JP2023154506A - Mount and book with ic tag for book - Google Patents

Abstract

To provide a mount with an IC tag that can be easily manufactured and can prevent excessive pressure from acting on an IC chip.SOLUTION: In a mount 10A with an IC tag for a book in which an IC tag 20 including an IC chip 25 is attached to a mount 11, the mount 11 is folded over a surface attached with the IC tag.SELECTED DRAWING: Figure 2

Description

The present invention relates to a book mount with an IC tag. A book to which this mount with an IC tag for a book is attached will also be mentioned.

It is becoming possible to attach IC tags using IC inlets to booklets such as books and magazines to perform general logistics management including production history management and sales management at retail stores. This will enable more detailed management and is expected to improve convenience for consumers purchasing booklets.

Patent Document 1 discloses a book with an electronic tag that is produced by saddle stitching. In this book, a part of the throat of the door that forms the binding part of the signature is removed to form a recess, and a chip is placed inside this recess to prevent the performance of the electronic tag from deteriorating. .

Japanese Patent Application Publication No. 2011-224810

In Patent Document 1, it is possible to reduce some of the pressure acting on the chip due to its structure, but since it is necessary to process a part of the text that is not directly related to the electronic tag, the manufacturing process of the book as a whole is becomes complicated.

In view of the above circumstances, an object of the present invention is to provide a mount with an IC tag that can be easily manufactured and can suppress excessive pressure from acting on an IC chip.

A first aspect of the present invention is a book mount with an IC tag, in which an IC tag having an IC chip is attached to the mount.
In this book mount with an IC tag, the mount is folded over the surface to which the IC tag is attached.

Another mount with an IC tag for books according to the present invention includes a mount having a hole and an IC tag having an IC chip and attached to the mount, and the IC chip is located within the range of the hole in plan view. ing.

A second aspect of the present invention is a book including the IC tag-attached mount for books according to the present invention.

According to the present invention, it is possible to provide a tag-attached mount that can be easily manufactured and can suppress excessive pressure from acting on an IC chip.

(a) is a top view of the mount with an IC tag for books according to the first embodiment of the present invention. (b) is a plan view of a mount related to the mount with an IC tag for books. FIG. 7 is a plan view of a mount with an IC tag for a book according to a second embodiment of the present invention. It is a top view which shows the modification of the mounting board with an IC tag for books. It is a figure which shows an example of the operation|movement when attaching the mount with an IC tag for books to a book. It is a figure which shows an example of the operation|movement when attaching the mount with an IC tag for books to a book. It is a figure which shows an example of the operation|movement when attaching the mount with an IC tag for books to a book. FIG. 3 is a schematic cross-sectional view showing a modification of the IC tag according to the present invention. FIG. 3 is a schematic cross-sectional view showing a modification of the IC tag according to the present invention. FIG. 3 is a schematic cross-sectional view showing a modification of the IC tag according to the present invention.

A first embodiment of the present invention will be described with reference to FIG.
FIG. 1A is a plan view showing a mount 10 with an IC tag for books (hereinafter simply referred to as a "mount with tag") according to the present embodiment.

The tagged mount 10 includes a mount 11 and an IC tag 20 attached to the mount 11.
Various types of paper can be used as the mount 11, and the dimensions of each part including the plan view shape and thickness can be determined as appropriate depending on the booklet etc. to be attached.

The basic structure of the IC tag 20 is known and includes a base material 21 with an antenna 22 provided on one surface, and an IC chip 25 electrically connected to the antenna.
As the base material 21, a sheet made of paper, plastic, etc. can be used. The antenna 22 can be formed by etching a metal layer, arranging metal wires, or the like. The IC chip 25 stores various types of information, including basic information about the attached booklet, individual information for identifying each booklet, etc., which are selected as appropriate depending on the management mode, management purpose, and the like.

As shown in FIG. 1B, the mount 11 is provided with a hole 12 that is larger than the shape of the IC chip 25 in plan view.
The hole 12 only needs to be at least one size larger than the shape of the IC chip 25 in plan view, and there is no particular restriction on its size, but it is set to a size that does not significantly reduce the bonding area between the IC tag 20 and the mount 11. It is preferable. It is preferable to make the hole 12 circular with a diameter of about 6 to 8 mm because the mount 11 can be efficiently produced by drilling holes in a bundle of mounts using a common drill or the like.

The IC tag 20 is attached to the mount 11 so that the IC chip 25 is located within the hole 12 when the tagged mount 10 is viewed from above. Although there are no particular restrictions on the manner in which the IC tag 20 is attached to the mount 11, a simple method is to provide an adhesive layer on one side of the base material 21 to form a label and attach it to the mount 11.

In the tagged mount 10 according to the present embodiment configured as described above, the hole 12 is located below the IC chip 25. Therefore, when pressure is applied to the IC chip 25 when the tagged mounts 10 are stacked or when books to which the tagged mounts 10 are attached are stacked, the IC chip 25 in the IC tag 20 and its surroundings are It can be deformed so that a portion enters the hole 12 and absorbs a portion of the applied pressure.
As a result, it is possible to suitably suppress excessive pressure from acting on the IC chip 25, and prevent damage, malfunction, etc. from occurring.
Moreover, it can be easily manufactured by simply attaching the IC tag 20 to the mount 11 having the hole 12.

In this embodiment, the IC tag 20 may be attached to the mount 11 with the surface on which the IC chip 25 is provided facing the mount 11 . In this case, since at least a portion of the IC chip 25 enters the hole 12 from the beginning, the effect of protecting the IC chip 25 can be enhanced.

A second embodiment of the present invention will be described with reference to FIG. 2. In the following description, the same reference numerals are given to the same components as those already described, and redundant description will be omitted.

In the tagged mount 10A of the present embodiment shown in FIG. 2, a part of the mount 11 is folded along the fold line 11a, and is stacked on the surface to which the IC tag 20 is attached. As a result, a portion of the mount 11 protrudes upward and is thicker than the surface to which the IC tag 20 is attached. Therefore, by absorbing part of the pressure that acts on the IC chips 25 when stacked, etc. by the thickened portion, it is possible to suitably suppress excessive pressure from acting on the IC chips 25. In the tag-attached mount 10A, this effect can be further enhanced by making the thickness of the part of the mount 11 that protrudes upward and becomes thicker than the thickness of the part where the IC chip 25 of the IC tag 20 is arranged. I can do it.
Moreover, it can be manufactured simply by attaching the IC tag 20 to the folded mount 11 or by simply folding back the mount 11 to which the IC tag 20 is attached.

The tagged mount 10A can be efficiently manufactured by supplying the folded mount 11 as shown in FIG. 2 to a labeler and pasting the IC tag 20 as a label with the labeler. In the tag-attached mount 10A, the part of the mount that is overlapped is always smaller than the remaining part, but by appropriately setting the dimensions of the area where the mounts do not overlap, it is possible to attach the IC tag 20 to the mount using a general labeler. Can be reliably pasted on areas that do not overlap. Specifically, in the traveling direction of the mount in the labeler, the dimensions of the non-overlapping parts and the attachment posture of the IC tag 20 can be set so that a gap of 3 mm or more is secured on both sides of the IC tag 20 in the traveling direction. preferable.

In the tag-attached mount 10B of the modified example shown in FIG. 3, a part of the mount 11 that is folded back along the fold line 11a is hollowed out to form a window 13 that is larger than the shape of the IC tag in plan view. . The IC tag 20 is attached inside the window section 13. In the tagged mount 10B, a part of the mount 11 that protrudes upward and is thicker than the surface to which the IC tag 20 is attached surrounds the IC chip 25 in plan view.
Even with such a configuration, it is possible to suitably suppress excessive pressure from acting on the IC chip 25, similarly to the tag-attached mount 10B.

In the tagged mount 10B, since the IC tag 20 is placed inside the window 13, the part of the mount to be stacked does not necessarily have to be smaller than the remaining part, and the part of the mount to be stacked and the remaining part are of the same size. It may be folded completely over.
When producing the tagged mount 10B using a general labeler, similarly to the tagged mount 10A, a gap of 3 mm or more is secured on both sides of the IC tag 20 in the traveling direction of the mount in the labeler, and The dimensions of the window portion 13 and the attachment posture of the IC tag 20 may be set so that a gap of 1.5 mm or more can be secured on both sides of the IC tag 20 in orthogonal directions.
As another aspect, the window part has the same size as the hole 12 in the first embodiment, and only the IC chip 25 and its surroundings are located within the window part, instead of the entire IC tag 20, in a plan view of the mount with the tag. It's okay.

In the tagged mount of this embodiment, the region to which the IC tag is attached and the folded region may be joined by adhesive or the like, or may be in a non-joined state.

The book according to this embodiment can be formed by attaching the above-described tagged mount to the book.
In the case of a book that uses perfect binding or azimuth binding, as shown in the procedure shown in FIG. A book according to the present invention can be produced by overlapping and binding the sheets (mounting paper 10A is shown). The IC tag-attached mount is preferably located at the beginning or end of the book. Therefore, it is preferable to arrange the IC tag-attached mount either before stacking the signatures 101 or after stacking all the signatures 101.

The tagged mount does not necessarily have to be bound together with the signature. For example, as in the procedure shown in FIG. 5, glue 102 is linearly applied to a signature 101, and a tagged mount (FIG. 5 shows a tagged mount 10A as an example) is attached to the signature using the glue 102. It may be joined to 101. Even with such an embodiment, a book according to the present invention can be produced.

In the book according to the present embodiment, since the tag-attached mount has the above-described configuration, even if a large number of books are stacked during the manufacturing process or the distribution process, excessive pressure can be suitably suppressed from acting on the IC chip 25. . As a result, good non-contact communication becomes possible, and various types of management related to books can be performed well.

As shown in FIGS. 3 and 4, a tagged mount 11 in which the size of the part where the IC tag is attached and the folded part are not the same can also be applied to books produced by saddle stitching. .
In this case, as shown in FIG. 6, after the plurality of signatures 101 that are stacked in an open state are all stacked except for the cover, a mount with a tag (in FIG. 6, a mount with a tag 10B is shown as an example). ) and stack them. After that, you can open the covers, stack them, and then perform wire binding.

When applying the tagged mount to saddle-stitch binding, it is preferable that the dimensional difference between the region where the IC tag is attached and the region where the IC tag is folded is approximately 7 to 10 mm.
In a book produced using saddle stitching, the IC tag and the folded part of the mount will be separated from each other, but when looking at the book as a whole, the difference in thickness caused by the folded part is maintained. Therefore, when the books are stacked, it is possible to suitably prevent excessive pressure from acting on the IC chip 25 like other books.

Although each embodiment of the present invention has been described, the specific configuration is not limited to this embodiment, and includes modifications and combinations of the configuration without departing from the gist of the present invention. Some changes are illustrated below, but these are not all, and other changes are also possible. Two or more of these changes may be combined as appropriate.

- As shown in FIG. 7, a spacer 26 may be placed in a portion of the IC tag where the IC chip 25 is not provided. In this way, the spacer 26 receives a portion of the pressure generated when other items are piled up on the tagged mount, thereby further reducing breakage and damage to the IC chip 25.
The spacer 26 may surround the IC chip 25 seamlessly in a plan view of the IC tag, or may not surround it completely. Moreover, although it is preferable that the thickness of the spacer 26 is greater than or equal to the thickness of the IC chip 25, even if the thickness is less than the thickness of the IC chip 25, a certain effect can be achieved as long as the difference is small.

- In the tag-attached mount according to the present invention, a paper layer may be attached to cover the IC tag. This makes it possible to perform various types of printing even on the part to which the IC tag is attached, making it easier to adapt it to a booklet. By covering the formed printing layer with an overcoat layer made of resin or the like, it is possible to prevent bleed-through when other pages of the booklet come into contact with it.
Another method is to form the base material 21 of the IC tag from paper and provide an adhesive layer 30 on the surface where the antenna 22 and the IC chip 25 are arranged, as shown in FIG. The configuration can be such that printing can be performed on the part to which the IC tag is attached. This configuration also has the advantage that printing, etc. can be performed without increasing the thickness of the IC tag.

- When providing an adhesive layer on an IC tag, as shown in FIG. 9, a non-adhesive portion 40 may be provided at the peripheral edge in plan view of the surface of the base material 21 on which the adhesive layer 30 is provided. In this way, even if the area of the adhesive layer 30 in plan view increases and spreads over the non-adhesive part 40 due to pressure during pasting, the adhesive layer 30 will not stick to the non-adhesive part 40, so the pressure will be released. Then, the planar area returns to its original size. As a result, the adhesive layer 30 is prevented from protruding from the base material 21 when the IC tag is viewed from above, and problems such as the protruding adhesive layer sticking to other pages can be suitably prevented.
The non-adhesive portion 40 can be formed by applying and drying an easy-to-peel agent, or by a known glue killing process.
By making the area where the adhesive layer is provided one size smaller than the dimension of the base material in plan view, the adhesive layer 30 is set so as not to protrude from the base material 21 when viewed in plan view of the IC tag even when the expected maximum pressure is applied. By doing so, this effect can be further enhanced.

- The shape of the antenna of the IC tag is not limited to that shown in the above embodiment, and can be set as appropriate depending on the required communication characteristics.

- The number of times the mount is folded over the surface on which the IC chip is attached is not limited to one time. Therefore, by folding the sheet a plurality of times, the thickness of the folded portion may be set to a desired value.

10, 10A, 10B Mount with IC tag for book 11 Mount 12 Hole 13 Window 20 IC tag 21 Base material 22 Antenna 25 IC chip

Claims (4)

A mount with an IC tag for a book, in which an IC tag having an IC chip is attached to the mount,
The mount is folded over the surface to which the IC tag is attached.
Mount with IC tag for books. The mount has a window portion at a portion that is folded over the surface to which the IC tag is attached,
At least a part of the IC tag, including the IC chip, is located within the window when viewed from above of the book IC tag-attached mount.
The mount with an IC tag for books according to claim 1. a mount having holes;
an IC tag having an IC chip and attached to the mount;
Equipped with
In plan view, the IC chip is located within the range of the hole;
Mount with IC tag for books. A book comprising the book IC tag-attached mount according to any one of claims 1 to 3.

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