JP2023135468A - Component mounting method and component mounting device - Google Patents

Abstract

To shorten the acquisition time of the data for movement correction of a mounting head, while securing mounting position accuracy.SOLUTION: A component mounting method includes an observation point imaging process (S5), deviation amount calculation processes (S9 and S11) for calculating the positional deviation amount of a mounting head 251, and a component mounting processing process for executing component mounting processing. In the observation point imaging process, an observation point 62 in a set area Ar1, an observation point 62 in a first row, and an observation point 62 in a first column are imaged. In the component mounting processing process, when a target mounting position is a first area corresponding to a specific area, the movement amount of the mounting head 251 is corrected on the basis of the positional deviation amount calculated from the image of the observation point 62 of the specific area and when a second area is further included, for the second area, the movement amount is corrected on the basis of the positional deviation amount calculated from the respective images of the observation point 62 in the first row and the observation point 62 in the first column.SELECTED DRAWING: Figure 4

Description

The present invention relates to a component mounting method and a component mounting apparatus in a component mounting apparatus that transports and mounts (mounts) components on a board.

2. Description of the Related Art A component mounting apparatus is known that uses a mounting head to transport components and mount them on a board. The mounting head is operated by an XY drive mechanism and moves horizontally on the XY plane. The positional accuracy when the mounting head moves is affected by drive errors of the XY drive mechanism, thermal deformation of the components of the XY drive mechanism, deterioration over time, and the like. In order to maintain a high level of component mounting accuracy, it is essential to correct the movement errors of the mounting head caused by these, and various techniques have been proposed in view of this problem.

For example, Patent Document 1 discloses a method of correcting movement errors of a mounting head using a jig substrate on which a plurality of marks (observation points) are attached in a grid pattern. In this method, a camera that moves together with the mounting head captures images of all the marks on the jig board placed at the work position, and measures the amount of deviation of each mark on the image (in other words, the amount of deviation of the mounting head at the position of each mark). ) is checked in advance, and the movement error of the mounting head is corrected based on the data on the amount of deviation (referred to as deviation data).

In addition, as a similar method, Patent Document 2 discloses that the mounting head is moved by imaging one row of marks arranged in the X direction and one row of marks arranged in the Y direction among the plurality of marks on the jig board. A method for correcting the error is disclosed. In this method, the deviation data for the remaining marks is generated by combining the deviation data of one line of marks in the X direction and the deviation data of one column of marks in the Y direction, and the deviation data is combined with the deviation data of the remaining marks. Based on this, the movement error of the mounting head is corrected.

Japanese Patent Application Publication No. 2012-146907 Japanese Patent Application Publication No. 2001-244696

According to the method of Patent Document 1, the movement of the mounting head is corrected based on the deviation data of all the marks actually imaged, so that the deviation of the mark corresponding to the target mounting position of the component or the mark at a position closer to the target mounting position is corrected. The data can be used to accurately correct movement errors of the mounting head. Therefore, it is advantageous in ensuring the accuracy of the component mounting position. However, since it is necessary to image all the marks on the jig substrate, the number of marks to be imaged is large, and it takes time to acquire the displacement data. Furthermore, the memory capacity required to store the data cannot be ignored.

On the other hand, according to the method of Patent Document 2, since the number of marks to be imaged is small, compared to the method of Patent Document 1, the time required to acquire shift data can be shortened, and the amount of memory used can also be reduced. However, since the movement error of the mounting head is corrected based on the data generated by the combination of the mark deviation data for one line in the X direction and the mark deviation data for one row in the Y direction, the mounting accuracy is pursued. This may be disadvantageous.

The present invention has been made in view of the above circumstances, and provides a technology that can shorten the acquisition time of data for correcting the movement of the mounting head while ensuring the required component mounting position accuracy. The purpose is to

In order to solve the above problems, a component mounting method according to one aspect of the present invention uses a mounting head movable along the A method for mounting components in a component mounting apparatus that performs component mounting processing for mounting components on top, in which a plurality of dot-shaped observation points are provided in a grid pattern, with rows arranged in the X direction and columns arranged in the Y direction. a jig board preparation step of arranging the jig board at the working position; an observation point imaging step of imaging the observation point of the jig board by a camera that moves together with the mounting head; a deviation amount calculation step of calculating the amount of positional deviation of the mounting head at each observation point from an image of the observation point, and correcting the amount of movement of the mounting head in the X and Y directions based on the amount of positional deviation and executing the component mounting process. and a component mounting process. In the observation point imaging step, of the plurality of observation points provided on the jig board, observation points in a specific area, observation points in a predetermined row, and observation points in a predetermined column are imaged. , in the component mounting processing step, when the target area of the component mounting processing is a first area corresponding to the specific area, the positional deviation amount calculated from the image of each observation point in the specific area; If the amount of movement of the mounting head is corrected based on the amount of movement of the mounting head and a second area is included in addition to the first area, for the second area, the observation point in the predetermined row and the observation point in the predetermined column are corrected. The amount of movement of the mounting head is corrected based on the amount of positional deviation calculated from each of the images.

According to this method, the observation points to be imaged in the observation point imaging step are the observation points in the setting area, the observation points in one predetermined row, and the observation points in one predetermined column among all the observation points on the jig board. It is an observation point. Therefore, the processing time for the observation point imaging process and the deviation amount calculation process is reduced compared to the case where all observation points on the jig board are imaged.

Then, for the component mounting process in the area (first area) corresponding to a specific area on the board, the amount of positional deviation of all observation points in the specific area, that is, the position calculated based on the image of the observation point actually captured. Since the amount of movement of the mounting head is corrected based on the amount of deviation, relatively high mounting accuracy is achieved. In addition, for areas other than the specific area (second area) on the board, based on the positional deviation amount calculated from the image of each of the observation points for one predetermined row and the observation points for one predetermined column. The amount of movement of the mounting head is corrected. Therefore, by setting the specific area based on the size of the board, the required mounting accuracy, etc., while ensuring the required component mounting position accuracy, the acquisition time of the data for correcting the movement of the mounting head, that is, the observation It becomes possible to shorten the time required for the point imaging process and the deviation amount calculation process.

In the above method, for example, when the board includes a high-precision area that requires higher mounting precision than other areas, in the observation point imaging step, the high-precision area of the jig board is Preferably, the observation point is imaged using an area corresponding to the specified area as the specific area.

As described above, for a specific area, the amount of movement of the mounting head is corrected based on the amount of positional deviation calculated based on the actual captured images of all observation points belonging to the area. Therefore, by setting the area corresponding to the high-precision area of the substrate as the specific area, it is possible to achieve desired accuracy in the high-precision area.

On the other hand, the component mounting apparatus according to the present invention includes a mounting head movable along the X-axis and the Y-axis, and the mounting head takes out components from a component supply section and mounts them on a board placed at a working position. A component mounting apparatus that performs component mounting processing, including a camera movable together with the mounting head, and a plurality of dot-shaped observation points arranged in a grid pattern with rows arranged in the X direction and columns arranged in the Y direction. a jig board holding section capable of holding the jig board mounted at the working position; and a control section capable of executing the component mounting process and a mounting preparation process for acquiring data necessary for the component mounting process. . The mounting preparation process includes an observation point imaging process of moving the mounting head and causing the camera to image the observation point of the jig board held by the jig board holding part; and a shift amount calculation process of calculating, as the data, a positional shift amount of the mounting head at each observation point from an image of the observation point. In the observation point imaging process, the control unit selects an observation point in a specific area, an observation point in a predetermined row, and an observation point in a predetermined column among the plurality of observation points provided on the jig board. At the same time, in the component mounting process, when the target area of the component mounting process is a first area corresponding to the specific area, the image is calculated from the image of each observation point in the specific area. If the amount of movement of the mounting head is corrected based on the amount of positional deviation determined and a second area is included in addition to the first area, for the second area, the observation point in the predetermined row and the predetermined The amount of movement of the mounting head is corrected based on the amount of positional deviation calculated from the image of each observation point in the column.

According to the configuration of this component mounting apparatus, it becomes possible to automate and execute component mounting processing based on the above-described component mounting method in the component mounting apparatus.

In this case, the component mounting apparatus further includes a command input unit that receives a command for specifying the specific area, and the control unit selects the observation point based on the specific area specified by the operation of the command input unit. Preferably, the device is configured to execute the imaging process and the component mounting process.

According to this configuration, the specific area can be freely set according to the size of the board and the required mounting accuracy.

Further, in a component mounting method according to another aspect of the present invention, a mounting head movable along the X-axis and the Y-axis takes out components from a component supply section and mounts them on a board placed at a work position. A method for mounting components in a component mounting apparatus that performs component mounting processing, in which a jig board is provided with a plurality of dot-like observation points arranged in a lattice shape, with rows arranged in the X direction and columns arranged in the Y direction. a jig board preparation step in which a jig board is placed at the working position; an observation point imaging step in which the observation point on the jig board is imaged by a camera that moves together with the mounting head; and an image of the observation point taken by the camera. a deviation amount calculation step of calculating the amount of positional deviation of the mounting head at each observation point, and a component mounting process of correcting the amount of movement of the mounting head in the XY direction based on the amount of positional deviation and executing the component mounting process. process. In the observation point imaging step, out of the plurality of observation points provided on the jig board, a plurality of observation points belonging to rows at predetermined intervals and a plurality of observation points belonging to columns at predetermined intervals are imaged. In the component mounting processing step, the amount of movement of the mounting head is corrected based on the shift amount calculated from the image of the observation point taken in the observation point imaging step.

According to this method, the observation points to be imaged in the observation point imaging step are a plurality of observation points belonging to rows at predetermined intervals and a plurality of observation points belonging to columns at predetermined intervals among all observation points on the jig board. It is. Therefore, the processing time for the observation point imaging process and the deviation amount calculation process is reduced compared to the case where all observation points on the jig board are imaged. Furthermore, during the component mounting process, the amount of movement of the mounting head is corrected based on the amount of deviation calculated from the image of the observation point taken in the observation point imaging step. Therefore, it becomes possible to perform component mounting processing on the board with relatively high accuracy.

Therefore, by setting the row and column spacing of the observation points to be imaged in the observation point imaging process based on the size and type of the board, data for correcting the movement of the mounting head can be obtained while ensuring the required component mounting position accuracy. It becomes possible to shorten the acquisition time, that is, the time required for the observation point imaging process and the deviation amount calculation process.

Further, a component mounting apparatus according to another aspect of the present invention includes a mounting head movable along the X-axis and the Y-axis, and the mounting head takes out a component from a component supply section and places it at a working position. A component mounting apparatus that performs a component mounting process on a board, comprising a camera movable together with the mounting head, and a plurality of dot-shaped observation points arranged in rows in the X direction and columns in the Y direction. a jig board holder capable of holding a jig board provided in a grid pattern at the working position; and a control capable of executing the component mounting process and a mounting preparation process for acquiring data necessary for the component mounting process. It is equipped with a section and a section. The mounting preparation process includes an observation point imaging process of moving the mounting head and causing the camera to image the observation point of the jig board held by the jig board holding part; and a shift amount calculation process of calculating, as the data, a positional shift amount of the mounting head at each observation point from an image of the observation point. In the observation point imaging process, the control unit includes a plurality of observation points belonging to columns at predetermined intervals and a plurality of observation points belonging to rows at predetermined intervals among the plurality of observation points provided on the jig board. At the same time, in the component mounting process, the amount of movement of the mounting head is corrected based on the shift amount calculated from the image of the observation point captured in the observation point imaging step.

According to the configuration of this component mounting apparatus, it becomes possible to automate and execute component mounting processing based on the above-described component mounting method in the component mounting apparatus.

In this case, the control unit further includes a command input unit that receives a command for specifying the interval between columns and rows of the observation points to be imaged in the observation point imaging process, and the control unit is configured to receive instructions for specifying intervals between columns and rows of the observation points to be imaged in the observation point imaging process, Preferably, the observation point imaging process and the component mounting process are performed based on the interval.

According to this configuration, the operator can freely set the intervals between the columns and rows of the observation points to be imaged in the observation point imaging process according to the size of the board and the required mounting accuracy.

According to the present invention as described above, it is possible to shorten the acquisition time of data for correcting the movement of the mounting head while ensuring the required component mounting position accuracy.

FIG. 1 is a plan view showing a component mounting apparatus according to the present invention. This is a block showing a control system of the component mounting apparatus. It is a top view of a jig board. FIG. 2 is a flowchart showing control of correction data acquisition processing (first embodiment); FIG. 3 is a flowchart showing control of component mounting processing (first embodiment). FIG. 2 is a schematic plan view of the component mounting apparatus showing an example of setting an imaging area. FIG. 3 is a schematic plan view of a jig board showing an example of setting an imaging area. FIG. 7 is a schematic plan view of the component mounting apparatus showing another example of setting the imaging area. FIG. 7 is a schematic plan view of a jig board showing another example of setting an imaging area. It is a flowchart which shows control (2nd embodiment) of data acquisition processing for correction. 7 is a flowchart showing control of component mounting processing (second embodiment). FIG. 7 is a plan view of the jig board showing observation points to be imaged in correction data acquisition processing. FIG. 2 is a schematic diagram of a main part showing an example of the positional relationship between a target mounting position of a component and an observation point.

Embodiments of the present invention will be described in detail below with reference to the drawings.

[Overall configuration of component mounting apparatus 1]
FIG. 1 is a plan view showing an apparatus main body 2 of a component mounting apparatus 1 according to the present invention. The component mounting device 1 is a device that produces component mounting boards in which components are mounted (mounted) on a substrate P such as a printed wiring board, and includes a device body 2 shown in FIG. 1 and a control section 4 (see FIG. 2). include. In FIG. 1, the directional relationship is shown using XY orthogonal coordinates that are orthogonal to each other on a horizontal plane.

The apparatus main body 2 includes a main body frame 21, a substrate transport mechanism 23, a component supply unit 24, a head unit 25, and a component recognition camera 32 provided on the main body frame 21.

The substrate transport mechanism 23 includes a pair of belt-type conveyors 231 extending in the X direction. The board P is carried from outside the machine to a predetermined working position (the position shown in FIG. 1) by the conveyor 231, subjected to component mounting processing, and then carried out from the working position to the outside of the machine. The board transport mechanism 23 includes a clamp mechanism (not shown), and during component mounting processing, the board P is positioned at a working position by this clamp mechanism.

The interval between the conveyors 231 is configured to be changeable. This makes it possible to transport substrates P of different sizes and to produce component-mounted substrates of different sizes. In this example, the interval between the conveyors 231 is changed by moving the other conveyor 231 in the Y direction based on the conveyor 231 located on one side (lower side in FIG. 1).

The component supply unit 24 is a unit area that supplies components to be mounted on the board P, and is equipped with a plurality of feeders 24F arranged in parallel. The component supply unit 24 is provided at both ends of the main body frame 21 in the Y direction with the substrate transport mechanism 23 interposed therebetween. The feeder 24F is, for example, a tape feeder that supplies chip-shaped parts. The component supply unit 24 may also include a feeder 24F other than the tape feeder, such as a stick feeder or a tray feeder.

The head unit 25 is a tool that picks a component from the feeder 24F of the component supply unit 24, moves it to the work position, and mounts the component on the board P. The head unit 25 is provided movably in the X direction and the Y direction by a head unit drive mechanism 26.

The head unit drive mechanism 26 includes a pair of fixed rails 261 extending in the Y direction fixed to the main body frame 21, a beam 262 extending in the X direction movably supported by these fixed rails 261, and a beam 262 extending in the X direction. A ball screw shaft 264 is screwed onto the beam 262 and rotationally driven by a Y-axis servo motor 263. Further, the head unit drive mechanism 26 includes a fixed rail 272 that is fixed to the beam 262 and supports the head unit 25 movably in the X direction, and a fixed rail 272 that is screwed to the head unit 25 and is rotationally driven by an X-axis servo motor 274. and a ball screw shaft 273. In other words, the head unit drive mechanism 26 uses the X-axis servo motor 274 to move the head unit 25 in the X direction via the ball screw shaft 273, and the Y-axis servo motor 263 to move the beam 262 via the ball screw shaft 264. Move it in the Y direction. With this configuration, the head unit drive mechanism 26 moves the head unit 25 in the X direction and the Y direction within a certain range of space above the main body frame 21. In this example, the fixed rail 272 corresponds to the "X-axis" of the present invention, and the fixed rail 261 corresponds to the "Y-axis" of the present invention.

The head unit 25 includes a plurality of axial mounting heads 251 extending in the vertical direction, and a head drive mechanism 252 (shown in FIG. 4) that drives these mounting heads 251.

The head drive mechanism 252 includes an elevation drive mechanism that raises and lowers each mounting head 251 individually, and a rotation drive mechanism that rotates each mounting head 251 around its central axis (in the R direction). The tip of each mounting head 251 is equipped with a nozzle for picking up components. Negative pressure and positive pressure are selectively supplied to each nozzle. As a result, the mounting head 251 suction-holds the component and releases (mounts) the component onto the board P.

The head unit 25 is further equipped with a board recognition camera 253. The board recognition camera 253 is an integrated illumination camera that integrally includes a camera body equipped with an imaging device such as a CCD or CMOS (Complementary Metal Oxide Semiconductor), and a lighting device such as an LED illumination. The board recognition camera 253 is provided in the head unit 25 facing downward, and moves together with the head unit 25 (mounting head 251) to detect marks on the board P placed at the work position during component mounting processing. Capture images of various marks. Further, the board recognition camera 253 images an observation point 62 written on the jig board 60, which will be described later, during a correction data acquisition process, which will be described later.

The component recognition camera 32 is a camera that images the components suctioned and held by each mounting head 251 of the head unit 25 from below, and like the board recognition camera 253, it includes a camera body equipped with an imaging device such as a CCD or CMOS, This is an integrated lighting camera that is integrated with a lighting device such as an LED lighting. The component recognition cameras 32 are disposed between the board transport mechanism 23 and each component supply unit 24 and at the center of the component supply unit 24 in the X direction, facing upward.

In the component mounting apparatus 1 described above, when the board P is carried into the work position along the conveyor 231, the head unit 25 reciprocates between the component supply unit 24 and the board P placed at the work position. The components are taken out from the feeder 24F and mounted (mounted) on a predetermined position on the board P. At this time, the suction state of the components suctioned by each mounting head 251 is imaged by the component recognition camera 32, and the amount of movement of the head unit 25 is corrected based on the recognition result. When all the components have been mounted on the board P, the board P is carried out from the working position, and the next board P is carried into the working position. A component mounting board is produced by repeating the operations of each part as described above.

[Control system of component mounting apparatus 1]
FIG. 2 is a block diagram showing a control system of the component mounting apparatus 1. As shown in FIG. The component mounting apparatus 1 includes the control section 4 as described above, as well as a display section 50 that displays various information regarding component mounting processing, etc., and an input section 51 (according to the present invention) that receives input operations for various commands to the control section 4. (corresponding to a "command input section").

The control unit 4 includes a CPU, ROM, RAM, peripheral circuits, and the like. The control unit 4 controls the operation of each component of the device body 2 by the CPU executing a control program stored in the ROM. The control section 4 includes a mounting control section 41, a transport control section 42, a component supply control section 43, an imaging control section 44, a data calculation section 45, a storage section 46, a display control section 47, etc. as main functional components.

The mounting control unit 41 comprehensively controls the operation of the component mounting process by the apparatus main body 2, mainly the operation of the head unit drive mechanism 26 and the head drive mechanism 252, and also executes various calculation processes associated with the control. Moreover, the mounting control unit 41 controls the operation of the correction data acquisition process separately from the component mounting process. The correction data acquisition process (corresponding to the "mounting preparation process" of the present invention) is a process for acquiring data for correcting movement errors of the head unit 25, and is a process for acquiring data for correcting movement errors of the head unit 25. This process calculates the movement error (displacement amount) of the head unit 25 by capturing an image of the observation point 62 provided on the substrate 60 with the substrate recognition camera 253. The correction data acquisition process will be described later. This correction data acquisition process is executed before the component mounting apparatus 1 starts operating (before the production of component mounting boards starts) or during regular maintenance.

The conveyance control unit 42 controls the conveyance operation of the substrate P by the substrate conveyance mechanism 23 (conveyor 231). The component supply control unit 43 controls component supply processing of each of the plurality of feeders 24F arranged in the component supply unit 24.

The imaging control unit 44 controls imaging operations by the board recognition camera 253 and the component recognition camera 32. The imaging control unit 44 also includes an image processing unit 44a, and generates a digital image of the mark on the board P and the observation point 62 on the jig board 60 based on the image signal output from the board recognition camera 253. , generates a digital image of the component based on the image signal output from the component recognition camera 32.

The data calculation unit 45 calculates the amount of suction deviation of the component with respect to the mounting head 251 based on the image (digital image) captured by the component recognition camera 32 during the component mounting process, and further calculates the amount of suction deviation of the component with respect to the mounting head 251. The movement correction amount of the head unit 25 is calculated. In addition, in the correction data acquisition process, the data calculation unit 45 calculates the movement error of the head unit 25 (mounting head 251) at the position of the observation point 62, based on the image of the observation point 62 described later taken by the board recognition camera 253. At the same time, the movement correction amount of the head unit 25 for correcting the movement error is also calculated.

The storage unit 46 stores various programs executed in component mounting processing and correction data acquisition processing, and various data referred to when executing the programs. Data such as the movement correction amount calculated by the data calculation section 45 is stored in the storage section 46 in an updated manner.

The display control unit 47 controls the display by the display unit 50 to display various information and images according to the status of the component mounting process, as well as various information and images in the correction data acquisition process. Note that the display section 50 is composed of a liquid crystal display device, etc., and the input section 51 is composed of a keyboard, a mouse, etc. Further, the display section 50 and the input section 51 may be integrally configured like a touch panel.

[Correction data acquisition processing and component mounting processing (first embodiment)]
Next, a first embodiment of correction data acquisition processing and component mounting processing will be described using FIGS. 3 to 7.

The head unit 25 (mounting head 251) has an inherent movement error on the XY coordinate axes due to the dimensional accuracy of the components of the head unit drive mechanism 26. It is important to investigate this inherent movement error in advance and correct it during the component mounting process in order to improve component mounting accuracy. The correction data acquisition process is a process of checking the inherent movement error of the head unit 25 and finding a movement correction amount for correcting the movement error.

A jig board 60 as shown in FIG. 3 is used in the correction data acquisition process. FIG. 3 is a plan view showing the jig board 60. The jig board 60 is a metal or resin board that is rectangular in plan view and has the same size as the maximum size board P that can be placed in the work area of the head unit 25, that is, the maximum size that allows component mounting processing. Note that the work area is a movable range of the head unit 25 (mounting head 251).

For example, the jig board 60 is supported by the conveyor 231 and positioned at a working position by a clamp mechanism, thereby being disposed within the working area. That is, the substrate transport mechanism 23 corresponds to the "jig substrate holding section" of the present invention.

A plurality of dot-shaped observation points 62 are provided on the upper surface of the jig substrate 60, arranged in a grid pattern at regular intervals in the X and Y directions. In this example, the jig board 60 is a rectangle that is slightly elongated in the X direction, and has a plurality of observation points arranged in rows in the X direction and columns in the Y direction, with N rows in the Y direction and M columns in the X direction. 62 are provided.

FIG. 4 is a flowchart showing control of the correction data acquisition process by the control unit 4. The control shown in this flowchart is started when the operator inputs a start command to the control unit 4 by operating the input unit 51 after the jig board 60 is set at the working position. Note that when the correction data acquisition process is executed, the interval between the conveyors 231 is changed to an interval corresponding to the maximum size substrate P. This allows the jig board 60 to be set at the working position.

First, the control unit 4 controls the display unit 50 to display a setting request screen for the imaging area Ar1 (step S1). The imaging area Ar1 is an area of the observation point 62 that is imaged by the board recognition camera 253 (corresponding to the "specific area" of the present invention), and is an area where the operator is set.

FIG. 6 is a schematic plan view of the component mounting apparatus 1 showing an example of setting the imaging area Ar1. In FIG. The shape and size of the jig board 60 are the same as this board P2. On the other hand, the symbol P1 indicates a board of a general size that requires highly accurate component mounting. For example, if a component mounting board of the same size as the board P1 is normally produced, and the largest size component mounting board (board P2) is rarely produced, the operator may The area corresponding to the image can be set as the imaging area Ar1. Note that FIG. 7 is a schematic plan view of the jig board 60 showing an example of setting the imaging area Ar1.

Note that when the display section 50 and the input section 51 are configured with touch panels, the control section 4 causes the display section 50 to display an image of the jig board 60. The operator can set the imaging area Ar1 by tracing the outline of the area corresponding to the board P1 in the image of the jig board displayed on the display unit 50 with a fingertip, a touch pen, or the like.

Next, it is determined whether the imaging area Ar1 has been set (step S3), and if Yes, the control unit 4 moves the head unit 25 to locate the observation point 62 on the jig board 60. Among them, the observation points 62 in the imaging area Ar1 (hereinafter sometimes referred to as setting area Ar1) set in step S3, and all observation points 62 in the first row (observation points 62 in area Ar2 in FIG. 7). , all observation points 62 in the first row (observation points 62 in area Ar3 in FIG. 7) are imaged by the board recognition camera 253 (step S5).

Note that all the observation points 62 in the first row and all the observation points 62 in the first column are imaged regardless of the range of the imaging area Ar1 set in step S3. In this case, the control unit 4 calculates an optimal route that can image the observation point 62 most efficiently (in a short time) based on the arrangement of the target observation point 62, and moves the head unit 25 along the route. let The optimal route is calculated by the data calculation unit 45. In addition, if the observation point 62 in the set area Ar1 and the observation point 62 in the first row and first column (the observation points 62 in areas Ar2 and Ar3) overlap, the optimal Only the observation points 62 that are more advantageous from the viewpoint of the route are imaged. The same applies to the overlapping observation points 62 in the first row and first column (each being the first observation point 62).

Next, it is determined whether all imaging of the target observation point 62 has been completed (step S7). If the determination is Yes here, the control unit 4 calculates the position correction amount of the head unit 25 at all observation points 62 within the setting area Ar1 (step S9).

Specifically, the control unit 4 detects an error (positional shift) between the position of the image of the observation point 62 in the imaging area Ar1 actually captured by the board recognition camera 253 and its designed position (for example, the center of the imaging field of view). In addition, the correction amount Δnm (ΔXnm, ΔYnm) is calculated. Note that "nm" is a number that specifies the observation point 62, "n" is a row number in FIG. 3, and "m" is a column number. The control unit 4 calculates this correction amount Δnm for all observation points 62 within the setting area Ar1 that are actually imaged by the board recognition camera 253.

Next, the control unit 4 calculates the amount of position correction of the head unit 25 at the observation point 62 in the remaining area Ar0 (sometimes referred to as non-setting area Ar0) excluding the set area Ar1.

(Step S11)
Specifically, the control unit 4 calculates the error (positional deviation amount) between the position of the image of the observation point 62 in the first row captured in the process of step S5 and its designed position, and calculates the correction amount Δ1m. (ΔX1m, ΔY1m) is calculated. This correction amount Δ1m is calculated for all observation points 62 in the first row that were actually imaged by the board recognition camera 253. That is, the correction amount Δ1m (ΔX1m, ΔY1m) of the head unit 25 at each observation point 62 in the first row is calculated.

Further, the control unit 4 calculates the error (positional deviation amount) between the position of the image of the observation point 62 in the first row captured in the process of step S5 and its designed position, and also calculates the correction amount Δn1 (ΔXn1 , ΔYn1). This correction amount Δn1 is calculated for all the observation points 62 in the first row that were actually imaged by the board recognition camera 253. That is, the correction amount Δn1 (ΔXn1, ΔYn1) of the head unit 25 at each observation point 62 in the first row is calculated.

Then, the control unit 4 adjusts the setting to be outside the setting by combining the correction amount Δ1m (ΔX1m, ΔY1m) of each observation point 62 in the first row and the correction amount Δn1 (ΔXn1, ΔYn1) of each observation point 62 in the first column. A correction amount Δnm (ΔXnm, ΔYnm) for each observation point 62 in area Ar0 is calculated. That is, the control unit 4 calculates the correction amount Δnm (ΔXnm, ΔYnm) of the head unit 25 at the observation point 62 located in the n-th row and m-th column of the non-setting area Ar0 using the following equations 1 and 2.

ΔXnm=ΔX1m+ΔXn1...(1)
ΔYnm=ΔY1m+ΔYn1...(2)
Note that when the observation points 62 in the setting area Ar1 and the observation points 62 in the first row and first column overlap with each other, the correction amounts Δnm at the overlapping observation points 62 are the same. Therefore, in the process of step S11 for the overlapping observation points 62, the control unit 4 applies the same value as the correction amount Δnm obtained in the process of step S9 to the correction amount of the observation points 62 in the first row and first column. Let it be Δnm.

When the calculation of the correction amount Δnm described above is completed, the control unit 4 stores the data of the correction amount Δnm calculated in steps S9 and S11 (hereinafter sometimes referred to as correction data) in the storage unit 46. , the correction data acquisition process ends. In the following explanation, the data of the correction amount Δnm in the setting area Ar1 obtained based on the process of step S9 will be referred to as "correction data within the setting area", and the data of the correction amount Δnm in the setting area Ar1 obtained based on the process of step S11 will be referred to as "correction data within the setting area". The data of the correction amount Δnm may be referred to as "outside setting area correction data".

Next, control of component mounting processing by the control unit 4 will be explained. FIG. 5 is a flowchart showing control of component mounting processing by the control unit 4. As shown in FIG.

When the component mounting process is started, the control unit 4 first determines for each component to be mounted on the board P whether or not the target mounting position of the component is within the setting area Ar1 (step S21). More precisely, it is determined whether the target mounting position of the component is within the area of the board P that corresponds to the setting area Ar1 (corresponding to the "first area" of the present invention). If the determination is Yes here, the control unit 4 refers to the in-area correction data among the correction data stored in the storage unit 46, and executes the component mounting process based on this in-area correction data ( Step S23).

Specifically, the control unit 4 determines whether the target mounting position of the component matches the position of any observation point 62 within the setting area Ar1, and if it is determined that the target mounting position matches the position of any observation point 62 within the area Ar1. Among the correction data, the correction data at the observation point 62 is referred to, and the moving operation of the head unit 25 is controlled based on this correction data and the target mounting position.

If it is determined that the target mounting position of the component does not match any of the observation points 62 within the setting area Ar1, the control unit 4 selects one or more observation points closest to the target mounting position from among the correction data within the area. The correction data at point 62 is referred to, and the moving operation of the head unit 25 is controlled based on this correction data and the target mounting position.

On the other hand, if it is determined No in the process of step S21, that is, if it is determined that the target mounting position of the component is in the non-setting area Ar0 (corresponding to the "second area" of the present invention), the control unit 4 Among the correction data stored in the storage unit 46, the out-of-area correction data is referred to, and the component mounting process is executed based on this out-of-area correction data (step S27).

Specifically, the control unit 4 determines whether the target mounting position of the component matches the position of any observation point 62 in the outside area Ar0, and if it is determined that the target mounting position matches the position of any observation point 62 in the outside area Ar0, Among the correction data, the correction data at the observation point 62 is referred to, and the moving operation of the head unit 25 is controlled based on this correction data and the target mounting position.

If it is determined that the target mounting position of the component does not match any of the observation points 62 in the outside-of-setting area Ar0, the control unit 4 selects one or more observation points closest to the target mounting position among the out-of-area correction data. The correction data at point 62 is referred to, and the moving operation of the head unit 25 is controlled based on this correction data and the target mounting position.

In addition, in the processes of steps S23 and S27, the control unit 4 also executes a process of recognizing the suction state of the component based on the image captured by the component recognition camera 32, and if there is a suction deviation of the component, this process is performed. A position correction amount is calculated so that the suction deviation is eliminated, and further, the moving operation of the head unit 25 is controlled based on this correction amount.

When the component mounting process is completed, the control unit 4 determines whether the component mounting process for all components on the board P has been completed (step S25), and if the determination is No here, the control unit 4 Then, the process returns to step S21, and the processes of steps S21 to S24 are repeated. When it is finally determined that the component mounting process for all components has been completed (Yes in step S25), the control unit 4 ends the control of this flowchart.

In this example, the process of setting the jig board 60 at the working position corresponds to the "jig board preparation process" of the present invention. Further, the processes in steps S5 and S7 in FIG. 4 correspond to the "observation point imaging process" of the present invention, and the processes in steps S9 to S11 correspond to the "deviation amount calculation process" in the present invention, and the processes in FIG. The processing of steps S21 to S27 corresponds to the "component mounting processing" of the present invention.

[Effect]
According to the component mounting apparatus 1 described above, the observation points 62 to be imaged in advance in the correction data acquisition process are set by the operator among all the observation points 62 on the jig board 60, as shown in FIG. These are the observation points 62 in area Ar1, all the observation points 62 in the first row (area Ar2), and all the observation points 62 in the first column (area Ar3) (step S5), and the other observation points 62 are not imaged. . Therefore, compared to the case where all the observation points 62 on the jig board 60 are imaged, the time required to image the observation points 62 is shortened.

Moreover, the setting area Ar1 described above corresponds to a board P of a general size that requires high-precision component mounting, and all observation points 62 are actually imaged in this setting area Ar1 (step S5 ), correction data is calculated for each observation point 62 (step S9). When the target mounting position of the component is within the setting area Ar1, the moving operation of the head unit 25 is controlled based on the correction data for each observation point 62 that is actually imaged (correction data within the setting area). (Step S23). As a result, highly accurate component mounting processing based on the correction data within the setting area can be performed on the board P having a size corresponding to the setting area Ar1.

Therefore, according to the component mounting apparatus 1 described above, it is possible to reasonably shorten the time required for the correction data acquisition process of the head unit 25 (mounting head 251) while ensuring the required component mounting position accuracy. It becomes possible.

In addition, when a component mounting board with a size larger than the setting area Ar1 is produced, an area other than the area corresponding to the setting area Ar1 (outside setting area Ar0) of the board P is filled with outside setting area correction data. The moving operation of the head unit 25 is controlled based on this (step S27). The out-of-setting area correction data is based on the correction amount Δnm at the observation point 62 that is not actually imaged, the correction amount Δ1m (ΔX1m, ΔY1m) for each observation point 62 in the first row that was actually imaged, and each of the points in the first column. This is data approximated by a combination with the correction amount Δn1 (ΔXn1, ΔYn1) of the observation point 62. Therefore, it is possible to perform the component mounting process without any problem even in areas other than the area corresponding to the setting area Ar1.

In the embodiments described above, the case where the area corresponding to the component mounting board (board P1) which is the main production target is set as the imaging area Ar1 has been described. That is, for the substrate P1, the moving operation of the head unit 25 is controlled based on the correction data within the setting area (step S25), and in the case of a substrate larger than the substrate P1 (for example, the largest size substrate P2), Regarding the area other than the area corresponding to the setting area Ar1 on the board P2 (outside setting area Ar0), an example has been described in which the moving operation of the head unit 25 is controlled based on the outside setting area correction data (step S27).

However, as an operational example of the component mounting apparatus 1, an imaging area Ar1 may be set as shown in FIGS. 8 and 9, for example. FIG. 8 is a schematic plan view of the component mounting apparatus 1 showing another example of setting the imaging area Ar1, and FIG. 9 is a schematic plan view of the jig board 60 showing another example of setting the imaging area Ar1.

For example, as shown in FIG. 8, a board P (same size as the largest board P2) has areas Pa1, Pa2 (same size as the largest board P2) in which parts mounting precision is required compared to other areas Pa3. In the case of including high-precision areas (referred to as high-precision areas Pa1 and Pa2), as shown in FIG. 9, areas of the jig board 60 corresponding to high-precision areas Pa1 and Pa2 can be set as imaging areas Ar1, respectively.

In this way, for the component mounting process in the high-precision areas Pa1 and Pa2 of the board P, the moving operation of the head unit 25 is controlled based on the correction data within the set area (step S23), , for component mounting processing in areas Pa3 other than Pa2, the moving operation of the head unit 25 is controlled based on the out-of-setting-area correction data (step S25). Therefore, it is possible to reasonably shorten the time required for the correction data acquisition process while ensuring the required component mounting accuracy in each of the areas Pa1 to Pa3 of the board P.

[Correction data acquisition processing and component mounting processing (second embodiment)]
Next, a second embodiment of correction data acquisition processing and component mounting processing will be described using FIGS. 10 to 13.

FIG. 10 is a flowchart showing control of the correction data acquisition process by the control unit 4. The control shown in this flowchart is also started when the operator inputs a start command to the control unit 4 by operating the input unit 51 after the jig board 60 is set at the working position.

First, the control unit 4 moves the head unit 25 to detect all the observation points 62 belonging to a preset specific row (specific row) among the observation points 62 on the jig board 60 using the board recognition camera 253. (Step S41). Specifically, as shown in FIG. 12, the control unit 4 controls each row at two-row intervals (every three rows) from the first row, that is, the first row, the fourth row, the seventh row...the As-th row. The observation points 62 in each row [As=1+(s-1)×3; s is an integer of 1 or more] are imaged. In the example shown in FIG. 12, the jig substrate 60 is provided with a total of 500 observation points 62 arranged in 20 rows and 25 columns.

Next, it is determined whether the imaging of the observation point 62 belonging to the specific row has been completed (step S43), and if the determination is Yes, the control unit 4 further moves the head unit 25, Among the observation points 62 on the jig board 60, all the observation points 62 belonging to a preset specific column (specific column) are imaged by the board recognition camera 253 (step S45). Specifically, as shown in FIG. 12, the control unit 4 controls each column at two column intervals (every three columns) from the first column, that is, the first column, the fourth column, the seventh column...the Ar column. The observation points 62 in each column [Ar=1+(r-1)×3; r is an integer of 1 or more] are imaged.

In addition, in the processing of steps S41 and S45, the control unit 4 calculates an optimal route that can image the observation point 62 most efficiently (in a short time) based on the arrangement of the target observation point 62, and follows that route. The head unit 25 is moved along the line. The optimal route is calculated by the data calculation unit 45. Furthermore, for observation points 62 that overlap with each other in each row and each column (observation points 62 at intersections between columns and rows), only one of the observation points 62 is imaged. As a result, as shown in FIG. 12, of the observation points 62 on the jig board 60, only the observation points 62 in the specific row and the specific column (observation points 62 indicated by black circles in FIG. 12) are imaged.

Next, the control unit 4 determines whether or not the imaging of the observation point 62 belonging to the specific column has been completed (step S47), and if the determination is Yes here, the observation point 62 that belongs to the specific column has been captured. The positional correction amount of the head unit 25 at each observation point 62 is calculated based on the image of the point 62 (step S49). Specifically, the control unit 4 calculates the correction amount Δnm (ΔXnm, ΔYnm) at each observation point 62 in the same manner as in step S9 (FIG. 4) of the correction data acquisition process of the first embodiment. .

When the calculation of the correction amount Δnm is completed, the control unit 4 stores the data of the correction amount Δnm calculated in the process of step S49 (hereinafter sometimes referred to as correction data) in the storage unit 46, and acquires the correction data. Finish the process.

Next, control of component mounting processing by the control unit 4 will be explained. FIG. 11 is a flowchart showing control of component mounting processing by the control unit 4. As shown in FIG.

When the component mounting process is started, the control unit 4 first checks for each component to be mounted on the board P whether or not the target mounting position of the component is on a line in a specific row or column. It is determined whether or not the target mounting position is located at a position of P that corresponds to a grid-like line connecting the observation points 62 imaged in steps S41 and S45 in FIG. 10 (step S61).

If the determination is Yes here, the control unit 4 moves the process to step S65 and calculates the position correction amount at the target mounting position. For example, if the target mounting position of the component matches the position of the observation point 62 imaged in steps S41 and S45 in FIG. The correction data corresponding to the observation point 62 is used as the correction data for the head unit 25 at the target mounting position. On the other hand, if the target mounting position of the component does not match the position of the observation point 62 imaged in steps S41 and S45 of FIG. The positional correction amount of the head unit 25 at the target mounting position is calculated based on the correction data corresponding to one or more observation points 62 closest to the target mounting position among the correction data corresponding to each observation point 62 in the target mounting position. .

On the other hand, if it is determined No in the process of step S61, that is, if it is determined that the target mounting position of the component is not on the line of the specific column or the specific row, the control unit 4 selects one of the lines of the specific column or specific row. Rows and columns of observation points 62 surrounding the target mounting position of the component are selected.

FIG. 13 is a schematic diagram showing an example of the positional relationship between the target mounting position of the component and the observation point 62. FIG. 13 shows that the target mounting position of component C is in the fourth row, seventh row, and seventh column among the rows and columns of observation points 62 (see FIG. 12) imaged in steps S41 and S45 in FIG. and the 10th column. In such a case, the control unit 4 selects the fourth row, the seventh row, the seventh column, and the tenth column in the process of step S63, and then moves the process to step S65. Note that when the target mounting position of the component C is an end or a corner of the board P, the number of rows and columns of observation points 62 surrounding the target position may be three or two.

In the process of step S65 after passing through the process of step S63, the control unit 4 first performs the observation that belongs to the row and column (4th and 7th rows, 7th and 10th columns) selected in step S63. Among the points 62, one or more observation points 62 closest to the target mounting position of the component C are specified. Then, based on the correction data corresponding to the observation point 62 among the correction data stored in the storage unit 46, the position correction amount of the head unit 25 at the target mounting position of the component C is calculated. For example, as shown in FIG. 13, when the target mounting position of component C is at the observation point 62 in the fifth row and eighth column, the control unit 4 performs the process in step S11 in FIG. 4 of the first embodiment. According to (Equations 1 and 2), the correction amount Δnm is calculated based on the correction data at the observation point 62 located in the 4th row and 8th column and the correction data at the observation point 62 in the 5th row and 7th column.

When the position correction amount is calculated in the process of step S65, the control unit 4 controls the movement of the head unit 25 based on the calculated position correction amount (correction data) and the target mounting position, thereby performing the component mounting process. is executed (step S67).

When the component mounting process is completed, the control unit 4 determines whether the component mounting process for all components on the board P has been completed (step S69), and if the determination is No here, the control unit 4 Then, the process returns to step S61, and the processes of steps S61 to S69 are repeated. When it is finally determined that the component mounting process for all components has been completed (Yes in step S69), the control unit 4 ends the control of this flowchart.

In this example, the process of setting the jig board 60 in the work area corresponds to the "jig board preparation process" of the present invention. Further, the processing of steps S41 to S47 in FIG. 10 corresponds to the "observation point imaging step" of the present invention, the processing of step S49 corresponds to the "deviation amount calculation step" of the present invention, and the processing of step S61 of FIG. The processes from S69 to S69 correspond to the "component mounting process" of the present invention.

According to the component mounting apparatus 1 (second embodiment) described above, the observation points 62 to be imaged in advance in the correction data acquisition process are among all the observation points 62 on the jig board 60, as shown in FIG. , the observation points 62 in the specific row and column, and the other observation points 62 are not imaged. Therefore, compared to the case where all the observation points 62 on the jig board 60 are imaged, the time required to image the observation points 62 is shortened.

Moreover, during the component mounting process, the rows and columns surrounding the target mounting position of the component are selected from among the specific columns and specific rows, and the nearest one or more observation points among the observation points 62 belonging to the specific column and specific row are selected. Based on the correction data corresponding to point 62, the position correction amount at the target mounting position is calculated. Then, the moving operation of the head unit 25 is controlled based on the position correction amount (steps S65, S67). Therefore, the mounting accuracy of components on the board P is also ensured.

Therefore, according to the correction data acquisition process and component mounting process as in the second embodiment, the head unit 25 (mounting head 251) is It becomes possible to reasonably shorten the time required for the correction data acquisition process.

In the correction data acquisition process of FIG. 10, the observation points 62 in a preset specific column and specific row are imaged by the board recognition camera 253 (steps S41 to S47). However, instead of using the board recognition camera 253 to take an image of the observation point 62 in a preset specific column and specific row, the operator causes the board recognition camera 253 to take an image, similar to the correction data acquisition process of the first embodiment. The observation points 62 in rows and columns may be arbitrarily set by operating the input unit 51.

According to this configuration, among component mounting boards, for example, for a board P for which relatively high mounting accuracy is required, the steps in FIG. The accuracy of the correction data obtained in S65 can be improved. On the other hand, for the board P where such high mounting accuracy is not required, the time required for the processing of steps S41 to S47 in FIG. 10 can be further shortened by setting the intervals between the specific rows and specific columns relatively wide. can do.

The component mounting apparatus 1 and the component mounting method executed in the component mounting apparatus 1 described above are examples of preferred embodiments of the component mounting apparatus and component mounting method according to the present invention, and their specific configuration and method. can be changed as appropriate without departing from the gist of the present invention.

For example, in the correction data acquisition process (FIG. 4) of the first embodiment, in order to create out-of-area correction data (step S11), the observation points 62 in the first row and first column are Each image is captured by a recognition camera 253. However, the observation points 62 that are imaged to create out-of-area correction data are not limited to the observation points 62 in the first row and first column. For example, the observation points 62 in other columns and rows, such as the observation points 62 in the 10th row and the 15th column, may be used. In short, it is sufficient to image one row and one column of observation points 62 using the board recognition camera 253.

In addition to imaging one row and one column of observation points 62 with the board recognition camera 253 to create out-of-area imaging data, it is also possible to image two rows of observation points 62 and one column of observation points 62. Alternatively, out-of-area imaging data may be created. For example, the out-of-area imaging data may be created by imaging the observation points 62 in the first and tenth rows and the observation points 62 in the first column. In this case, the correction amount Δnm for the area corresponding to the 1st to 9th rows is calculated based on the imaging results of the observation points 62 in the 1st row and 1st column, and the correction amount Δnm for the area corresponding to the 10th row and above is calculated. Δnm can be calculated based on the imaging results of the observation point 62 in the 10th row and 1st column. Similarly, even if you create out-of-area imaging data by imaging one row of observation points and two columns of observation points, or by imaging two rows of observation points and two columns of observation points, good.

In addition, when creating out-of-area imaging data, one row of correction data is calculated from the correction data of observation points 62 in multiple rows (<N) that were actually imaged, or correction data for one row is calculated from the correction data of observation points 62 in multiple rows (<M) that were actually imaged. The correction data for one column may be calculated from the correction data of the observation point 62. Specifically, for example, the correction amount Δ1m (supplementary data) obtained from the observation point 62 in the first row, and the correction amount Δ10m (supplementary data) at the observation point 62 in the 10th row, which is separated from the first row by a predetermined interval. From this, the correction amount Δym for the virtual Y row and one row of observation points is calculated, and the out-of-area imaging data is created using this virtual Y row and one row of observation point correction amount Δym. Good too. Similarly, for example, from the correction amount Δn1 (supplementary data) obtained from the observation point 62 in the first column and the correction amount Δn10 (supplementary data) at the observation point 62 in the 10th column separated from the first column by a predetermined interval. The correction amount Δnx for the virtual X column and one column of observation points may be calculated, and the out-of-area imaging data may be created using this virtual X column and the correction amount Δnx for the observation points for one column. . Note that the correction amount Δym for the virtual observation point in the Y row and the correction amount Δnx for the virtual observation point in the X column can be, for example, the average value of the supplementary data.

In addition, in the correction data acquisition process (FIG. 10) of the second embodiment, the observation points 62 in the preset specific column and specific row are the observation points in each row at two row intervals (every three rows) from the first row. 62 and observation points 62 in each row at two row intervals (every three rows) from the first row are imaged by a board recognition camera 253. However, the spacing between the rows and columns of the observation points 62 to be imaged is not limited to the two-row spacing and the two-column spacing as described above. Further, the row spacing and the column spacing of the observation points 62 to be imaged may be different from each other, and can be appropriately selected depending on the size and type of component mounting board to be produced.

In the embodiment, a jig board 60 having the same size as the maximum size board that can be produced by the component mounting apparatus 1 is used as the jig board 60, but a smaller jig board 60 may also be used. In this case, the correction data acquisition process described using FIGS. 4 and 10 may be performed multiple times while moving the jig board 60.

1 Component mounting device 2 Device main body 4 Control unit 23 Board transport mechanism 24 Component supply unit 25 Head unit 251 Mounting head 253 Board recognition camera 26 Head unit drive mechanism 41 Mounting control unit 42 Transport control unit 43 Component supply control unit 44 Imaging control unit 45 Data calculation section 46 Storage section 47 Display control section 50 Display section 51 Input section 60 Jig board 62 Observation point

Claims (7)

A method for mounting components in a component mounting apparatus in which a mounting head movable along the X and Y axes performs a component mounting process in which components are taken out from a component supply section and mounted on a board placed at a work position. hand,
a jig board preparation step of arranging a jig board on which a plurality of dot-shaped observation points are provided in a lattice shape, with rows arranged in the X direction and columns arranged in the Y direction, at the working position;
an observation point imaging step of imaging the observation point of the jig board with a camera that moves together with the mounting head;
a displacement amount calculating step of calculating a positional displacement amount of the mounting head at each observation point from an image of the observation point captured by the camera;
a component mounting process step of correcting the amount of movement of the mounting head in the X and Y directions based on the amount of positional deviation and executing the component mounting process;
In the observation point imaging step, among the plurality of observation points provided on the jig board, an observation point in a specific area, an observation point in a predetermined row, and an observation point in a predetermined column are imaged,
In the component mounting processing step, when the target area of the component mounting processing is a first area corresponding to the specific area, the amount of positional deviation calculated from the image of each observation point in the specific area is When the movement amount of the mounting head is corrected based on the amount of movement of the mounting head and a second area is included in addition to the first area, for the second area, the observation points in the predetermined row and the observation points in the predetermined column are corrected. A component mounting method, comprising: correcting the amount of movement of the mounting head based on the amount of positional deviation calculated from the image. In the component mounting method according to claim 1,
If the board includes a high precision area that requires higher mounting precision than other areas,
In the observation point imaging step, the observation point is imaged by using an area of the jig board that corresponds to the high-precision area as the specific area. A component mounting apparatus is equipped with a mounting head that is movable along the X-axis and the Y-axis, and performs a component mounting process in which the mounting head takes out components from a component supply section and mounts them on a board placed at a work position. hand,
a camera movable together with the mounting head;
a jig substrate holder capable of holding a jig substrate on which a plurality of dot-shaped observation points are arranged in a grid pattern in rows in the X direction and columns in the Y direction at the working position;
A control unit capable of executing the component mounting process and a mounting preparation process for acquiring data necessary for the component mounting process,
The implementation preparation process includes:
observation point imaging processing of moving the mounting head and causing the camera to image the observation point of the jig board held by the jig board holding section;
a displacement amount calculation process of calculating the amount of positional displacement of the mounting head at each observation point as the data from an image of the observation point captured by the camera;
The control unit includes:
In the observation point imaging process, among the plurality of observation points provided on the jig board, an observation point in a specific area, an observation point in a predetermined row, and an observation point in a predetermined column are imaged, and
In the component mounting process, when the target area of the component mounting process is a first area corresponding to the specific area, based on the positional deviation amount calculated from the image of each observation point in the specific area. When the movement amount of the mounting head is corrected to include a second area in addition to the first area, for the second area, each of the observation points in the predetermined row and the observation point in the predetermined column A component mounting apparatus, wherein the amount of movement of the mounting head is corrected based on the amount of positional deviation calculated from the image. The component mounting apparatus according to claim 3,
further comprising a command input unit that receives a command for specifying the specific area,
The component mounting apparatus is characterized in that the control unit executes the observation point imaging process and the component mounting process based on the specific area designated by operation of the command input unit. A method for mounting components in a component mounting apparatus in which a mounting head movable along the X and Y axes performs a component mounting process in which components are taken out from a component supply section and mounted on a board placed at a work position. hand,
a jig board preparation step of arranging a jig board on which a plurality of dot-shaped observation points are provided in a lattice shape, with rows arranged in the X direction and columns arranged in the Y direction, at the working position;
an observation point imaging step of imaging the observation point of the jig board with a camera that moves together with the mounting head;
a displacement amount calculating step of calculating a positional displacement amount of the mounting head at each observation point from an image of the observation point captured by the camera;
a component mounting process step of correcting the amount of movement of the mounting head in the X and Y directions based on the amount of positional deviation and executing the component mounting process;
In the observation point imaging step, among the plurality of observation points provided on the jig board, a plurality of observation points belonging to rows at predetermined intervals and a plurality of observation points belonging to columns at every predetermined interval are imaged,
In the component mounting processing step, the amount of movement of the mounting head is corrected based on the shift amount calculated from the image of the observation point taken in the observation point imaging step. A component mounting apparatus is equipped with a mounting head that is movable along the X-axis and the Y-axis, and performs a component mounting process in which the mounting head takes out components from a component supply section and mounts them on a board placed at a work position. hand,
a camera movable together with the mounting head;
a jig substrate holder capable of holding a jig substrate on which a plurality of dot-shaped observation points are arranged in a grid pattern in rows in the X direction and columns in the Y direction at the working position;
A control unit capable of executing the component mounting process and a mounting preparation process for acquiring data necessary for the component mounting process,
The implementation preparation process includes:
observation point imaging processing of moving the mounting head and causing the camera to image the observation point of the jig board held by the jig board holding section;
a displacement amount calculation process of calculating the amount of positional displacement of the mounting head at each observation point as the data from an image of the observation point captured by the camera;
The control unit includes:
In the observation point imaging process, among the plurality of observation points provided on the jig board, a plurality of observation points belonging to columns at predetermined intervals and a plurality of observation points belonging to rows at every predetermined interval are imaged. Further, in the component mounting process, the amount of movement of the mounting head is corrected based on the amount of shift calculated from the image of the observation point taken in the observation point imaging step. The component mounting apparatus according to claim 6,
further comprising a command input unit that receives a command for specifying a column and row interval of the observation point to be imaged in the observation point imaging process,
The component mounting apparatus is characterized in that the control unit executes the observation point imaging process and the component mounting process based on the interval specified by operation of the command input unit.