CN117091926B - 用于预对准样本以通过宽离子束（bib）系统更有效地处理多个样本的系统和方法 - Google Patents

用于预对准样本以通过宽离子束（bib）系统更有效地处理多个样本的系统和方法

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Publication number
CN117091926B
CN117091926B CN202310573540.8A CN202310573540A CN117091926B CN 117091926 B CN117091926 B CN 117091926B CN 202310573540 A CN202310573540 A CN 202310573540A CN 117091926 B CN117091926 B CN 117091926B
Authority
CN
China
Prior art keywords
sample
bib
mask
sample holder
ion beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202310573540.8A
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English (en)
Chinese (zh)
Other versions
CN117091926A (zh
Inventor
M·赫鲁泽克
L·诺瓦克
T·维斯塔维尔
K·K·尼利塞蒂
J·诺伊尔
O·克尔瓦奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FEI Co
Original Assignee
FEI Co
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Filing date
Publication date
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Publication of CN117091926A publication Critical patent/CN117091926A/zh
Application granted granted Critical
Publication of CN117091926B publication Critical patent/CN117091926B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H01J37/228—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination or light collection take place in the same area of the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/061—Construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/08—Ion sources
    • H01J2237/0822—Multiple sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H01J2237/186—Valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/201—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated for mounting multiple objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/31—Processing objects on a macro-scale
    • H01J2237/3151—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Plasma & Fusion (AREA)
  • Engineering & Computer Science (AREA)
  • Sampling And Sample Adjustment (AREA)
CN202310573540.8A 2022-05-19 2023-05-19 用于预对准样本以通过宽离子束（bib）系统更有效地处理多个样本的系统和方法 Active CN117091926B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/748,972 US12106931B2 (en) 2022-05-19 2022-05-19 Systems and methods for pre-aligning samples for more efficient processing of multiple samples with a Broad Ion Beam (BIB) system
US17/748972 2022-05-19

Publications (2)

Publication Number Publication Date
CN117091926A CN117091926A (zh) 2023-11-21
CN117091926B true CN117091926B (zh) 2026-04-10

Family

ID=86378497

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310573540.8A Active CN117091926B (zh) 2022-05-19 2023-05-19 用于预对准样本以通过宽离子束（bib）系统更有效地处理多个样本的系统和方法

Country Status (4)

Country Link
US (1) US12106931B2 (cg-RX-API-DMAC7.html)
EP (1) EP4279899B1 (cg-RX-API-DMAC7.html)
JP (1) JP2023171342A (cg-RX-API-DMAC7.html)
CN (1) CN117091926B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12165833B2 (en) * 2022-05-19 2024-12-10 Fei Company System and methods for automated processing of multiple samples in a BIB system
US12548731B2 (en) * 2022-09-30 2026-02-10 Fei Company Systems and methods for transferring a sample

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004017381A2 (en) * 2002-08-19 2004-02-26 The Trustees Of Columbia University In The City Of New York Process and system for laser crystallization processing of film regions on a substrate to minimize edge areas, and structure of such film regions
JP5462028B2 (ja) * 2010-02-23 2014-04-02 Ｎｓｋテクノロジー株式会社 露光装置、露光方法及び基板の製造方法
SG177822A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a sample
SG177823A1 (en) * 2010-07-06 2012-02-28 Camtek Ltd Method and system for preparing a lamella
US9761412B2 (en) * 2014-05-09 2017-09-12 Hitachi High-Technologies Corporation Ion milling apparatus and sample processing method
MY183097A (en) * 2014-08-05 2021-02-13 Intevac Inc Implant masking and alignment system with rollers
US9576772B1 (en) * 2015-08-31 2017-02-21 Fei Company CAD-assisted TEM prep recipe creation
KR102145816B1 (ko) * 2016-02-26 2020-08-19 주식회사 히타치하이테크 이온 밀링 장치, 및 이온 밀링 방법
EP3196919B1 (en) * 2016-10-20 2018-09-19 FEI Company Cryogenic specimen processing in a charged particle microscope
US11476120B2 (en) 2017-03-30 2022-10-18 Intel Corporation Method of sample preparation using dual ion beam trenching
CN109979793B (zh) * 2017-12-27 2023-11-07 Fei 公司 复合型sem-cl和fib-ioe显微术
US20210088770A1 (en) * 2019-09-24 2021-03-25 Fei Company Pose estimation using sematic segmentation
JP2020194789A (ja) * 2020-08-11 2020-12-03 株式会社日立ハイテク イオンミリング方法、およびイオンミリング装置

Also Published As

Publication number Publication date
EP4279899B1 (en) 2024-10-30
EP4279899A1 (en) 2023-11-22
US12106931B2 (en) 2024-10-01
US20230377834A1 (en) 2023-11-23
CN117091926A (zh) 2023-11-21
JP2023171342A (ja) 2023-12-01

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