JP2023142418A5 - - Google Patents

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Publication number
JP2023142418A5
JP2023142418A5 JP2022049328A JP2022049328A JP2023142418A5 JP 2023142418 A5 JP2023142418 A5 JP 2023142418A5 JP 2022049328 A JP2022049328 A JP 2022049328A JP 2022049328 A JP2022049328 A JP 2022049328A JP 2023142418 A5 JP2023142418 A5 JP 2023142418A5
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JP
Japan
Prior art keywords
surface portion
lead wire
board
component
hole
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022049328A
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English (en)
Japanese (ja)
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JP2023142418A (ja
JP7610134B2 (ja
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Priority to JP2022049328A priority Critical patent/JP7610134B2/ja
Priority claimed from JP2022049328A external-priority patent/JP7610134B2/ja
Publication of JP2023142418A publication Critical patent/JP2023142418A/ja
Publication of JP2023142418A5 publication Critical patent/JP2023142418A5/ja
Application granted granted Critical
Publication of JP7610134B2 publication Critical patent/JP7610134B2/ja
Active legal-status Critical Current
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JP2022049328A 2022-03-25 2022-03-25 遊技機 Active JP7610134B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022049328A JP7610134B2 (ja) 2022-03-25 2022-03-25 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022049328A JP7610134B2 (ja) 2022-03-25 2022-03-25 遊技機

Publications (3)

Publication Number Publication Date
JP2023142418A JP2023142418A (ja) 2023-10-05
JP2023142418A5 true JP2023142418A5 (enrdf_load_stackoverflow) 2024-07-24
JP7610134B2 JP7610134B2 (ja) 2025-01-08

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ID=88205779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022049328A Active JP7610134B2 (ja) 2022-03-25 2022-03-25 遊技機

Country Status (1)

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JP (1) JP7610134B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7730031B2 (ja) * 2022-12-23 2025-08-27 サミー株式会社 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284830A (ja) * 1997-04-11 1998-10-23 Sony Corp マルチディスペンサ型ハンダ塗布装置及びハンダ処理方法
JP2000208933A (ja) * 1999-01-19 2000-07-28 Sony Corp 部品分離装置
JP5669282B1 (ja) * 2013-10-24 2015-02-12 山佐株式会社 制御装置、遊技機、及び制御装置の組付け方法
JP2018166983A (ja) * 2017-03-30 2018-11-01 京楽産業．株式会社 遊技機
JP7525797B2 (ja) * 2022-03-25 2024-07-31 サミー株式会社 遊技機

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