JP2023146377A - Buckwheat processing apparatus and buckwheat processing method - Google Patents

Abstract

To provide a buckwheat processing apparatus that can improve sterilization effect, and to provide a buckwheat processing method.SOLUTION: The buckwheat processing apparatus according to the embodiment includes: a placement unit having a placement surface on which at least one of wholegrain buckwheat, peeled buckwheat and buckwheat flour is placed; and an irradiation module provided facing the placement surface and for irradiating infrared ray.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to a buckwheat processing device and a buckwheat processing method.

In the food market, food safety awareness is increasing due to measures such as HACCP (Hazard Analysis and Critical Control Point). The food market also has problems such as food loss due to spoilage.

Here, brown soba (buckwheat seeds with shells intact after harvesting) has a larger number of bacteria attached to it than other grains. Therefore, large numbers of bacteria remain in the shelled buckwheat and in the milled buckwheat flour.
When raw noodles are manufactured using peeled buckwheat or buckwheat flour, which has a large number of bacteria attached to it, quality deterioration problems such as a short shelf life after manufacturing tend to occur. In this case, if additives such as alcoholic spirits are added during the production of raw noodles, quality deterioration can be suppressed. However, when additives containing alcohol such as alcoholic spirits are added, a new problem arises in that the flavor is impaired by the alcohol.

Generally, ultraviolet light is used to sterilize bacteria and viruses attached to food. Therefore, it may be possible to sterilize brown soba, peeled buckwheat, and buckwheat flour by irradiating them with ultraviolet light. However, in the case of brown soba, peeled buckwheat, and buckwheat flour, sterilization by ultraviolet rays hardly occurs.

Therefore, methods for sterilizing buckwheat flour include heating with heated steam, kneading with a twin screw, and irradiation with microwaves or radiation. However, heating using heated steam has a problem in that there is a limit to the reduction in the number of bacteria. Another problem is that processing equipment capable of implementing these methods is expensive.

Therefore, it has been desired to develop a buckwheat processing device and a buckwheat processing method that can improve the sterilization effect.

JP2019-135985A

The problem to be solved by the present invention is to provide a buckwheat processing device and a buckwheat processing method that can improve the sterilization effect.

The buckwheat processing device according to the embodiment includes: a mounting section having a mounting surface on which at least one of brown buckwheat noodles, peeled buckwheat meat, and buckwheat flour is mounted; provided opposite to the mounting surface; It is equipped with an irradiation module that irradiates infrared rays.

According to embodiments of the present invention, it is possible to provide a buckwheat processing device and a buckwheat processing method that can improve the sterilization effect.

FIG. 2 is a schematic diagram for illustrating a processing device. It is a schematic diagram for illustrating an irradiation module. FIG. 2 is a schematic cross-sectional view illustrating an example of a carbon lamp heater. FIG. 2 is a schematic cross-sectional view illustrating an example of an alloy lamp heater. FIG. 2 is a schematic cross-sectional view illustrating an example of a halogen lamp heater. It is a graph for illustrating the relationship between irradiance and wavelength of a carbon lamp heater, an alloy lamp heater, and a halogen lamp heater. It is a graph for illustrating the sterilization effect when peeled buckwheat is irradiated with infrared rays. It is a graph for illustrating the sterilization effect when buckwheat flour is irradiated with infrared rays. FIG. 7 is a schematic cross-sectional view for illustrating an irradiation module according to another embodiment. FIG. 7 is a schematic cross-sectional view for illustrating a processing device according to another embodiment.

(Soba processing equipment)
Hereinafter, embodiments will be illustrated with reference to the drawings. Note that in each drawing, similar components are denoted by the same reference numerals, and detailed explanations are omitted as appropriate. Further, arrows X, Y, and Z in each figure represent three directions orthogonal to each other. For example, the X direction and the Y direction are horizontal directions, and the X direction is the transport direction of the processing object 100. For example, the Z direction is the vertical direction.
Furthermore, in this specification, "sterilization" includes not only reducing the number of attached bacteria and viruses, but also sterilization that kills bacteria and viruses.

Here, ultraviolet rays are generally used to sterilize bacteria and viruses attached to food. However, by irradiating ultraviolet rays on ``brown soba'', which is buckwheat with the shell on as it was harvested, ``shelled buckwheat'', which is the shelled buckwheat, and ``buckwheat flour'', which is made by milling the shelled buckwheat, There is almost no sterilization caused by ultraviolet light.

Therefore, the buckwheat processing apparatus 1 according to the present embodiment (hereinafter simply referred to as processing apparatus 1) does not irradiate the processing object 100 with ultraviolet rays, but irradiates the processing object 100 with infrared rays. Note that when a lamp heater that irradiates infrared rays is used as the irradiation unit, which will be described later, infrared rays are mainly irradiated, but visible light (for example, light in the red region) may be mixed in as well.

FIG. 1 is a schematic diagram illustrating a processing device 1. As shown in FIG.
As shown in FIG. 1, the processing device 1 includes, for example, a supply section 10, a moving section 20, an irradiation module 30, a housing section 40, and a controller 50.

The supply section 10 is provided, for example, near the end of the moving section 20 on the carry-in side. For example, the supply section 10 accommodates therein the processing object 100 to be processed, and supplies a predetermined amount of the processing object 100 to the moving section 20 .

The processed product 100 can be at least one of brown soba, peeled buckwheat, and buckwheat flour.
Therefore, the supply unit 10 includes a hopper that stores a plurality of granules (brown soba, peeled buckwheat) or a plurality of powders (buckwheat flour), and a hopper that stores a plurality of granules stored in the hopper or a plurality of granules stored in the hopper. It has a supply device that takes out a predetermined amount of powder and supplies it to the moving section 20. The feeding device can be, for example, a chute equipped with a vibrating device. Note that the configuration of the supply section 10 is not limited to that illustrated. The supply section 10 may be any device that can supply a predetermined amount of granular material or a predetermined amount of powder material to the moving section 20 .
Note that the supply unit 10 is not necessarily necessary and can be omitted. When the supply section 10 is omitted, for example, an operator may supply the processing object 100 to the moving section 20 (placing section 21).

The moving section 20 includes a placing section 21 . The mounting section 21 has a mounting surface on which the processing object 100 is mounted. The mounting section 21 is movable in a predetermined direction. The moving section 20 illustrated in FIG. 1 moves the mounting section 21 on which the processing object 100 is mounted in the X direction. For example, the moving unit 20 moves the processed material 100 from the supply position of the unprocessed processed material 100 (the position of the supply section 10) to the discharge position of the processed processed material 100a (the position of the storage section 40).

As illustrated in FIG. 1, the moving unit 20 can be, for example, a conveyor. When the moving section 20 is a conveyor, the placing section 21 can be, for example, a belt. Furthermore, the moving unit 20 may be a pallet conveyor or the like. When the moving unit 20 is a pallet conveyor, the placing unit 21 can be, for example, a pallet on which the processed material 100 is placed.

Further, in FIG. 1, the case where the moving part 20 is a conveyor is illustrated, but the moving part 20 has a table on which the processed material 100 is placed, and the table on which the processed material 100 is placed is moved in a predetermined direction. It may also rotate or pivot. In this case, the table serves as a placing section on which the object to be processed 100 is placed.

Note that the configuration of the moving unit 20 is not limited to that illustrated. The moving unit 20 can move the unprocessed workpiece 100 to the infrared ray irradiation area in the irradiation module 30, and can move the processed workpiece 100a to the outside of the infrared ray irradiation area. good.

Moreover, in the moving unit 20, it is preferable that the plurality of supplied granules (brown soba, peeled buckwheat) do not overlap with each other. If the plurality of supplied granules do not overlap each other, each of the plurality of granules can be irradiated with infrared rays. Therefore, it becomes easy to uniformly sterilize a plurality of granules.

In the moving part 20, it is preferable that the thickness of the layer containing the plurality of supplied powders (buckwheat flour) is made thin. If the layer containing a plurality of powdery substances is thin, it becomes easy to sterilize the powdery substances below the layer when irradiated with infrared rays. Therefore, it becomes easy to uniformly sterilize a plurality of powdered materials.

In this case, for example, the supply section 10 may further include a blade 22. A predetermined gap can be provided between the blade 22 and the mounting section 21. The gap between the blade 22 and the mounting portion 21 can be set, for example, to a size that allows non-overlapping granules to pass through, or a size that allows a layer containing a plurality of powders to have a predetermined thickness. Note that in place of the blade 22 or in addition to the blade 22, a vibration device that applies vibration to the mounting section 21, a blowing device that supplies gas to the processing object 100 placed on the mounting section 21, etc. can also be provided. . That is, a device for leveling the workpiece 100 placed on the placing portion 21 can be provided as appropriate. Note that the worker may level the workpiece 100 placed on the placing section 21.

The irradiation module 30 is provided facing the mounting surface of the mounting section 21. The irradiation module 30 irradiates the object 100 with infrared rays. The irradiation module 30 irradiates infrared rays onto the processing object 100 placed on the mounting section 21 and moving in a predetermined direction (for example, the X direction).

FIG. 2 is a schematic diagram illustrating the irradiation module 30.
As shown in FIG. 2, the irradiation module 30 includes, for example, a reflector 31 and an irradiation section 32.
The reflector 31 reflects infrared rays emitted from the irradiation section 32 and directed toward the side opposite to the side of the mounting section 21 (processed object 100), so as to direct the infrared rays toward the side of the mounting section 21 (processed object 100). . The reflector 31 is, for example, a concave mirror.

The irradiation section 32 is provided inside the reflector 31. The irradiation unit 32 can be, for example, a lamp heater that irradiates infrared rays. The irradiation unit 32 can be, for example, a carbon lamp heater 32a, an alloy lamp heater 32b, a halogen lamp heater 32c, or the like. The carbon lamp heater 32a is sometimes simply referred to as a carbon heater or the like. The alloy lamp heater 32b is sometimes simply referred to as an alloy heater or the like. The halogen lamp heater 32c is sometimes simply referred to as a halogen lamp.
Note that the lamp heater is not limited to the one illustrated, and may be any lamp heater that emits infrared rays.

Although FIG. 1 illustrates the case where one irradiation module 30 is provided, it is sufficient that at least one irradiation module 30 is provided. When a plurality of irradiation modules 30 are provided, for example, the plurality of irradiation modules 30 can be provided side by side in the moving direction of the mounting section 21 (for example, the X direction). In this case, the types of lamp heaters provided in each of the plurality of irradiation modules 30 may be the same or different.

Moreover, in FIG. 1 and FIG. 2, although the case where one lamp heater is provided in one irradiation module 30 was illustrated, the number of lamp heaters should just be provided at least one. When one irradiation module 30 is provided with a plurality of lamp heaters, for example, the plurality of lamp heaters can be provided side by side in the moving direction of the mounting section 21 (for example, the X direction). Moreover, when a plurality of lamp heaters are provided in one irradiation module 30, the same type of lamp heaters or different types of lamp heaters can be provided.

For example, the lamp heater may be at least one of the carbon lamp heater 32a, the alloy lamp heater 32b, and the halogen lamp heater 32c.

FIG. 3 is a schematic cross-sectional view illustrating an example of the carbon lamp heater 32a.
As shown in FIG. 3, the carbon lamp heater 32a has a configuration extending in one direction.
The carbon lamp heater 32a includes, for example, a bulb 32a1, a heating element 32a2, a conductive part 32a3, an inner lead 32a4, an outer lead 32a5, and a connecting part 32a6.

The valve 32a1 has, for example, a cylindrical shape. The bulb 32a1 is made of quartz glass, for example. Both end portions of the valve 32a1 are sealed by sealing portions 32a1a. The internal space of the valve 32a1 is filled with an inert gas. If the internal space of the valve 32a1 is filled with an inert gas, the pressure in the internal space increases when electricity is applied, so that evaporation of the heating element 32a2 can be suppressed. The inert gas can be, for example, one of argon (Ar), xenon (Xe), krypton (Kr), neon (Ne), or a mixture of these gases.

The pressure of the inert gas (filling pressure) at 25° C. in the internal space of the valve 32a1 can be, for example, 0.6 bar (60 kPa) to 0.9 bar (90 kPa). The pressure (filling pressure) of the inert gas at 25° C. in the internal space of the valve 32a1 can be determined from the standard state of gas (SATP (Standard Ambient Temperature and Pressure): temperature 25° C., 1 bar).

The heating element 32a2 is provided in the internal space of the valve 32a1. The heating element 32a2 extends in the central region of the bulb 32a1 along the tube axis of the bulb 32a1. When energized, the heating element 32a2 generates heat and emits infrared rays. The heating element 32a2 contains carbon. The heating element 32a2 has, for example, a spiral shape. The heating element 32a2 is formed, for example, by spirally winding a band-shaped mesh structure containing carbon or a linear body containing carbon fibers. The external shape of the heating element 32a2 is, for example, cylindrical. Note that the heating element 32a2 may be, for example, a cylindrical mesh structure containing carbon fibers, a band-shaped body containing carbon, a linear body containing carbon, or the like.

One conductive part 32a3 can be provided for one sealing part 32a1a. The conductive part 32a3 is provided inside the sealing part 32a1a. The conductive portion 32a3 is made of, for example, molybdenum foil.

Inner lead 32a4 is provided on the opposite side of conductive portion 32a3 from outer lead 32a5. Inner lead 32a4 is connected to conductive portion 32a3 and connecting portion 32a6. At least one inner lead 32a4 can be provided for one conductive portion 32a3. The inner lead 32a4 has a linear shape and contains, for example, molybdenum.

One end of the outer lead 32a5 is connected to the conductive part 32a3, and the other end is exposed from the sealing part 32a1a. The outer lead 32a5 has a linear shape and contains, for example, molybdenum.

The connecting portion 32a6 is provided between the heating element 32a2 and the inner lead 32a4. The connecting portion 32a6 holds the end of the heating element 32a2 and the end of the inner lead 32a4. The connecting portion 32a6 is made of a heat-resistant and conductive material. The connecting portion 32a6 includes, for example, metal such as nickel or a nickel alloy.

FIG. 4 is a schematic cross-sectional view illustrating an example of the alloy lamp heater 32b.
As shown in FIG. 4, the alloy lamp heater 32b has a configuration extending in one direction. The alloy lamp heater 32b includes, for example, a bulb 32b1, a heating element 32b2, a lead 32b3, and a holder 32b4.

The valve 32b1 has, for example, a cylindrical shape. The bulb 32b1 is made of quartz glass, for example. Both ends of the valve 32b1 are open. The gas in the internal space of the valve 32b1 is the same gas as the outside air (for example, air at atmospheric pressure). That is, the alloy lamp heater 32b is a so-called open type lamp heater.

The heating element 32b2 is provided in the internal space of the valve 32b1. The heating element 32b2 extends in the central region of the bulb 32b1 along the tube axis of the bulb 32b1. When energized, the heating element 32b2 generates heat and emits infrared rays. The heating element 32b2 has, for example, a spiral shape. The heating element 32b2 is formed, for example, by spirally winding a linear body containing an alloy. The external shape of the heating element 32b2 is, for example, cylindrical. The alloy contained in the heating element 32b2 is, for example, an iron-chromium-aluminum alloy. The iron-chromium-aluminum alloy can be, for example, Kanthal (registered trademark).

A pair of leads 32b3 are provided. The lead 32b3 has a linear shape and is provided inside the holder 32b4. One end of the lead 32b3 projects into the inside of the valve 32b1 from the holder 32b4. One end of the lead 32b3 is connected to the end of the heating element 32b2. The other end of the lead 32b3 projects outward from the holder 32b4. The lead 32b3 is made of metal such as stainless steel, nickel, and nickel alloy, for example.

The holders 32b4 are provided at both ends of the valve 32b1. The holder 32b4 is fixed to the end of the valve 32b1 using, for example, an inorganic adhesive. The holder 32b4 is made of an insulating and heat resistant material. The holder 32b4 is made of ceramics such as aluminum oxide, for example.

FIG. 5 is a schematic cross-sectional view illustrating an example of the halogen lamp heater 32c.
As shown in FIG. 5, the halogen lamp heater 32c has a configuration extending in one direction.
The halogen lamp heater 32c includes, for example, a bulb 32c1, a heating element 32c2, a conductive portion 32c3, and a lead 32c4.

The valve 32c1 has, for example, a cylindrical shape. The bulb 32c1 is made of quartz glass, for example. Both end portions of the valve 32c1 are sealed by sealing portions 32c1a. An inert gas is sealed in the internal space of the valve 32c1. The inert gas can be, for example, one of xenon, krypton, argon, etc., or a mixed gas of krypton and nitrogen gas. Further, halogen substances such as bromine and iodine can also be included. For example, trace amounts of bromide can be included in xenon, krypton, etc.

The pressure of the inert gas (filling pressure) at 25° C. in the internal space of the valve 32c1 can be, for example, 0.6 bar (60 kPa) to 0.9 bar (90 kPa). The pressure (filling pressure) of the inert gas at 25° C. in the internal space of the valve 32c1 can be determined from the standard state of gas (SATP (Standard Ambient Temperature and Pressure): temperature 25° C., 1 bar).

The heating element 32c2 is provided in the internal space of the valve 32c1. The heating element 32c2 extends in the central region of the bulb 32c1 along the tube axis of the bulb 32c1. Furthermore, an anchor 32c2a that supports the heating element 32c2 may be provided. When energized, the heating element 32c2 generates heat and emits infrared rays. The heating element 32c2 has, for example, a spiral shape. The heating element 32c2 is formed, for example, by spirally winding a linear body containing tungsten. The external shape of the heating element 32c2 is, for example, cylindrical. An end portion of the heating element 32c2 is connected to a conductive portion 32c3 inside the sealing portion 32c1a.

One conductive part 32c3 can be provided for one sealing part 32c1a. The conductive part 32c3 is provided inside the sealing part 32c1a. The conductive portion 32c3 is made of, for example, molybdenum foil.

One end of the lead 32c4 is connected to the conductive part 32c3 inside the sealing part 32c1a. The other end of the lead 32c4 is exposed from the sealing part 32c1a. The lead 32c4 has a linear shape and contains, for example, molybdenum.

Here, the lamp heater emits infrared rays along with heat. Further, in the case of a lamp heater, the wavelength range of infrared rays that can be irradiated is wide. For example, the lamp heater can irradiate infrared rays with a wavelength of 800 nm or more and 4000 nm or less.
Note that although the lamp heater mainly emits infrared rays, visible light (for example, light in the red region) may be mixed in as well.

FIG. 6 is a graph for illustrating the relationship between the irradiance and wavelength of the carbon lamp heater 32a, the alloy lamp heater 32b, and the halogen lamp heater 32c.
As can be seen from FIG. 6, the carbon lamp heater 32a, the alloy lamp heater 32b, and the halogen lamp heater 32c can irradiate infrared rays with a wavelength of 800 nm or more.

Further, the peak wavelength of the carbon lamp heater 32a and the alloy lamp heater 32b is on the longer wavelength side than that of the halogen lamp heater 32c. Further, the radiation intensity increases in the order of carbon lamp heater 32a, alloy lamp heater 32b, and halogen lamp heater 32c.

FIG. 7 is a graph illustrating the sterilization effect when peeled buckwheat is irradiated with infrared rays.
FIG. 8 is a graph illustrating the sterilization effect when buckwheat flour is irradiated with infrared rays.
Note that the infrared ray irradiation time was 120 minutes. The radiation intensity and wavelength of infrared rays are illustrated in FIG. 6. In addition, the bacteria are coliform bacteria.
As can be seen from FIGS. 7 and 8, the number of bacteria can be reduced by irradiating peeled buckwheat and buckwheat flour with infrared rays.
Moreover, if the carbon lamp heater 32a and the alloy lamp heater 32b are used, the sterilization effect can be improved compared to the case where the halogen lamp heater 32c is used. Moreover, if the carbon lamp heater 32a is used, the sterilization effect can be improved compared to the case where the alloy lamp heater 32b is used. That is, if the peak wavelength of the irradiated infrared rays is on the long wavelength side and the lamp heater has a higher irradiance at the peak wavelength, a high sterilization effect can be obtained.
In addition, in the case of brown soba, the same sterilization effect as in the case of peeled buckwheat can be enjoyed.

FIG. 9 is a schematic cross-sectional view for illustrating an irradiation module 30a according to another embodiment. As shown in FIG. 9, the irradiation module 30a includes, for example, an irradiation section 131, a cooling section 132, a circuit board 133, and a housing 134.

The irradiation unit 131 includes, for example, a substrate 131a and a plurality of light emitting elements 131b.
The substrate 131a has a plate shape and is provided at the end of the heat dissipation section 132a.
The plurality of light emitting elements 131b are arranged side by side on the surface of the substrate 131a opposite to the heat dissipation section 132a side. The arrangement form and number of the plurality of light emitting elements 131b can be changed as appropriate depending on the size of the mounting section 21 and the like. The light emitting element 131b can be, for example, a light emitting diode that emits infrared rays. The light emitting element 131b may emit infrared rays having a peak wavelength in a range of 700 nm or more and 1500 nm or less, for example.

The cooling section 132 includes, for example, a heat radiation section 132a and an air blowing section 132b.
The heat dissipation section 132a has, for example, a block-shaped base to which the irradiation section 131 is attached, and a plurality of fins. The heat radiation part 132a is formed of a material with high thermal conductivity, such as an aluminum alloy, for example.

The blowing section 132b supplies gas G to the plurality of fins provided in the heat radiating section 132a. The gas G is, for example, air contained in the atmosphere in which the processing device 1 is installed. The air blower 132b is provided inside the housing 134. The air blower 132b is attached to the inner wall of the housing 134, for example. The blowing section 132b can be, for example, an axial fan.

The circuit board 133 is provided inside the housing 134. The circuit board 133 switches, for example, turning on and off the plurality of light emitting elements 131b, controlling the electric power applied to the plurality of light emitting elements 131b, and switching between supplying and stopping the supply of gas G by the blower section 132b. or

The housing 134 has a box shape, and houses, for example, the irradiation section 131, the cooling section 132, and the circuit board 133 therein. A plurality of exhaust ports 134a can be provided on the side surface of the housing 134. Furthermore, the housing 134 can be provided with a power connector 134b, a communication connector 134c, a filter 134d, and the like.

Furthermore, a window 134e can be provided at the end of the housing 134 on the side where the irradiation section 131 is provided. The window 134e transmits infrared rays emitted from the irradiation section 131 (light emitting element 131b). The window 134e is made of quartz glass, for example.

As described above, the irradiation module 30a includes a plurality of light emitting elements 131b that emit infrared rays. Therefore, the irradiation module 30a can irradiate the object 100 with infrared rays. That is, even by using the irradiation module 30a having a plurality of light emitting elements 131b that emit infrared rays, it is possible to sterilize brown soba, peeled buckwheat, and buckwheat flour.

However, the lamp heater can emit infrared rays in a wider wavelength range than the light emitting element 131b. Further, the lamp heater can irradiate infrared rays with higher radiation intensity than the light emitting element 131b. Further, the lamp heater can irradiate heat as well as infrared rays.
Therefore, if the lamp heater is used, a higher sterilization effect can be obtained than when the light emitting element 131b is used. Moreover, if the lamp heater is used, the manufacturing cost of the processing apparatus 1 can be reduced compared to the case where the light emitting element 131b is used.

Next, returning to FIG. 1, the accommodating section 40 and the controller 50 will be explained.
The storage unit 40 stores the processed object 100a. The accommodating section 40 can be, for example, a container provided near the end of the moving section 20 on the discharge side. Furthermore, the storage section 40 may be provided with a chute, a vibrating device, or the like for promoting discharge of the processed material 100a from the moving section 20.

The controller 50 controls the operation of each element provided in the processing device 1. The controller 50 includes, for example, a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a semiconductor memory. Controller 50 is, for example, a computer. For example, a control program that controls the operation of each element provided in the processing device 1 can be stored in the storage unit.

For example, when the sensor 23 detects that the processing object 100 has been carried into the irradiation area of the irradiation module 30 (30a), the controller 50 controls the irradiation module 30 (30a) to (30a) is irradiated with infrared rays.

For example, the controller 50 controls the irradiation module 30 (30a) and the moving unit 20 to control the cumulative amount of infrared rays irradiated onto the processing object 100. For example, the controller 50 controls the moving speed of the moving section 20 and changes the time period during which the object to be treated 100 is irradiated with infrared rays within a range of 5 minutes to 120 minutes. Note that an appropriate integrated amount of infrared rays can be determined through experiments and simulations.

FIG. 10 is a schematic cross-sectional view illustrating a processing apparatus 1a according to another embodiment.
The processing apparatus 1 illustrated in FIG. 1 irradiates infrared rays to the processed object 100 being transported. On the other hand, the processing apparatus 1 illustrated in FIG. 10 irradiates infrared rays to the processing object 100 in a stationary state.

As shown in FIG. 10, the processing device 1a includes, for example, a mounting section 60, an irradiation module 30b, a housing 70, and a controller 50a.
The mounting section 60 is provided inside the housing 70 in a detachable manner. The processing object 100 is placed on the placement surface 60a of the placement section 60. The mounting section 60 can be, for example, a tray. The mounting portion 60 can be made of, for example, a material that can transmit infrared rays. If the infrared rays can pass through the mounting section 60, the object to be treated 100 can be irradiated with infrared rays from more directions. Therefore, it is possible to improve the sterilization effect and the sterilization efficiency.

The irradiation module 30b can be, for example, a lamp heater that irradiates infrared rays or a light emitting element 131b that irradiates infrared rays. Note that the irradiation module 30b illustrated in FIG. 10 is a lamp heater. Examples of the lamp heater include a carbon lamp heater 32a, an alloy lamp heater 32b, and a halogen lamp heater 32c. The irradiation module 30b can be provided on the inner wall of the housing 70, for example.

The housing 70 has a box shape and has an opening 70a on one side. Further, a door 70b that can open and close the opening 70a can be provided. If the casing 70 has the door 70b, the area where infrared rays are irradiated by the irradiation module 30b can be hermetically sealed.
Furthermore, the inner wall of the housing 70 can include a material that has a high reflectance to infrared rays. For example, the inner wall of the housing 70 can include metal such as aluminum. In this way, the object to be treated 100 can be irradiated with infrared rays reflected by the inner wall of the housing 70. Therefore, it is possible to improve the sterilization effect and the sterilization efficiency.

The controller 50a controls the operation of each element provided in the processing device 1a. The controller 50a includes, for example, a calculation section such as a CPU, and a storage section such as a semiconductor memory. The controller 50a is, for example, a computer. The storage unit can store, for example, a control program that controls the operation of each element provided in the processing device 1a.

For example, the controller 50a controls the irradiation module 30b to control the cumulative amount of infrared rays irradiated onto the processing object 100. For example, the controller 50a controls the irradiation time of the infrared rays irradiated from the irradiation module 30b, and controls the cumulative amount of infrared rays irradiated onto the processing object 100.

The processing apparatus 1a according to the present embodiment can also improve the sterilization effect. For example, when the amount of processing material 100 is large, using the processing apparatus 1 can improve work efficiency. For example, when the amount of processing material 100 is relatively small, the processing apparatus 1a can be used to reduce the work space.

(Soba processing method)
Next, a method for processing soba noodles according to the present embodiment will be described.
The buckwheat processing method according to the present embodiment can be carried out using, for example, the processing apparatuses 1 and 1a described above.
The buckwheat processing method according to the present embodiment sterilizes the processed material 100 (at least one of brown buckwheat, peeled buckwheat, and buckwheat flour) by irradiating infrared rays.
Note that the content of the processing can be the same as that described for the processing apparatuses 1 and 1a, so a detailed explanation will be omitted.

Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention, as well as within the scope of the invention described in the claims and its equivalents. Further, each of the embodiments described above can be implemented in combination with each other.

1 processing device, 1a processing device, 30 irradiation module, 30a irradiation module, 30b irradiation module, 32 irradiation section, 32a carbon lamp heater, 32b alloy lamp heater, 32c halogen lamp heater, 100 processing object, 100a processing object, 131 irradiation section , 131b light emitting element

Claims (5)

a placing part having a placing surface on which at least one of brown soba, peeled buckwheat, and buckwheat flour is placed;
an irradiation module that is provided opposite to the placement surface and irradiates infrared rays;
Buckwheat processing equipment equipped with The irradiation module has a lamp heater,
The buckwheat processing device according to claim 1, wherein the lamp heater irradiates the infrared rays having a wavelength of 800 nm or more and 4000 nm or less. 3. The buckwheat processing apparatus according to claim 1, wherein the lamp heater is at least one of a carbon lamp heater, an alloy lamp heater, and a halogen lamp heater. The side processing device according to any one of claims 1 to 3, wherein the placing section is movable in a predetermined direction. A method for processing buckwheat, which sterilizes at least one of brown buckwheat, peeled buckwheat, and buckwheat flour by irradiating infrared rays.

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