JP2023152418A

JP2023152418A - Electrical contact and electrical connection device

Info

Publication number: JP2023152418A
Application number: JP2022062431A
Authority: JP
Inventors: 輝夫福士; Teruo Fukushi
Original assignee: Micronics Japan Co Ltd
Current assignee: Micronics Japan Co Ltd
Priority date: 2022-04-04
Filing date: 2022-04-04
Publication date: 2023-10-17

Abstract

To enable tips of a plurality of electrical contacts to be joined in parallel with a substrate surface by reducing the effect of deflection on the substrate surface when joining the electrical contacts to the substrate surface in aligning the height of the tips, even when the substrate surface has slight deflection.SOLUTION: A tabular electrical contact mounted on a substrate surface includes: a contact part in electrical contact with an electrode of an object to be inspected; a beam part connected to one end of the contact part; a main body supporting part supporting the beam part; and a joint part jointed to the substrate surface while being in contact with a wiring formed on the substrate surface. The joint part is elastic in a direction perpendicular to the substrate surface under load at joining, and can adjust a posture of the body part including the main body supporting part, the beam part, and the contact part, and can maintain the posture of the body part at joining.SELECTED DRAWING: Figure 1

Description

本発明は、電気的接触子及び電気的接続装置に関し、例えば、半導体ウェハ上に形成された半導体集積回路等の電気的検査を行なう検査装置に用いられる電気的接触子に適用し得るものである。 TECHNICAL FIELD The present invention relates to an electrical contact and an electrical connection device, and can be applied, for example, to an electrical contact used in an inspection device for electrically inspecting a semiconductor integrated circuit formed on a semiconductor wafer. .

半導体ウェハ上に形成された半導体集積回路（以下、「被検査体」とも呼ぶ。）の電気的特性を検査する際、プローブカード等の電気的接続装置を、テストヘッダに取り付けた検査装置（「テスタ」とも呼ぶ。）が用いられる。 When testing the electrical characteristics of a semiconductor integrated circuit formed on a semiconductor wafer (hereinafter also referred to as "test object"), an inspection device (" ) is used.

プローブカードの一方の面（例えば下面）には、複数の電気的接触子（以下、「プローブ」とも呼ぶ。）が装着されており、被検査体の検査の際に、各電気的接触子の先端部が、被検査体の対応する電極端子に電気的に接触する。その後、検査装置からの電気信号が各電気的接触子を介して各被検査体に供給され、また各被検査体からの信号が各電気的接触子を介して検査装置側に取り込まれることで、各被検査体の電気的検査が行なわれる。 A plurality of electrical contacts (hereinafter also referred to as "probes") are attached to one surface (for example, the bottom surface) of the probe card, and when testing an object to be inspected, each electrical contact is The tip portion electrically contacts the corresponding electrode terminal of the object to be inspected. After that, the electrical signal from the inspection device is supplied to each object to be inspected via each electrical contact, and the signal from each object to be inspected is taken into the inspection device via each electrical contact. , an electrical test is performed on each object to be tested.

従来、プローブカードの一方の面に複数の電気的接触子を装着させる際、図９に例示するように、プローブカードの基板９５に取り付ける部分である電気的接触子９１の接合部を基板９５の面側に向けて、プローブカードの基板９５の面に対して電気的接触子９１が垂直方向に起立するように、電気的接触子９１を基板９５の面に置く。そして、図中の上側から下側に向けて（すなわち、電気的接触子９１側から基板９５側に向けた方向に）一定の荷重を加えた状態で、電気的接触子９１の接合部を半田等で覆うようにして、電気的接触子９１の接合部とプローブカードの基板９５の面との間を半田等で固定する。 Conventionally, when attaching a plurality of electrical contacts to one surface of a probe card, as illustrated in FIG. The electrical contact 91 is placed on the surface of the substrate 95 of the probe card so that the electrical contact 91 stands vertically to the surface of the substrate 95 of the probe card. Then, while applying a constant load from the top to the bottom in the figure (that is, from the electrical contact 91 side to the board 95 side), the joint portion of the electrical contact 91 is soldered. The connection portion of the electrical contactor 91 and the surface of the substrate 95 of the probe card are fixed with solder or the like so as to be covered with a wire or the like.

国際公開番号ＷＯ２００７／０８６１４７号International publication number WO2007/086147

しかしながら、複数の電気的接触子を据えるプローブカード基板の表面は、必ずしもフラットではなく、基板が僅かに撓んで反りやうねりがある。被検査体の電極端子に対する位置合わせを確実にするために、複数の電気的接触子のそれぞれの先端の高さ位置を整列基準面ＳＦ（図９参照）に揃えて、プローブカード基板に対して各電気的接触子を接合しようとすると、基板表面に対して電気的接触子の接合部が浮いたり傾いたりしてしまい、その状態のまま電気的接触子をプローブカード基板に接合してしまうと、接合部分が不安定となってしまう。例えば、高温試験では熱により半田が軟化し、接合部分が不安定となってしまい、被検査体の電極端子に対する位置ずれ、電気的接触子の倒れが生じてしまう。 However, the surface of the probe card board on which the plurality of electrical contacts are placed is not necessarily flat, and the board is slightly bent, causing warps and undulations. In order to ensure alignment with the electrode terminals of the object to be inspected, the height positions of the tips of each of the plurality of electrical contacts are aligned with the alignment reference plane SF (see Fig. 9), and the height positions are aligned with respect to the probe card board. When you try to connect each electrical contact, the joint part of the electrical contact will float or tilt with respect to the board surface, and if you connect the electrical contact to the probe card board in that state, , the joint becomes unstable. For example, in a high-temperature test, the solder softens due to heat, making the bonded part unstable, resulting in misalignment of the object to be inspected with respect to the electrode terminal, and the fall of the electrical contact.

そのため、本発明は、上述した課題に鑑み、複数の電気的接触子の間で、先端の高さ位置を揃えて基板表面に接合する際、基板表面に微細な撓みがあるときでも、基板表面の撓みの影響を和らげて確実に接合することができる電気的接触子及び電気的接続装置を提供しようとするものである。 Therefore, in view of the above-mentioned problems, the present invention has been made to solve the problem that, when a plurality of electrical contacts are bonded to the substrate surface with their tips aligned at the same height, even when there is minute deflection on the substrate surface. The object of the present invention is to provide an electrical contact and an electrical connection device that can reduce the influence of deflection of the electrical contacts and ensure reliable connection.

かかる課題を解決するため、第１の本発明は、基板表面に据え付けられる板状の電気的接触子であって、被検査体の電極と電気的に接触する接触部と、接触部の一端と連結する梁部と、梁部を支持する本体支持部と、基板表面に形成された配線と接触しながら基板表面に接合する接合部とを備え、接合部が、接合時の荷重を受けて、基板表面に垂直な方向に弾性して、本体支持部、梁部及び接触部を含む本体部の姿勢を調整可能であり、本体部の接合時の姿勢を保持可能なものであることを特徴とする。 In order to solve this problem, a first aspect of the present invention provides a plate-shaped electrical contact installed on the surface of a substrate, which includes a contact part that makes electrical contact with an electrode of an object to be inspected, and one end of the contact part. The device includes a beam portion to be connected, a main body support portion that supports the beam portion, and a joint portion that is joined to the surface of the substrate while contacting wiring formed on the surface of the substrate, and the joint portion receives a load at the time of joining. It is characterized by being elastic in a direction perpendicular to the substrate surface, so that the posture of the main body including the main body supporting portion, the beam portion, and the contact portion can be adjusted, and the posture of the main body when being joined can be maintained. do.

第２の本発明は、検査装置と、被検査体の電極に接触する複数の接触子との間を電気的に接続する電気的接続装置において、基板と、基板の一方の端部側に設けられ、被検査体の電極に対して接触する複数の接触子とを備え、接触子が、第１の本発明の電気的接触子を有することを特徴とする。 A second aspect of the present invention provides an electrical connection device for electrically connecting an inspection device and a plurality of contacts contacting electrodes of an object to be inspected. and a plurality of contacts that contact the electrodes of the object to be inspected, and the contacts include the electrical contact of the first aspect of the present invention.

本発明によれば、複数の電気的接触子の間で、先端の高さ位置を揃えて基板表面に接合する際、基板表面に微細な撓みがあるときでも、基板表面の撓みの影響を和らげて確実に接合することができる。 According to the present invention, when a plurality of electrical contacts are bonded to the substrate surface with their tips aligned at the same height, even when there is minute deflection on the substrate surface, the influence of the deflection on the substrate surface is alleviated. can be reliably joined.

実施形態において、プローブ基板の配線基板に据える電気的接触子の構成例を示す構成図である。FIG. 2 is a configuration diagram showing an example of the configuration of electrical contacts installed on the wiring board of the probe board in the embodiment. 実施形態に係る電気的接続装置の構成を示す構成図である。FIG. 1 is a configuration diagram showing the configuration of an electrical connection device according to an embodiment. 実施形態に係る電気的接触子の配線基板への接合を説明する説明図である。FIG. 3 is an explanatory diagram illustrating joining of the electrical contact to the wiring board according to the embodiment. 実施形態に係る姿勢保持部の構成を示す拡大構成図である。FIG. 2 is an enlarged configuration diagram showing the configuration of the posture holding section according to the embodiment. 実施形態に係る電気的接触子の第１の変形例を示す構成図である。It is a block diagram which shows the 1st modification of the electrical contactor based on embodiment. 実施形態に係る電気的接触子の第２の変形例を示す構成図である。It is a block diagram which shows the 2nd modification of the electrical contactor based on embodiment. 実施形態に係る電気的接触子の第３の変形例を示す構成図である。It is a block diagram which shows the 3rd modification of the electrical contactor based on embodiment. 実施形態に係る電気的接触子の第４の変形例を示す構成図である。It is a block diagram which shows the 4th modification of the electrical contactor based on embodiment. 従来の微妙に撓んでいる基板面への電気的接触子の接合を説明する説明図である。FIG. 2 is an explanatory diagram illustrating a conventional method of joining an electrical contact to a substrate surface that is slightly bent. 実施形態において微妙に撓んでいる基板面への電気的接触子の接合を説明する説明図である。FIG. 3 is an explanatory diagram illustrating the joining of an electrical contact to a substrate surface that is slightly bent in the embodiment.

（Ａ）実施形態
以下、本発明に係る電気的接触子及び電気的接続装置の実施形態を、図面を参照しながら詳細に説明する。 (A) Embodiment Hereinafter, embodiments of an electrical contact and an electrical connection device according to the present invention will be described in detail with reference to the drawings.

（Ａ－１）実施形態の構成
（Ａ－１－１）電気的接続装置
まず、実施形態に係る複数の電気的接触子を据える電気的接続装置の構成例を、図２を参照しながら説明する。 (A-1) Configuration of Embodiment (A-1-1) Electrical Connection Device First, a configuration example of an electrical connection device for installing a plurality of electrical contacts according to the embodiment will be explained with reference to FIG. do.

図２は、実施形態に係る電気的接続装置の構成を示す構成図である。図２では、電気的接続装置３の主要な構成部材を図示しているが、これらの構成部材に限定されず、実際の電気的接続装置は、図２に図示しない構成部材も有する。 FIG. 2 is a configuration diagram showing the configuration of the electrical connection device according to the embodiment. Although FIG. 2 shows the main components of the electrical connection device 3, the present invention is not limited to these components, and the actual electrical connection device also includes components not shown in FIG. 2.

図２において、この実施形態に係る電気的接続装置３は、平板状の配線基板４１と、配線基板４１と電気的に接続される電気的接続ユニット４２と、電気的接続ユニット４２と電気的に接続すると共に、被検査体２の電極端子５１と電気的に接続する複数の電気的接触子１が装着されたプローブ基板４３と、を備える。 In FIG. 2, the electrical connection device 3 according to this embodiment includes a flat wiring board 41, an electrical connection unit 42 that is electrically connected to the wiring board 41, and an electrical connection unit 42 that is electrically connected to the electrical connection unit 42. The probe board 43 is equipped with a plurality of electrical contacts 1 that are connected and electrically connected to the electrode terminals 51 of the object to be inspected 2 .

電気的接続装置３は、図示しない検査装置（テスター）のテストヘッドに装着されるものである。被検査体２をプローブ基板４３に向けて押圧し、プローブ基板４３の各電気的接触子１の先端部１６１と被検査体２の電極端子５１とを電気的に接触させる。そして、検査の際に、図示しない検査装置（テスタ）からの電気信号が各電気的接触子１を介して被検査体２の電極端子５１に電気信号を供給され、さらに被検査体２の電極端子５１からの電気信号が各電気的接触子１を介してテスタに与えられる。このようにして、テスタは、被検査体２の電気特性を捉えることで被検査体２の電気的検査を行なう。 The electrical connection device 3 is attached to a test head of a tester (not shown). The object to be inspected 2 is pressed toward the probe substrate 43 to bring the tip portion 161 of each electrical contact 1 of the probe substrate 43 into electrical contact with the electrode terminal 51 of the object to be inspected 2 . During inspection, an electrical signal from an inspection device (tester) (not shown) is supplied to the electrode terminal 51 of the object to be inspected 2 via each electrical contactor 1. An electrical signal from the terminal 51 is applied to the tester via each electrical contact 1. In this way, the tester conducts an electrical test of the object to be inspected 2 by capturing the electrical characteristics of the object to be inspected 2 .

検査対象である被検査体２はチャックトップ５の上面に載置される。チャックトップ５は、水平方向のＸ軸方向、水平面上においてＸ軸方向に対して垂直なＹ軸方向、水平面（Ｘ－Ｙ平面）に対して垂直なＺ軸方向に位置調整が可能であり、さらに、Ｚ軸回りのθ方向に回転姿勢を調整可能である。被検査体２の電気的検査を実施する際には、上下方向（Ｚ軸方向）に昇降可能なチャックを移動させて、被検査体２の電極端子５１をプローブ基板４３の各電気的接触子１の先端部に電気的に接触させるため、電気的接続装置３のプローブ基板４３の下面と、チャックトップ５上の被検査体２とが相対的に近づくように移動させる。 The object to be inspected 2 is placed on the upper surface of the chuck top 5 . The chuck top 5 can be positioned in the horizontal X-axis direction, in the Y-axis direction perpendicular to the X-axis direction on the horizontal plane, and in the Z-axis direction perpendicular to the horizontal plane (XY plane), Furthermore, the rotational attitude can be adjusted in the θ direction around the Z axis. When performing an electrical test on the object to be inspected 2, a chuck that can be raised and lowered in the vertical direction (Z-axis direction) is moved to connect the electrode terminals 51 of the object to be inspected 2 to each electrical contact on the probe board 43. 1, the lower surface of the probe substrate 43 of the electrical connection device 3 and the object to be inspected 2 on the chuck top 5 are moved relatively closer to each other.

［配線基板］
配線基板４１は、例えばポリイミド等の樹脂材料で形成されたものであり、例えば略円形板状に形成されたプリント基板等である。配線基板４１の上面の周縁部には、テスタのテストヘッド（図示しない）と電気的に接続する多数の電極端子（図示しない）が配置されている。また、配線基板４１の下面には、図示しない配線パターンが形成されており、配線パターンの接続端子と、電気的接続ユニット４２に設けられている複数の接続子（図示しない）の上端部とが電気的に接続するようになっている。 [Wiring board]
The wiring board 41 is made of a resin material such as polyimide, and is, for example, a printed circuit board formed into a substantially circular plate shape. A large number of electrode terminals (not shown) are arranged on the periphery of the upper surface of the wiring board 41 to electrically connect to a test head (not shown) of a tester. Further, a wiring pattern (not shown) is formed on the lower surface of the wiring board 41, and connection terminals of the wiring pattern and upper ends of a plurality of connectors (not shown) provided in the electrical connection unit 42 are connected to each other. It is designed to be electrically connected.

配線基板４１は様々な構成をとることができるが、例えば以下のような構成をとることができる。例えば、配線基板４１の上面には、テストヘッドと電気的に接続する電極端子が形成され、配線基板４１の下面には、電気的接続ユニット４２の各接続子と電気的に接続する配線パターンが形成され、更に、配線基板４１の内部には配線回路が形成されている。配線基板４１の下面の配線パターンと、配線基板４１の上面の電極端子とは、配線基板４１内部の配線回路を介して接続可能となっている。したがって、配線基板４１内の配線回路を介して、電気的接続ユニット４２の各接続子と、テストヘッドとの間で電気信号を導通させることができる。なお、配線基板４１の上面には、被検査体２の電気的検査に必要な複数の電子部品も配置されている。 Although the wiring board 41 can take various configurations, for example, it can take the following configuration. For example, electrode terminals electrically connected to the test head are formed on the upper surface of the wiring board 41, and wiring patterns electrically connected to the connectors of the electrical connection unit 42 are formed on the lower surface of the wiring board 41. Furthermore, a wiring circuit is formed inside the wiring board 41. The wiring pattern on the lower surface of the wiring board 41 and the electrode terminal on the upper surface of the wiring board 41 can be connected via a wiring circuit inside the wiring board 41. Therefore, electrical signals can be made conductive between each connector of the electrical connection unit 42 and the test head via the wiring circuit within the wiring board 41. Note that on the upper surface of the wiring board 41, a plurality of electronic components necessary for electrically testing the object to be inspected 2 are also arranged.

［電気的接続ユニット］
電気的接続ユニット４２は、例えばポゴピン等のような複数の接続子を有している。電気的接続装置３の組み立て状態では、各接続子の上端部を、配線基板４１の下面の配線パターンの接続端子に電気的に接続され、また各接続子の下端部を、プローブ基板４３の上面に設けられたパッドに接続される。電気的接触子１の先端部が被検査体２の電極端子５１に電気的に接触するので、被検査体２の電極端子５１は、電気的接触子１及び接続子を通じて、テスタと電気的に接続される。 [Electrical connection unit]
The electrical connection unit 42 has a plurality of connectors, such as pogo pins. In the assembled state of the electrical connection device 3, the upper end of each connector is electrically connected to the connection terminal of the wiring pattern on the lower surface of the wiring board 41, and the lower end of each connector is connected to the upper surface of the probe board 43. is connected to a pad provided on the Since the tip of the electrical contact 1 electrically contacts the electrode terminal 51 of the test object 2, the electrode terminal 51 of the test object 2 is electrically connected to the tester through the electrical contact 1 and the connector. Connected.

［プローブ基板］
プローブ基板４３は、複数の電気的接触子１を有する基板であり、略円形若しくは多角形（例えば１６角形等）に形成されたものである。電気的接続装置３にプローブ基板４３が装着される際、プローブ基板４３は、その周縁部をプローブ基板支持部１８により支持される。プローブ基板４３に組み込まれる電気的接触子１は、例えば、カンチレバー型プローブ等を用いることができるが、これに限定されるものではない。被検査体（半導体集積回路）２の数や、各被検査体２の電極端子５１の数等に応じた数の電気的接触子１が、プローブ基板４３に組み込まれる。 [Probe board]
The probe substrate 43 is a substrate having a plurality of electrical contacts 1, and is formed into a substantially circular or polygonal shape (for example, hexagonal shape, etc.). When the probe board 43 is attached to the electrical connection device 3 , the probe board 43 is supported at its peripheral edge by the probe board support section 18 . The electrical contact 1 incorporated into the probe substrate 43 can be, for example, a cantilever type probe, but is not limited thereto. The number of electrical contacts 1 corresponding to the number of objects to be tested (semiconductor integrated circuits) 2, the number of electrode terminals 51 of each object to be tested 2, etc. is incorporated into the probe board 43.

プローブ基板４３は様々な構成をとることができるが、図２ではその一例を示している。例えば、プローブ基板４３は、例えばセラミック板等で形成される基板部材４３１と、基板部材４３１の下面に形成された配線基板４３２とを有する。 Although the probe board 43 can take various configurations, one example is shown in FIG. For example, the probe board 43 includes a board member 431 made of, for example, a ceramic plate, and a wiring board 432 formed on the lower surface of the board member 431.

セラミック基板である基板部材４３１の内部には、板厚方向に貫通する多数の導電路（図示しない）が形成されたものとしてもよい。基板部材４３１の上面にはパッドが形成されており、基板部材４３１内の導電路の一端が、当該基板部材４３１の上面の対応する配線パターンの接続端子と接続するように形成されている。基板部材４３１の下面では、基板部材４３１内の導電路の他端が、配線基板４３２の上面に設けられた接続端子と接続されるように形成されている。 A large number of conductive paths (not shown) penetrating in the thickness direction may be formed inside the substrate member 431, which is a ceramic substrate. A pad is formed on the upper surface of the substrate member 431, and one end of the conductive path within the substrate member 431 is formed to connect to a connection terminal of a corresponding wiring pattern on the upper surface of the substrate member 431. On the lower surface of the substrate member 431, the other end of the conductive path within the substrate member 431 is formed to be connected to a connection terminal provided on the upper surface of the wiring board 432.

配線基板４３２は、例えばポリイミド等の合成樹脂部材で形成された基板である。配線基板４３２の一方の面（例えば、下面）には複数の電気的接触子１のそれぞれと接合している。配線基板４３２の一方の面に接続している電気的接触子１は、電気的接続ユニット４２を介して、配線基板４１の対応する接続端子と電気的に接続している。 The wiring board 432 is a board made of a synthetic resin material such as polyimide, for example. Each of the plurality of electrical contacts 1 is connected to one surface (for example, the lower surface) of the wiring board 432 . The electrical contact 1 connected to one surface of the wiring board 432 is electrically connected to the corresponding connection terminal of the wiring board 41 via the electrical connection unit 42.

（Ａ－１－２）電気的接触子の構成
次に、実施形態に係る電気的接触子１の構成を図面を参照しながら説明する。 (A-1-2) Structure of Electrical Contactor Next, the structure of the electrical contactor 1 according to the embodiment will be described with reference to the drawings.

図１は、実施形態において、プローブ基板４３の配線基板４３２に据える電気的接触子１の構成例を示す構成図である。 FIG. 1 is a configuration diagram showing an example of the configuration of the electrical contact 1 placed on the wiring board 432 of the probe board 43 in the embodiment.

図１において、実施形態に係る電気的接触子１は、接合部１０、本体支持部１１、第１アーム部１３、第２アーム部１４、台座部１５、接触部１６を有する。 In FIG. 1, the electrical contact 1 according to the embodiment includes a joint portion 10, a main body support portion 11, a first arm portion 13, a second arm portion 14, a pedestal portion 15, and a contact portion 16.

電気的接触子１は、例えば金属等の導電性部材で形成されており、配線基板４３２の表面に形成された配線４５と、被検査体２の電極端子５１との間で電気信号を導通する。例えば、電気的接触子１の接合部１０が、配線基板４３２の配線４５と接触するように接合されて、配線基板４３２に電気的接触子１が据え付けられる。被検査体２の検査時に、電気的接触子１の接触部１６の先端部１６１が、被検査体２の電極端子５１と電気的に接触して、電気的接触子１が、配線４５と被検査体２の電極端子５１との間で電気信号を導通する。 The electrical contact 1 is made of a conductive member such as metal, and conducts electrical signals between the wiring 45 formed on the surface of the wiring board 432 and the electrode terminal 51 of the object to be inspected 2. . For example, the joint portion 10 of the electrical contact 1 is joined so as to be in contact with the wiring 45 of the wiring board 432, and the electrical contact 1 is installed on the wiring board 432. When inspecting the object to be inspected 2, the tip 161 of the contact portion 16 of the electrical contact 1 comes into electrical contact with the electrode terminal 51 of the object to be inspected 2, and the electrical contact 1 is connected to the wiring 45 and the object to be inspected. An electric signal is conducted between the electrode terminal 51 of the test object 2 and the electrode terminal 51 .

電気的接触子１は、例えば、メッキ加工、エッチング、リソグラフィ等のＭＥＭＳプロセス技術により形成することができ、電気的接触子１は、全体の厚さを同じ又は同程度で形成された板状部材である。また、電気的接触子１の寸法は、被検査体２の電極端子５１の大きさや電極端子５１間の間隔等に応じて決められるので特に限定されないが、例えば電気的接触子１の左右方向（長手方向）の寸法（長さ）は数ｍｍ程度とすることができる。 The electrical contact 1 can be formed by, for example, MEMS process technology such as plating, etching, and lithography, and the electrical contact 1 is a plate-like member formed with the same or approximately the same overall thickness. It is. Further, the dimensions of the electrical contact 1 are not particularly limited as they are determined according to the size of the electrode terminals 51 of the object to be inspected 2, the spacing between the electrode terminals 51, etc.; The dimension (length) in the longitudinal direction can be approximately several mm.

電気的接触子１は、カンチレバー型プローブである。すなわち、接触部１６が被検査体２の電極端子５１と電気的に接触する際に、電極端子５１側から接触部１６側に向けて接触荷重が作用し、その接触荷重により、本体支持部１１側と連結している第１アーム部１３及び第２アーム部１４が弾性変形し、第１アーム部１３及び第２アーム部１４が接触部１６を弾性的に支持する。このように、カンチレバー型の電気的接触子１は、接触部１６と電極端子５１との接触荷重を抑制しながら、接触部１６と電極端子５１とを確実に電気的に接触させることができる。 The electrical contact 1 is a cantilever probe. That is, when the contact part 16 makes electrical contact with the electrode terminal 51 of the object to be inspected 2, a contact load acts from the electrode terminal 51 side toward the contact part 16 side, and the contact load causes the main body support part 11 The first arm part 13 and the second arm part 14 connected to the side are elastically deformed, and the first arm part 13 and the second arm part 14 elastically support the contact part 16. In this manner, the cantilever-type electrical contact 1 can reliably bring the contact portion 16 and the electrode terminal 51 into electrical contact while suppressing the contact load between the contact portion 16 and the electrode terminal 51.

［本体支持部］
本体支持部１１は、接合部１０側から上方に向けて（配線基板４３２から被検査体２側に向けて）延びた部分である。本体支持部１１は、接触部１６が被検査体２の電極端子５１に接触した際に生じる接触荷重により弾性変形する、第１アーム部１３及び第２アーム部１４を支持する部分である。 [Body support part]
The main body support portion 11 is a portion extending upward from the joint portion 10 side (from the wiring board 432 toward the inspected object 2 side). The main body support portion 11 is a portion that supports the first arm portion 13 and the second arm portion 14, which is elastically deformed by a contact load generated when the contact portion 16 contacts the electrode terminal 51 of the inspected object 2.

［第１アーム部及び第２アーム部］
第１アーム部１３及び第２アーム部１４の一端は、本体支持部１１と連結し、第１アーム部１３及び第２アーム部１４の他端は、台座部１５と連結している。第１アーム部１３及び第２アーム部１４は、接触部１６の電極端子５１への接触時に、接触部１６を弾性的に支持する部分である。第１アーム部１３及び第２アーム部１４は、接触荷重による接触部１６の上下方向の移動量や、オーバードライブによる左右方向のスクラブ量を調整する部分である。 [First arm section and second arm section]
One ends of the first arm section 13 and the second arm section 14 are connected to the main body support section 11 , and the other ends of the first arm section 13 and the second arm section 14 are connected to the pedestal section 15 . The first arm portion 13 and the second arm portion 14 are portions that elastically support the contact portion 16 when the contact portion 16 contacts the electrode terminal 51. The first arm part 13 and the second arm part 14 are parts that adjust the vertical movement amount of the contact part 16 due to contact load and the horizontal scrub amount due to overdrive.

図１では、電気的接触子１が２本のアーム部（第１アーム部１３及び第２アーム部１４）を備える場合を例示するが、アーム部の本数はこれに限定されず、また、接触部１６を弾性的に支持可能であればアーム部の形状は限定されない。 Although FIG. 1 exemplifies the case where the electrical contactor 1 includes two arm portions (the first arm portion 13 and the second arm portion 14), the number of arm portions is not limited to this, and the contact The shape of the arm part is not limited as long as it can elastically support the part 16.

［台座部］
台座部１５は、第１アーム部１３及び第２アーム部１４の各他端と連結すると共に、接触部１６を備える部分である。 [Pedestal part]
The pedestal portion 15 is a portion that is connected to the other ends of the first arm portion 13 and the second arm portion 14 and includes a contact portion 16 .

［接触部］
接触部１６は、台座部１５の上部に設けられ、接触部１６の先端部１６１が被検査体２の電極端子５１と電気的に接触する。 [Contact part]
The contact part 16 is provided on the upper part of the pedestal part 15, and the tip part 161 of the contact part 16 makes electrical contact with the electrode terminal 51 of the object to be inspected 2.

［接合部］
接合部１０は、プローブ基板４３の配線基板４３２に取り付けられる部分である。 [Joint part]
The joint portion 10 is a portion of the probe board 43 that is attached to the wiring board 432.

電気的接触子１を配線基板４３２に接合する際、電気的接触子１の接合部１０側を、配線基板４３２の基板面に向けて、配線基板４３２の基板面に対して電気的接触子１が垂直に起立した状態となるようにして、基板面に接合部１０を置く。このとき、配線基板４３２上の配線４５に、接合部１０が接触するようにする。 When joining the electrical contact 1 to the wiring board 432, the electrical contact 1 is placed against the board surface of the wiring board 432 with the joint 10 side of the electrical contact 1 facing the board surface of the wiring board 432. The bonding portion 10 is placed on the substrate surface so that the bonding portion 10 stands vertically. At this time, the bonding portion 10 is brought into contact with the wiring 45 on the wiring board 432.

その後、接合部１０と配線４５とを確実に接触させるため、上側から下側に向けて（電気的接触子１の接触部１６側から配線基板４３２側に向けて）、電気的接触子１の先端部１６１の高さ位置が整列基準面ＳＦ（図３参照）に揃うように、電気的接触子１の接合部１０を基板面に押し付け、その状態で、半田等の接合材Ｓを用いて、電気的接触子１の接合部１０と配線基板４３２の基板面とを接合する。 Thereafter, in order to ensure that the joint 10 and the wiring 45 are in contact with each other, the electrical contact 1 is The joint part 10 of the electrical contact 1 is pressed against the substrate surface so that the height position of the tip part 161 is aligned with the alignment reference plane SF (see FIG. 3), and in this state, using a joint material S such as solder, , the joint portion 10 of the electrical contactor 1 and the substrate surface of the wiring board 432 are joined.

このとき、図３に例示するように、電気的接触子１の接合部１０を、半田等の接合材Ｓで覆うようにして、電気的接触子１の接合部１０と配線基板４３２とを接合する。 At this time, as illustrated in FIG. 3, the bonding portion 10 of the electrical contact 1 is covered with a bonding material S such as solder, and the bonding portion 10 of the electrical contact 1 and the wiring board 432 are bonded. do.

ここで、図１に示すように、電気的接触子１の接合部１０は、基端部１０６と、電気的接触子１の長手方向に延びた基部１０３と、配線基板４３２の基板面に対して接触する基板面接触部１０４と、基部１０３と基板面接触部１０４との間に存在する弾性部１０５と、基板面接触部１０４の一方の端部側で基板面に対して垂直方向に起立する第１保持部１０１と、基板面接触部１０４の他方の端部側で基板面に対して垂直方向に起立する第２保持部１０２とを有する。 Here, as shown in FIG. 1, the joint portion 10 of the electrical contact 1 is connected to the base end 106, the base 103 extending in the longitudinal direction of the electrical contact 1, and the board surface of the wiring board 432. an elastic portion 105 existing between the base 103 and the substrate surface contact portion 104, and an elastic portion 105 that stands up perpendicularly to the substrate surface at one end of the substrate surface contact portion 104; The second holding part 102 stands up in the direction perpendicular to the substrate surface on the other end side of the substrate surface contacting part 104.

基端部１０６は、本体支持部１１の下方側（配線基板４３２の基板面側）と基部１０３とに連結する部分である。基端部１０６は、板状の電気的接触子１の側面から見ると、略台形の形状としている。 The base end portion 106 is a portion that connects the lower side of the main body support portion 11 (the substrate surface side of the wiring board 432) and the base portion 103. The base end portion 106 has a substantially trapezoidal shape when viewed from the side of the plate-shaped electrical contact 1.

基部１０３は、基端部１０６の下方側（配線基板４３２の基板面側）に連結して、電気的接触子１の長手方向に延びる板状部分である。基部１０３は、基端部１０６から上側に存在している各要素（すなわち、接触部１６、台座部１５、第１アーム部１３及び第２アーム部１４、本体支持部１１）の姿勢を保持する部分である。基部１０３の下方側（配線基板４３２の基板面側）には、基部１０３の長手方向に沿って、３個の弾性部１０５が設けられている。 The base portion 103 is a plate-shaped portion that is connected to the lower side of the base end portion 106 (the side of the substrate surface of the wiring board 432) and extends in the longitudinal direction of the electrical contact 1. The base portion 103 maintains the posture of each element present above the base end portion 106 (i.e., the contact portion 16, the pedestal portion 15, the first arm portion 13 and the second arm portion 14, and the main body support portion 11). It is a part. Three elastic parts 105 are provided on the lower side of the base 103 (on the board surface side of the wiring board 432) along the longitudinal direction of the base 103.

各弾性部１０５は、一方の端部（上側端部）が基部１０３に連結しており、他方の端部（下側端部）が基板面接触部１０４に連結している。各弾性部１０５は、一方の端部から、垂直下向きに一旦引き出され、その後折り曲げられて、長手方向に所定長だけ延ばし、更にその後折り曲げて逆向きに所定長だけ延ばすように複数回の折り返しを行ない、蛇腹状に形成されている。 Each elastic portion 105 has one end (upper end) connected to the base 103 and the other end (lower end) connected to the substrate surface contact portion 104 . Each elastic portion 105 is once pulled out vertically downward from one end, then bent and extended by a predetermined length in the longitudinal direction, and then folded back multiple times so as to be further bent and extended by a predetermined length in the opposite direction. It is shaped like a bellows.

各弾性部１０５が、図１に例示するように蛇腹状とすることで、電気的接触子１の接合時に、上側から下側に向けて一様の荷重がかけられたときに、配線基板４３２の反りやうねり等に応じて、３個の弾性部１０５がそれぞれ独立して変形し、各弾性部１０５が基板面の反りやうねり等を吸収する。 By forming each elastic portion 105 into a bellows shape as illustrated in FIG. The three elastic parts 105 deform independently according to the warpage, waviness, etc. of the substrate surface, and each elastic part 105 absorbs the warp, waviness, etc. of the substrate surface.

そのため、複数の電気的接触子１のそれぞれの先端部１６１の高さ位置を揃えながら、複数の電気的接触子１を配線基板４３２に接合する際、基部１０３と配線基板４３２の基板面とが平行となり、配線基板４３２の基板面に対して垂直に起立した姿勢で各電気的接触子１を接合することができる。 Therefore, when bonding the plurality of electrical contacts 1 to the wiring board 432 while aligning the height positions of the tips 161 of the plurality of electrical contacts 1, the base 103 and the board surface of the wiring board 432 are Each electrical contact 1 can be joined in a posture parallel to the other and standing perpendicular to the board surface of the wiring board 432.

なお、弾性部１０５の形状は、上下方向（配線基板４３２に対して垂直方向とその逆方向）に弾性を持つ形状であれば、図１に例示するもの限定されない。また、弾性部１０５の数は、１個、２個又は４個以上でもよい。 Note that the shape of the elastic portion 105 is not limited to that illustrated in FIG. 1 as long as it has elasticity in the vertical direction (in the direction perpendicular to the wiring board 432 and in the opposite direction). Moreover, the number of elastic parts 105 may be one, two, or four or more.

第１保持部１０１は、基板面接触部１０４の一方の端部側で垂直に設けられ、第２保持部１０２は、基板面接触部１０４の他方の端部側で垂直に設けられており、基板面接触部１０４と第１保持部１０１と第２保持部１０２とは、略Ｕ字形状を形成している。すなわち、配線基板４３２の基板面に対して垂直方向に起立する部材のうち、上部が開口している。 The first holding part 101 is provided vertically on one end side of the substrate surface contacting part 104, and the second holding part 102 is provided vertically on the other end side of the substrate surface contacting part 104, The substrate surface contact portion 104, the first holding portion 101, and the second holding portion 102 form a substantially U-shape. That is, the upper part of the member that stands up in the direction perpendicular to the board surface of the wiring board 432 is open.

第１保持部１０１の内側面には、複数の係合凹部（以下では、「被係合部」と呼ぶ。）１１０が一定のピッチで設けられている。同様に、第２保持部１０２の内側面にも、複数の係合凹部１１１が一定のピッチで設けられている。 A plurality of engaging recesses (hereinafter referred to as "engaged parts") 110 are provided at a constant pitch on the inner surface of the first holding part 101. Similarly, a plurality of engagement recesses 111 are provided on the inner surface of the second holding part 102 at a constant pitch.

また、基部１０３の第１端部１０３ａは、第１保持部１０１の係合凹部１１０と係合する係合凸部１０８を有している。同様に、基部１０３の第２端部１０３ｂは、第２保持部１０２の係合凹部１１１と係合する係合凸部１０９を有する。 Further, the first end portion 103a of the base portion 103 has an engagement convex portion 108 that engages with the engagement recess 110 of the first holding portion 101. Similarly, the second end 103b of the base 103 has an engagement convex portion 109 that engages with the engagement recess 111 of the second holding portion 102.

ここで、第１端部１０３ａの係合凸部１０８と、第１保持部１０１の係合凹部１１０とを有する構成と、第２保持部１０２の係合凹部１１１と、第２端部１０３ｂの係合凸部１０９とを有する構成のそれぞれを、「姿勢保持部１５０」とも呼ぶ。 Here, a configuration including an engagement convex portion 108 of the first end portion 103a and an engagement recess 110 of the first holding portion 101, an engagement recess 111 of the second holding portion 102, and a structure having the engagement convex portion 110 of the second end portion 103b. Each structure having the engaging convex portion 109 is also referred to as a “posture holding portion 150”.

図１では、複数の係合凹部１１０が、垂直に起立している第１保持部１０１の中央部付近から下方に向けて（配線基板４３２の基板面側に向けて）配置されている場合を例示する。しかし、係合凸部１０８との係合が可能な位置に、係合凹部１１０が配置されていればよい。例えば、第１保持部１０１の下端で、係合凸部１０８と係合凹部１１０とが係合する可能性が少ないので、第１保持部１０１の下端に係合凹部１１０がなくてもよい。なお係合凹部１１１についても同様である。 FIG. 1 shows a case where the plurality of engagement recesses 110 are arranged downward (toward the board surface side of the wiring board 432) from near the center of the first holding part 101 that stands vertically. Illustrate. However, it is sufficient that the engagement recess 110 is disposed at a position where it can be engaged with the engagement protrusion 108 . For example, since it is unlikely that the engagement protrusion 108 and the engagement recess 110 will engage with each other at the lower end of the first holding part 101, the engagement recess 110 may not be provided at the lower end of the first holding part 101. The same applies to the engagement recess 111.

図１０は、実施形態において微妙に撓んでいる基板面への電気的接触子の接合を説明する説明図である。図１０（Ａ）は、荷重印加前の様子を説明する説明図であり、図１０（Ｂ）は、荷重印加時の様子を説明する説明図である。 FIG. 10 is an explanatory diagram illustrating bonding of an electrical contact to a substrate surface that is slightly bent in the embodiment. FIG. 10(A) is an explanatory diagram illustrating the state before load application, and FIG. 10(B) is an explanatory diagram illustrating the state when load is applied.

図４は、実施形態に係る姿勢保持部１５０の構成を示す拡大構成図である。図４は、基部１０３の第２端部１０３ｂ側に設けられている姿勢保持部１５０を例示している。第１端部１０３ａ側の姿勢保持部１５０も同様の概念である。 FIG. 4 is an enlarged configuration diagram showing the configuration of the posture holding section 150 according to the embodiment. FIG. 4 shows an example of the posture holding section 150 provided on the second end 103b side of the base 103. As shown in FIG. The attitude holding section 150 on the first end 103a side has a similar concept.

例えば、図１０（Ａ）及び図１０（Ｂ）において、配線基板４３２に電気的接触子１を接合する際、上側から下側に向けた荷重がかけられると、基部１０３が配線基板４３２の基板面側に押し込まれる。その際、弾性部１０５が変形することで、基板面の反りを吸収して、整列基準面と、電気的接続装置（プローブカード）に備わる複数の電気的接触子１の先端部１６１で形成される平面との平行状態を保持するが、基板面の反りが大きい場合、いずれかの弾性部１０５が大きく変形して、基部１０３のいずれかの端部（例えば、第２端部１０３ｂ）が基板面側に深く押し込まれる。そのとき、図４のように、例えば第２端部１０３ｂの係合凸部１０９が係合凹部１１１に嵌り、電気的接触子１の姿勢を保持することができる。 For example, in FIGS. 10(A) and 10(B), when a load is applied from the upper side to the lower side when bonding the electrical contact 1 to the wiring board 432, the base portion 103 is attached to the wiring board 432. Pushed into the surface. At this time, the elastic portion 105 deforms to absorb the warpage of the substrate surface, and the alignment reference surface and the tip portions 161 of the plurality of electrical contacts 1 provided in the electrical connection device (probe card) are formed. However, if the substrate surface is largely warped, one of the elastic parts 105 will be greatly deformed, and one end of the base 103 (for example, the second end 103b) will be parallel to the plane of the substrate. It is pushed deeply into the surface. At this time, as shown in FIG. 4, for example, the engagement convex portion 109 of the second end portion 103b fits into the engagement recess 111, and the posture of the electrical contact 1 can be maintained.

すなわち、電気的接触子１の接合の際に、荷重が加わったときに、基部１０３の両端部にある係合凸部１０８及び係合凸部１０９のそれぞれが、係合凹部１１０及び係合凹部１１１に係合することで、電気的接触子１の姿勢を保持することができる。 That is, when a load is applied during the joining of the electrical contact 1, the engagement convex portions 108 and 109 at both ends of the base 103 move into the engagement concave portions 110 and 109, respectively. By engaging with 111, the posture of the electrical contact 1 can be maintained.

さらに、係合凸部１０８及び係合凸部１０９のそれぞれが、係合凹部１１０及び係合凹部１１１に係合している状態で、すなわち電気的接触子１の姿勢を保持体状態で、半田等の接合材Ｓを用いて電気的接触子１を配線基板４３２に接合できるので、安定した確実な接合が可能となる。 Further, in a state in which the engaging convex portion 108 and the engaging convex portion 109 are respectively engaged with the engaging concave portion 110 and the engaging concave portion 111, that is, in the state where the electrical contact 1 is in the holder state, soldering is performed. Since the electrical contact 1 can be bonded to the wiring board 432 using a bonding material S such as the above, stable and reliable bonding is possible.

また、接合部１０における各弾性部１０５の間隙は、板状部材を突き抜いた貫通部分である。したがって、各弾性部１０５の間隙に、接合材Ｓが入り込んだ状態で、接合材Ｓが固化するので、弾性変形した状態の各弾性部１０５を保持したまま、接合部１０を強固に接合することができる。 Moreover, the gap between each elastic portion 105 in the joint portion 10 is a penetrating portion that pierces the plate-like member. Therefore, the bonding material S solidifies while entering the gap between each elastic portion 105, so that the bonding portion 10 can be firmly bonded while each elastic portion 105 in an elastically deformed state is maintained. I can do it.

その結果、配線基板４３２の基板面に反りやうねりがあっても、配線基板４３２の基板面に対する浮きや傾きを抑えた状態で、配線基板４３２に対して電気的接触子１を確実に接合することができる。 As a result, even if the board surface of the wiring board 432 is warped or undulated, the electrical contact 1 can be reliably bonded to the wiring board 432 while suppressing floating or tilting of the wiring board 432 with respect to the board surface. be able to.

また、高温試験により半田等の接合材Ｓが軟化しても、被検査体２の電極端子５１に対する先端部１６１の位置ずれや、電気的接触子１の倒れなどを抑えることができる。 Further, even if the bonding material S such as solder is softened by the high temperature test, it is possible to prevent the dislocation of the tip 161 of the object to be inspected 2 with respect to the electrode terminal 51 and the fall of the electrical contact 1.

上述の例では、基部のいずれか端部が深く押し込まれる場合を例示したが、これに限らず、配線基板４３２の基板面の状態によっては、基部１０３の両端部が深く押し込まれて、第１端部１０３ａの係合凸部１０８が第１保持部１０１の係合凹部１１０に嵌ると同時に、第２端部１０３ｂの係合凸部１０９と、第２保持部１０２の係合凹部１１１に嵌ることもある。 In the above example, the case where either end of the base is pushed deeply is illustrated, but the present invention is not limited to this, and depending on the condition of the board surface of the wiring board 432, both ends of the base 103 may be pushed deeply and the first The engagement protrusion 108 of the end 103a fits into the engagement recess 110 of the first holding part 101, and at the same time, the engagement protrusion 109 of the second end 103b and the engagement recess 111 of the second holding part 102 fit. Sometimes.

また、第１保持部１０１及び第２保持部１０２のそれぞれの内側面には、高さが異なる係合凹部１１０及び係合凹部１１１を設けているので、基部１０３の端部の沈み込みに応じて、係合凸部１０８と係合凸部１０９とがそれぞれ、高さが異なる係合凹部１１０と係合凹部１１１に嵌ることもある。その場合でも、配線基板４３２の基板面に対する浮きや傾きを軽減した状態を保持できる。 In addition, since an engaging recess 110 and an engaging recess 111 having different heights are provided on the inner side surfaces of the first holding part 101 and the second holding part 102, it is possible to accommodate the depression of the end of the base 103. Therefore, the engagement protrusion 108 and the engagement protrusion 109 may fit into the engagement recess 110 and the engagement recess 111, which have different heights, respectively. Even in this case, it is possible to maintain a state in which the wiring board 432 is less lifted or tilted with respect to the board surface.

（Ａ－２）変形例
（Ａ－２－１）第１の変形例
図５は、実施形態に係る電気的接触子の第１の変形例を示す構成図である。 (A-2) Modification (A-2-1) First Modification FIG. 5 is a configuration diagram showing a first modification of the electrical contact according to the embodiment.

図５において、第１の変形例の電気的接触子１Ａの接合部１０Ａは、弾性部１０５Ａの構成が、図１の電気的接触子１の接合部１０の弾性部１０５と異なる。 In FIG. 5, a joint portion 10A of an electrical contact 1A of the first modification has a configuration of an elastic portion 105A that is different from the elastic portion 105 of the joint portion 10 of the electrical contact 1 of FIG.

図５の電気的接触子１Ａにおいて、接合部１０Ａは、互いのピッチを略等間隔で配置した４個の弾性部１０５Ａを備え、各弾性部１０５Ａは板バネで形成されている。すなわち、各弾性部１０５Ａの一方の端部（上端部）は基部１０３に連結し、各弾性部１０５Ａの他方の端部（下端部）は基板面接触部１０４に連結している。 In the electrical contact 1A shown in FIG. 5, the joint portion 10A includes four elastic portions 105A arranged at substantially equal pitches, and each elastic portion 105A is formed of a plate spring. That is, one end (upper end) of each elastic portion 105A is connected to the base 103, and the other end (lower end) of each elastic portion 105A is connected to the substrate surface contact portion 104.

４個の弾性部１０５Ａのうち、右側（第１保持部１０１側）にある２個の弾性部１０５Ａは、左上側から右下側に向けて斜めに、下に凸の湾曲しており、左側（第２保持部１０２側）にある２個の弾性部１０５Ａは、右上側から左下側に向けて斜めに下に凸の湾曲している。これにより、電気的接触子１の姿勢を保持することができる。 Among the four elastic parts 105A, the two elastic parts 105A on the right side (first holding part 101 side) are curved diagonally and convexly downward from the upper left side to the lower right side. The two elastic parts 105A (on the second holding part 102 side) are curved obliquely and convexly downward from the upper right side toward the lower left side. Thereby, the posture of the electrical contact 1 can be maintained.

図５の各弾性部１０５Ａの線径は、弾性変形量に応じて適宜決めることができる。例えば、各弾性部１０５Ａの一方の端部（上端部）側の線径を比較的太くし、他方の端部（下端部）側の線径を比較的細くすることで、各弾性部１０５Ａの変形量を大きくすることができる。 The wire diameter of each elastic portion 105A in FIG. 5 can be appropriately determined depending on the amount of elastic deformation. For example, by making the wire diameter at one end (upper end) of each elastic portion 105A relatively thick and the wire diameter at the other end (lower end) side relatively thin, each elastic portion 105A The amount of deformation can be increased.

（Ａ－２－２）第２の変形例
図６は、実施形態の電気的接触子の第２の変形例を示す構成図である。 (A-2-2) Second Modification FIG. 6 is a configuration diagram showing a second modification of the electrical contact according to the embodiment.

図６において、第２の変形例の電気的接触子１Ｂの接合部１０Ｂの構成が、図１の電気的接触子１の接合部１０と異なる。 In FIG. 6, the configuration of the joint portion 10B of the electrical contact 1B of the second modification is different from the joint portion 10 of the electrical contact 1 of FIG.

図６の電気的接触子１Ｂでは、姿勢保持部１５０Ｂの構成が、図１の姿勢保持部１５０の構成と異なる。以下では、第１保持部１０１Ｂ側の姿勢保持部１５０Ｂを用いて例示するが、第２保持部１０２Ｂ側のものも同様である。 In the electrical contact 1B of FIG. 6, the configuration of the posture holding section 150B is different from the configuration of the posture holding section 150 of FIG. In the following, an example will be given using the posture holding section 150B on the first holding section 101B side, but the same applies to the posture holding section 150B on the second holding section 102B side.

例えば、図６の第１保持部１０１Ｂの内側面に設けられる係合凹部１１０Ｂは、隣接する２個の突起のそれぞれが大きく形成されており、係合凸部１０８と係合する係合凹部１１０Ｂの奥行（すなわち、Ｘ方向の長さ）が深く形成されている。これにより、係合凸部１０８と強固に係合することができる。 For example, in the engagement recess 110B provided on the inner surface of the first holding part 101B in FIG. The depth (that is, the length in the X direction) is formed to be large. Thereby, it is possible to firmly engage the engagement convex portion 108.

また例えば、第１保持部１０１Ｂの内側面には、２個の突起で形成される、１個の係合凹部１１０Ｂのみが設けられる場合を例示している。なお、係合凹部１１０Ｂの数は、２個であってもよいし、３個以上であってもよい。また、複数の係合凹部１１０Ｂを備える場合、係合凹部１１０Ｂ間のピッチは一定値であってもよいし、一定値でなくてもよい。後者の場合、例えば、第１保持部１０１Ｂの下側に向かうほど、係合凹部１１０Ｂ間のピッチ長が小さくなるようにしてもよい。これにより、配線基板４３２の基板面の微細なうねりがあるときでも、微細な高さ調整が可能である。 Further, for example, a case is illustrated in which only one engagement recess 110B formed by two protrusions is provided on the inner surface of the first holding part 101B. Note that the number of engagement recesses 110B may be two or three or more. Further, when a plurality of engagement recesses 110B are provided, the pitch between the engagement recesses 110B may or may not be a constant value. In the latter case, for example, the pitch length between the engagement recesses 110B may become smaller toward the lower side of the first holding portion 101B. Thereby, even when there is minute undulation on the board surface of the wiring board 432, minute height adjustment is possible.

さらに例えば、図１及び図５で例示した第１保持部１０１の上部は、内側方向に折れ曲がった部分を備えているのに対して、図６の第１保持部１０１Ｂは、その上部に折れ曲がった部分を備えていない。これにより、電気的接触子１Ｂの構成をより簡単な構造とすることができる。 Furthermore, for example, the upper part of the first holding part 101 illustrated in FIGS. 1 and 5 has an inwardly bent part, whereas the first holding part 101B in FIG. Does not have any parts. Thereby, the configuration of the electrical contact 1B can be made simpler.

図６の電気的接触子１Ｂにおいて、接合部１０Ｂは、第１の変形例で説明した弾性部１０５Ａを２個備えるようにした。２個の弾性部１０５Ａについては第１の変形例で説明したので詳細な説明は省略する。 In the electrical contact 1B of FIG. 6, the joint portion 10B includes two elastic portions 105A described in the first modification. The two elastic portions 105A have been described in the first modification, so detailed description thereof will be omitted.

（Ａ－２－３）第３の変形例
図７は、実施形態の電気的接触子の第３の変形例を示す構成図である。 (A-2-3) Third Modified Example FIG. 7 is a configuration diagram showing a third modified example of the electrical contact according to the embodiment.

図７において、第３の変形例の電気的接触子１Ｃは、姿勢保持部１５０Ｃの構成が、図１及び図５～図６の姿勢保持部１５０及び１５０Ｂの構成と異なる。以下では、第１保持部１０１Ｃ側の姿勢保持部１５０Ｃを用いて例示するが、第２保持部１０２Ｃ側のものも同様である。 In FIG. 7, in the electrical contact 1C of the third modification, the configuration of the posture holding section 150C is different from the configuration of the posture holding sections 150 and 150B in FIGS. 1 and 5 to 6. In the following, an example will be given using the posture holding section 150C on the first holding section 101C side, but the same applies to the posture holding section 150C on the second holding section 102C side.

図７において、第１保持部１０１Ｃ側の姿勢保持部１５０Ｃは、係合凹部１１０Ｃが、第１保持部１０１Ｃの外側面に設けられている。 In FIG. 7, in the posture holding part 150C on the side of the first holding part 101C, an engagement recess 110C is provided on the outer surface of the first holding part 101C.

また、基部１０３の第１端部１０３ａ側は、逆Ｕ字形状に形成されており、逆Ｕ字形状の先端側（図７の右側）端部の内側面に、係合凹部１１０Ｃに対して係合する係合凸部１０８Ｃが設けられている。 Further, the first end 103a side of the base 103 is formed in an inverted U shape, and an engagement recess 110C is formed on the inner surface of the tip end (right side in FIG. 7) of the inverted U shape. An engaging convex portion 108C that engages is provided.

このように、第１保持部１０１Ｃの外側面にある係合凹部１１０Ｃに対して、更に外側から係合凸部１０８Ｃが係合する構造としてもよく、この場合でも上述した実施形態と同様の効果を得ることができる。 In this way, the engaging convex portion 108C may be further engaged from the outside with the engaging concave portion 110C on the outer surface of the first holding portion 101C, and in this case, the same effect as in the above-described embodiment can be obtained. can be obtained.

（Ａ－２－４）第４の変形例
図８は、実施形態の電気的接触子の第４の変形例を示す構成図である。 (A-2-4) Fourth Modification FIG. 8 is a configuration diagram showing a fourth modification of the electrical contact according to the embodiment.

図８において、第４の変形例の電気的接触子１Ｄは、姿勢保持部１５０Ｄの構成が、図１及び図５～図７の姿勢保持部１５０及び１５０Ｂ、１５０Ｃの構成と異なる。以下では、第１保持部１０１Ｄ側の姿勢保持部１５０Ｄを用いて例示するが、第２保持部１０２Ｄ側のものも同様である。 In FIG. 8, in the electrical contact 1D of the fourth modification, the configuration of the posture holding section 150D is different from the configuration of the posture holding sections 150, 150B, and 150C in FIGS. 1 and 5 to 7. In the following, an example will be given using the posture holding section 150D on the first holding section 101D side, but the same applies to the posture holding section 150D on the second holding section 102D side.

図８において、第１保持部１０１Ｄ側の姿勢保持部１５０Ｄは、係合凹部１１０Ｄが、第１保持部１０１Ｄの内側面及び外側面の両方に設けられている。 In FIG. 8, the posture holding part 150D on the side of the first holding part 101D has an engagement recess 110D provided on both the inner and outer surfaces of the first holding part 101D.

また、基部１０３の第１端部１０３ａ側は、逆Ｕ字形状に形成されており、逆Ｕ字形状の図８の右側端部及び左側端部のそれぞれの内側面に、係合凹部１１０Ｄに対して係合する係合凸部１０８Ｄが設けられている。 Further, the first end 103a side of the base 103 is formed in an inverted U shape, and an engaging recess 110D is formed on the inner surface of each of the right end and left end of the inverted U shape in FIG. An engagement convex portion 108D that engages with the other is provided.

このように、基板面に対して垂直に起立する第１保持部１０１Ｄに対して、逆Ｕ字形状の第１端部１０３ａが上から嵌合するように、第１保持部１０１Ｄの内側面と外側面の両方に設けられた係合凹部１１０Ｃに対して、係合凸部１０８Ｃが係合する構造としてもよく、この場合でも上述した実施形態と同様の効果を得ることができる。 In this way, the inverted U-shaped first end 103a is connected to the inner surface of the first holding part 101D so that it fits from above into the first holding part 101D that stands perpendicular to the substrate surface. The structure may be such that the engagement convex portion 108C engages with the engagement concave portions 110C provided on both of the outer surfaces, and even in this case, the same effects as in the embodiment described above can be obtained.

（Ａ－３）実施形態の効果
以上のように、この実施形態によれば、電気的接触子の先端位置の高さを揃えながら電気的接触子を基板面に接合する際、基板面に反りやうねりがあっても、電気的接触子に荷重がかけられ、基板面の微小なうねり等に追従して、うねり等の影響を吸収する弾性部と、荷重により沈み込んだ電気的接触子の姿勢を保持する姿勢保持部とを備えることにより、基板面に対して接合部の浮き等を軽減して、電気的接触子を基板面に起立させることができる。その結果、電気的接触子の先端位置のバラツキを軽減でき、基板面に対して電気的接触子を確実に接合できる。 (A-3) Effects of the Embodiment As described above, according to this embodiment, when the electrical contacts are bonded to the substrate surface while aligning the heights of the tip positions of the electrical contacts, the substrate surface is warped. Even if there is a undulation or undulation, a load is applied to the electrical contact, and the elastic part absorbs the effects of the undulation by following the minute undulations on the board surface, and the electrical contact that sinks due to the load. By including the posture holding part that maintains the posture, it is possible to reduce floating of the joint portion with respect to the substrate surface, and to make the electrical contact stand up on the substrate surface. As a result, variations in the tip positions of the electrical contacts can be reduced, and the electrical contacts can be reliably bonded to the substrate surface.

（Ｂ）他の実施形態
上述した実施形態においても種々の変形例を言及したが、本発明は、以下の変形実施形態にも適用できる。 (B) Other Embodiments Although various modifications have been mentioned in the embodiments described above, the present invention can also be applied to the following modification embodiments.

（Ｂ－１）上述した実施形態で説明した姿勢保持部は、係合凹部が凹部形状であり、係合部が係合凹部に嵌る凸部形状である場合を例示したが、両者が嵌りあい、電気的接触子の姿勢を保持できるならば、係合部が凹部形状であり、係合凹部が凸部形状であってもよい。 (B-1) In the posture holding section described in the above embodiment, the engagement recess is in the shape of a recess, and the engagement part is in the shape of a convex part that fits into the engagement recess. The engaging portion may have a concave shape, and the engaging concave portion may have a convex shape, as long as the posture of the electrical contact can be maintained.

１（１Ａ、１Ｂ、１Ｃ、１Ｄ）…電気的接触子、２…被検査体、３…電気的接続装置、５…チャックトップ、１０（１０Ａ、１０Ｂ）…接合部、１１…本体支持部、１３…第１アーム部、１４…第２アーム部、１５…台座部、１６…接触部、１６１…先端部、１８…プローブ基板支持部、
４１…配線基板、４２…電気的接続ユニット、４３…プローブ基板、４５…配線、５１…電極端子、４３１…基板部材、４３２…配線基板、
１０１（１０１Ｂ、１０１Ｃ、１０１Ｄ）…第１保持部、１０２（１０２Ｂ、１０２Ｃ、１０２Ｄ）…第２保持部、１０３…基部、１０３ａ…第１端部、１０３ｂ…第２端部、１０４…基板面接触部、１０５（１０５Ａ）…弾性部、１０６…基端部、１０８（１０８Ｃ、１０８Ｄ）…係合凸部、１０９（１０９Ｃ、１０９Ｄ）…係合凸部、１１０（１１０Ｂ、１１０Ｃ、１１０Ｄ）…係合凹部、１１１（１１１Ｂ、１１１Ｃ、１１１Ｄ）…係合凹部、１５０（１５０Ｂ、１５０Ｃ、１５０Ｄ）…姿勢保持部。 1 (1A, 1B, 1C, 1D)... electrical contact, 2... object to be inspected, 3... electrical connection device, 5... chuck top, 10 (10A, 10B)... joint portion, 11... main body support portion, 13... First arm part, 14... Second arm part, 15... Pedestal part, 16... Contact part, 161... Tip part, 18... Probe board support part,
41... Wiring board, 42... Electrical connection unit, 43... Probe board, 45... Wiring, 51... Electrode terminal, 431... Board member, 432... Wiring board,
101 (101B, 101C, 101D)...first holding part, 102 (102B, 102C, 102D)...second holding part, 103...base, 103a...first end, 103b...second end, 104...substrate surface Contact portion, 105 (105A)...Elastic portion, 106... Base end portion, 108 (108C, 108D)... Engagement protrusion, 109 (109C, 109D)... Engagement protrusion, 110 (110B, 110C, 110D)... Engagement recess, 111 (111B, 111C, 111D)...Engagement recess, 150 (150B, 150C, 150D)...Posture holding part.

Claims

A plate-shaped electrical contact installed on the surface of a board,
a contact part that makes electrical contact with the electrode of the object to be inspected;
a beam portion connected to one end of the contact portion;
a main body support part that supports the beam part;
a bonding portion that is bonded to the substrate surface while contacting wiring formed on the substrate surface;
The bonding portion is elastic in a direction perpendicular to the substrate surface in response to a load during bonding, and is capable of adjusting the posture of the main body portion including the main body support portion, the beam portion, and the contact portion; An electrical contact characterized by being able to maintain the posture of its main body when it is joined.

The joint portion is
a base that supports the main body;
a substrate surface contact portion that contacts the substrate surface; and a holding portion provided at each end of the substrate surface contact portion;
an elastic portion that is present between the base portion and the substrate surface contact portion and is elastic in response to a load during the bonding;
The electrical contact according to claim 1, further comprising: a posture holding section that maintains the posture of the base section supporting the main body section by accumulating energy in the elastic section.

The posture holding section is
engaging portions at both ends of the base;
The electrical contact according to claim 2, further comprising: an engaged portion provided on each holding portion at both ends of the substrate surface contact portion.

The engaged portion is a recess provided on at least one side surface of the holding portion and formed between protrusions,
The electrical contact according to claim 3, wherein the engaging portion is a convex portion formed at an end of the base.

In an electrical connection device that electrically connects an inspection device and a plurality of contacts that contact electrodes of an object to be inspected,
A substrate and
a plurality of contacts provided on one end side of the substrate and in contact with the electrodes of the object to be inspected;
An electrical connection device characterized in that the contact has the electrical contact according to any one of claims 1 to 4.