereon.

In addition, in manufacturing the vapor deposition mask according to the embodiment, the primary electrodeposited layer 15 and the overlapping portions of the frame 3 and the metal layer 7 are configured so that they simply contact each other on a flat surface. Regarding the metal layer 7 formed on the outer periphery 2b of the primary electrodeposition layer 15 by providing a large number of through holes or recesses over the entire periphery of the outer periphery 2b of the pattern formation area 2a in the electrodeposition layer 15 (mask body 2). Alternatively, the metal layer 7 may be formed so as to partially bite into the outer peripheral edge 2b by filling the through hole or recess.

In this case, the metal layer 7 is present in each through hole or recess of the outer periphery 2b in addition to the upper surface of the outer periphery 2b of the pattern forming area 2a with respect to the primary electrodeposition layer 15. outer periphery 2
To increase the bonding strength with b. As a result, the mask main body 2
The mask body 2 and the frame body 3 can be more firmly connected and integrated, and the mask body 2 can be reliably prevented from falling off or being misaligned with respect to the frame body 3, and the accuracy of vapor deposition and the reproduction accuracy of the vapor deposited product can be improved. I can do it.

(Second embodiment of the present invention)
In the manufacturing of the vapor deposition mask in the first embodiment, the frame 3 provided with the cutting portion 3b in advance is used in the step of arranging the frame 3 on the matrix 10. In addition, as a second embodiment, as shown in FIG. 16, after the frame body 3 is placed on the master die 10, a cutting part 3b is provided on the frame body 3 as a step of mask manufacturing. You can also do that.

In this case, as a method for providing the separation processing portion 3b by removal processing, a method may be used in which the frame body 3 placed on the mother mold 10 is immersed in an etching solution and dissolved. In the case of this etching, an etching solution that dissolves the frame 3 but has a selective etching property that does not affect the material of parts other than the frame, such as the matrix 10, is used, or a predetermined area of the frame to be removed is excluded. A masking material 19 is placed on the area (see FIG. 16(B)).

Specifically, for example, a photosensitive film resist is placed by thermocompression bonding or the like so as to cover the area not to be etched, and this resist is exposed to ultraviolet rays to be cured, and a mask is placed on the area to be removed. Processing such as development is performed to harden and form the masking material 19. In addition, as a masking material, a protective film having resistance to an etching solution may be disposed to cover a portion not to be etched.

After forming the masking material 19, the frame 3 is immersed together with the matrix 10 in an etching solution, and the exposed part of the surface of the frame 3 that is not covered with the masking material 19 is etched and dissolved to a predetermined depth. (See FIG. 16(C)). A portion of the frame 3 that is partially removed by this etching becomes a cutting portion 3b that is thinner and easier to cut than other portions of the frame 3.

After the cutting part 3b with the desired depth and shape is obtained through etching, the masking material 19 is dissolved and removed using a predetermined removing agent, and the frame 3 and the primary electrodeposited layer 15 are exposed. , a state is reached in which a metal layer can be formed by electroforming, and after this, the process of forming a metal layer by electroforming and the subsequent steps proceed as in the first embodiment.

In addition to providing the cutting part 3b on the frame 3 by etching, unnecessary parts of the frame 3 placed on the mother mold 10 are removed by machining or laser processing to form the cutting part 3b. 3b may also be provided.

As described above, in the method for manufacturing a vapor deposition mask according to the present embodiment, the primary electrodeposition layer 15 that becomes the mask body is formed on the matrix 10, and the frame body 3 is positioned around the primary electrodeposition layer 15. and further form a metal layer 7 for connecting the frame 3 and the primary electrodeposition layer 15 in a predetermined range extending from the surface of the frame 3 to the surface of the outer peripheral edge 2b of the primary electrodeposition layer 15. In this process, since the cutting part 3b is provided on the frame 3 by a predetermined removal process, the primary electrodeposited layer 15, the frame 3, and the metal layer 7, which have been peeled off as one from the matrix 10, can be removed from the vapor deposition mask 1. In this state, the frame 3 has an inner area (holding frame 4
) and an outer region (reinforced frame portion 5) that can be separated when unnecessary while reinforcing the entire frame, and the reinforcing frame portion 5 outside the cut-off processing portion 3b of the frame 3 can be sufficiently By increasing the size, the rigidity of the frame 3 against the stress of the mask body 2 is increased, and the vapor deposition mask 1 is fixedly installed in the vapor deposition apparatus in a state where the displacement of each part of the mask body from its original position is suppressed. A state of alignment with the substrate to be evaporated can be ensured, and evaporation can be performed accurately at appropriate positions on the substrate to be evaporated.

In addition, after the vapor deposition mask 1 is fixedly installed on the vapor deposition apparatus side, if it is no longer necessary to ensure the rigidity of the frame 3 by the reinforcing frame portion 5 outside the separation processing portion 3b of the frame 3, the separation processing portion By performing the separation process at 3b, the reinforcing frame portion 5 can be easily and effortlessly separated, allowing a smooth transition to the vapor deposition process using the vapor deposition device, and the shape of the holding frame portion 5 that remains as the frame body 3 and the holding of the mask body 2 thereby. The reinforcing frame portion 5 can be separated without affecting the condition, and the subsequent vapor deposition process can proceed without any problem.

(Third embodiment of the present invention)
In the installation of the vapor deposition mask 1 in the vapor deposition apparatus in the first embodiment, after the production of the vapor deposition mask is completed, the vapor deposition mask 1 is fixed to the frame 50 of the vapor deposition apparatus as it is,
Although a vapor deposition mask is installed in the vapor deposition apparatus, as a third embodiment, as shown in FIGS. Alternatively, the displacement of the frame 3 and the mask body 2 may be kept within an allowable range before installation in the vapor deposition apparatus.

In the vapor deposition mask 1 in a fully manufactured state before being installed in the vapor deposition apparatus, as in the first embodiment, the mask body 2 is formed in a state that generates stress in the direction of inward contraction with respect to the frame body 3. As a result, a force is applied from the mask body 2 to deform the frame 3. Here, the frame 3 has a structure in which a reinforcing frame part 5 is integrally arranged on the outside of a holding frame part 4, and the reinforcing frame part 5 is reinforced from the outside. As a result, the rigidity of the frame 3 against the force that tends to deform the frame 3 due to the stress of the mask body 2 is increased, and the frame 3 that receives the force does not deform significantly. Since the frame body 3 is difficult to deform, the mask main body 2 is also difficult to deform.

However, the frame body 3 cannot be made very thick because it needs to be formed thinly as a part of the vapor deposition mask 1, and there are also certain restrictions on the size of the reinforcing frame portion 5 due to the handling when fixing it to the frame 50. Therefore, there is a limit to the rigidity reinforcement of the frame 3, and deformation of the frame 3 cannot be completely suppressed.

Therefore, if the force applied from the mask body 2 is large, a part of the frame 3 will deform slightly inward, allowing the mask body 2 that is integrated with the frame 3 to contract, resulting in As a result, slight deformation of the mask body 2 may not be suppressed. At this time, if the dimensional accuracy conditions of the vapor deposited product are strict and the tolerance range for the positional deviation of the mask body 2 is small, displacement exceeding the allowable range will occur at a predetermined location of the mask body 2, resulting in a reduction in the yield of the vapor deposited product. It may lead to deterioration.

On the other hand, when the vapor deposition mask 1 is installed in the vapor deposition apparatus, a force is applied to the frame 3 that opposes the force that tries to deform the frame 3 based on the stress of the mask body 2, and the displacement of the frame 3 is changed. is within an allowable range, and the holding frame portion 4 of the frame body 3 is fixed to the frame 50 while maintaining the state in which the displacement of the frame body 3 is within the allowable range. This suppresses deformation of the frame 3 and at the same time prevents the mask body 2 from shifting from its correct position, which would otherwise be accompanied by deformation of the frame 3.

The specific installation process is to first measure the displacement of the frame 3 and mask body 2 that make up the vapor deposition mask 1 from their original state, and then install a predetermined location on the outer periphery of the frame 3 that is outside the position where the large displacement occurred. A series of steps of applying a tensile force from the outside to keep the displacement within the allowable range is repeated until the displacement falls within the allowable range at any position of the frame 3 and the mask body 2. Then, the holding frame portion 4 of the frame body 3 is fixed to the frame 50 while maintaining the state of the frame body 3 and the mask body 2 in which the displacement is within an allowable range due to the application of the tensile force. After that, the procedure is to release the tensile force applied to the frame 3. Note that the positions on the outer periphery of the frame to which the tensile force is applied are the positions excluding the outer periphery of the frame that is outside (on an extension line) of the lattice-like portion inside the frame. This is because the parts of the outer periphery of the frame that are outside of the grid-like part inside the frame have high rigidity due to their connection with the grid-like part, and are less prone to deformation due to stress in the mask body.
This is because even if a tensile force is applied from the outside when deformation occurs, it is difficult to apply a deformation in the opposite direction to offset the deformation.

Specifically, as a first step, displacements in two directions parallel to each side of the rectangular frame outer periphery at each position of the frame 3 and mask body 2 of the vapor deposition mask 1 are measured. Then, as a second step, if the inward displacement at a predetermined location does not fall within the preset tolerance range, the outer periphery of the frame 3, which is outside the location where the maximum displacement occurred, is injected in the direction of the maximum displacement. A predetermined outward pulling force parallel to is applied with a magnitude such that the displacement of the location falls within the tolerance range.

Subsequently, as a third step, the displacements in the two directions at each position of the frame and the mask body are measured again with a tensile force applied. After this measurement, in the fourth step, if a new inward displacement does not fall within the above tolerance range, a new maximum displacement is generated while maintaining the state where the tensile force is applied. A predetermined outward tensile force parallel to the direction of the new maximum displacement is further applied to the outer periphery of the frame outside the location where the displacement is within the allowable range.

In addition, as a fifth step, at any point inside the outer periphery of the frame where a tensile force has already been applied, the outward displacement is adjusted to a preset tolerance when another tensile force is applied later. If a state outside the range is measured, an adjustment is made to reduce the tensile force applied to the outer periphery of the frame outside the location so that the displacement of the location falls within the allowable range.

Then, the third to fifth steps are repeated until the measured displacement at each position of the frame 3 and the mask body 2 falls within the allowable range.

To explain using a specific example, in the vapor deposition mask after manufacturing is completed, position A of the mask body 2
The maximum displacement is -6.1 μm in the vertical direction (y-axis direction) of the frame 3, that is, 6.1 μm inside the frame.
A displacement of 1 μm has been confirmed by measurement (see FIG. 17). This displacement is within the permissible range (±1μ
m), so we installed a frame in the y-axis direction parallel to the direction of the maximum displacement on the outer periphery of the frame 3 (the center of the upper side and the center of the lower side) which is outside in the y-axis direction of position A where the maximum displacement occurred. Apply a tensile force of 40 N in each direction outward from the body (see Figure 18).

However, when measuring the displacement at each position of the frame and mask body after applying this 40N tensile force, the maximum displacement is still - in the y-axis direction of the frame 3 at position A of the mask body 2.
A displacement of 3.0 μm was confirmed (see FIG. 18). Since this displacement does not fall within the allowable range, similarly to the above, two locations on the outer periphery of the frame 3 (the center of the upper side and the center of the lower side), which are outside of the position A in the y-axis direction, are placed on the outside of the frame in the y-axis direction. A tensile force of 80 N is applied in each direction as a force such that the displacement at position A falls within the permissible range (see FIG. 19).

After applying a tensile force of 80N in the y-axis direction, the displacement at each position of the frame body is measured, and the maximum displacement is newly determined in the lateral direction (x-axis direction) of the frame body 3 at position B of the mask body 2. -2.4μ
m, that is, a displacement of 2.4 μm inside the frame was confirmed (see FIG. 19). Since this displacement does not fall within the allowable range, the tensile force (80N) in the y-axis direction is still applied, and the frame 3 is placed outside the position B in the x-axis direction where the maximum displacement occurs. The outer periphery of (
The displacement at position B is within the allowable range in each direction outward of the frame in the x-axis direction parallel to the direction of maximum displacement. A tensile force of 40 N is applied to each case as a force that can be accommodated (see FIG. 20).

After applying a tensile force of 40N in the x-axis direction, the displacement of each position of the frame body and mask body is measured. As a result, the maximum displacement is newly determined at position C of the mask body 2 in the y-axis direction of the frame body 3. -1.
A displacement of 5 μm, that is, 1.5 μm inside the frame was confirmed (see FIG. 20). Since this displacement does not fall within the allowable range, the previous tensile force in the y-axis direction (80N) and the tensile force in the x-axis direction (40N) are maintained as they are, and the position C where the maximum displacement occurs is maintained. A frame is placed in the y-axis direction parallel to the direction of maximum displacement at a total of four locations on the outer periphery of the frame 3 (two locations slightly away from the center of the top side and two locations slightly away from the center of the bottom side) on the outside of the frame 3 in the y-axis direction. A tensile force of 20 N is applied in each direction outward from the body as a force such that the displacement at position C falls within the allowable range (see FIG. 21).

After applying a tensile force of 20N in the y-axis direction, the displacement of each position of the frame body and mask body is measured, and the maximum displacement is newly determined at position D of the mask body 2 in the y-axis direction of the frame body 3. +1.
A displacement of 1 μm, that is, 1.1 μm outside the frame was confirmed (see FIG. 21). Since this displacement does not fall within the allowable range, while maintaining the state in which the previous tensile force (40N) in the x-axis direction was applied, the frame body 3, which is outside the position D in the y-axis direction where the maximum displacement occurred, At two points on the outer periphery (center of the upper side and center of the lower side), the tensile force (80N) that was previously applied in each direction outward of the frame in the y-axis direction was reduced to 60N, and the The tensile force that was previously applied in each direction toward the outside of the frame in the y-axis direction at a total of four locations on the outer periphery (two locations slightly away from the center of the top side and two locations slightly away from the center of the bottom side) 20N) to 30N (see FIG. 22) so that the displacement at position D falls within the allowable range.

After adjusting the tensile force applied in the y-axis direction in this way and measuring the displacement at each position of the frame body and mask body, the maximum displacement at position E of the mask body 2 is newly determined as x of the frame body 3. A displacement of -1.1 μm in the axial direction, that is, a displacement of 1.1 μm inside the frame was confirmed (see Figure 22).
. Since this displacement is not within the allowable range, the tensile force in the y-axis direction (60N, 30N
) and the tensile force (40 N) in the x-axis direction are maintained as they are, and the outer periphery of the frame 3 (a little away from the center of the left side) is A tensile force of 20 N is applied to each of the external directions of the frame in the x-axis direction parallel to the direction of maximum displacement (see Figure 23). ).

After applying a tensile force of 20N in the x-axis direction, the displacement of each position of the frame body and mask body is measured, and the maximum displacement is newly determined at position F of the mask body 2 in the y-axis direction of the frame body 3. -1.
A displacement of 2 μm, that is, 1.2 μm inside the frame was confirmed (see FIG. 23). Since this displacement was not within the allowable range, the maximum displacement occurred while maintaining the tensile force in the y-axis direction (80N) and the tensile force in the x-axis direction (40N, 20N) as they were. At a total of four locations on the outer periphery of the frame 3 on the outside in the y-axis direction at position F (two locations slightly away from the center of the top side and two locations slightly away from the center of the bottom side), first move the outside of the frame in the y-axis direction. The tensile force (30N) applied in each direction is reduced to 20N (see FIG. 24) so that the displacement at position F falls within the allowable range.

After adjusting the tensile force applied in the y-axis direction in this way and measuring the displacement at each position of the frame body and mask body, the maximum displacement of the frame body 3 and mask body 2 is in the x-axis direction at position G. -0.8 μm, that is, 0.8 μm displacement inward of the frame was confirmed (see Figure 24)
. Since this displacement falls within the permissible range, the repetition of the steps of measurement, application of tensile force, and adjustment is completed.

When the displacement falls within the allowable range by repeating these steps, the holding frame 4 of the frame 3 of the vapor deposition mask 1 is moved into or outside the vapor deposition apparatus while applying a tensile force to the frame 3. It is fixed to the positioned frame 50. The holding frame portion 4 is fixed to the frame 50, and the frame body 3
After the mask main body 2 is held in an appropriate position without shifting, the tensile force applied to the frame 3 is released, and the reinforcing frame portion 5 of the frame 3 is removed as in the first embodiment. of,
It is cut at the separation processing part 3b provided at the boundary with the holding frame part 4, and is separated and removed from the holding frame part 4. When the frame 50 is inside the vapor deposition apparatus, the process of installing the vapor deposition mask 1 is completed when the frame 50 and the vapor deposition mask 1 are installed in this state, or when the frame 50 is outside the vapor deposition apparatus.

As described above, the method for installing a vapor deposition mask according to the present embodiment applies external tensile force to a predetermined portion of the frame 3 that can be significantly deformed due to stress in the mask body 2 of the vapor deposition mask 1 to prevent displacement. The process of keeping the displacement within the allowable range is repeated until the displacement falls within the allowable range at any position of the frame 3, and the holding frame portion of the frame 3 is left in the state where the displacement falls within the allowable range. 4 is fixed to the frame 50 and the evaporation mask 1 is installed in the evaporation device, and then the tensile force applied to the frame 3 is released, thereby deforming the frame 3 of the evaporation mask 1. The frame body 3 is fixed to the frame 50 and the vapor deposition mask 1 is properly installed in the vapor deposition apparatus while reliably preventing the frame body 3 from shifting from its correct position by applying an external force to suppress the deformation of the frame body 3. The accuracy of vapor deposition can be further improved.

1 Vapor deposition mask 2 Mask main body 2a Pattern formation area 2b Outer periphery 3 Frame 3a Opening 3b Cutting section 3c Groove 3d Through hole 3e Notch 4 Holding frame 5 Reinforcing frame 7 Metal layer 8 Vapor deposition hole 9 Vapor deposition pattern 10 Master mold 11 Resist layer 12 Mask film 13 Thin part 14 Primary pattern resist 15 Primary electrodeposition layer 16 Resist layer 17 Mask film 18 Secondary pattern resist 19 Masking material 50 Frame 51 Bar

Claims (5)

A vapor deposition mask comprising a mask body provided with a large number of independent vapor deposition holes in a predetermined pattern, and a frame body disposed integrally with the mask body,
The frame body is provided with a cutting part,
The cutting part has a plurality of through holes arranged in a line,
The through-hole is provided with a notch at an end in a direction in which the through-holes are lined up in a plurality of lines,
The vapor deposition mask is characterized in that the separation processing portion has a shape in which the removed portion is increased or decreased depending on the deformability of each portion of the frame. The portion to be removed in the separation processing section is such that the ratio of the removed portion to the remaining portion that is not removed is made small at locations where the amount of deformation of the frame due to the force applied to the frame based on the stress of the mask body is large; 2. The vapor deposition mask according to claim 1, wherein the ratio of the removed portion to the remaining portion that is not removed is set to be increased at a portion where the amount of deformation of the frame is small. The frame has a holding frame that is connected and integrated with the mask main body, and a reinforcing frame that is provided integrally with the holding frame, and is formed in a frame shape that is thicker than the mask main body. The vapor deposition mask according to claim 1 or 2, characterized in that: 4. The vapor deposition mask according to claim 3, wherein a separation processing section is provided at a boundary between the holding frame section and the reinforcing frame section. 5. The vapor deposition mask according to claim 3, wherein the reinforcing frame can be separated and removed from the holding frame.