JP2023138198A - Circuit board fixing structure and light irradiation device - Google Patents

Circuit board fixing structure and light irradiation device Download PDF

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Publication number
JP2023138198A
JP2023138198A JP2022044767A JP2022044767A JP2023138198A JP 2023138198 A JP2023138198 A JP 2023138198A JP 2022044767 A JP2022044767 A JP 2022044767A JP 2022044767 A JP2022044767 A JP 2022044767A JP 2023138198 A JP2023138198 A JP 2023138198A
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circuit board
electrode
hole
base
members
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浩明 渡邊
Hiroaki Watanabe
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Hoya Corp
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Hoya Corp
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Priority to JP2022044767A priority Critical patent/JP2023138198A/en
Priority to PCT/JP2023/010487 priority patent/WO2023182190A1/en
Publication of JP2023138198A publication Critical patent/JP2023138198A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section

Abstract

To provide a circuit board fixing structure which enables a circuit board on a base to be easily replaced and is compact in a size.SOLUTION: A circuit board fixing structure which fixes a circuit board to a surface of a base comprises: a positive electrode pattern and a negative electrode pattern formed on a surface of a circuit board to supply electric power to the circuit board; a pair of first through-holes which respectively penetrates the circuit board from the positive and negative electrode patterns; a pair of second through-holes which vertically penetrates the base so as to be communicated with the respective first through-holes; a pair of electrode members which is inserted into the respective second through-holes; and a pair of fixing members which is engaged with the respective electrode members and fixes the circuit board to the base. Each electrode member has: an electrode terminal extending along the second through-hole; and an insulation member which is arranged so as to cover an outer periphery of the electrode terminal to insulate between the electrode terminal and the base and regulates rotation of each electrode member with respect to the second through-hole. When the fixing members are respectively engaged with the electrode members, the positive electrode pattern and the negative electrode pattern are electrically connected to the respective electrode terminals through the respective fixing members.SELECTED DRAWING: Figure 1

Description

本発明は、基台(例えば、ヒートシンク、ベースプレート)上に回路基板を固定する回路基板固定構造に関し、特に、回路基板の固定と電力供給とを兼ねる電極を有する回路基板固定構造、及びこれを備える光照射装置に関する。 The present invention relates to a circuit board fixing structure for fixing a circuit board on a base (e.g., a heat sink, a base plate), and particularly to a circuit board fixing structure having electrodes that serve both to fix the circuit board and supply power, and to a circuit board fixing structure equipped with the same. This invention relates to a light irradiation device.

従来、オフセット枚葉印刷用のインキとして、紫外光の照射により硬化する紫外線硬化型インキが用いられている。また、液晶パネルや有機EL(Electro Luminescence)パネル等、FPD(Flat Panel Display)のシール剤として、紫外線硬化樹脂が用いられている。このような紫外線硬化型インキや紫外線硬化樹脂の硬化には、一般に、紫外光を照射する光照射装置が用いられる(例えば、特許文献1)。 Conventionally, as ink for offset sheet-fed printing, ultraviolet curing ink that is cured by irradiation with ultraviolet light has been used. Further, ultraviolet curing resins are used as sealants for FPDs (Flat Panel Displays) such as liquid crystal panels and organic EL (Electro Luminescence) panels. A light irradiation device that irradiates ultraviolet light is generally used to cure such ultraviolet curable ink or ultraviolet curable resin (for example, Patent Document 1).

特許文献1に記載の光照射装置は、ヒートシンクと、ヒートシンク上に固定された複数の光源モジュールと、ヒートシンクの側面に固定された端子台等を備えている。各光源モジュールは、端子台に向かって突出するように配置された電極板を有し、各電極板が端子台に固定されることによって各光源モジュールに電力が供給されるようになっている。また、光源モジュールの基板を押圧する固定板が各電極板を覆うように配置され、各固定板と各電極板とが端子台に共締めされることによって各光源モジュールがヒートシンク上に固定されるようになっている。 The light irradiation device described in Patent Document 1 includes a heat sink, a plurality of light source modules fixed on the heat sink, a terminal block, etc. fixed to the side surface of the heat sink. Each light source module has an electrode plate arranged to protrude toward the terminal block, and power is supplied to each light source module by fixing each electrode plate to the terminal block. In addition, a fixing plate that presses the board of the light source module is arranged to cover each electrode plate, and each fixing plate and each electrode plate are fastened together to the terminal block, thereby fixing each light source module on the heat sink. It looks like this.

特開2015-28915号公報JP2015-28915A

特許文献1に記載の光照射装置においては、電極板と固定板とを別個に設けて、光源モジュールに安定した電力を供給すると共に、過大なストレスを加えることなく光源モジュールを固定している。しかしながら、電極板と固定板が端子台に向かって突出する(つまり、光源モジュールの外側に向かって突出する)ため、光源モジュールの並び方向と直交する方向のサイズが大きくなる(つまり、薄くできない)という問題がある。また、光源モジュールの故障時等、光源モジュールの交換が必要となった場合には、固定板の脱着作業も必要となるため、光源モジュールの交換作業をより簡単に行うことが可能な構成が求められていた。 In the light irradiation device described in Patent Document 1, an electrode plate and a fixing plate are separately provided to supply stable power to the light source module and fix the light source module without applying excessive stress. However, because the electrode plate and the fixing plate protrude toward the terminal block (that is, they protrude toward the outside of the light source module), the size in the direction perpendicular to the direction in which the light source modules are arranged becomes large (that is, it cannot be made thinner). There is a problem. Additionally, if the light source module needs to be replaced due to a failure, etc., the fixing plate must also be attached and removed, so a configuration that allows easier replacement of the light source module is required. It was getting worse.

本発明は、このような事情に鑑みてなされたものであり、その目的とするところは、基台(ヒートシンク等)上の回路基板(光源モジュール等)を容易に交換可能で、かつ小型の回路基板固定構造を提供することである。また、このような回路基板固定構造を備える光照射装置を提供することである。 The present invention was made in view of the above circumstances, and its purpose is to easily replace the circuit board (light source module, etc.) on the base (heat sink, etc.) and to create a small circuit. An object of the present invention is to provide a substrate fixing structure. Another object of the present invention is to provide a light irradiation device including such a circuit board fixing structure.

上記目的を達成するため、本発明の回路基板固定構造は、金属の基台の表面に回路基板を固定する回路基板固定構造であって、回路基板に電力を供給するために、回路基板の表面に形成された正極パターン及び負極パターンと、正極パターン及び負極パターンのそれぞれから回路基板を垂直に貫通する一対の第1貫通孔と、各第1貫通孔と連通するように、基台の表面から基台を垂直に貫通する一対の第2貫通孔と、各第2貫通孔に挿通される一対の電極部材と、回路基板の表面側に取り付けられて各電極部材と係合し、回路基板を基台に固定する一対の固定部材と、を備え、各電極部材は、第2貫通孔に沿って延びる電極端子と、電極端子の外周を覆うように配置され電極端子と基台とを絶縁すると共に、各電極部材を第2貫通孔に対して回転規制する絶縁部材と、を有し、各固定部材と各電極部材とが係合したときに、正極パターン及び負極パターンのそれぞれが、各固定部材を介して各電極端子と電気的に接続されることを特徴とする。 In order to achieve the above object, the circuit board fixing structure of the present invention is a circuit board fixing structure for fixing a circuit board to the surface of a metal base, and in order to supply power to the circuit board, the circuit board fixing structure fixes the circuit board to the surface of a metal base. A positive electrode pattern and a negative electrode pattern formed on the substrate, a pair of first through holes vertically penetrating the circuit board from each of the positive electrode pattern and the negative electrode pattern, and a pair of first through holes extending from the surface of the base so as to communicate with each of the first through holes. A pair of second through holes that vertically penetrate the base, a pair of electrode members that are inserted into each of the second through holes, and a pair of electrode members that are attached to the front surface of the circuit board and engage with each of the electrode members, and the circuit board is a pair of fixing members fixed to the base, each electrode member having an electrode terminal extending along the second through hole, and arranged to cover the outer periphery of the electrode terminal to insulate the electrode terminal and the base. and an insulating member that restricts rotation of each electrode member with respect to the second through hole, so that when each fixed member and each electrode member are engaged, each of the positive electrode pattern and the negative electrode pattern It is characterized in that it is electrically connected to each electrode terminal via a member.

このような構成によれば、電極部材と固定部材が回路基板の固定と電力の供給を兼ねているため、回路基板に電力を供給するための専用の部材を設ける必要がなく、回路基板固定構造を小型化することが可能となる。また、回路基板の交換が必要となった場合にも、固定部材を取り外して回路基板を交換するだけの作業となるため(つまり、回路基板に電力を供給するための専用の部材を接続したり、配線等を行う必要がないため)、簡単な作業で回路基板を交換することが可能となる。また、電極部材が回転規制されているため、固定部材の着脱作業も容易に行うことができる。 According to this configuration, since the electrode member and the fixing member serve both to fix the circuit board and supply power, there is no need to provide a dedicated member for supplying power to the circuit board, and the circuit board fixing structure It becomes possible to downsize the. In addition, even if it becomes necessary to replace the circuit board, the task is simply to remove the fixing member and replace the circuit board (in other words, it is necessary to connect special parts to supply power to the circuit board). , wiring, etc.), it is possible to replace the circuit board with a simple operation. Further, since the electrode member is restricted from rotating, the fixing member can be easily attached and detached.

また、絶縁部材の外形の少なくとも一部に、第2貫通孔の中心軸に平行な平面部が形成されており、平面部が第2貫通孔に係合していることが望ましい。 Further, it is desirable that at least a portion of the outer shape of the insulating member be formed with a flat portion parallel to the central axis of the second through hole, and that the flat portion be engaged with the second through hole.

また、絶縁部材の外形の少なくとも一部に、第2貫通孔の中心軸に対して垂直な方向に突出する突起部を有し、第2貫通孔が突起部を収容する収容部を有することが望ましい。 Further, at least a portion of the outer shape of the insulating member may include a protrusion that protrudes in a direction perpendicular to the central axis of the second through hole, and the second through hole may have an accommodating portion for accommodating the protrusion. desirable.

また、基台の裏面側に配置され、電極端子が貫通する開口を有すると共に、絶縁部材の一端面と当接する固定板をさらに備えることが望ましい。 Further, it is desirable to further include a fixing plate that is disposed on the back side of the base, has an opening through which the electrode terminal passes, and comes into contact with one end surface of the insulating member.

また、基台の裏面側に配置され、電極端子が貫通すると共に、絶縁部材の一部と嵌合する開口を有する固定板をさらに備えることが望ましい。 It is also desirable to further include a fixing plate that is disposed on the back side of the base and has an opening through which the electrode terminal passes and which fits into a part of the insulating member.

また、各電極部材は、回路基板に対して各電極部材が離れるように付勢する付勢部材を有することが望ましい。 Moreover, it is desirable that each electrode member has a biasing member that biases each electrode member to separate from the circuit board.

また、基台は、表面に回路基板の載置面を有し、回路基板と略平行な板状のベース部と、ベース部の裏面から略垂直に起立し、互いに平行に延設された複数の放熱フィンと、を有し、各第2貫通孔は、ベース部を貫通する第3貫通孔と、第3貫通孔と連通するように、複数の放熱フィンの一部が基台と垂直な方向に切欠かれて形成された第4貫通孔と、から構成されることが望ましい。 The base has a surface on which the circuit board is placed, and includes a plate-shaped base section that is substantially parallel to the circuit board, and a plurality of plate-shaped base sections that stand up substantially perpendicularly from the back surface of the base section and extend parallel to each other. radiating fins, and each second through hole has a third through hole penetrating the base portion, and a portion of the plurality of radiating fins is perpendicular to the base so as to communicate with the third through hole. It is desirable that the fourth through hole is formed by being cut in the direction.

また、基台は、冷媒が流れる流路を内部に有することが望ましい。 Further, it is desirable that the base has a flow path therein through which the refrigerant flows.

また、別の観点からは、本発明の光照射装置は、上記いずれかの回路基板固定構造と、回路基板上に配置され、正極パターン及び負極パターンから電力を供給される複数の発光素子と、を備えることを特徴とする。 Moreover, from another point of view, the light irradiation device of the present invention includes any one of the circuit board fixing structures described above, a plurality of light emitting elements arranged on the circuit board and supplied with power from a positive electrode pattern and a negative electrode pattern, It is characterized by having the following.

また、正極パターン上及び負極パターン上にそれぞれ配置され、各固定部材によって回路基板と共に共締めされる一対の機能部材をさらに備えることが望ましい。また、この場合、一対の機能部材が、複数の発光素子から出射される光の一部を反射するミラー面を有することが望ましい。 Moreover, it is desirable to further include a pair of functional members disposed on the positive electrode pattern and the negative electrode pattern, respectively, and fastened together with the circuit board by each fixing member. Further, in this case, it is desirable that the pair of functional members have a mirror surface that reflects a portion of the light emitted from the plurality of light emitting elements.

また、発光素子から出射される光が、紫外域の波長の光であることが望ましい。 Further, it is desirable that the light emitted from the light emitting element has a wavelength in the ultraviolet region.

以上のように、本発明によれば、基台上の回路基板を容易に交換可能で、かつ小型の回路基板固定構造が実現される。また、このような回路基板固定構造を備える光照射装置が実現される。 As described above, according to the present invention, a compact circuit board fixing structure is realized in which the circuit board on the base can be easily replaced. Moreover, a light irradiation device including such a circuit board fixing structure is realized.

本発明の第1の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。FIG. 1 is a diagram illustrating a schematic configuration of a light irradiation device including a circuit board fixing structure according to a first embodiment of the present invention. 本発明の第1の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する分解斜視図である。FIG. 1 is an exploded perspective view illustrating a schematic configuration of a light irradiation device including a circuit board fixing structure according to a first embodiment of the present invention. 本発明の第1の実施形態に係る回路基板固定構造の電極棒と絶縁スリーブの構成を説明する斜視図である。FIG. 2 is a perspective view illustrating the structure of an electrode rod and an insulating sleeve of the circuit board fixing structure according to the first embodiment of the present invention. 本発明の第2の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 2nd embodiment of the present invention. 本発明の第3の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 3rd embodiment of the present invention. 本発明の第4の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 4th embodiment of the present invention. 本発明の第5の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 5th embodiment of the present invention. 本発明の第5の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する分解斜視図である。It is an exploded perspective view explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 5th embodiment of the present invention. 本発明の第6の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 6th embodiment of the present invention. 本発明の第7の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 7th embodiment of the present invention. 本発明の第8の実施形態に係る回路基板固定構造を備える光照射装置の概略構成を説明する図である。It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 8th embodiment of the present invention.

以下、本発明の実施の形態について図面を参照して詳細に説明する。なお、図中同一又は相当部分には同一の符号を付してその説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the same or corresponding parts in the figures are denoted by the same reference numerals, and the description thereof will not be repeated.

(第1の実施形態)
図1は、本発明の第1の実施形態に係る回路基板固定構造10を備える光照射装置1の概略構成を説明する図であり、図1(a)は斜視図であり、図1(b)は正面図であり、図1(c)は背面図であり、図1(d)は図1(b)のA-A線における断面図である。また、図2は、図1の光照射装置1の分解斜視図であり、図2(a)は斜め前方から見た図であり、図2(b)は斜め後方から見た図である。
(First embodiment)
FIG. 1 is a diagram illustrating a schematic configuration of a light irradiation device 1 including a circuit board fixing structure 10 according to a first embodiment of the present invention, FIG. 1(a) is a perspective view, and FIG. 1(b) is a perspective view. ) is a front view, FIG. 1(c) is a rear view, and FIG. 1(d) is a sectional view taken along line AA in FIG. 1(b). Moreover, FIG. 2 is an exploded perspective view of the light irradiation device 1 of FIG. 1, FIG. 2(a) is a diagram seen diagonally from the front, and FIG. 2(b) is a diagram seen diagonally from the rear.

本実施形態の光照射装置1は、印刷装置等に搭載されて、紫外線硬化型インキや紫外線硬化樹脂を硬化させる光源装置であり、例えば、正面(LEDモジュール100が配置されている面)が照射対象物と対向するように、照射対象物の上方に配置され、照射対象物に対して下向きに紫外光を出射する。なお、本明細書においては、図1に示すように、後述するLED(Light Emitting Diode)素子110が紫外光を出射する方向をZ軸方向、光照射装置1の長手方向をX軸方向、ならびにZ軸方向及びX軸方向に直交する方向(光照射装置1の短手方向)をY軸方向と定義して説明する。また、一般に、紫外光とは、波長400nm以下の光を意味するものとされているが、本明細書において、紫外光とは、紫外線硬化型インクを硬化させることが可能な波長(例えば、波長250~420nm)の光を意味するものとする。 The light irradiation device 1 of this embodiment is a light source device that is installed in a printing device or the like to cure ultraviolet curable ink or ultraviolet curable resin, and for example, the front surface (the surface where the LED module 100 is arranged) is irradiated. It is placed above the irradiation target so as to face the target, and emits ultraviolet light downward toward the irradiation target. In this specification, as shown in FIG. 1, the direction in which an LED (Light Emitting Diode) element 110 (described later) emits ultraviolet light is referred to as the Z-axis direction, the longitudinal direction of the light irradiation device 1 is referred to as the X-axis direction, and In the description, a direction perpendicular to the Z-axis direction and the X-axis direction (the lateral direction of the light irradiation device 1) is defined as the Y-axis direction. Further, in general, ultraviolet light is considered to mean light with a wavelength of 400 nm or less, but in this specification, ultraviolet light refers to a wavelength that can cure ultraviolet curable ink (for example, 250 to 420 nm).

図1及び図2に示すように、本実施形態の光照射装置1は、2個のLEDモジュール100と、ヒートシンク200(基台)と、各LEDモジュール100に電力を供給するアノード端子300a、カソード端子300b等と、これらを収容する金属製の箱形のケース(不図示)等を備えている。なお、本明細書においては、アノード端子300a及びカソード端子300bを総称して、電極部材300ともいう。 As shown in FIGS. 1 and 2, the light irradiation device 1 of this embodiment includes two LED modules 100, a heat sink 200 (base), an anode terminal 300a for supplying power to each LED module 100, and a cathode terminal. It includes terminals 300b and the like, and a metal box-shaped case (not shown) that accommodates them. Note that in this specification, the anode terminal 300a and the cathode terminal 300b are also collectively referred to as the electrode member 300.

LEDモジュール100は、X軸方向及びY軸方向によって規定される矩形状の基板105(回路基板)と、基板105上に複数のLED素子110(発光素子)とを備えており、ヒートシンク200の一端面上に、2個のLEDモジュール100が配置、固定されている(図1(a)、(b)、図2参照)。基板105は、例えば、熱伝導率の高い窒化アルミニウムで形成されたセラミックス基板であり、各基板105には、電極部材300に対応する位置に一対の貫通孔120(第1貫通孔)が形成されている(図1(d)、図2)。なお、本実施形態においては、ヒートシンク200の表面(基板載置面)に放熱グリス(不図示)を塗布した上で基板105をヒートシンク200上に載置することで、基板105の裏面とヒートシンク200との間に放熱グリスを挟み込み、基板105とヒートシンク200との密着性を高めている。 The LED module 100 includes a rectangular substrate 105 (circuit board) defined by the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 (light-emitting elements) on the substrate 105. Two LED modules 100 are arranged and fixed on the end face (see FIGS. 1(a), (b), and FIG. 2). The substrates 105 are, for example, ceramic substrates made of aluminum nitride with high thermal conductivity, and each substrate 105 has a pair of through holes 120 (first through holes) formed at positions corresponding to the electrode members 300. (Fig. 1(d), Fig. 2). Note that in this embodiment, by applying heat dissipation grease (not shown) to the front surface (board mounting surface) of the heat sink 200 and then placing the board 105 on the heat sink 200, the back surface of the board 105 and the heat sink 200 are connected to each other. Heat dissipation grease is sandwiched between the substrate 105 and the heat sink 200 to improve the adhesion between the substrate 105 and the heat sink 200.

図1(a)に示すように、LEDモジュール100は、基板105上に7列(Y軸方向)×10個(X軸方向)の態様で配置された70個のLED素子110を備えている。70個のLED素子110は、Z軸方向に光軸が揃えられた状態で、基板105の表面に配置されている。基板105の表面には、各LED素子110に電力を供給するためのアノードパターンAP(正極パターン)及びカソードパターンKP(負極パターン)が形成されており、各LED素子110は、アノードパターンAP及びカソードパターンKPの一端部にそれぞれハンダ付け等(例えば、導電性接着剤(銀ペースト)、ロウ材、溶接・溶着、拡散接合等)で電気的に接続されている。また、本実施形態のアノードパターンAPは、アノード端子300aの電極棒310に電気的に接続され、カソードパターンKPは、カソード端子300bの電極棒310に電気的に接続されている(詳細は後述)。そして、アノード端子300a及びカソード端子300bの電極棒310は、不図示のドライバ回路と電気的に接続されており、各LED素子110には、アノード端子300a及びカソード端子300b、アノードパターンAP及びカソードパターンKPを介して、ドライバ回路から駆動電流が供給されるようになっている。各LED素子110に駆動電流が供給されると、各LED素子110からは駆動電流に応じた光量の紫外光(例えば、波長385nm)が出射される。なお、本実施形態の各LED素子110は、略一様な光量の紫外光を出射するように各LED素子110に供給される駆動電流が調整されており、光照射装置1から出射される紫外光は、X軸方向及びY軸方向において略均一な光強度分布を有している。 As shown in FIG. 1A, the LED module 100 includes 70 LED elements 110 arranged in 7 rows (Y-axis direction) x 10 LED elements (X-axis direction) on a substrate 105. . The 70 LED elements 110 are arranged on the surface of the substrate 105 with their optical axes aligned in the Z-axis direction. On the surface of the substrate 105, an anode pattern AP (positive electrode pattern) and a cathode pattern KP (negative electrode pattern) for supplying power to each LED element 110 are formed. They are each electrically connected to one end of the pattern KP by soldering or the like (eg, conductive adhesive (silver paste), brazing material, welding/welding, diffusion bonding, etc.). Further, the anode pattern AP of this embodiment is electrically connected to the electrode bar 310 of the anode terminal 300a, and the cathode pattern KP is electrically connected to the electrode bar 310 of the cathode terminal 300b (details will be described later). . The electrode rods 310 of the anode terminal 300a and the cathode terminal 300b are electrically connected to a driver circuit (not shown), and each LED element 110 has an anode terminal 300a, a cathode terminal 300b, an anode pattern AP, and a cathode pattern. A drive current is supplied from the driver circuit via KP. When a drive current is supplied to each LED element 110, each LED element 110 emits ultraviolet light (for example, wavelength 385 nm) in an amount corresponding to the drive current. Note that the drive current supplied to each LED element 110 of this embodiment is adjusted so as to emit a substantially uniform amount of ultraviolet light, and the ultraviolet light emitted from the light irradiation device 1 is The light has a substantially uniform light intensity distribution in the X-axis direction and the Y-axis direction.

ヒートシンク200は、LEDモジュール100の基板105の裏面に密着するように配置され、各LED素子110で発生した熱を放熱する、いわゆる空冷ヒートシンクである。ヒートシンク200は、アルミニウムや銅等の熱伝導性の良好な材料からなり、X-Y平面に平行な薄板状のベース部210と、基板105が当接する面とは反対側の面に形成された複数の放熱フィン220と、を備えている。各放熱フィン220は、Y-Z平面に平行な薄板状の形状を呈し、X軸方向に所定の間隔をおいて設けられている。なお、本実施形態においては、不図示の冷却ファンによって生成される気流によって、複数の放熱フィン220が一様に冷却されるようになっている。 The heat sink 200 is a so-called air-cooled heat sink that is disposed in close contact with the back surface of the substrate 105 of the LED module 100 and radiates heat generated by each LED element 110. The heat sink 200 is made of a material with good thermal conductivity such as aluminum or copper, and is formed on a thin plate-shaped base portion 210 parallel to the XY plane and on a surface opposite to the surface in contact with the substrate 105. A plurality of heat radiation fins 220 are provided. Each radiation fin 220 has a thin plate shape parallel to the YZ plane, and is provided at predetermined intervals in the X-axis direction. Note that in this embodiment, the plurality of radiation fins 220 are uniformly cooled by an airflow generated by a cooling fan (not shown).

また、ヒートシンク200には、基板105の貫通孔120と連通するように、ヒートシンク200の表面から垂直に(Z軸方向と相反する方向に)貫通する貫通孔211(第2貫通孔)が形成されており、貫通孔211には電極部材300が挿通されている(図1(c)、(d)、図2)。なお、本実施形態の貫通孔211は、基板105の貫通孔120と連通するように、ベース部210を貫通する断面円形の貫通孔212(第3貫通孔)と、貫通孔212と連通するように形成された貫通孔222(第4貫通孔)と、から構成されている。より具体的には、貫通孔212に対応する位置の放熱フィン220が垂直な方向に(Z軸方向と相反する方向に)切欠かれており、この切欠部223と、この切欠部223をX軸方向に挟む2枚の放熱フィン220によって囲まれる空間内に、放熱フィン220をZ軸方向に貫通する断面矩形の貫通孔222が形成されている。また、貫通孔222を形成する放熱フィン220には、電極部材300の絶縁スリーブ330の突起部332と係合する凹部224(収容部)が形成されている(図1(d))。 Further, a through hole 211 (second through hole) is formed in the heat sink 200 and extends vertically from the surface of the heat sink 200 (in a direction opposite to the Z-axis direction) so as to communicate with the through hole 120 of the substrate 105. The electrode member 300 is inserted into the through hole 211 (FIGS. 1(c), (d), and FIG. 2). Note that the through hole 211 of this embodiment has a through hole 212 (third through hole) having a circular cross section that penetrates the base portion 210 so as to communicate with the through hole 120 of the substrate 105 , and a through hole 212 (third through hole) that penetrates the base portion 210 . The through hole 222 (fourth through hole) is formed in the through hole 222 (fourth through hole). More specifically, the radiation fin 220 at a position corresponding to the through hole 212 is notched in a vertical direction (in a direction opposite to the Z-axis direction), and this notch 223 is aligned with the X-axis. A through hole 222 having a rectangular cross section and penetrating through the radiation fins 220 in the Z-axis direction is formed in a space surrounded by the two radiation fins 220 sandwiched in the direction. Furthermore, a recess 224 (accommodating part) that engages with a protrusion 332 of an insulating sleeve 330 of an electrode member 300 is formed in the radiation fin 220 forming the through hole 222 (FIG. 1(d)).

上述のように、本実施形態の電極部材300には、アノードパターンAPと接続されるアノード端子300aと、カソードパターンKPと接続されるカソード端子300bとがあるが、具体的な構成は同一であるため、以下、代表してカソード端子300bについて主に説明する。図2に示すように、本実施形態の電極部材300(カソード端子300b)は、電極棒310(電極端子)と、固定ネジ320(固定部材)と、絶縁スリーブ330(絶縁部材)と、から構成されている。 As described above, the electrode member 300 of this embodiment includes the anode terminal 300a connected to the anode pattern AP and the cathode terminal 300b connected to the cathode pattern KP, but the specific configurations are the same. Therefore, the cathode terminal 300b will be mainly explained below as a representative. As shown in FIG. 2, the electrode member 300 (cathode terminal 300b) of this embodiment includes an electrode rod 310 (electrode terminal), a fixing screw 320 (fixing member), and an insulating sleeve 330 (insulating member). has been done.

図3は、本実施形態の電極棒310と絶縁スリーブ330の構成を説明する斜視図である。図3(a)は、電極棒310と絶縁スリーブ330がアセンブリされた状態を示す斜視図であり、図3(b)は分解斜視図である。図3に示すように、電極棒310は、円筒状の金属製の部材であり、絶縁スリーブ330は、先端部330aが円筒状で基端部330bが四角筒状の樹脂製の部材である。絶縁スリーブ330の先端部330aは、ベース部210に形成された貫通孔212に嵌り、基端部330bは放熱フィン220の貫通孔222に嵌るようになっており、電極棒310が絶縁スリーブ330内に挿通、固定されて(つまり、電極棒310の外周面に絶縁スリーブ330が取り付けられて)、ヒートシンク200の貫通孔211に挿入される(図1(d)、図2)。なお、本実施形態の絶縁スリーブ330のY軸方向の両端面には、それぞれ、外側(Y軸方向及びY軸方向と相反する方向)に突出する突起部332が形成されており、電極部材300がヒートシンク200の貫通孔211に挿入されたときに、突起部332が放熱フィン220の凹部224と係合し、電極部材300のZ軸方向の移動が規制されるようになっている。つまり、電極部材300がヒートシンク200から脱落しないように構成されている。そして、電極部材300が貫通孔211に取り付けられたとき、電極棒310及び絶縁スリーブ330の先端はヒートシンク200の表面(載置面)と略同一面上に位置するか、又はヒートシンク200の表面よりも僅かに窪んだ状態となり(図2(a))、電極棒310及び絶縁スリーブ330の基端部330bはヒートシンク200の裏面側から突出するように配置される(図2(b))。 FIG. 3 is a perspective view illustrating the configuration of the electrode rod 310 and the insulating sleeve 330 of this embodiment. FIG. 3(a) is a perspective view showing an assembled state of the electrode rod 310 and the insulating sleeve 330, and FIG. 3(b) is an exploded perspective view. As shown in FIG. 3, the electrode rod 310 is a cylindrical metal member, and the insulating sleeve 330 is a resin member with a cylindrical distal end 330a and a square cylindrical base end 330b. The distal end portion 330a of the insulating sleeve 330 fits into the through hole 212 formed in the base portion 210, and the base end portion 330b fits into the through hole 222 of the radiation fin 220, so that the electrode rod 310 is inserted into the insulating sleeve 330. (that is, the insulating sleeve 330 is attached to the outer peripheral surface of the electrode rod 310), and is inserted into the through hole 211 of the heat sink 200 (FIG. 1(d), FIG. 2). Note that protrusions 332 protruding outward (in the Y-axis direction and in a direction opposite to the Y-axis direction) are formed on both end surfaces of the insulating sleeve 330 in the Y-axis direction, respectively, and the electrode member 300 When the electrode member 300 is inserted into the through hole 211 of the heat sink 200, the protrusion 332 engages with the recess 224 of the radiation fin 220, and movement of the electrode member 300 in the Z-axis direction is restricted. In other words, the electrode member 300 is configured not to fall off from the heat sink 200. Then, when the electrode member 300 is attached to the through hole 211, the tips of the electrode rod 310 and the insulating sleeve 330 are located on the same plane as the surface (placing surface) of the heat sink 200, or are located closer to the surface of the heat sink 200. The electrode rod 310 and the base end 330b of the insulating sleeve 330 are arranged to protrude from the back side of the heat sink 200 (FIG. 2(b)).

このように、本実施形態の光照射装置1は、電極部材300が貫通孔211に取り付けられた状態で、組み立てが行われる。つまり、電極部材300が貫通孔211に取り付けられたヒートシンク200を準備し、ヒートシンク200の表面(載置面)に放熱グリスを塗布し、各LEDモジュール100を載置する。そして、基板105の貫通孔120が電極棒310の上方(Z軸方向側)に位置するように(つまり、貫通孔120が貫通孔211と連通するように)位置合わせを行い、貫通孔120に固定ネジ320を取り付ける。貫通孔120に固定ネジ320を取り付けると、固定ネジ320のネジ部321が電極棒310の内周面に形成されたネジ穴部310a(図1(d))に螺合し、LEDモジュール100が、固定ネジ320の頭部とヒートシンク200との間に狭持され、固定される(図1(d))。なお、上述のように、本実施形態においては、電極部材300の絶縁スリーブ330の基端部330bが四角筒状の形状を呈し、放熱フィン220の貫通孔222に嵌まり込んでいるため、固定ネジ320を回転させたとしても、電極部材300が回転することはなく、固定ネジ320を容易に着脱できるようになっている。そして、LEDモジュール100が、固定ネジ320によって固定されると、カソードパターンKPが固定ネジ320を介して電極棒310と電気的に接続される。また、アノードパターンAPも同様に、固定ネジ320を介して電極棒310と電気的に接続される。従って、一対の電極棒310に接続されたドライバ回路からLED素子110の駆動電流が供給されると、アノードパターンAP及びカソードパターンKPを介して各LED素子110に電力が供給される。 In this way, the light irradiation device 1 of this embodiment is assembled with the electrode member 300 attached to the through hole 211. That is, the heat sink 200 with the electrode member 300 attached to the through hole 211 is prepared, heat dissipation grease is applied to the surface (mounting surface) of the heat sink 200, and each LED module 100 is mounted. Then, alignment is performed so that the through hole 120 of the substrate 105 is located above the electrode rod 310 (on the Z-axis direction side) (that is, so that the through hole 120 communicates with the through hole 211), and the through hole 120 Attach the fixing screw 320. When the fixing screw 320 is attached to the through hole 120, the threaded portion 321 of the fixing screw 320 is screwed into the screw hole portion 310a (FIG. 1(d)) formed on the inner peripheral surface of the electrode rod 310, and the LED module 100 is , is held and fixed between the head of the fixing screw 320 and the heat sink 200 (FIG. 1(d)). As described above, in this embodiment, the base end 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and fits into the through hole 222 of the radiation fin 220, so that it cannot be fixed. Even if the screw 320 is rotated, the electrode member 300 does not rotate, and the fixing screw 320 can be easily attached and detached. Then, when the LED module 100 is fixed with the fixing screws 320, the cathode pattern KP is electrically connected to the electrode rod 310 via the fixing screws 320. Similarly, the anode pattern AP is electrically connected to the electrode rod 310 via the fixing screw 320. Therefore, when driving current for the LED elements 110 is supplied from the driver circuit connected to the pair of electrode rods 310, power is supplied to each LED element 110 via the anode pattern AP and the cathode pattern KP.

このように、本実施形態においては、電極部材300が基板105の固定と電力の供給を兼ねている。従って、基板105に電力を供給するための専用の部材を設ける必要がなく、光照射装置1(回路基板固定構造10)を小型化することが可能となる。また、LEDモジュール100の故障時等、LEDモジュール100の交換が必要となった場合にも、固定ネジ320を取り外してLEDモジュール100を交換するだけの作業となるため(つまり、LEDモジュール100に電力を供給するための専用の部材を接続したり、配線等を行う必要がないため)、簡単な作業でLEDモジュール100を交換することが可能となる。なお、本実施形態においては、電極部材300の絶縁スリーブ330の基端部330bが四角筒状の形状を呈し、放熱フィン220の貫通孔222に嵌まり込んでいるため、固定ネジ320の回転に合わせて電極部材300が回転することはなく、また、絶縁スリーブ330の突起部332が放熱フィン220の凹部224と係合して電極部材300のZ軸方向の移動が規制されているため、固定ネジ320の着脱作業も容易に行うことができる。 In this manner, in this embodiment, the electrode member 300 serves both to fix the substrate 105 and to supply power. Therefore, there is no need to provide a dedicated member for supplying power to the board 105, and it is possible to downsize the light irradiation device 1 (circuit board fixing structure 10). Furthermore, even if it becomes necessary to replace the LED module 100 due to a failure of the LED module 100, the task is simply to remove the fixing screw 320 and replace the LED module 100 (in other words, the LED module 100 is powered (Because there is no need to connect special members for supplying the LED or perform wiring, etc.), it is possible to replace the LED module 100 with a simple operation. In this embodiment, the base end 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and is fitted into the through hole 222 of the radiation fin 220. At the same time, the electrode member 300 does not rotate, and the protrusion 332 of the insulating sleeve 330 engages with the recess 224 of the radiation fin 220 to restrict movement of the electrode member 300 in the Z-axis direction, so it is fixed. The work of attaching and detaching the screw 320 can also be easily performed.

以上が本実施形態の説明であるが、本発明は、上記の構成に限定されるものではなく、本発明の技術的思想の範囲内において様々な変形が可能である。 Although the present embodiment has been described above, the present invention is not limited to the above configuration, and various modifications can be made within the scope of the technical idea of the present invention.

例えば、本実施形態においては、光照射装置1が回路基板固定構造10を備えるものとして説明したが、回路基板固定構造10の用途はこれに限定されるものではなく、基台(例えば、ヒートシンク、ベースプレート)上に回路基板を支持する構成を有する装置に適用することができる。 For example, in the present embodiment, the light irradiation device 1 has been described as having the circuit board fixing structure 10, but the use of the circuit board fixing structure 10 is not limited to this, and the use of the circuit board fixing structure 10 is not limited to this. The present invention can be applied to a device having a configuration in which a circuit board is supported on a base plate (base plate).

また、本実施形態の光照射装置1は、2個のLEDモジュール100を備えるものとして説明したが、これに限定されるものではなく、LEDモジュール100の個数は光照射装置1の仕様に応じて適宜設定される。 Furthermore, although the light irradiation device 1 of the present embodiment has been described as having two LED modules 100, it is not limited to this, and the number of LED modules 100 may vary according to the specifications of the light irradiation device 1. Set as appropriate.

また、本実施形態の光照射装置1は、紫外光を出射するものとして説明したが、このような構成に限定されるものではなく、本発明は、可視光や赤外光を出射する光源装置に適用することも可能である。 Further, although the light irradiation device 1 of the present embodiment has been described as one that emits ultraviolet light, it is not limited to such a configuration, and the present invention is a light source device that emits visible light or infrared light. It is also possible to apply it to

(第2の実施形態)
図4は、本発明の第2の実施形態に係る回路基板固定構造20を備える光照射装置2の概略構成を説明する図であり、図4(a)は正面図であり、図4(b)は図4(a)のB-B線における断面図であり、図4(c)は図4(a)のC-C線における断面図である。
(Second embodiment)
FIG. 4 is a diagram illustrating a schematic configuration of a light irradiation device 2 including a circuit board fixing structure 20 according to a second embodiment of the present invention, FIG. 4(a) is a front view, and FIG. 4(b) is a front view. ) is a sectional view taken along line BB in FIG. 4(a), and FIG. 4(c) is a sectional view taken along line CC in FIG. 4(a).

図4(b)、(c)に示すように、本実施形態の光照射装置2においては、電極部材300を90°回転させ、絶縁スリーブ330の突起部332がX軸方向及びX軸方向と相反する方向に突出する向きで配置されている点で第1の実施形態の光照射装置1と異なる。また、本実施形態においては、放熱フィン220の凹部224に代えて、放熱フィン220の切欠部223をX軸方向に挟む2枚の放熱フィン220に、突起部332が係合する開口部226(収容部)が形成されている点で第1の実施形態の光照射装置1と異なる。 As shown in FIGS. 4(b) and 4(c), in the light irradiation device 2 of this embodiment, the electrode member 300 is rotated by 90 degrees, and the protrusion 332 of the insulating sleeve 330 is aligned with the X-axis direction and the X-axis direction. The light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that the light irradiation device 1 is arranged so as to protrude in opposite directions. Furthermore, in this embodiment, instead of the recess 224 of the radiation fin 220, an opening 226 ( The light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that a storage portion) is formed.

本実施形態においても、電極部材300の絶縁スリーブ330の基端部330bが四角筒状の形状を呈し、放熱フィン220の貫通孔222に嵌まり込んでいるため、固定ネジ320の回転に合わせて電極部材300が回転することはない。また、絶縁スリーブ330の突起部332が放熱フィン220の開口部226と係合して電極部材300のZ軸方向の移動が規制されるため、第1の実施形態と同様、固定ネジ320の着脱作業を容易に行うことができる。 Also in this embodiment, the base end 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and is fitted into the through hole 222 of the radiation fin 220. The electrode member 300 does not rotate. Further, since the protrusion 332 of the insulating sleeve 330 engages with the opening 226 of the radiation fin 220 to restrict movement of the electrode member 300 in the Z-axis direction, the fixing screw 320 can be attached and detached similarly to the first embodiment. Work can be done easily.

(第3の実施形態)
図5は、本発明の第3の実施形態に係る回路基板固定構造30を備える光照射装置3の概略構成を説明する図であり、図5(a)は正面図であり、図5(b)は図5(a)のD-D線における断面図であり、図5(c)は図5(b)E部拡大図である。
(Third embodiment)
FIG. 5 is a diagram illustrating a schematic configuration of a light irradiation device 3 including a circuit board fixing structure 30 according to a third embodiment of the present invention, FIG. 5(a) is a front view, and FIG. 5(b) is a front view. ) is a sectional view taken along line DD in FIG. 5(a), and FIG. 5(c) is an enlarged view of portion E in FIG. 5(b).

図5(b)、(c)に示すように、本実施形態の光照射装置3においては、電極部材300の先端部330aが第1の実施形態のものよりも長く、絶縁スリーブ330の先端部330aの外周面上に圧縮バネ340(付勢部材)を備えている点で第1の実施形態の光照射装置1と異なる。より具体的には、本実施形態の圧縮バネ340を電極部材300の先端部330aに取付けた状態(つまり、圧縮バネ340が先端部330aに巻回された状態)で電極部材300がヒートシンク200の貫通孔211に挿入されている。そして、電極部材300がヒートシンク200の貫通孔211に挿入されたときに、突起部332が放熱フィン220の凹部224と係合し、電極部材300のZ軸方向の移動が規制されるが、このときに圧縮バネ340の先端側がヒートシンク200のベース部210の裏面に当接し、他端側が電極部材300の先端部330aと基端部330bとの間の段差部330cに当接し、圧縮されるようになっている。従って、本実施形態の電極部材300がヒートシンク200の貫通孔211に取付けられると、電極部材300が圧縮バネ340の付勢力によってZ軸方向と相反する方向に付勢される(つまり、基板105に対して電極部材300が離れるように付勢される)。このため、突起部332と凹部224との間にZ軸方向の遊びがあったとしてもキャンセルされる。また、固定ネジ320によってLEDモジュール100が取付けられると、固定ネジ320に対しても圧縮バネ340の付勢力が及ぶため、LEDモジュール100もZ軸方向と相反する方向に(つまり、ヒートシンク200のベース部210に)付勢され、LEDモジュール100がヒートシンク200に確実に密着することとなる。 As shown in FIGS. 5(b) and 5(c), in the light irradiation device 3 of this embodiment, the tip 330a of the electrode member 300 is longer than that of the first embodiment, and the tip of the insulating sleeve 330 is longer than that of the first embodiment. The light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that a compression spring 340 (biasing member) is provided on the outer peripheral surface of the light irradiation device 330a. More specifically, when the compression spring 340 of this embodiment is attached to the tip 330a of the electrode member 300 (that is, the compression spring 340 is wound around the tip 330a), the electrode member 300 is attached to the heat sink 200. It is inserted into the through hole 211. When the electrode member 300 is inserted into the through hole 211 of the heat sink 200, the protrusion 332 engages with the recess 224 of the radiation fin 220, and the movement of the electrode member 300 in the Z-axis direction is restricted. When the compression spring 340 is compressed, the distal end thereof contacts the back surface of the base portion 210 of the heat sink 200, and the other end thereof contacts the stepped portion 330c between the distal end portion 330a and the proximal end portion 330b of the electrode member 300. It has become. Therefore, when the electrode member 300 of this embodiment is attached to the through hole 211 of the heat sink 200, the electrode member 300 is biased in a direction opposite to the Z-axis direction by the biasing force of the compression spring 340 (that is, the electrode member 300 is biased toward the substrate 105). (The electrode member 300 is urged away from the electrode member 300.) Therefore, even if there is play in the Z-axis direction between the protrusion 332 and the recess 224, it is canceled. Furthermore, when the LED module 100 is attached with the fixing screw 320, the biasing force of the compression spring 340 is also applied to the fixing screw 320, so that the LED module 100 also moves in a direction opposite to the Z-axis direction (that is, the base of the heat sink 200 portion 210), and the LED module 100 is reliably brought into close contact with the heat sink 200.

なお、本実施形態においても、電極部材300の絶縁スリーブ330の基端部330bが四角筒状の形状を呈し、放熱フィン220の貫通孔222に嵌まり込んでいるため、固定ネジ320の回転に合わせて電極部材300が回転することはない。また、絶縁スリーブ330の突起部332が放熱フィン220の凹部224と係合して電極部材300のZ軸方向の移動が規制されているため、第1の実施形態と同様、固定ネジ320の着脱作業を容易に行うことができる。 In this embodiment as well, the base end 330b of the insulating sleeve 330 of the electrode member 300 has a rectangular cylindrical shape and is fitted into the through hole 222 of the radiation fin 220. At the same time, the electrode member 300 does not rotate. Further, since the protrusion 332 of the insulating sleeve 330 engages with the recess 224 of the radiation fin 220 to restrict movement of the electrode member 300 in the Z-axis direction, the fixing screw 320 can be attached and detached similarly to the first embodiment. Work can be done easily.

(第4の実施形態)
図6は、本発明の第4の実施形態に係る回路基板固定構造40を備える光照射装置4の概略構成を説明する図であり、図6(a)は正面図であり、図6(b)は図6(a)のF-F線における断面図であり、図6(c)は図6(b)G部拡大図である。
(Fourth embodiment)
FIG. 6 is a diagram illustrating a schematic configuration of a light irradiation device 4 including a circuit board fixing structure 40 according to a fourth embodiment of the present invention, FIG. 6(a) is a front view, and FIG. 6(b) is a front view. ) is a cross-sectional view taken along line FF in FIG. 6(a), and FIG. 6(c) is an enlarged view of section G in FIG. 6(b).

図6に示すように、本実施形態の光照射装置4は、基板105上のLED素子110をY軸方向から挟むように、各LEDモジュール100の基板105上に配置される一対の基板固定部材400(機能部材)を備えている点で第1の実施形態の光照射装置1と異なる。基板固定部材400は、略中央部に貫通孔410を有する金属の矩形板状の部材であり、貫通孔410が基板105の貫通孔120と連通するように配置され、貫通孔410及び貫通孔120に挿通される固定ネジ320によって基板105と共にヒートシンク200に共締めされている(図6(c))。各基板固定部材400が固定ネジ320によって固定されると、アノードパターンAP上に基板固定部材400が圧着し、基板固定部材400と固定ネジ320を介してアノードパターンAPとアノード端子300aの電極棒310とが電気的に接続される。同様に、カソードパターンKP上に基板固定部材400が圧着し、基板固定部材400と固定ネジ320を介してカソードパターンKPとカソード端子300bの電極棒310とが電気的に接続される。なお、本実施形態においては、一対の基板固定部材400の互いに対向する側面(LED素子110に面する側面)は、Z軸方向に向かって開くように傾斜するテーパー面になっており、その表面には反射ミラー420が形成されている。従って、LED素子110から出射される紫外光のうち、拡がり角の大きい成分が反射ミラー420に入射、反射され、前方(Z軸方向)に向かって導光される。このため、LED素子110から出射される紫外光の利用効率が上がる。 As shown in FIG. 6, the light irradiation device 4 of this embodiment includes a pair of substrate fixing members arranged on the substrate 105 of each LED module 100 so as to sandwich the LED elements 110 on the substrate 105 from the Y-axis direction. The light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that it includes a functional member 400 (functional member). The board fixing member 400 is a metal rectangular plate-shaped member having a through hole 410 approximately in the center, and is arranged so that the through hole 410 communicates with the through hole 120 of the board 105. The substrate 105 and the heat sink 200 are fastened together with a fixing screw 320 inserted into the heat sink 200 (FIG. 6(c)). When each substrate fixing member 400 is fixed by the fixing screw 320, the substrate fixing member 400 is crimped onto the anode pattern AP, and the electrode rod 310 of the anode pattern AP and the anode terminal 300a is connected to the anode pattern AP via the substrate fixing member 400 and the fixing screw 320. are electrically connected. Similarly, the substrate fixing member 400 is crimped onto the cathode pattern KP, and the cathode pattern KP and the electrode rod 310 of the cathode terminal 300b are electrically connected via the substrate fixing member 400 and the fixing screw 320. In this embodiment, the mutually opposing side surfaces (side surfaces facing the LED element 110) of the pair of substrate fixing members 400 are tapered surfaces that are inclined to open toward the Z-axis direction. A reflecting mirror 420 is formed in the. Therefore, of the ultraviolet light emitted from the LED element 110, a component with a large divergence angle is incident on the reflection mirror 420, reflected, and guided forward (in the Z-axis direction). Therefore, the utilization efficiency of the ultraviolet light emitted from the LED element 110 increases.

本実施形態においても、LEDモジュール100の交換が必要となった場合、固定ネジ320を取り外してLEDモジュール100を交換するだけの作業となるため、簡単な作業でLEDモジュール100を交換することが可能となる。なお、本実施形態においては、基板固定部材400が反射ミラー420を兼ねる構成としているが、他の実施形態としては、基板固定部材400がレンズホルダ機能を有する等、他の機能を備えてもよい。 Also in this embodiment, when it becomes necessary to replace the LED module 100, the task is simply to remove the fixing screw 320 and replace the LED module 100, so it is possible to replace the LED module 100 with a simple task. becomes. In this embodiment, the substrate fixing member 400 also serves as the reflecting mirror 420, but in other embodiments, the substrate fixing member 400 may have other functions such as a lens holder function. .

(第5の実施形態)
図7は、本発明の第5の実施形態に係る回路基板固定構造50を備える光照射装置5の概略構成を説明する図であり、図7(a)は正面図であり、図7(b)は背面図であり、図7(c)は図7(a)のH-H線における断面図であり、図7(d)は図7(a)のJ-J線における断面図であり、図7(e)は図7(d)のK-K線における断面図である。また、図8は、図7の光照射装置5の分解斜視図であり、図8(a)は斜め前方から見た図であり、図8(b)は斜め後方から見た図である。
(Fifth embodiment)
FIG. 7 is a diagram illustrating a schematic configuration of a light irradiation device 5 including a circuit board fixing structure 50 according to a fifth embodiment of the present invention, FIG. 7(a) is a front view, and FIG. 7(b) is a front view. ) is a rear view, FIG. 7(c) is a sectional view taken along line HH in FIG. 7(a), and FIG. 7(d) is a sectional view taken along line JJ in FIG. 7(a). , FIG. 7(e) is a cross-sectional view taken along the line KK in FIG. 7(d). Moreover, FIG. 8 is an exploded perspective view of the light irradiation device 5 of FIG. 7, FIG. 8(a) is a view seen diagonally from the front, and FIG. 8(b) is a view seen diagonally from the rear.

図7及び8に示すように、本実施形態の光照射装置5は、空冷のヒートシンク200に代えて、水冷ヒートシンク500を備える点、電極部材300(アノード端子300a及びカソード端子300b)とは形状の異なる電極部材600(アノード端子600a及びカソード端子600b)を備える点、及び背面固定板700を備える点で第1の実施形態の光照射装置1と異なる。 As shown in FIGS. 7 and 8, the light irradiation device 5 of this embodiment includes a water-cooled heat sink 500 instead of the air-cooled heat sink 200, and the electrode member 300 (anode terminal 300a and cathode terminal 300b) has a different shape. The light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that it includes different electrode members 600 (an anode terminal 600a and a cathode terminal 600b) and a back fixing plate 700.

水冷ヒートシンク500は、LEDモジュール100の基板105の裏面に密着するように配置され、各LED素子110で発生した熱を放熱するX-Y平面に平行な薄板状の冷却装置である。水冷ヒートシンク500の内部には、水冷ヒートシンク500の略中央部をX軸方向に往復する水路550(流路)が形成されており(図7(e))、冷媒(例えば水)が、水冷ヒートシンク500の裏面に形成された給水口552から供給され、水路550を流れ、排水口554から排出されるようになっている。また、水冷ヒートシンク500には、基板105の貫通孔120と連通するように、水冷ヒートシンク500の表面から垂直に(Z軸方向と相反する方向に)貫通する貫通孔511(第2貫通孔)が形成されており、貫通孔511には電極部材600が収容されるようになっている(図7(c)、(d)、(e)、図8)。なお、本実施形態の貫通孔511は、電極部材600と嵌合するように、断面が略小判型の長孔になっている。 The water-cooled heat sink 500 is a thin plate-shaped cooling device parallel to the XY plane that is disposed in close contact with the back surface of the substrate 105 of the LED module 100 and radiates heat generated by each LED element 110. Inside the water-cooled heat sink 500, a water channel 550 (flow path) that reciprocates in the X-axis direction approximately at the center of the water-cooled heat sink 500 is formed (FIG. 7(e)), and a refrigerant (for example, water) flows through the water-cooled heat sink 500. Water is supplied from a water supply port 552 formed on the back surface of the water bottle 500, flows through a water channel 550, and is discharged from a drain port 554. In addition, the water-cooled heat sink 500 has a through hole 511 (second through hole) that penetrates from the surface of the water-cooled heat sink 500 perpendicularly (in a direction opposite to the Z-axis direction) so as to communicate with the through hole 120 of the substrate 105. The electrode member 600 is accommodated in the through hole 511 (FIGS. 7(c), (d), (e), and FIG. 8). Note that the through hole 511 of this embodiment is a long hole with a substantially oval cross section so as to fit with the electrode member 600.

図8に示すように、本実施形態の電極部材600は、電極棒610と、固定ネジ620と、絶縁スリーブ630と、から構成されている。電極棒610は、円筒状の金属製の部材であり、絶縁スリーブ630は、電極棒610を収容する樹脂製の部材である。絶縁スリーブ630は、円柱を2つのX-Z平面でカットした2つの平面部632を有する、X-Y断面が小判型の本体部630bと、本体部630bから前方(Z軸方向)に突出する円筒状の先端部630aを有している。絶縁スリーブ630は、水冷ヒートシンク500に形成された貫通孔511に嵌るようになっており、電極棒610が絶縁スリーブ630内に挿通、固定されて(つまり、電極棒610の外周面に絶縁スリーブ630が取り付けられて)、水冷ヒートシンク500の貫通孔511に挿入される(図7(c)、(d)、図8)。本実施形態においては、絶縁スリーブ630の先端部630aが、水冷ヒートシンク500に形成された貫通孔511の先端に当て付くまで電極部材600を挿入すると、電極部材600が貫通孔511に完全に収容されるようになっている(図7(c)、(d))。 As shown in FIG. 8, the electrode member 600 of this embodiment includes an electrode rod 610, a fixing screw 620, and an insulating sleeve 630. The electrode rod 610 is a cylindrical metal member, and the insulating sleeve 630 is a resin member that accommodates the electrode rod 610. The insulating sleeve 630 has a main body part 630b having an oval shape in XY cross section and has two flat parts 632 obtained by cutting a cylinder along two XZ planes, and protrudes forward (in the Z-axis direction) from the main body part 630b. It has a cylindrical tip 630a. The insulating sleeve 630 is adapted to fit into a through hole 511 formed in the water-cooled heat sink 500, and the electrode rod 610 is inserted and fixed into the insulating sleeve 630 (that is, the insulating sleeve 630 is attached to the outer peripheral surface of the electrode rod 610). is attached) and inserted into the through hole 511 of the water-cooled heat sink 500 (FIGS. 7(c), (d), FIG. 8). In this embodiment, when the electrode member 600 is inserted until the tip 630a of the insulating sleeve 630 touches the tip of the through hole 511 formed in the water-cooled heat sink 500, the electrode member 600 is completely accommodated in the through hole 511. (Fig. 7(c), (d)).

背面固定板700は、水冷ヒートシンク500の背面にネジ(不図示)又は接着等で固定される、樹脂又は金属の板状の部材である。背面固定板700は、電極棒610の外径よりも僅かに大きい円形の開口部710を有し、開口部710から電極棒610が露出するように固定されている。背面固定板700が水冷ヒートシンク500に固定されたとき、背面固定板700が絶縁スリーブ630の本体部630bと当接するように構成されており(つまり、背面固定板700によって電極部材600のZ軸方向の移動が規制されるようになっており)、電極部材600が水冷ヒートシンク500から脱落しないようになっている(図7(c)、(d))。 The back surface fixing plate 700 is a resin or metal plate-shaped member that is fixed to the back surface of the water-cooled heat sink 500 with screws (not shown) or adhesive. The back fixing plate 700 has a circular opening 710 that is slightly larger than the outer diameter of the electrode rod 610, and is fixed so that the electrode rod 610 is exposed from the opening 710. When the back fixing plate 700 is fixed to the water-cooled heat sink 500, the back fixing plate 700 is configured to come into contact with the main body 630b of the insulating sleeve 630 (that is, the back fixing plate 700 prevents the electrode member 600 from moving in the Z-axis direction. movement is regulated), and the electrode member 600 is prevented from falling off the water-cooled heat sink 500 (FIGS. 7(c) and 7(d)).

このように、本実施形態の光照射装置5は、電極部材600が貫通孔511に取り付けられた状態で、組み立てが行われる。つまり、電極部材600が貫通孔511に取り付けられた水冷ヒートシンク500を準備し、水冷ヒートシンク500の表面(載置面)に放熱グリスを塗布し、各LEDモジュール100を載置する。そして、基板105の貫通孔120が電極棒610の上方(Z軸方向側)に位置するように(つまり、貫通孔120が貫通孔511と連通するように)位置合わせを行い、貫通孔120に固定ネジ620を取り付ける。貫通孔120に固定ネジ620を取り付けると、固定ネジ620のネジ部621が電極棒610の内周面に形成されたネジ穴部(不図示)に螺合し、LEDモジュール100が、固定ネジ620の頭部と水冷ヒートシンク500との間に狭持され、固定される。なお、上述のように、本実施形態においては、電極部材600の絶縁スリーブ630の本体部630bが断面小判型の形状を呈し、貫通孔511に嵌まり込んでいるため、固定ネジ620を回転させたとしても、電極部材600が回転することはなく、固定ネジ620を容易に着脱できるようになっている。そして、LEDモジュール100が、固定ネジ620によって固定されると、カソードパターンKPが固定ネジ620を介して電極棒610(カソード端子600b)と電気的に接続される。また、アノードパターンAPも同様に、固定ネジ620を介して電極棒610(アノード端子600a)と電気的に接続される。従って、一対の電極棒610に接続されたドライバ回路からLED素子110の駆動電流が供給されると、アノードパターンAP及びカソードパターンKPを介して各LED素子110に電力が供給される。 In this manner, the light irradiation device 5 of this embodiment is assembled with the electrode member 600 attached to the through hole 511. That is, the water-cooled heat sink 500 with the electrode member 600 attached to the through-hole 511 is prepared, heat dissipation grease is applied to the surface (placing surface) of the water-cooled heat sink 500, and each LED module 100 is mounted. Then, alignment is performed so that the through hole 120 of the substrate 105 is located above the electrode rod 610 (on the Z-axis direction side) (that is, so that the through hole 120 communicates with the through hole 511), and the through hole 120 Attach the fixing screw 620. When the fixing screw 620 is attached to the through hole 120, the threaded portion 621 of the fixing screw 620 is screwed into a screw hole (not shown) formed on the inner peripheral surface of the electrode rod 610, and the LED module 100 is attached to the fixing screw 620. and the water-cooled heat sink 500 and is fixed therebetween. As described above, in this embodiment, the main body portion 630b of the insulating sleeve 630 of the electrode member 600 has an oval-shaped cross section and is fitted into the through hole 511, so that the fixing screw 620 cannot be rotated. Even if the electrode member 600 is rotated, the fixing screw 620 can be easily attached and detached. Then, when the LED module 100 is fixed with the fixing screw 620, the cathode pattern KP is electrically connected to the electrode rod 610 (cathode terminal 600b) via the fixing screw 620. Similarly, the anode pattern AP is electrically connected to the electrode rod 610 (anode terminal 600a) via the fixing screw 620. Therefore, when driving current for the LED elements 110 is supplied from the driver circuit connected to the pair of electrode rods 610, power is supplied to each LED element 110 via the anode pattern AP and the cathode pattern KP.

このように、本実施形態においても、電極部材600が基板105の固定と電力の供給を兼ねている。従って、基板105に電力を供給するための専用の部材を設ける必要がなく、光照射装置5(回路基板固定構造50)を小型化することが可能となる。また、LEDモジュール100の故障時等、LEDモジュール100の交換が必要となった場合にも、固定ネジ620を取り外してLEDモジュール100を交換するだけの作業となるため(つまり、LEDモジュール100に電力を供給するための専用の部材を接続したり、配線等を行う必要がないため)、簡単な作業でLEDモジュール100を交換することが可能となる。なお、本実施形態においても、固定ネジ620の回転に合わせて電極部材600が回転することはなく、また、背面固定板700によって電極部材600のZ軸方向の移動が規制されているため、固定ネジ620の着脱作業も容易に行うことができる。 In this way, also in this embodiment, the electrode member 600 serves both to fix the substrate 105 and to supply power. Therefore, there is no need to provide a dedicated member for supplying power to the board 105, and the light irradiation device 5 (circuit board fixing structure 50) can be downsized. Furthermore, even if it becomes necessary to replace the LED module 100 due to a failure of the LED module 100, the task is simply to remove the fixing screw 620 and replace the LED module 100 (in other words, if the LED module 100 is powered (Because there is no need to connect special members for supplying the LED or perform wiring, etc.), it is possible to replace the LED module 100 with a simple operation. Note that in this embodiment as well, the electrode member 600 does not rotate in accordance with the rotation of the fixing screw 620, and the movement of the electrode member 600 in the Z-axis direction is restricted by the back fixing plate 700, so that the electrode member 600 cannot be fixed. The work of attaching and detaching the screw 620 can also be easily performed.

(第6の実施形態)
図9は、本発明の第6の実施形態に係る回路基板固定構造60を備える光照射装置6の概略構成を説明する図であり、図9(a)は正面図であり、図9(b)は背面図であり、図9(c)は図9(a)のL-L線における断面図であり、図9(d)は図9(a)のM-M線における断面図であり、図9(e)は図9(d)のN-N線における断面図である。
(Sixth embodiment)
FIG. 9 is a diagram illustrating a schematic configuration of a light irradiation device 6 including a circuit board fixing structure 60 according to a sixth embodiment of the present invention, in which FIG. 9(a) is a front view and FIG. 9(b) is a front view. ) is a rear view, FIG. 9(c) is a sectional view taken along line LL in FIG. 9(a), and FIG. 9(d) is a sectional view taken along line MM in FIG. 9(a). , FIG. 9(e) is a cross-sectional view taken along the line NN in FIG. 9(d).

図9(b)、(c)、(d)、(e)に示すように、本実施形態の光照射装置6においては、絶縁スリーブ630が、本体部630bの基端面(先端部630aとは反対側の面)から後方(Z軸方向と相反する方向)に突出する四角筒状の後端部630cを有する点、絶縁スリーブ630の本体部630bが円筒状の形状を呈している点、背面固定板700の開口部710が矩形状の形状を呈し、該開口部710に後端部630cが嵌合している点、で第5の実施形態の光照射装置5と異なる。 As shown in FIGS. 9(b), (c), (d), and (e), in the light irradiation device 6 of this embodiment, the insulating sleeve 630 The main body part 630b of the insulating sleeve 630 has a cylindrical shape; The light irradiation device 5 differs from the light irradiation device 5 of the fifth embodiment in that the opening 710 of the fixed plate 700 has a rectangular shape, and the rear end 630c fits into the opening 710.

このように、本実施形態においては、電極部材600の絶縁スリーブ630の後端部630cが四角筒状の形状を呈し、背面固定板700の開口部710に嵌まり込んでいるため、固定ネジ620の回転に合わせて電極部材600が回転することはない。また、絶縁スリーブ630の本体部630bの基端面の一部(後端部630cよりも外側の部分)が、背面固定板700に当接して電極部材600のZ軸方向の移動が規制されているため(図9(c)、(d))、第5の実施形態と同様、固定ネジ620の着脱作業を容易に行うことができる。 As described above, in this embodiment, the rear end 630c of the insulating sleeve 630 of the electrode member 600 has a rectangular cylindrical shape and is fitted into the opening 710 of the back fixing plate 700, so that the fixing screw 620 The electrode member 600 does not rotate in accordance with the rotation of the electrode member 600. Further, a part of the proximal end surface of the main body portion 630b of the insulating sleeve 630 (a portion outside the rear end portion 630c) comes into contact with the back surface fixing plate 700, and movement of the electrode member 600 in the Z-axis direction is restricted. Therefore, as in the fifth embodiment, the fixing screw 620 can be easily attached and detached (FIGS. 9(c) and 9(d)).

(第7の実施形態)
図10は、本発明の第7の実施形態に係る回路基板固定構造70を備える光照射装置7の概略構成を説明する図であり、図10(a)は正面図であり、図10(b)は図10(a)のO-O線における断面図であり、図10(c)は図10(b)のP-P線における断面図である。
(Seventh embodiment)
FIG. 10 is a diagram illustrating a schematic configuration of a light irradiation device 7 including a circuit board fixing structure 70 according to a seventh embodiment of the present invention, FIG. 10(a) is a front view, and FIG. 10(b) is a front view. ) is a sectional view taken along line OO in FIG. 10(a), and FIG. 10(c) is a sectional view taken along line PP in FIG. 10(b).

図10(c)に示すように、本実施形態の光照射装置7においては、水冷ヒートシンク500の貫通孔511の断面形状が、略矩形状になっている点で第5の実施形態の光照射装置5と異なる。 As shown in FIG. 10(c), in the light irradiation device 7 of this embodiment, the cross-sectional shape of the through hole 511 of the water-cooled heat sink 500 is substantially rectangular. This is different from device 5.

このように、本実施形態においても、電極部材600の絶縁スリーブ630の本体部630bが断面小判型の形状を呈し、貫通孔511に嵌まり込んでいるため、固定ネジ620の回転に合わせて電極部材600が回転することはない。また、絶縁スリーブ630の基端面が背面固定板700に当接して電極部材600のZ軸方向の移動が規制されているため(図10(b))、固定ネジ620の着脱作業も容易に行うことができる。 In this manner, also in this embodiment, the main body portion 630b of the insulating sleeve 630 of the electrode member 600 has an oval-shaped cross section and is fitted into the through hole 511, so that the electrode is rotated in accordance with the rotation of the fixing screw 620. Member 600 does not rotate. Furthermore, since the proximal end surface of the insulating sleeve 630 comes into contact with the back fixing plate 700 and movement of the electrode member 600 in the Z-axis direction is restricted (FIG. 10(b)), it is easy to attach and detach the fixing screw 620. be able to.

(第8の実施形態)
図11は、本発明の第8の実施形態に係る回路基板固定構造80を備える光照射装置8の概略構成を説明する図であり、図11(a)は正面図であり、図11(b)は図11(a)のQ-Q線における断面図である。
(Eighth embodiment)
FIG. 11 is a diagram illustrating a schematic configuration of a light irradiation device 8 including a circuit board fixing structure 80 according to an eighth embodiment of the present invention, FIG. 11(a) is a front view, and FIG. 11(b) ) is a sectional view taken along the QQ line in FIG. 11(a).

図11に示すように、本実施形態の光照射装置8は、基板105上のLED素子110をY軸方向から挟むように、各LEDモジュール100の基板105上に配置される一対の基板固定部材400を備えている点で第5の実施形態の光照射装置5と異なる。基板固定部材400は、略中央部に貫通孔410を有する金属の矩形板状の部材であり、貫通孔410が基板105の貫通孔120と連通するように配置され、貫通孔410及び貫通孔120に挿通される固定ネジ620によって基板105と共に水冷ヒートシンク500に共締めされている(図11(b))。各基板固定部材400が固定ネジ620によって固定されると、アノードパターンAP(図11において不図示)上に基板固定部材400が圧着し、基板固定部材400と固定ネジ620を介してアノードパターンAPとアノード端子600aの電極棒610とが電気的に接続される。同様に、カソードパターンKP(図11において不図示)上に基板固定部材400が圧着し、基板固定部材400と固定ネジ620を介してカソードパターンKPとカソード端子600bの電極棒610とが電気的に接続される。なお、本実施形態においては、一対の基板固定部材400の互いに対向する側面(LED素子110に面する側面)は、Z軸方向に向かって開くように傾斜するテーパー面になっており、その表面には反射ミラー420が形成されている。従って、LED素子110から出射される紫外光のうち、拡がり角の大きい成分が反射ミラー420に入射、反射され、前方(Z軸方向)に向かって導光される。このため、LED素子110から出射される紫外光の利用効率が上がる。 As shown in FIG. 11, the light irradiation device 8 of this embodiment includes a pair of substrate fixing members arranged on the substrate 105 of each LED module 100 so as to sandwich the LED elements 110 on the substrate 105 from the Y-axis direction. The light irradiation device 5 is different from the light irradiation device 5 of the fifth embodiment in that it includes the light irradiation device 400. The board fixing member 400 is a metal rectangular plate-shaped member having a through hole 410 approximately in the center, and is arranged so that the through hole 410 communicates with the through hole 120 of the board 105. The substrate 105 and the water-cooled heat sink 500 are fastened together by fixing screws 620 inserted into the substrate 105 (FIG. 11(b)). When each substrate fixing member 400 is fixed by the fixing screw 620, the substrate fixing member 400 is crimped onto the anode pattern AP (not shown in FIG. 11), and the anode pattern AP is connected to the anode pattern AP via the substrate fixing member 400 and the fixing screw 620. The electrode rod 610 of the anode terminal 600a is electrically connected. Similarly, the substrate fixing member 400 is crimped onto the cathode pattern KP (not shown in FIG. 11), and the cathode pattern KP and the electrode rod 610 of the cathode terminal 600b are electrically connected via the substrate fixing member 400 and fixing screws 620. Connected. In this embodiment, the mutually opposing side surfaces (side surfaces facing the LED element 110) of the pair of substrate fixing members 400 are tapered surfaces that are inclined to open toward the Z-axis direction. A reflecting mirror 420 is formed in the. Therefore, of the ultraviolet light emitted from the LED element 110, a component with a large divergence angle is incident on the reflection mirror 420, reflected, and guided forward (in the Z-axis direction). Therefore, the utilization efficiency of the ultraviolet light emitted from the LED element 110 increases.

このように、本実施形態においても、LEDモジュール100の交換が必要となった場合、固定ネジ620を取り外してLEDモジュール100を交換するだけの作業となるため、簡単な作業でLEDモジュール100を交換することが可能となる。 In this way, in this embodiment as well, when it becomes necessary to replace the LED module 100, the task is simply to remove the fixing screw 620 and replace the LED module 100, so the LED module 100 can be replaced with a simple task. It becomes possible to do so.

なお、今回開示された実施の形態は、全ての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は、上記した説明ではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。 It should be noted that the embodiments disclosed herein are illustrative in all respects and should not be considered restrictive. The scope of the present invention is indicated by the claims rather than the above description, and it is intended that all changes within the meaning and range equivalent to the claims are included.

1 :光照射装置
2 :光照射装置
3 :光照射装置
4 :光照射装置
5 :光照射装置
6 :光照射装置
7 :光照射装置
8 :光照射装置
10 :回路基板固定構造
20 :回路基板固定構造
30 :回路基板固定構造
40 :回路基板固定構造
50 :回路基板固定構造
60 :回路基板固定構造
70 :回路基板固定構造
80 :回路基板固定構造
100 :LEDモジュール
105 :基板
110 :LED素子
120 :貫通孔
200 :ヒートシンク
210 :ベース部
211 :貫通孔
212 :貫通孔
220 :放熱フィン
222 :貫通孔
223 :切欠部
224 :凹部
226 :開口部
300 :電極部材
300a :アノード端子
300b :カソード端子
310 :電極棒
310a :ネジ穴部
320 :固定ネジ
321 :ネジ部
330 :絶縁スリーブ
330a :先端部
330b :基端部
330c :段差部
332 :突起部
340 :圧縮バネ
400 :基板固定部材
410 :貫通孔
420 :反射ミラー
500 :水冷ヒートシンク
511 :貫通孔
550 :水路
552 :給水口
554 :排水口
600 :電極部材
600a :アノード端子
600b :カソード端子
610 :電極棒
620 :固定ネジ
621 :ネジ部
630 :絶縁スリーブ
630a :先端部
630b :本体部
630c :後端部
632 :平面部
700 :背面固定板
710 :開口部
1 : Light irradiation device 2 : Light irradiation device 3 : Light irradiation device 4 : Light irradiation device 5 : Light irradiation device 6 : Light irradiation device 7 : Light irradiation device 8 : Light irradiation device 10 : Circuit board fixing structure 20 : Circuit board Fixing structure 30 : Circuit board fixing structure 40 : Circuit board fixing structure 50 : Circuit board fixing structure 60 : Circuit board fixing structure 70 : Circuit board fixing structure 80 : Circuit board fixing structure 100 : LED module 105 : Board 110 : LED element 120 : Through hole 200 : Heat sink 210 : Base part 211 : Through hole 212 : Through hole 220 : Radiation fin 222 : Through hole 223 : Notch part 224 : Recessed part 226 : Opening part 300 : Electrode member 300a : Anode terminal 300b : Cathode terminal 310 : Electrode rod 310a : Screw hole part 320 : Fixing screw 321 : Screw part 330 : Insulating sleeve 330a : Tip part 330b : Base end part 330c : Step part 332 : Projection part 340 : Compression spring 400 : Board fixing member 410 : Through hole 420: Reflection mirror 500: Water-cooled heat sink 511: Through hole 550: Water channel 552: Water supply port 554: Drain port 600: Electrode member 600a: Anode terminal 600b: Cathode terminal 610: Electrode rod 620: Fixing screw 621: Screw part 630: Insulation Sleeve 630a: Tip part 630b: Main body part 630c: Rear end part 632: Plane part 700: Back fixing plate 710: Opening part

Claims (12)

金属の基台の表面に回路基板を固定する回路基板固定構造であって、
前記回路基板に電力を供給するために、前記回路基板の表面に形成された正極パターン及び負極パターンと、
前記正極パターン及び前記負極パターンのそれぞれから前記回路基板を垂直に貫通する一対の第1貫通孔と、
前記各第1貫通孔と連通するように、前記基台の表面から前記基台を垂直に貫通する一対の第2貫通孔と、
前記各第2貫通孔に挿通される一対の電極部材と、
前記回路基板の表面側に取り付けられて前記各電極部材と係合し、前記回路基板を前記基台に固定する一対の固定部材と、
を備え、
前記各電極部材は、
前記第2貫通孔に沿って延びる電極端子と、
前記電極端子の外周を覆うように配置され前記電極端子と前記基台とを絶縁すると共に、前記各電極部材を前記第2貫通孔に対して回転規制する絶縁部材と、を有し、
前記各固定部材と前記各電極部材とが係合したときに、前記正極パターン及び前記負極パターンのそれぞれが、前記各固定部材を介して前記各電極端子と電気的に接続される
ことを特徴とする回路基板固定構造。
A circuit board fixing structure for fixing a circuit board to the surface of a metal base,
a positive electrode pattern and a negative electrode pattern formed on the surface of the circuit board for supplying power to the circuit board;
a pair of first through holes vertically penetrating the circuit board from each of the positive electrode pattern and the negative electrode pattern;
a pair of second through holes that vertically penetrate the base from the surface of the base so as to communicate with the first through holes;
a pair of electrode members inserted into each of the second through holes;
a pair of fixing members that are attached to the front side of the circuit board and engage with each of the electrode members to fix the circuit board to the base;
Equipped with
Each of the electrode members is
an electrode terminal extending along the second through hole;
an insulating member arranged to cover the outer periphery of the electrode terminal to insulate the electrode terminal and the base and to restrict rotation of each of the electrode members with respect to the second through hole;
When each of the fixing members and each of the electrode members are engaged, each of the positive electrode pattern and the negative electrode pattern is electrically connected to each of the electrode terminals via each of the fixing members. Circuit board fixing structure.
前記絶縁部材の外形の少なくとも一部に、前記第2貫通孔の中心軸に平行な平面部が形成されており、前記平面部が前記第2貫通孔に係合していることを特徴とする請求項1に記載の回路基板固定構造。 A flat part parallel to the central axis of the second through hole is formed on at least a part of the outer shape of the insulating member, and the flat part engages with the second through hole. The circuit board fixing structure according to claim 1. 前記絶縁部材の外形の少なくとも一部に、前記第2貫通孔の中心軸に対して垂直な方向に突出する突起部を有し、
前記第2貫通孔が前記突起部を収容する収容部を有する
ことを特徴とする請求項1又は請求項2に記載の回路基板固定構造。
The insulating member has a protrusion on at least a part of its outer shape that protrudes in a direction perpendicular to the central axis of the second through hole,
3. The circuit board fixing structure according to claim 1, wherein the second through hole has an accommodating portion that accommodates the protrusion.
前記基台の裏面側に配置され、前記電極端子が貫通する開口を有すると共に、前記絶縁部材の一端面と当接する固定板をさらに備えることを特徴とする請求項1から請求項3のいずれか一項に記載の回路基板固定構造。 Any one of claims 1 to 3, further comprising a fixing plate disposed on the back side of the base, having an opening through which the electrode terminal passes, and abutting one end surface of the insulating member. The circuit board fixing structure according to item 1. 前記基台の裏面側に配置され、前記電極端子が貫通すると共に、前記絶縁部材の一部と嵌合する開口を有する固定板をさらに備えることを特徴とする請求項1から請求項3のいずれか一項に記載の回路基板固定構造。 Any one of claims 1 to 3, further comprising a fixing plate disposed on the back side of the base, having an opening through which the electrode terminal passes and which fits into a part of the insulating member. The circuit board fixing structure according to item (1). 前記各電極部材は、前記回路基板に対して前記各電極部材が離れるように付勢する付勢部材を有する、ことを特徴とする請求項1から請求項5のいずれか一項に記載の回路基板固定構造。 The circuit according to any one of claims 1 to 5, wherein each of the electrode members has a biasing member that biases each of the electrode members to separate from the circuit board. Board fixed structure. 前記基台は、
表面に前記回路基板の載置面を有し、前記回路基板と略平行な板状のベース部と、
前記ベース部の裏面から略垂直に起立し、互いに平行に延設された複数の放熱フィンと、を有し、
前記各第2貫通孔は、
前記ベース部を貫通する第3貫通孔と、
前記第3貫通孔と連通するように、前記複数の放熱フィンの一部が前記基台と垂直な方向に切欠かれて形成された第4貫通孔と、から構成される
ことを特徴とする請求項1から請求項6のいずれか一項に記載の回路基板固定構造。
The base is
a plate-shaped base portion having a surface on which the circuit board is placed and substantially parallel to the circuit board;
a plurality of heat dissipation fins that stand up substantially perpendicularly from the back surface of the base portion and extend parallel to each other;
Each of the second through holes is
a third through hole passing through the base portion;
A fourth through hole is formed by cutting out a part of the plurality of radiation fins in a direction perpendicular to the base so as to communicate with the third through hole. The circuit board fixing structure according to any one of claims 1 to 6.
前記基台は、冷媒が流れる流路を内部に有する、ことを特徴とする請求項1から請求項6のいずれか一項に記載の回路基板固定構造。 The circuit board fixing structure according to any one of claims 1 to 6, wherein the base has a channel therein through which a coolant flows. 請求項1から請求項8のいずれか一項に記載の回路基板固定構造と、
前記回路基板上に配置され、前記正極パターン及び前記負極パターンから電力を供給される複数の発光素子と、
を備えることを特徴とする光照射装置。
The circuit board fixing structure according to any one of claims 1 to 8,
a plurality of light emitting elements arranged on the circuit board and supplied with power from the positive electrode pattern and the negative electrode pattern;
A light irradiation device comprising:
前記正極パターン上及び前記負極パターン上にそれぞれ配置され、前記各固定部材によって前記回路基板と共に共締めされる一対の機能部材をさらに備えることを特徴とする請求項9に記載の光照射装置。 The light irradiation device according to claim 9, further comprising a pair of functional members disposed on the positive electrode pattern and the negative electrode pattern, respectively, and fastened together with the circuit board by the respective fixing members. 前記一対の機能部材が、前記複数の発光素子から出射される光の一部を反射するミラー面を有することを特徴とする請求項10に記載の光照射装置。 The light irradiation device according to claim 10, wherein the pair of functional members has a mirror surface that reflects a portion of the light emitted from the plurality of light emitting elements. 前記発光素子から出射される光が、紫外域の波長の光であることを特徴とする請求項9から請求項11のいずれか一項に記載の光照射装置。 12. The light irradiation device according to claim 9, wherein the light emitted from the light emitting element has a wavelength in the ultraviolet region.
JP2022044767A 2022-03-19 2022-03-19 Circuit board fixing structure and light irradiation device Pending JP2023138198A (en)

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