JP2023142415A5 - - Google Patents

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Publication number
JP2023142415A5
JP2023142415A5 JP2022049325A JP2022049325A JP2023142415A5 JP 2023142415 A5 JP2023142415 A5 JP 2023142415A5 JP 2022049325 A JP2022049325 A JP 2022049325A JP 2022049325 A JP2022049325 A JP 2022049325A JP 2023142415 A5 JP2023142415 A5 JP 2023142415A5
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Japan
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surface portion
lead wire
board
component
degrees
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JP2022049325A
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English (en)
Japanese (ja)
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JP7701628B2 (ja
JP2023142415A (ja
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Publication of JP2023142415A5 publication Critical patent/JP2023142415A5/ja
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JP2022049325A 2022-03-25 2022-03-25 遊技機 Active JP7701628B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022049325A JP7701628B2 (ja) 2022-03-25 2022-03-25 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022049325A JP7701628B2 (ja) 2022-03-25 2022-03-25 遊技機

Publications (3)

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JP2023142415A JP2023142415A (ja) 2023-10-05
JP2023142415A5 true JP2023142415A5 (enrdf_load_stackoverflow) 2024-07-24
JP7701628B2 JP7701628B2 (ja) 2025-07-02

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ID=88205782

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JP2022049325A Active JP7701628B2 (ja) 2022-03-25 2022-03-25 遊技機

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JP (1) JP7701628B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7730032B2 (ja) * 2022-12-23 2025-08-27 サミー株式会社 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284830A (ja) * 1997-04-11 1998-10-23 Sony Corp マルチディスペンサ型ハンダ塗布装置及びハンダ処理方法
JP2000208933A (ja) 1999-01-19 2000-07-28 Sony Corp 部品分離装置
JP5181241B2 (ja) 2008-07-04 2013-04-10 株式会社大都技研 遊技台
JP2018166983A (ja) 2017-03-30 2018-11-01 京楽産業．株式会社 遊技機
JP7525797B2 (ja) 2022-03-25 2024-07-31 サミー株式会社 遊技機

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