JP2023171342A - ブロードイオンビーム（ｂｉｂ）システムを用いた複数の試料のより効率的な処理のために試料を事前に位置合わせするためのシステム及び方法 - Google Patents

ブロードイオンビーム（ｂｉｂ）システムを用いた複数の試料のより効率的な処理のために試料を事前に位置合わせするためのシステム及び方法 Download PDF

Info

Publication number
JP2023171342A
JP2023171342A JP2023082382A JP2023082382A JP2023171342A JP 2023171342 A JP2023171342 A JP 2023171342A JP 2023082382 A JP2023082382 A JP 2023082382A JP 2023082382 A JP2023082382 A JP 2023082382A JP 2023171342 A JP2023171342 A JP 2023171342A
Authority
JP
Japan
Prior art keywords
sample
bib
mask
ion beam
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023082382A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023171342A5 (cg-RX-API-DMAC7.html
Inventor
フロウゼク ミカエル
Hrouzek Michal
ノヴァク リボル
Novak Libor
ヴィスタヴェール トマス
Vystavel Tomas
カンス ネーリゼッティ クリシュナ
Kanth Neelisetty Krishna
ネウジール ヤン
Neuzil Jan
クルヴァチェ オンドレイユ
Klvac Ondrej
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FEI Co
Original Assignee
FEI Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FEI Co filed Critical FEI Co
Publication of JP2023171342A publication Critical patent/JP2023171342A/ja
Publication of JP2023171342A5 publication Critical patent/JP2023171342A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H01J37/228—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination or light collection take place in the same area of the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/061—Construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/08—Ion sources
    • H01J2237/0822—Multiple sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H01J2237/186—Valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/201—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated for mounting multiple objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3151—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2023082382A 2022-05-19 2023-05-18 ブロードイオンビーム（ｂｉｂ）システムを用いた複数の試料のより効率的な処理のために試料を事前に位置合わせするためのシステム及び方法 Pending JP2023171342A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/748,972 2022-05-19
US17/748,972 US12106931B2 (en) 2022-05-19 2022-05-19 Systems and methods for pre-aligning samples for more efficient processing of multiple samples with a Broad Ion Beam (BIB) system

Publications (2)

Publication Number Publication Date
JP2023171342A true JP2023171342A (ja) 2023-12-01
JP2023171342A5 JP2023171342A5 (cg-RX-API-DMAC7.html) 2026-05-11

Family

ID=86378497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023082382A Pending JP2023171342A (ja) 2022-05-19 2023-05-18 ブロードイオンビーム（ｂｉｂ）システムを用いた複数の試料のより効率的な処理のために試料を事前に位置合わせするためのシステム及び方法

Country Status (4)

Country Link
US (1) US12106931B2 (cg-RX-API-DMAC7.html)
EP (1) EP4279899B1 (cg-RX-API-DMAC7.html)
JP (1) JP2023171342A (cg-RX-API-DMAC7.html)
CN (1) CN117091926B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12165833B2 (en) * 2022-05-19 2024-12-10 Fei Company System and methods for automated processing of multiple samples in a BIB system
US12548731B2 (en) * 2022-09-30 2026-02-10 Fei Company Systems and methods for transferring a sample

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175026A (ja) * 2010-02-23 2011-09-08 Nsk Ltd 露光装置、露光方法及び基板の製造方法
WO2015170400A1 (ja) * 2014-05-09 2015-11-12 株式会社日立ハイテクノロジーズ イオンミリング装置、及び試料加工方法
WO2017145371A1 (ja) * 2016-02-26 2017-08-31 株式会社日立ハイテクノロジーズ イオンミリング装置、及びイオンミリング方法
JP2017532759A (ja) * 2014-08-05 2017-11-02 インテヴァック インコーポレイテッド 注入マスク及びアライメント
US20200098554A1 (en) * 2017-03-30 2020-03-26 Intel Corporation Method of sample preparation using dual ion beam trenching
JP2020194789A (ja) * 2020-08-11 2020-12-03 株式会社日立ハイテク イオンミリング方法、およびイオンミリング装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004017381A2 (en) * 2002-08-19 2004-02-26 The Trustees Of Columbia University In The City Of New York Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
SG177822A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a sample
SG177823A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a lamella
US9576772B1 (en) * 2015-08-31 2017-02-21 Fei Company CAD-assisted TEM prep recipe creation
EP3196919B1 (en) * 2016-10-20 2018-09-19 FEI Company Cryogenic specimen processing in a charged particle microscope
CN109979793B (zh) * 2017-12-27 2023-11-07 Fei 公司 复合型sem-cl和fib-ioe显微术
US20210088770A1 (en) * 2019-09-24 2021-03-25 Fei Company Pose estimation using sematic segmentation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175026A (ja) * 2010-02-23 2011-09-08 Nsk Ltd 露光装置、露光方法及び基板の製造方法
WO2015170400A1 (ja) * 2014-05-09 2015-11-12 株式会社日立ハイテクノロジーズ イオンミリング装置、及び試料加工方法
JP2017532759A (ja) * 2014-08-05 2017-11-02 インテヴァック インコーポレイテッド 注入マスク及びアライメント
WO2017145371A1 (ja) * 2016-02-26 2017-08-31 株式会社日立ハイテクノロジーズ イオンミリング装置、及びイオンミリング方法
US20200098554A1 (en) * 2017-03-30 2020-03-26 Intel Corporation Method of sample preparation using dual ion beam trenching
JP2020194789A (ja) * 2020-08-11 2020-12-03 株式会社日立ハイテク イオンミリング方法、およびイオンミリング装置

Also Published As

Publication number Publication date
EP4279899B1 (en) 2024-10-30
EP4279899A1 (en) 2023-11-22
US12106931B2 (en) 2024-10-01
US20230377834A1 (en) 2023-11-23
CN117091926A (zh) 2023-11-21
CN117091926B (zh) 2026-04-10

Similar Documents

Publication Publication Date Title
Berger et al. Plasma FIB milling for the determination of structures in situ
EP4279899B1 (en) Systems and methods for pre-aligning samples for more efficient processing of multiple samples with a broad ion beam (bib) system
US20250292433A1 (en) 3d fiducial for precision 3d nand channel tilt/shift analysis
US20250321164A1 (en) Broad ion beam (bib) systems for more efficient processing of multiple samples
JP2023171344A (ja) 複数の試料のより効率的な処理のためのレーザ及びブロードイオンビーム（ｂｉｂ）を組み合わせたシステム
JP2023171343A (ja) Ｂｉｂシステムにおける複数の試料の自動処理のためのシステム及び方法
US20060091325A1 (en) Method and apparatus for the automated process of in-situ lift-out
US20250095953A1 (en) Systems and methods for performing sample lift-out for highly reactive materials
US12278087B2 (en) Systems and methods for performing sample lift-out for highly reactive materials
US20210088770A1 (en) Pose estimation using sematic segmentation
JP2023051864A (ja) モジュール式超高真空電子顕微鏡

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260427

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20260427

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20260427

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260707